1761results about How to "Efficient heat dissipation" patented technology

A socket fixed to a heat sink holds a card-type LED module formed by integrating LED elements. The socket (6) includes: a frame structure for holding the LED module (1000) with its light source unit exposed through the frame opening; and a pressing member positioned around the opening for pressing the back surface of the LED module against the heat sink (2122). The socket may include a structure including a lower member (61) placed on a heat sink and an upper frame member (62) holding the LED module with its light source unit (1002) exposed through the frame opening. The upper member supported by the lower member via a hinge can open / close, and includes a pressing unit pressing the LED module set in the open state, against the lower member (61). The lower member (61) includes, in its main part, a lock unit (63) directly or indirectly lock the upper member (62) when the upper member is closed.

The invention discloses a high heat-conducting thin graphene-based composite material, as well as a preparation method and an application thereof. The composite material comprises a base body component and a packing component, wherein the base body component and the packing component respectively include thin graphene, polymer and / or polymer monomer and a high heat-conducting material; the preparation method comprises a step of compounding the base body component with the packing component; the compounding method comprises fusing, ball-milling, solution blending, electrostatic spinning, solution spinning, melt-spinning, extruding by double screws, mixing by an open mill or powder metallurgy. The polymer, the thin graphene, the traditional high heat-conducting material and the like are compounded by a simple process, so as to form the product with excellent heat conducting property, and good mechanical and electrical properties. Therefore, the process is easy to perform and control, and cost is low; and the obtained product has a wide application prospect in the aspects such as efficient heat conduction and radiation.

The present invention relates to a method of manufacturing the light emitting component of a VECSEL and the corresponding VECSEL. In the method a layer stack (2) is epitaxially grown on a semiconductor substrate (1). The layer stack comprises an active region (4), an upper distributed Bragg reflector (5) and a n- or p-doped current injection layer (13) arranged between the active region (4) and the semiconductor substrate (1). A mechanical support (6) or submount is bonded to an upper side of the layer stack (2) and the semiconductor substrate (1) is subsequently removed. A metallization layer (7) is optionally deposited on the lower side of the layer stack (2) and an optically transparent substrate (8) is bonded to this lower side. The proposed method allows the manufacturing of such a component in a standard manner and results in a VECSEL with a homogenous current injection and high efficiency of heat dissipation.

The invention relates to a process for the manufacture of ethylene polymers and copolymers in which ethylene is compressed in a primary compressor at a throughput of at least 55 tonnes / hour, mixed with recycled ethylene and further compressed in a two-stage reciprocating secondary compressor having at least 14 cylinders to a pressure of at least 2300 bar at a throughput of at least 120 tonnes / hour, heating at least a portion of that ethylene to a temperature of at least 95° C. and introducing it into a tubular reactor of diameter at least 65 mm and a length of at least 1500 m, introducing initiator in at least three reaction zones to give a conversion of at least 28% and maintaining a pressure drop over the reactor to maintain a flow velocity of at least 6 m / s.

A light emitting diode (LED) lighting luminaire designed to have detachable components for convenience and low cost in the luminaire maintenance including a heat dissipation means that includes detachable upper and lower sections, where the upper section has a top central recess of space positioned by horizontal heat dissipation fins and a driver that is surround by longitudinal fins for efficient dissipation of heat generated by an LED lighting source to thereby effectively cool the LED lighting source and driver.

A retrofit light emitting diode (LED) lighting luminaire designed to have detachable and replaceable components for convenience and low cost in the luminaire maintenance including a heat dissipation member that includes detachable upper and lower sections with aligned radially extending fins, and a driver retained within the luminaire. The LED chip is retained against a surface of the lower heat dissipation member so that heat from the LED is transmitted to the radially extending fins to thereby effectively cool the LED lighting source and driver.

The invention relates to an x-ray anode and a process for its manufacture. The x-ray anode is characterized in that the anode material is embodied as a layer on a diamond window. The x-ray anode is preferably used with x-ray units which require as selective as possible x-radiation production to achieve as high as possible radiation intensity. Use in x-ray microscopes in which a high radiation intensity guarantees the highest resolutions is particularly preferred.

A cryoprobe system utilizing a monolithic, insulated, hand-held thermal mass having an exposed tip for cryosurgical applications and the like, as well as a heat extraction base configured to interface with the thermal mass to quickly and efficiently reduce the heat of the thermal mass to cryogenic temperatures. The heat extraction base of the preferred embodiment of the present invention is configured to interface with the tip of the thermal mass, such that the tip plugs in securely to the base, to permit an efficient thermal transfer of heat from the thermal mass through the base via a heat exchange system communicating with the base which employs a low temperature cryo-refrigeration unit. The cryo-refrigeration unit may comprise a single low temperature cooling unit to reduce the temperature of the base to around minus one hundred degrees Centigrade utilizing off-the-shelf cryogenic refrigeration methods, or may utilize a series of more conventional refrigeration units in a primary and secondary heat extraction arrangement, which method may further utilize thermocouple or Peltier effect device assist to further reduce the temperature of the heat extraction base to the required temperature. Also claimed is the method of cryosurgery employing the device(s) of the present invention.

Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body.

A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

A connector (100) for connecting a component (102) to a heat sink (104), wherein the connector (100) is formed as a female part of a bayonet coupling enclosing an opening (106) for receiving one of the component (102) and the heat sink (104). Further, the connector (100) in use is arranged to ensure direct thermal contact between the component (102) and the heat sink (104) in the opening (106).

A developer carrier for carrying a developer, the developer carrier comprises: an opposing region that opposes a latent image-carryable region on an image carrier, and a solid portion that is solid at an end portion of the developer carrier in a longitudinal direction thereof; wherein an end of the solid portion, which is on a side of a center of the developer carrier in the longitudinal direction, is located closer to the center of the developer carrier than an edge of the opposing region.

A semiconductor image sensor module and a method for manufacturing thereof as well as a camera and a method for manufacturing thereof are provided in which a semiconductor image sensor chip and an image signal processing chip are connected with a minimum parasitic resistance and parasitic capacity and efficient heat dissipation of the image signal processing chip and shielding of light are simultaneously obtained. A semiconductor image sensor module 1 at least includes a semiconductor image sensor chip 2 having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip 3 for processing image signals formed in the semiconductor image sensor chip 2, wherein a plurality of bump electrodes 15a are formed on a first main surface, a plurality of bump electrodes 15b are formed on the image signal processing chip 3, both the chips 2 and 3 are formed to be laminated through heat dissipating means 4 and the plurality of bump electrodes 15a of the semiconductor image sensor chip 2 and the plurality of bump electrodes 15b on the image signal processing chip 3 are electrically connected.

An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips.

A lighting fixture utilizing LED light sources for illumination of commercial, outdoor and other large area applications incorporates efficient heat dissipation and improved convective air flow. An integrated heat transfer assembly is disclosed that is configured to enhance heat dissipation by providing an efficient thermal conductive pathway for radiation of heat to an external environment. The lighting fixture body is configured with a lens body and heat sink having a chimney tube with internally facing finned heat sink arrangement for providing enhanced convective air flow through the light fixture body. When the heat sink transfers heat from the LED light sources during operation so as to create heated air surrounding the heat sink, ambient air is drawn through the chimney and the heated air is exhausted through air gaps so as to create a conductive air current with the environment. The heat sink fins are configured to enhance the natural air draw through the chimney by tapering the surface areas of the fins.

The present invention provides an LED light source module design featured with efficient heat dissipation. This invention comprises a printed circuit board of thickness less than 400 μm, installed with an LED array which is composed of multiple high powers, super bright emitter LEDs. The thinner version of the printed circuit provides shorter route for faster thermal conductivity; and thus promotes the efficiency for heat dissipation. With its bendable flexibility, the thinner version of the printed circuit board can accommodate and well affix to the inner side of any shape of lighting fixture rack. This further enhances the heat dissipation for varieties of lighting fixture rack design.

Provided are a vertical-type light emitting device and a method of manufacturing the same. The light emitting device includes a p-type semiconductor layer, an active layer, and an n-type semi-conductor layer that are stacked, a cover layer disposed on a p-type electrode layer to surround the p-type electrode layer, a conductive support layer disposed on the cover layer, and an n-type electrode layer disposed on the n-type semiconductor layer.

The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.

A cryoprobe system utilizing a monolithic, insulated, hand-held thermal mass having an exposed tip for cryosurgical applications and the like, as well as a heat extraction base configured to interface with the thermal mass to quickly and efficiently reduce the heat of the thermal mass to cryogenic temperatures. The heat extraction base of the preferred embodiment of the present invention is configured to interface with the tip of the thermal mass, such that the tip plugs in securely to the base, to permit an efficient thermal transfer of heat from the thermal mass through the base via a heat exchange system communicating with the base which employs a low temperature cryo-refrigeration unit. The cryo-refrigeration unit may comprise a single low temperature cooling unit to reduce the temperature of the base to around minus one hundred degrees Centigrade utilizing off-the-shelf cryogenic refrigeration methods, or may utilize a series of more conventional refrigeration units in a primary and secondary heat extraction arrangement, which method may further utilize thermocouple or Peltier effect device assist to further reduce the temperature of the heat extraction base to the required temperature. Also claimed is the method of cryosurgery employing the device(s) of the present invention, and a heat pipe appliance to engage a remote treatment area.

A battery cartridge includes a pair of outer frame members for receiving unit cells and an inner frame member disposed between the outer frame members. The unit cells are mounted between the outer and inner frame members. The inner frame member has a plurality of through-holes, which communicate with the outside while the unit cells are mounted between the outer and inner frame members. An opened type battery module includes such a battery cartridge. The battery cartridge and the battery module have a high structural integration and mechanical strength. Consequently, the present invention has the effect of minimizing the size of a battery system, stably mounting unit cells having low mechanical strength, and effectively removing heat from the unit cells.

A process for producing an olefin polymer with high polymerization activity without using an expensive co-catalyst or using a limited amount of the co-catalyst, more particularly a process for producing a high molecular weight (co)polymer with high polymerization activity even at a high polymerization temperature which is more practical.At least one olefin is polymerized by means of a polymerization catalyst comprising at least one transition metal compound selected from transition metal compounds which have a substituted indenyl group, represented by a certain specific chemical formula, and an organoaluminum compound represented by the formula Al(R)3.