Patents
Literature

309results about How to "Improve heat dissipation" patented technology

Heat dissipation power distribution cabinet

The invention discloses a heat dissipation power distribution cabinet comprising a cabinet body of heat dissipation power distribution cabinet, wherein an air inlet of heat dissipation power distribution cabinet is formed in the top of the cabinet body of heat dissipation power distribution cabinet, an air inlet cover is arranged at the air inlet, heat dissipation windows of heat dissipation powerdistribution cabinet are arranged on two side walls of the cabinet body of heat dissipation power distribution cabinet, heat dissipation window covers are arranged at the heat dissipation windows, afan of heat dissipation power distribution cabinet is arranged at the heat dissipation window of heat dissipation power distribution cabinet on one side, the fan of heat dissipation power distributioncabinet is located in the cabinet body of heat dissipation power distribution cabinet, an air outlet of heat dissipation power distribution cabinet is formed in the bottom of the cabinet body of heatdissipation power distribution cabinet, a metal screen of heat dissipation power distribution cabinet is arranged at the air outlet of heat dissipation power distribution cabinet, and a cabinet doorheat dissipation power distribution cabinet is arranged on the cabinet body of heat dissipation power distribution cabinet. The heat dissipation power distribution cabinet disclosed by the invention can solve the problem that the service lives of circuit components in the power distribution cabinet are shortened due to poor heat dissipation.
Owner:湖州旭源电气科技有限公司

Ejector assisted slab-type loop heat pipe

The invention discloses an ejector assisted slab-type loop heat pipe which comprises a main loop and a bypath loop; in the main loop, a capillary core in an evaporator is connected with a gas collection channel; an overheating gaseous working medium at an outlet of the gas collection channel injects a saturated gaseous working medium from a compensating chamber through an ejector; the mixed gaseous working medium is connected with an inlet of a condenser by a gas line pipeline; an outlet of the condenser is connected with an inlet of the compensating chamber by a liquid line pipeline; the compensating chamber and the capillary core are longitudinally processed together; the capillary core, the gas collection channel and the compensating chamber are wrapped in a housing of the evaporator; in the bypass loop, a saturated gaseous working medium generated from liquid gasification by absorption of heat leakage in the compensating chamber passes through a regulating valve and then enters the ejector; and through changing the opening of the regulating valve, the flow of the saturated gaseous working medium gasified in the compensating chamber due to different heat leakage quantity is ensured to be led away. The ejector assisted slab-type loop heat pipe is an economical, effective, and feasible improvement scheme, and the performance of the loop heat pipe can be improved effectively.
Owner:XI AN JIAOTONG UNIV

Terahertz quantum cascade laser device structure and production method thereof

The invention provides a terahertz quantum cascade laser device structure and a production method thereof. The terahertz quantum cascade laser device structure at least comprises a ridge waveguide structure, wherein the ridge waveguide structure comprises a semi-insulating GaAs substrate, a GaAs buffer layer, a lower contact layer, an active region, an upper contact layer, a heat-conducting insulating layer, an upper metal layer and a lower metal layer. By depositing the heat-conducting insulating layer and covering metal on the side surface of the device, a transverse heat dissipation channel is provided for a device, so that the device has stronger heat dissipation capability compared with THz QCL uncovered by metal on the sidewall. A flip chip packaging method is adopted, and a supporting substrate adopts a high heat-conductivity material such as silicon, so that the heat dissipation capability of the supporting substrate is improved compared with the normal semi-insulating GaAs substrate for packaging the device, and the supporting substrate has a relatively large electrode area and also is favorable for the heat dissipation of the device. The novel structure is used for improving the temperature characteristics and the energy efficiency of THz QCL, thus being favorable for working in a continuous or high-duty-cycle pulse state; the device can be produced by a standard semiconductor process, and the production method of the device is suitable for industrial mass production.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Vertical convector radiator and vertical convector radiating down lamp

The invention discloses a vertical convector radiator and comprises a vertical convector radiating down lamp of the vertical convector radiator. The vertical convector radiator comprises light source installation parts and a plurality of heat radiating fins of which the lower ends are connected with the light source installation parts in a heat conducting mode, wherein the vertical convector radiator comprises a plurality of convection passageways which penetrates through and is vertical to the upper surface and the lower surface of the convector radiator. When the vertical convector radiator in the technical scheme adopted operates, the lower end of the heat dissipation rectangular fin continuously heats the neighbouring air and the air rises, simultaneously, the neighbouring cold air can continuously complement to generate convection, thus the vertical convector radiator of the specific implement method can form a higher air velocity field even under the passive voice radiating condition, full heat exchange is generated between the cold air and the heat dissipation rectangular fin surface of the vertical convector radiator, the heat is rapidly take away, thereby avoiding the generation of the heat island effect in the bottom of the radiator, and the heat dissipation capacity is greatly improved.
Owner:KINGSUN OPTOELECTRONIC CO LTD

Expandable processing device

The invention relates to an expandable processing device. The expandable processing device comprises a case with an opening formed in the back. A plurality of first ventilation holes are formed in a front face plate of the case, a plurality of guiding rails arranged at intervals and correspondingly used for inserting different functional business modules are arranged in the case, the length direction of the guiding rails is perpendicular to the front face plate, a bus back plate functionally butting joint with the functional business modules is arranged between the guiding rails and the front face plate, a plurality of second ventilation holes are formed in the bus back plates, the bus back plate and the front face plate are arranged in parallel, an initiative heat dissipation assembly is arranged between the bus back plate and the front face plate and comprises a partition plate, air sucking fans for sucking air outside the case are arranged on the partition plate, and air blowing fans for blowing air into the case are arranged below the partition plate. By means of the guiding rails in the case, relative independence of installing space of the different functional business modules is achieved, electromagnetic interference between the functional business modules is reduced, heat dissipation can be achieved, and according to the front-feeding and front-discharging mode and the bottom-feeding and the top-discharging mode of the initiative heat dissipation assembly, it is guaranteed that devices inside the case can work within the wide temperature range.
Owner:ANHUI SUN CREATE ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products