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826results about How to "Good thermal conductivity" patented technology

High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof

The invention discloses a high heat-conducting thin graphene-based composite material, as well as a preparation method and an application thereof. The composite material comprises a base body component and a packing component, wherein the base body component and the packing component respectively include thin graphene, polymer and / or polymer monomer and a high heat-conducting material; the preparation method comprises a step of compounding the base body component with the packing component; the compounding method comprises fusing, ball-milling, solution blending, electrostatic spinning, solution spinning, melt-spinning, extruding by double screws, mixing by an open mill or powder metallurgy. The polymer, the thin graphene, the traditional high heat-conducting material and the like are compounded by a simple process, so as to form the product with excellent heat conducting property, and good mechanical and electrical properties. Therefore, the process is easy to perform and control, and cost is low; and the obtained product has a wide application prospect in the aspects such as efficient heat conduction and radiation.
Owner:苏州格瑞丰纳米科技有限公司

Thermal conductive molding compound and preparation method thereof

The invention discloses a thermal conductive molding compound and a preparation method thereof. The thermal conductive molding compound consists of the following components by weight percent: 15-40% of thermal conductive filler A, 10-30% of thermal conductive filler B, 1-5% of thermal conductive filler C, 5-15% of reinforcing component, 0.05-0.5% of surface modifier and 0-2% of other additives. The preparation method comprises the following steps: adding the thermal conductive filler B in a mixer, adding the surface modifier for mixing, and then adding the thermal conductive filler C for further mixing to obtain a mixture I; adding the thermal conductive filler A in a high-speed mixer, and adding the surface modifier for mixing to obtain a mixture II; after uniformly mixing a plastic matrix with other additives, adding the mixture of the plastic matrix and other additives from the main feeding port of a twin-screw extruder; adding the mixture I and the mixture II from the main feeding port or a feeding port on one side downstream of the extruder; independently adding the reinforcing component from a feeding port on the other side downstream of the extruder; and obtaining the thermal conductive molding compound from the twin-screw extruder. The thermal conductive molding compound has excellent thermal conductivity and good mechanical property.
Owner:KINGFA SCI & TECH CO LTD +1

Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive

The invention discloses a conductive adhesive for LED (light emitting diode) packaging. The conductive adhesive consists of the following raw materials in percentage by weight: 75 to 95 percent of conductive powder, 2 to 12 percent of epoxy resin, 1 to 10 percent of epoxy diluting agent, 1 to 3 percent of curing agent, 0 to 1 percent of curing accelerator, and 0.5 to 2 percent of coupling agent. The LED conductive adhesive provided by the invention has superior performance and good heat conduction and electric conduction effects and can fully meet operating requirements of a high-brightness high-power LED chip.
Owner:YANTAI DARBOND TECH

Composite shape-stabilized phase change material with light absorption and conductive properties and preparation method thereof

The invention provides a composite shape-stabilized phase change material with light absorption and conductive properties and a preparation method thereof. The material consists of 5-15 percent of porous carbon material and 85-95 percent of organic phase change material distributed in the porous carbon material, wherein the organic phase change material is distributed in the porous carbon material. The method comprises the following steps of: preparing a carbon material with the three-dimensional communicating porous property; heating and fusing the organic phase change material and casting the organic phase change material on the porous carbon material; shocking the mixture at the temperature of 100-120 DEG C for a certain time so as to uniformly distribute the organic phase change material in the porous carbon material; and grinding the mixture at room temperature, and pressing and forming the material in a die. The composite shape-stabilized phase change material has high heat conduction, light absorption and conductivity; the heat transfer efficiency of the phase change material can be obviously improved; and meanwhile, the solar energy and electric energy can be converted into heat energy at high efficiency and are stored in the phase change material, and the material is a photoelectric composite shape-stabilized phase change material.
Owner:PEKING UNIV

Foam metal composite phase change material heat storage temperature-difference power generation device

The invention relates to a foam metal composite phase change material heat storage temperature-difference power generation device. The device comprises a plurality of small separated sealed containers arranged on the outer wall of a high-temperature flue gas pipeline in a sleeved mode. The small separated sealed containers are filled with foam metal composite phase change materials. The outer sides of the small separated sealed containers are closely connected with the hot end of a temperature-difference thermoelectric power generation module through a thermally-conductive adhesive. The shape of the inner sides of the small separated sealed containers is the same as the shape of the outer wall of the high-temperature flue gas pipeline, and the inner sides of the small separated sealed containers make close contact with the outer wall of the high-temperature flue gas pipeline; the outer sides of the small separated sealed containers are planes connected with the hot end of the temperature-difference thermoelectric power generation module, and the cold end of the temperature-difference thermoelectric power generation module is connected with a radiating block. The radiating block is filled with circulating cooling water, and the outer side of the radiating block is connected with radiating fins. According to the device, the foam metal composite phase change heat storage materials are combined with temperature-difference thermoelectric power generation devices to generate power, and therefore the efficiency of temperature-difference thermoelectric power generation can be effectively improved. The device can be conveniently installed on a boiler pipeline or an automobile exhaust pipeline and is reliable in power generation performance.
Owner:CHINA UNIV OF GEOSCIENCES (WUHAN)

Resin composition with high-heat, high-glass transition temperature for printed circuit board, prepreg and coating substance

The invention relates to resin combination with high thermal conductivity and glass transition temperature used for a printed circuit board. According to the weight percentage, the resin combination comprises brominated epoxy resin occupying 20 percent to 70 percent, hardening agent occupying 1 percent to 10 percent, accelerating agent occupying 0.1 percent to 10 percent, inorganic powder occupying 0 percent to 20 percent, high heat conducting powder occupying 5 percent to 85 percent, and processing auxiliary agent occupying 0 percent to 10 percent. The resin combination has the advantages of high glass transition temperature and heat conducting performance, excellent thermal resistance and flame resistance, which can be applied to the heat conducting insulating layer of the printed circuit board after being made into a high heat conducting preimpregnated body through a containing and soaking way or into a high heat conducting coating through a coating way, thus the printed circuit board has high heat conducting performance, and the heat quantity generated by the operation of the electronic elements on the printed circuit board can be rapidly dissipated to enhance the service life and the stability of the electronic elements.
Owner:NANYA PLASTICS CORP

High thermal-conductivity polymer composite material and preparation method thereof

The invention discloses a high thermal-conductivity polymer composite material. The high thermal-conductivity polymer composite material comprises the following components in percentage by weight: 60%-95% of epoxy resin and 5%-40% of hyperbranched polyaryl amide grafted ceramic thermal-conductivity filler particles. The invention further discloses a preparation method of the high thermal-conductivity polymer composite material. According to the high thermal-conductivity polymer composite material and the preparation method thereof disclosed by the invention, the hyperbranched polyaryl amide grafted ceramic thermal-conductivity filler particles and the epoxy resin are used materials to obtain the high thermal-conductivity functional ceramic thermal-conductivity filler/epoxy resin polymer composite material; and the composite material has high thermal conductivity, and higher thermal conductivity and heat engine performances in comparison with the conventional filler direct blending process. The polymer composite material disclosed by the invention has excellent thermal conductivity and can be used for greatly improving the thermal conductivity and mechanical performances of the polymer matrix under low thermal-conductivity filler mixing amount, and therefore, the polymer composite material has an extensive application value in the fields of machinery, electronics, chemical engineering and the like. The preparation method disclosed by the invention is simple and easy to operate, strong in controllability and capable of realizing large-scale production.
Owner:SHANGHAI JIAO TONG UNIV

Halogen-free flame retardant heat conduction polyurethane pouring sealant and preparation method thereof

The invention relates to the technical field of a polyurethane pouring sealant, and particularly relates to a halogen-free flame retardant heat conduction polyurethane pouring sealant. The halogen-free flame retardant heat conduction polyurethane pouring sealant is formed by uniformly mixing 100 parts by mass of component A and 15-25 parts by mass of component B, wherein the component A comprises 30-45 parts by mass of polymer polyhydric alcohol, 15-25 parts by mass of halogen-free flame retardant, 40-55 parts by mass of heat conducting filler, 0.1-2 parts by mass of defoaming agent and 0.1-2 parts by mass of catalyst, the component B is isocyanate, and the polymer polyhydric alcohol is one of or a mixture of castor oil and polyether polyol. The halogen-free flame retardant heat conduction polyurethane pouring sealant does not contain halogen and has high conductivity of heat, high flame resistance and strong mechanical property. Meanwhile, the invention also discloses a preparation method of the halogen-free flame retardant heat conduction polyurethane pouring sealant. The preparation method is simple in process and has strong operability.
Owner:FUJIAN RUISEN CHEM

Metal laser selective melting forming double-piston controllable preheating powder cylinder

The invention discloses a metal laser selective melting forming double-piston controllable preheating powder cylinder capable of respectively working in two states of single piston and double pistons. When the powder cylinder works in the state of single piston, firstly, a large piston basal plate in a forming cylinder is leveled; and then, the periphery of a cylinder body is heated by using a cylinder body heating ring, and a piston heating plate is used for heating a piston cover plate to realize indirect heating of a forming cylinder and metal powder in a powder feeding cylinder. When the powder cylinder works in the state of double pistons, firstly, a small piston basal plate is leveled; and then, powder in a small piston forming cylinder and a small piston powder feeding cylinder is uniformly heated by using the cylinder body heating ring and the piston heating plate. The powder cylinder adopts an integrated double-piston design; a small piston can be replaced and disassembled to realize the laser forming of metal components with different sizes; powder is saved; and meanwhile, the powder cylinder can be heated in all directions, so that the controllable powder preheating is realized, the powder heating is uniform, the temperature gradient is improved, and the deformation and the split of the components are reduced.
Owner:XI AN JIAOTONG UNIV

Method for Improving Thermal Conductivity in Micro-Fluid Ejection Heads

InactiveUS20080079779A1Improve thermal conductivity characteristicDissipate heatPrintingThermal conductivityMaterials science
Methods for improving the thermal conductivity of a substrate for a micro-fluid ejection head and micro-fluid ejection heads are provided. One such head includes a substrate having a thermal conductivity ranging from about 1.4 W / m-° C. to about 148 W / m-° C., a fluid ejection actuator, and a thermal bus thermally adjacent to the substrate and configured to dissipate heat associated with the operation of the actuator. Exemplary modified substrates have improved thermal conductivity characteristics as compared to a corresponding substrate not modified to include the thermal bus.
Owner:LEXMARK INT INC

In-situ polymerization preparation method of spinning-level high-heat-conductivity graphene/nylon composite material

ActiveCN105949760AGood thermal conductivityExcellent spinnabilityGrapheneCvd grapheneElectrospinning
The invention relates to an in-situ polymerization preparation method of a spinning-level high-heat-conductivity graphene/nylon composite material, belonging to the field of high-polymer composite materials. The in-situ polymerization preparation method comprises the following steps: diluting and dispersing a graphene oxide concentrated solution and water, and carrying out ultrasonic oscillation to obtain a graphene oxide dispersion solution; adding the graphene oxide dispersion solution into a nylon monomer, heating and uniformly mixing, and carrying out stepwise heating polymerization; and carrying out after-treatment to obtain the graphene/nylon composite material. The in-situ polymerization method is adopted to solve the problems of poor dispersity and high aggregation tendency of the graphene in the nylon monomer, and the nylon monomer and the oxygen-containing functional group of the graphene oxide can form a firm chemical bond. The synthesized graphene/nylon composite material has favorable heat conductivity, and the heat conductivity coefficient is 0.23-6.12 W/(m.K). Besides, the graphene/nylon composite material has favorable spinning properties, and can be used for spinning by melt spinning, electrostatic spinning or any other spinning process.
Owner:BEIJING UNIV OF CHEM TECH

Shape-stabilized phase change energy storage material for building and preparation method thereof

The invention relates to a shape-stabilized phase change energy storage material for building and a preparation method thereof. The material provided by the invention comprises components of: by weight, 70-85% of a composite phase change energy storage material with its melting point being 18-30 DEG C and 15-30% of gesso. The composite phase change energy storage material with its melting point being 18-30 DEG C is composed of a porous matrix and a mixed fatty acid phase change material, wherein the mass ratio of the porous matrix to the mixed fatty acid phase change material is 1:4-1:6. At the temperature of 60-80 DEG C, the porous matrix is added in the molten lauric acid-capric acid mixed fatty acid to prepare a composite phase change material. Then, gesso is mixed with the composite phase change material to prepare a shape-stabilized fatty acid phase change energy storage material with a more stable adsorption property. The prepared shape-stabilized phase change energy storage material has good thermal conductivity, good adsorption stability and good material plasticity, will not cause seepage at high temperature, is easy to mix with a building material, and has a good application prospect.
Owner:NANJING UNIV OF TECH +1

High-thermal-conductivity PP (polypropylene)-based composite material and preparation method thereof

The invention discloses a high-thermal-conductivity PP-based composite material, which comprises 60% to 80% of PP, 1% to 20% of surface-modified efficient thermal conduction agents, 1% to 5% of compatilizers, 0.5% to 1% of antioxidants and 0.5% to 1% of coupling agents in percentage by weight. The preparation method of the high-thermal-conductivity PP-based composite material comprises steps of mixing materials uniformly, then placing the mixed materials in an extruder, fusing and extruding, and granulating the extruded materials. According to the high-thermal-conductivity PP-based composite material and the preparation method thereof, a product has good thermal conductivity and can be applied to cooling components of lighting and communication systems.
Owner:GUANGDONG HIGH & NEW ENG PLASTICS

Multi-beam tile type TR component

The invention discloses a multi-beam tile type TR component, which can separately set an amplification processing module and a multi-beam amplitude-phase modulation module in a TR component, and thencan integrate a multi-beam forming function and an amplitude-phase modulation function through the multi-beam amplitude-phase modulation module. Thereby, the miniaturization and high-level integrationof a multi-beam phased array TR component can be achieved; and meanwhile, as a multi-beam vector modulation chip in the technical scheme of the embodiment of the application can perform independent amplitude modulation and phase modulation on multi-beam signals, great flexibility and scalability can be brought to the design of the multi-beam TR component, the size, weight and versatility of TR component application system equipment can be adjusted according to actual needs, and the technical effects of very extensive application values and applicability can be achieved in the field of microwave and millimeter wave radar communication with strict requirements for the above applications.
Owner:CHENGDU T-RAY TECH CO LTD
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