309results about How to "Improve heat dissipation" patented technology

A retrofit light emitting diode (LED) lighting luminaire designed to have detachable and replaceable components for convenience and low cost in the luminaire maintenance including a heat dissipation member that includes detachable upper and lower sections with aligned radially extending fins, and a driver retained within the luminaire. The LED chip is retained against a surface of the lower heat dissipation member so that heat from the LED is transmitted to the radially extending fins to thereby effectively cool the LED lighting source and driver.

On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.

A solid-state lighting device (500) includes a plurality of light-emitting elements (510, 525, 530) configured for generating light that are thermally coupled to a heat spreading chassis configured for coupling to one or more heat sinks (520). The lighting device further includes a mixing chamber which is optically coupled to the plurality of light-emitting elements and configured to mix the light emitted by the plurality of light-emitting elements. A control system is operatively coupled to the plurality of light-emitting elements, and configured to control operation of the plurality of light-emitting elements.

A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.

A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.

A photoactivation apparatus (200) separately delivers light to a plurality of wells of a multiwell plate (110). The device-includes a plurality of light emitting diodes (210) attached to a first surface of a substrate (220) such that when the photoactivation apparatus is positioned on the multiwell plate each of the light emitting diodes delivers light to one corresponding well. The light emitting diodes (210) may extend at least partially into the wells of the multiwell plate. A heat sink (250) and fan may be provided on the device to dissipate heat generated by the light emitting diodes. The components are preferably enclosed in a conveniently-sized housing (270). The housing may include one or more grips and air vents. The apparatus includes an interlocking lip (230) defining a recess which is sized to receive at least a portion of the multiwell plate. A power supply connected to the apparatus and configured to provide an equal voltage across each of the light emitting diodes.

Heat dissipation, is improved, of a semiconductor device on a tape carrier package, in which the number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration and narrower pitches are employed. There are included a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns are formed. The heat dissipation patterns are disposed at positions where the heat dissipation patterns do not interfere with the lead patterns 21 to 24 and are also electrically and thermally connected to the corresponding heat dissipating electrode patterns 15 to 17, respectively.

The invention relates to a lighting device (1) comprising a housing (8) with a light source connector for a LED (11) and a reflective collimator (3) and a refractive collimator (9) as well as to a method for their manufacture. The reflective collimator (3) comprises a plurality of reflective segments (4, 4′, 5, 5′, 6, 6′, 7, 7′), which are spaced apart from each other by means of air slits suitable for dissipation of heated air. The segments (4, 4′, 5, 5′, 6, 6′, 7, 7′) are adapted to reflect laterally emitted light generated by the light source (11) towards a direction which is substantially parallel to said main direction. Lighting devices according to this invention may have a compact design and an improved dissipation of the heat generated by the LEDs.

The invention discloses a heat dissipation power distribution cabinet comprising a cabinet body of heat dissipation power distribution cabinet, wherein an air inlet of heat dissipation power distribution cabinet is formed in the top of the cabinet body of heat dissipation power distribution cabinet, an air inlet cover is arranged at the air inlet, heat dissipation windows of heat dissipation powerdistribution cabinet are arranged on two side walls of the cabinet body of heat dissipation power distribution cabinet, heat dissipation window covers are arranged at the heat dissipation windows, afan of heat dissipation power distribution cabinet is arranged at the heat dissipation window of heat dissipation power distribution cabinet on one side, the fan of heat dissipation power distributioncabinet is located in the cabinet body of heat dissipation power distribution cabinet, an air outlet of heat dissipation power distribution cabinet is formed in the bottom of the cabinet body of heatdissipation power distribution cabinet, a metal screen of heat dissipation power distribution cabinet is arranged at the air outlet of heat dissipation power distribution cabinet, and a cabinet doorheat dissipation power distribution cabinet is arranged on the cabinet body of heat dissipation power distribution cabinet. The heat dissipation power distribution cabinet disclosed by the invention can solve the problem that the service lives of circuit components in the power distribution cabinet are shortened due to poor heat dissipation.

The invention discloses an ejector assisted slab-type loop heat pipe which comprises a main loop and a bypath loop; in the main loop, a capillary core in an evaporator is connected with a gas collection channel; an overheating gaseous working medium at an outlet of the gas collection channel injects a saturated gaseous working medium from a compensating chamber through an ejector; the mixed gaseous working medium is connected with an inlet of a condenser by a gas line pipeline; an outlet of the condenser is connected with an inlet of the compensating chamber by a liquid line pipeline; the compensating chamber and the capillary core are longitudinally processed together; the capillary core, the gas collection channel and the compensating chamber are wrapped in a housing of the evaporator; in the bypass loop, a saturated gaseous working medium generated from liquid gasification by absorption of heat leakage in the compensating chamber passes through a regulating valve and then enters the ejector; and through changing the opening of the regulating valve, the flow of the saturated gaseous working medium gasified in the compensating chamber due to different heat leakage quantity is ensured to be led away. The ejector assisted slab-type loop heat pipe is an economical, effective, and feasible improvement scheme, and the performance of the loop heat pipe can be improved effectively.

The invention relates to a junction box which safely dissipates heat produced by electrical/electronic components assembled in the box. The junction box has a housing with cover and at least one component chamber that juts out from a side wall of the housing. The component chamber has cooling fins. An electric or electronic component, sheathed in insulation, is inserted into the component chamber, such that it fits firmly against the walls of the chamber. The cover has cooling fins and overhangs the body of the housing and the component chamber in several areas. The construction of the junction box with the component chambers that jut out from the body and the housing cover with overhang enhance heat dissipation and allow the box to be used with solar modules in which bypass flows up to 16 A and greater occur.

An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside of the second casing has a containing area. The storage unit is disposed at the containing area. The cover is removably assembled at the second casing to cover the containing area and contact the storage unit. The heat dissipation unit is disposed at the cover.

A projection lighting apparatus is disclosed for marking and demarcation applications in airports, waterways, and industrial environments. The lighting apparatus comprises a plurality of high intensity LEDs with their output coupled to the input ends of a plurality of optical fibers. The output ends of the optical fibers are packaged to form a desired illumination pattern. The illumination pattern is projected onto the target surface through a secondary optical system for marking and demarcation enhancement.

The invention provides a stator used for a motor, the motor and a ventilation cooling method of the motor. The stator used for the motor comprises concentrated windings and at least two wedge blocks arranged at the gaps between the adjacent concentrated windings. The at least two wedge blocks are distributed on the concentrated windings in a staggered mode to form a first ventilation path. According to the stator used for the motor, the motor and the ventilation cooling method of the motor, the concentrated windings can be cooled effectively, the concentrated windings are effectively constrained in the circumferential direction through the at least two wedge blocks, the service life of the motor is further prolonged, and the reliability of the motor is improved.

The invention provides a terahertz quantum cascade laser device structure and a production method thereof. The terahertz quantum cascade laser device structure at least comprises a ridge waveguide structure, wherein the ridge waveguide structure comprises a semi-insulating GaAs substrate, a GaAs buffer layer, a lower contact layer, an active region, an upper contact layer, a heat-conducting insulating layer, an upper metal layer and a lower metal layer. By depositing the heat-conducting insulating layer and covering metal on the side surface of the device, a transverse heat dissipation channel is provided for a device, so that the device has stronger heat dissipation capability compared with THz QCL uncovered by metal on the sidewall. A flip chip packaging method is adopted, and a supporting substrate adopts a high heat-conductivity material such as silicon, so that the heat dissipation capability of the supporting substrate is improved compared with the normal semi-insulating GaAs substrate for packaging the device, and the supporting substrate has a relatively large electrode area and also is favorable for the heat dissipation of the device. The novel structure is used for improving the temperature characteristics and the energy efficiency of THz QCL, thus being favorable for working in a continuous or high-duty-cycle pulse state; the device can be produced by a standard semiconductor process, and the production method of the device is suitable for industrial mass production.

The invention discloses a vertical convector radiator and comprises a vertical convector radiating down lamp of the vertical convector radiator. The vertical convector radiator comprises light source installation parts and a plurality of heat radiating fins of which the lower ends are connected with the light source installation parts in a heat conducting mode, wherein the vertical convector radiator comprises a plurality of convection passageways which penetrates through and is vertical to the upper surface and the lower surface of the convector radiator. When the vertical convector radiator in the technical scheme adopted operates, the lower end of the heat dissipation rectangular fin continuously heats the neighbouring air and the air rises, simultaneously, the neighbouring cold air can continuously complement to generate convection, thus the vertical convector radiator of the specific implement method can form a higher air velocity field even under the passive voice radiating condition, full heat exchange is generated between the cold air and the heat dissipation rectangular fin surface of the vertical convector radiator, the heat is rapidly take away, thereby avoiding the generation of the heat island effect in the bottom of the radiator, and the heat dissipation capacity is greatly improved.

A display device comprising a display panel for displaying an image, a chassis base coupled to the display panel to support the display panel, the chassis base having at least one chassis base hole, and at least one reinforcing member formed on the chassis base such that the at least one reinforcing member covers the at least one chassis base hole.

The present invention provides a vacuum cleaner motor which comprises a housing, a stator core, a rotor core, fixed impeller, wind cover, dynamic impeller, stator winding, rotor winding and a heat radiation fan, wherein the heat radiation fan is fixed on a output shaft between bearing and a commutator; gap is left between outer edge of the excircle of fan blade of the heat radiation fan and wall of inner circumference. The design proposal can, on one hand, blow cold wind to the commutator, the rotor winding, the stator winding and a carbon brush assembly directly, on the other hand make the rotor winding, the commutator and the heat radiation fan move in dynamic balance with heat radiation structure simple and heat radiation effect very good, also service life and use security of the dry & wet vacuum cleaner can be effectively enhanced.

According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.

The invention discloses an aluminum-alloy wire drawing lubricating fluid. The lubricating fluid is prepared from following raw materials by weight: 2-3 parts of salicylic acid, 1-2 parts of polyoxyethylene alkyl ether, 4-5 parts of n-butanol, 1-2 parts of polyethylene glycol monolaurate, 1-2 parts of oleic acid, 6-8 parts of polyvinyl alcohol, 1-2 parts of tert-butyl hydroperoxide, 2-3 parts of an antiwear agent, 1-2 parts of a silane coupling agent KH-550 and 1000 parts of water. Nano aluminium nitride powder is added into the lubricating fluid, thus promoting heat dissipation, enhancing film-forming property and increasing the processing speed. The lubricating fluid has excellent anti-oxidation and anti-discoloration effects so that a working fluid is not prone to densification or turning blue. The lubricating fluid has excellent lubricating property, thus improving the processing precision and surface smoothness. The consumption of a wire drawing die is low. Threads or wires are protected effectively. Generation of surface quality defect and other phenomena is reduced. The service lifetime of the die can be prolonged.

The invention relates to an expandable processing device. The expandable processing device comprises a case with an opening formed in the back. A plurality of first ventilation holes are formed in a front face plate of the case, a plurality of guiding rails arranged at intervals and correspondingly used for inserting different functional business modules are arranged in the case, the length direction of the guiding rails is perpendicular to the front face plate, a bus back plate functionally butting joint with the functional business modules is arranged between the guiding rails and the front face plate, a plurality of second ventilation holes are formed in the bus back plates, the bus back plate and the front face plate are arranged in parallel, an initiative heat dissipation assembly is arranged between the bus back plate and the front face plate and comprises a partition plate, air sucking fans for sucking air outside the case are arranged on the partition plate, and air blowing fans for blowing air into the case are arranged below the partition plate. By means of the guiding rails in the case, relative independence of installing space of the different functional business modules is achieved, electromagnetic interference between the functional business modules is reduced, heat dissipation can be achieved, and according to the front-feeding and front-discharging mode and the bottom-feeding and the top-discharging mode of the initiative heat dissipation assembly, it is guaranteed that devices inside the case can work within the wide temperature range.

The invention discloses a cooling device of an electric drive bulldozer. The cooling device comprises an engine cooling device which is used for cooling mechanical heat source parts; the cooling device also comprises a circuit cooling device which is used for cooling electronic heat source parts. The circuit cooling device is added on the cooling device of the electric drive bulldozer on the basis of the existing engine cooling device, so that the electronic heat source parts of the electric drive bulldozer can be independently cooled, therefore, the cooling device is not only beneficial to intensifying the heat dissipation capability of the electronic heat source parts with a relative lower working temperature, and simultaneously, is beneficial to ensuring the heat dissipation reliability of the high temperature mechanical heat source parts, such as engine, and further, the cooling effect of the cooling device of the electric drive bulldozer is improved. In addition, the invention also discloses an electric drive bulldozer which comprises the cooling device.

A high bay light has a lamp holder, a light module, a plurality of cooling modules and a lamp cover. The lamp holder includes a frame. The frame has a plurality of connecting pieces extending radially therefrom. The light module is mounted on the lamp holder and includes a printed circuit board and at least one LED. The cooling modules are mounted on the printed circuit board and each cooling module includes a heat pipe and a cooling component. The lamp cover covers the cooling modules and includes an open bottom, an interior and a top hole. The open bottom and the top hole communicate with the interior. The connecting pieces of the frame are secured to the lamp cover so as to form a plurality of bottom holes between adjacent connecting pieces. With the above-mentioned structure, the high bay light can provide improved heat dissipation.

There is provided a socket. The socket includes: a wiring substrate including a first surface and a second surface opposite to the first surface; a plurality of connection terminals provided on the wiring substrate and each including a contact portion, wherein the connection terminals extend from the first surface of the wiring substrate; and a positioning member formed in a frame shape and provided on the wiring substrate to surround the connection terminals. The positioning member includes a sidewall plate having a plurality of holes formed therethrough.

A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a fourth bond pad on the surface of the carrier chip and electrically connected to the first and the second bond pads, respectively. The first, the second, the third, and the fourth bond pads are on a same surface of the carrier chip. The LED package component further includes a first and a second metal bump bonding the first and the second bond pads, respectively, onto the LED chip through flip-chip bonding; and a window-type module substrate bonded onto the third and the fourth bond pads through flip-chip bonding. The window-type module substrate includes a window, with the LED chip configured to emit light toward the window. The heat radiation performance is high and the light-emitting device package having a low thermal conductivity material is improved over conventional LED packages.

The invention provides an SOILDMOS transistor with changeover body connection, comprising a source region (40), a body region (30), a drift region (20), a drain region (50), a source electrode (400), a drain electrode (500) and a gate electrode (60). The invention is characterized in that an embedded dielectric layer (70) is provided with windows (800, 810 and 820) which have gradually changed widths and connect an SOI layer and a substrate semiconductor. In the SOILDMOS transistor with changeover body connection, the SOI layer (active region) and the substrate semiconductor can be connected by optimally designing the width of the windows with gradually changed widths of the embedded dielectric layer. Cavities generated by collision ionization can flow out from the substrate. Meanwhile, joule heat generated in a device region can effectively flow toward heat sink of the substrate, which not only can reduce self-heating effect but also can depress floating body effect.

The semiconductor device includes: a semiconductor chip; a die pad for holding the semiconductor chip; a lead; and a sealing resin material for sealing the semiconductor chip, the die pad and an inner portion of the lead. The die pad has an upset portion protruding upward to form a flat face smaller in area than the semiconductor chip, and the portion of the die pad excluding the upset portion is covered with a buffer resin material smaller in elasticity than the sealing resin material.

The invention discloses a transformer cleaning method. A vertical stabilizing plate is arranged in the middle part of the top of the base, and lifting devices and water tanks are respectively arranged on the bases on both sides of the stabilizing plate. The side wall of the stable plate is provided with a vertical chute, one side of the slider is set in the chute and slides in the chute, the other side of the slider is provided with a mounting plate, and the mounting plate is vertically provided with a water pipe and a rotating motor. The end of the water pipe is connected to the brush pipe through a sealed joint. The outer wall of the brush pipe is evenly provided with water outlet holes and bristles. The brush pipe is provided with a second gear. The rotating motor is connected to the first gear through the rotating rod, the first gear and the second gear. are meshed with each other, a water pipe is inserted in the water tank, a water pump is arranged on the water pipe, one end of the water pipe is inserted into the bottom of the water tank, and the other end of the water pipe is connected with a water pipe. The invention has the advantages of simple structure, convenient use, fast cleaning speed and high safety.

The invention discloses a cabinet provided with a convenient-to-detach dust screen, and relates to the field of computer devices. The cabinet provided with the convenient-to-detach dust screen comprises a cabinet body, two detachable side plates and a dust screen, wherein the side plates have flat U-shaped structures; the transverse edges of the upper parts and the lower parts of the side plates are provided with symmetrical sliding chutes; each vertical edge is provided with three exhaust ports; the dust screen is wrapped in a strip-shaped metal border; the size of the metal border adapts to those of the sliding chutes in the side plates, and the metal border is arranged in the sliding chutes, one end of the metal border is provided with a fixing table protruding to the outside of the cabinet; one end of each side plate is provided with a limiting sheet; the limiting sheets are connected to the vertical edges on side edges through springs. By adopting the cabinet, dust can be cleaned conveniently.

A sensor module and method for producing the sensor module including a chip carrier and a sensor chip disposed thereon. The sensor module includes at least one partial cover having a recess on a second face of the chip carrier, such that heat from the chip carrier and/or the sensor chip can be dissipated to the recess.