Semiconductor packaging structure and forming method thereof

Abstract

The invention discloses a semiconductor packaging structure and a forming method thereof. The semiconductor packaging structure comprises a radiating fin frame and a lead frame, wherein the radiating fin frame is connected with a radiating fin, a chip is stuck on a chip holder of the lead frame, the radiating fin is connected with the chip through a combining material, the lead frame is provided with a first pin, and second pins and a third pin are arranged on the radiating fin frame. The forming method of the semiconductor packaging structure comprises the following steps: the second pins and the third pin are arranged on the radiating fin, the first pin is connected with a bottom electrode of the chip holder as a current input end; three second pins on the radiating fin frame are connected with an electrode on the upper surface of the chip as current output ends; the third pin on the radiating fin frame is welded with a lead as a current control end, so that application of the lead is greatly reduced, a work flow is reduced and the heat dissipation is accelerated; after injection molding, colloids are exposed on the two faces of a semiconductor, so that the double-faced heat dissipation is realized, and a radiating function of the semiconductor is improved.

Description

technical field

[0001] The invention belongs to the field of semiconductor packaging, and in particular relates to a semiconductor packaging structure and a molding method thereof. Background technique

[0002] In recent years, semiconductor devices have become more and more integrated, and their storage capacity, signal processing speed and power have developed rapidly, but their volume has become smaller and smaller. This trend has accelerated the rapid development of semiconductor integrated circuits. Among them, the lead frame is the skeleton of the semiconductor integrated circuit. As the chip carrier of the integrated circuit or discrete device, the lead frame is a key structure that realizes the electrical connection between the lead-out end of the internal circuit of the chip and the external lead by means of a bonding gold wire, and forms an electrical circuit. Components, which act as a bridge to connect with external wires. A lead frame is mainly composed of two ...

Examples

Embodiment 1

[0041] refer to Figure 1 to Figure 5 , a semiconductor packaging structure molding method, it comprises the following steps:

[0042] Prepare the lead frame 1: a semi-etched area 23 is provided around the chip holder 21 of the lead frame 1, the first pin 22 is connected to the chip holder 21, and the electrode of the chip holder 21 is directly connected to the first pin 22, and the first pin 22 is connected to the first pin 22. The pin 22 is provided with a first tin climbing hole 24, and the lead frame 1 is also provided with a positioning groove 25, a pin identification hole 26 and a first connecting rod 27;

[0043] Welding the chip 3: using the bonding material 5 to weld the chip 3 on the chip holder 21;

[0044] Prepare the heat sink frame 2: the heat sink frame 2 is provided with a back half-etched area 41 and a front half-etched area 42, and is provided with a second pin 43 and a third pin 44, and the second pin 43 and the third pin The pins 44 are all provided with ...

technical field

[0001] The invention belongs to the field of semiconductor packaging, and in particular relates to a semiconductor packaging structure and a molding method thereof. Background technique

[0002] In recent years, semiconductor devices have become more and more integrated, and their storage capacity, signal processing speed and power have developed rapidly, but their volume has become smaller and smaller. This trend has accelerated the rapid development of semiconductor integrated circuits. Among them, the lead frame is the skeleton of the semiconductor integrated circuit. As the chip carrier of the integrated circuit or discrete device, the lead frame is a key structure that realizes the electrical connection between the lead-out end of the internal circuit of the chip and the external lead by means of a bonding gold wire, and forms an electrical circuit. Components, which act as a bridge to connect with external wires. A lead frame is mainly composed of two ...

Examples

Embodiment 1

[0041] refer to Figure 1 to Figure 5 , a semiconductor packaging structure molding method, it comprises the following steps:

[0042] Prepare the lead frame 1: a semi-etched area 23 is provided around the chip holder 21 of the lead frame 1, the first pin 22 is connected to the chip holder 21, and the electrode of the chip holder 21 is directly connected to the first pin 22, and the first pin 22 is connected to the first pin 22. The pin 22 is provided with a first tin climbing hole 24, and the lead frame 1 is also provided with a positioning groove 25, a pin identification hole 26 and a first connecting rod 27;

[0043] Welding the chip 3: using the bonding material 5 to weld the chip 3 on the chip holder 21;

[0044] Prepare the heat sink frame 2: the heat sink frame 2 is provided with a back half-etched area 41 and a front half-etched area 42, and is provided with a second pin 43 and a third pin 44, and the second pin 43 and the third pin The pins 44 are all provided with ...

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