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749results about How to "Good heat dissipation" patented technology

Multiple-disc type magnetorheological brake

The invention relates to a multiple-disc type magnetorheological brake which mainly comprises a transmission shaft, a wheel hub, a drive friction plate group, a driven friction plate group, inner and outer magnetic isolation rings, an exciting coil with a U-shaped iron core, magnetic-conducting side plates and a magnetic isolation casing. A sealing ring is used for sealing magnetorheological fluid between the drive friction plate group and the driven friction plate group; the drive friction plate group and the driven friction plate group are respectively sleeved on the magnetic isolation rings and the wheel hub through splines; the drive friction plate group is separated from the driven friction plate group by the inner magnetic isolation ring and the outer magnetic isolation ring; the exciting coil with the U-shaped iron core is directly spliced in iron core jacks of the magnetic conducting side plates; and the braking torque can be changed through changing the current intensity of the coil. When the braking torque is not enough, the quantity of friction plates can be increased or the quantity of the exciting coil with the U-shaped iron core can be increased to adapt to the big torque braking. The multiple-disc type magnetorheological brake has the advantages that the structure is compact, the braking torque is big, the assembly and the disassembly are convenient, the coil is easily used for radiating the heat, and the number of turns wounded by the coil is more.
Owner:CHINA UNIV OF MINING & TECH

Heat conductive silicone grease composition and cured product thereof

Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.
Owner:SHIN ETSU CHEM IND CO LTD
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