High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof

A technology of thin-layer graphene and composite materials, applied in the field of material science, can solve the problems of unsatisfactory performance, large amount of addition, high cost, etc., and achieve the effects of low cost, good mechanics, and excellent thermal conductivity

Inactive Publication Date: 2013-05-29
苏州格瑞丰纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these high thermal conductivity materials still have defects such as high

Method used

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  • High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Example 1 Preparation of graphene / graphite / acrylic resin thermally conductive composite

[0026] 1) Take 1g of thin-layer graphene and add it to 28g of acrylic resin. After mechanical stirring for 15 minutes, add 5g of phosphorous flake graphite and continue mechanical stirring for 45 minutes to obtain a thermally conductive composite, which is processed into a film to form a thermally conductive adhesive , The thermal conductivity is greater than 1.5w / mK.

[0027] 2) Take 1.5g of thin layer graphene and add it to 25g of acrylic acid resin. After mechanical stirring for 15 minutes, add 13.5g of graphite flakes and continue stirring for 45 minutes to obtain a thermally conductive resin composite, which is processed into a film , To form a thermally conductive adhesive with a thermal conductivity of 2W / mK.

Example Embodiment

[0028] Example 2 Preparation of graphene / magnesium oxide / silicone rubber thermally conductive composite

[0029] 1) 0.5g thin layer graphene is added to 50g silicone rubber, mechanically stirred for 15 minutes, then 9.5g magnesium oxide powder is added, and mechanical stirring is continued for 45 minutes, then 10g of curing agent is added, and cured at 70°C for 12 hours to obtain a thermally conductive composite Things. The composite is processed into a thermal pad, the thermal conductivity is greater than 3W / mK

[0030] 2) 1g thin-layer graphene is added to 45g silicone rubber, mechanically stirred for 15 minutes, then 9g of magnesium oxide powder is added, and stirring is continued for 45 minutes, then 9g of curing agent is added, and cured at 70°C for 12 hours to obtain a thermally conductive silicone rubber compound . The composite is processed into a thermal pad with a thermal conductivity greater than 3.5W / mK.

Example Embodiment

[0031] Example 3 Graphene / Alumina / Epoxy Thermal Conductive Composite

[0032] 1) 1.5g thin-layer graphene is added to 50g epoxy resin, after mechanical stirring for 15 minutes, 8.5g alumina is added, and stirring is continued for 45 minutes, 50g curing agent is added, and cured for 12 hours to obtain epoxy thermal conductive composite . The composite is processed into a block, the thermal conductivity is greater than 1.5W / mK

[0033] 2) 1g thin layer graphene is added to 60g epoxy resin, after mechanical stirring for 15 minutes, 9g alumina is added, stirring is continued for 45 minutes, 60g curing agent is added, and cured for 12 hours to obtain an epoxy resin thermally conductive composite. The composite is processed into blocks, and the thermal conductivity is greater than 1.2W / mK.

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Abstract

The invention discloses a high heat-conducting thin graphene-based composite material, as well as a preparation method and an application thereof. The composite material comprises a base body component and a packing component, wherein the base body component and the packing component respectively include thin graphene, polymer and/or polymer monomer and a high heat-conducting material; the preparation method comprises a step of compounding the base body component with the packing component; the compounding method comprises fusing, ball-milling, solution blending, electrostatic spinning, solution spinning, melt-spinning, extruding by double screws, mixing by an open mill or powder metallurgy. The polymer, the thin graphene, the traditional high heat-conducting material and the like are compounded by a simple process, so as to form the product with excellent heat conducting property, and good mechanical and electrical properties. Therefore, the process is easy to perform and control, and cost is low; and the obtained product has a wide application prospect in the aspects such as efficient heat conduction and radiation.

Description

technical field [0001] The invention particularly relates to a high thermal conductivity thin-layer graphene-based composite material, its preparation method and application, and belongs to the field of material science. Background technique [0002] Due to the characteristics of easy processing, light weight, stable properties, and low cost, polymers are widely used in production and life, especially in thermal interface. However, their thermal conductivity is poor, and it is difficult to meet the requirements of practical applications. Therefore, it is necessary to add some high thermal conductivity fillers to increase its thermal conductivity. Currently commonly used fillers are boron nitride, aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride and some metal particles. However, these high thermal conductivity materials still have defects such as high cost and large amount of addition, and the performance cannot meet the requirements. Contents of the inv...

Claims

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Application Information

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IPC IPC(8): C08K3/04C08K7/00C08K7/06C08K3/38C08K3/28C08K3/34C08K3/08C08K3/22C08K3/02C08L79/02C08L79/04C08L65/00C08L63/00C08L83/04C08L23/06C08L23/12C08L27/06C08L27/16C08L27/18C08L39/06C08L29/04C08L33/02C08L61/06C08L33/12C08L71/08C08L69/00C08L79/08C08L77/00C09K5/14
Inventor 刘立伟李伟伟邱胜强郭玉芬魏相飞高嵩龙明生刘平
Owner 苏州格瑞丰纳米科技有限公司
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