827results about How to "Good thermal conductivity" patented technology

The invention discloses a high heat-conducting thin graphene-based composite material, as well as a preparation method and an application thereof. The composite material comprises a base body component and a packing component, wherein the base body component and the packing component respectively include thin graphene, polymer and / or polymer monomer and a high heat-conducting material; the preparation method comprises a step of compounding the base body component with the packing component; the compounding method comprises fusing, ball-milling, solution blending, electrostatic spinning, solution spinning, melt-spinning, extruding by double screws, mixing by an open mill or powder metallurgy. The polymer, the thin graphene, the traditional high heat-conducting material and the like are compounded by a simple process, so as to form the product with excellent heat conducting property, and good mechanical and electrical properties. Therefore, the process is easy to perform and control, and cost is low; and the obtained product has a wide application prospect in the aspects such as efficient heat conduction and radiation.

The invention discloses a thermal conductive molding compound and a preparation method thereof. The thermal conductive molding compound consists of the following components by weight percent: 15-40% of thermal conductive filler A, 10-30% of thermal conductive filler B, 1-5% of thermal conductive filler C, 5-15% of reinforcing component, 0.05-0.5% of surface modifier and 0-2% of other additives. The preparation method comprises the following steps: adding the thermal conductive filler B in a mixer, adding the surface modifier for mixing, and then adding the thermal conductive filler C for further mixing to obtain a mixture I; adding the thermal conductive filler A in a high-speed mixer, and adding the surface modifier for mixing to obtain a mixture II; after uniformly mixing a plastic matrix with other additives, adding the mixture of the plastic matrix and other additives from the main feeding port of a twin-screw extruder; adding the mixture I and the mixture II from the main feeding port or a feeding port on one side downstream of the extruder; independently adding the reinforcing component from a feeding port on the other side downstream of the extruder; and obtaining the thermal conductive molding compound from the twin-screw extruder. The thermal conductive molding compound has excellent thermal conductivity and good mechanical property.

A backlight assembly and a liquid crystal display device can discharge heat from the lamp unit to the outside or effectively dissipate the heat. The backlight assembly of the present invention includes a lamp unit, a receiving member for receiving the lamp unit, a first heat dissipation member disposed below the receiving member, and a second heat dissipation for wrapping around a lateral side of the receiving member and the first heat dissipation member. The lamp unit is disposed on an area corresponding to the lateral side of the receiving member. In one embodiment, the first heat dissipation member is a flat plate made of graphite and disposed on an outer side of the bottom of the receiving member. The second heat dissipation member is metal with good thermal conductivity in close contact with the first heat dissipation member and the lateral side of the receiving member where the lamp unit is disposed. Thus, the heat discharged from the lamp unit can be distributed uniformly over the entire area of the receiving member. In addition, the lateral side of the receiving member where the lamp unit is disposed can be replaced with the second heat dissipation member.

A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

The invention relates to the technical field of novel coating preparation and in particular relates to an aqueous coating with high heat-dissipation performance which comprises the following components: 30-60 parts of aqueous resin, 1-10 parts of graphene, 10-30 parts of packing, 10-20 parts of an aid and 30-60 parts of a solvent, wherein the radial size of the graphene is 1-100 microns; and the graphene consists of 1-3 layers. The high heat-dissipation performance aqueous coating provided by the invention is good in heat dissipation effect, environmentally friendly and low in cost.

The invention discloses a conductive adhesive for LED (light emitting diode) packaging. The conductive adhesive consists of the following raw materials in percentage by weight: 75 to 95 percent of conductive powder, 2 to 12 percent of epoxy resin, 1 to 10 percent of epoxy diluting agent, 1 to 3 percent of curing agent, 0 to 1 percent of curing accelerator, and 0.5 to 2 percent of coupling agent. The LED conductive adhesive provided by the invention has superior performance and good heat conduction and electric conduction effects and can fully meet operating requirements of a high-brightness high-power LED chip.

The invention discloses graphene heat radiation paint. The graphene heat radiation paint comprises the following ingredients, by weight, 40-80 parts of high-molecular resin, 5-15 parts of graphene, 1-8 parts of one-dimensional nanomaterials, 1-8 parts of heat conduction metal powder, 0.5-5 parts of dispersing agents, 0.5-5 parts of antifoaming agents and 100-200 parts of inert solvent. The heat conduction metal powder is at least one selected from silver powder, copper powder and aluminum powder and the granularity is 1-20 micrometers. The above paint has good heat radiation and heat conduction functions. The invention also discloses a preparation method for the graphene heat radiation paint. The preparation method mainly comprises processes of stirring, grinding and reblending. Operation is simple, and the cost is low. The graphene heat radiation paint is mainly applied in heat radiation of daily electronic products and also can be applied in spaceflight electronic devices with high requirements because of good heat conduction and heat radiation functions.

A light emitting diode apparatus includes a heat dissipating substrate, a composite layer, an epitaxial layer, a first electrode and a second electrode. The composite layer includes a reflective layer, a transparent conductive layer and a patterned insulating thermoconductive layer, which is disposed between the reflective layer and the transparent conductive layer. The composite layer is disposed between the heat dissipating substrate and the epitaxial layer and allows currents to concentrate to the reflective layer or the transparent conductive layer and then to be diffused evenly through the transparent conductive layer. The epitaxial layer includes a first semiconductor layer electrically connected with the first electrode, an active layer and a second semiconductor layer electrically connected with the second electrode.

The invention provides a composite shape-stabilized phase change material with light absorption and conductive properties and a preparation method thereof. The material consists of 5-15 percent of porous carbon material and 85-95 percent of organic phase change material distributed in the porous carbon material, wherein the organic phase change material is distributed in the porous carbon material. The method comprises the following steps of: preparing a carbon material with the three-dimensional communicating porous property; heating and fusing the organic phase change material and casting the organic phase change material on the porous carbon material; shocking the mixture at the temperature of 100-120 DEG C for a certain time so as to uniformly distribute the organic phase change material in the porous carbon material; and grinding the mixture at room temperature, and pressing and forming the material in a die. The composite shape-stabilized phase change material has high heat conduction, light absorption and conductivity; the heat transfer efficiency of the phase change material can be obviously improved; and meanwhile, the solar energy and electric energy can be converted into heat energy at high efficiency and are stored in the phase change material, and the material is a photoelectric composite shape-stabilized phase change material.

The invention relates to a foam metal composite phase change material heat storage temperature-difference power generation device. The device comprises a plurality of small separated sealed containers arranged on the outer wall of a high-temperature flue gas pipeline in a sleeved mode. The small separated sealed containers are filled with foam metal composite phase change materials. The outer sides of the small separated sealed containers are closely connected with the hot end of a temperature-difference thermoelectric power generation module through a thermally-conductive adhesive. The shape of the inner sides of the small separated sealed containers is the same as the shape of the outer wall of the high-temperature flue gas pipeline, and the inner sides of the small separated sealed containers make close contact with the outer wall of the high-temperature flue gas pipeline; the outer sides of the small separated sealed containers are planes connected with the hot end of the temperature-difference thermoelectric power generation module, and the cold end of the temperature-difference thermoelectric power generation module is connected with a radiating block. The radiating block is filled with circulating cooling water, and the outer side of the radiating block is connected with radiating fins. According to the device, the foam metal composite phase change heat storage materials are combined with temperature-difference thermoelectric power generation devices to generate power, and therefore the efficiency of temperature-difference thermoelectric power generation can be effectively improved. The device can be conveniently installed on a boiler pipeline or an automobile exhaust pipeline and is reliable in power generation performance.

The invention discloses a low-density thermal conductive silicone pad and a preparation method thereof. The low-density thermal conductive silicone pad is prepared from the following components: 100 parts of vinyl silicone oil, 0-25 parts of silicon resin, 0-30 parts of crude rubber, 1-25 parts of a cross-linking agent, 0.01-0.5 part of a catalyst, 50-1,200 parts of a thermal conductive filler, 10-200 parts of a flame-retardant filler, 0-100 parts of a low-density filler and 0.001-0.1 part of an inhibitor. As a proper amount of the low-density filler is contained, together with the proper amounts of the thermal conductive filler, a reinforcing filler, the flame-retardant filler and other fillers, the thermal conductive silicone pad with good thermal conductivity, excellent flame-retardant and mechanical property and low density is prepared; compared with a common thermal conductive silicone pad at present, the low-density thermal conductive silicone pad has the advantages that the density is reduced by about 60%, the battery weight of an electric vehicle can be remarkably reduced, and application of the low-density thermal conductive silicone pad in the field of electric vehicles is greatly improved.

The invention relates to the technical field of a polyurethane pouring sealant, and particularly relates to a halogen-free flame retardant heat conduction polyurethane pouring sealant. The halogen-free flame retardant heat conduction polyurethane pouring sealant is formed by uniformly mixing 100 parts by mass of component A and 15-25 parts by mass of component B, wherein the component A comprises 30-45 parts by mass of polymer polyhydric alcohol, 15-25 parts by mass of halogen-free flame retardant, 40-55 parts by mass of heat conducting filler, 0.1-2 parts by mass of defoaming agent and 0.1-2 parts by mass of catalyst, the component B is isocyanate, and the polymer polyhydric alcohol is one of or a mixture of castor oil and polyether polyol. The halogen-free flame retardant heat conduction polyurethane pouring sealant does not contain halogen and has high conductivity of heat, high flame resistance and strong mechanical property. Meanwhile, the invention also discloses a preparation method of the halogen-free flame retardant heat conduction polyurethane pouring sealant. The preparation method is simple in process and has strong operability.

Methods for improving the thermal conductivity of a substrate for a micro-fluid ejection head and micro-fluid ejection heads are provided. One such head includes a substrate having a thermal conductivity ranging from about 1.4 W / m-° C. to about 148 W / m-° C., a fluid ejection actuator, and a thermal bus thermally adjacent to the substrate and configured to dissipate heat associated with the operation of the actuator. Exemplary modified substrates have improved thermal conductivity characteristics as compared to a corresponding substrate not modified to include the thermal bus.

The invention discloses an electronic equipment sealing structure which comprises a shell, wherein a circuit board with an electronic element is arranged in the shell; wire rods are introduced into the shell respectively from two ends of the shell and electrically connected with the circuit board; the shell comprises an upper shell and a cover board; an opening is formed on the bottom surface of the upper shell, and the cover board is covered at the opening of the upper shell; a soft encapsulation glue layer is encapsulated on the upper part of the inner cavity of the upper shell, and at least wraps a board body of the circuit board; and a hard encapsulation glue layer is encapsulated below the soft encapsulation glue layer. According to the electronic equipment sealing structure, a phenomenon of stress damage, caused by encapsulation glue, to the electronic element can be avoided. The invention also discloses an electronic power supply with the electronic equipment sealing structure, and an encapsulation method for the electronic power supply.

The invention relates to an in-situ polymerization preparation method of a spinning-level high-heat-conductivity graphene / nylon composite material, belonging to the field of high-polymer composite materials. The in-situ polymerization preparation method comprises the following steps: diluting and dispersing a graphene oxide concentrated solution and water, and carrying out ultrasonic oscillation to obtain a graphene oxide dispersion solution; adding the graphene oxide dispersion solution into a nylon monomer, heating and uniformly mixing, and carrying out stepwise heating polymerization; and carrying out after-treatment to obtain the graphene / nylon composite material. The in-situ polymerization method is adopted to solve the problems of poor dispersity and high aggregation tendency of the graphene in the nylon monomer, and the nylon monomer and the oxygen-containing functional group of the graphene oxide can form a firm chemical bond. The synthesized graphene / nylon composite material has favorable heat conductivity, and the heat conductivity coefficient is 0.23-6.12 W / (m.K). Besides, the graphene / nylon composite material has favorable spinning properties, and can be used for spinning by melt spinning, electrostatic spinning or any other spinning process.

The invention relates to a shape-stabilized phase change energy storage material for building and a preparation method thereof. The material provided by the invention comprises components of: by weight, 70-85% of a composite phase change energy storage material with its melting point being 18-30 DEG C and 15-30% of gesso. The composite phase change energy storage material with its melting point being 18-30 DEG C is composed of a porous matrix and a mixed fatty acid phase change material, wherein the mass ratio of the porous matrix to the mixed fatty acid phase change material is 1:4-1:6. At the temperature of 60-80 DEG C, the porous matrix is added in the molten lauric acid-capric acid mixed fatty acid to prepare a composite phase change material. Then, gesso is mixed with the composite phase change material to prepare a shape-stabilized fatty acid phase change energy storage material with a more stable adsorption property. The prepared shape-stabilized phase change energy storage material has good thermal conductivity, good adsorption stability and good material plasticity, will not cause seepage at high temperature, is easy to mix with a building material, and has a good application prospect.

The invention discloses a high-thermal-conductivity PP-based composite material, which comprises 60% to 80% of PP, 1% to 20% of surface-modified efficient thermal conduction agents, 1% to 5% of compatilizers, 0.5% to 1% of antioxidants and 0.5% to 1% of coupling agents in percentage by weight. The preparation method of the high-thermal-conductivity PP-based composite material comprises steps of mixing materials uniformly, then placing the mixed materials in an extruder, fusing and extruding, and granulating the extruded materials. According to the high-thermal-conductivity PP-based composite material and the preparation method thereof, a product has good thermal conductivity and can be applied to cooling components of lighting and communication systems.

A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a disk having relatively high thermal conductivity and heat spreading characteristics. The heat-conducting medium also includes a first recessed surface and an opposing second recessed surface. Extending from within each recessed surface is an array of heat conducting bristles to provide a plurality of contact points to the heat source and heat sink to aid in the transfer of heat. The recessed surfaces may be defined by a rim positioned circumferentially about the disk. The presence of the rim about each recessed surface acts to minimize the amount of pressure that may be exerted by the heat sink and the heat source against the bristles. A method for manufacturing the heat-conducting medium is also provided.

The invention discloses a multi-beam tile type TR component, which can separately set an amplification processing module and a multi-beam amplitude-phase modulation module in a TR component, and thencan integrate a multi-beam forming function and an amplitude-phase modulation function through the multi-beam amplitude-phase modulation module. Thereby, the miniaturization and high-level integrationof a multi-beam phased array TR component can be achieved; and meanwhile, as a multi-beam vector modulation chip in the technical scheme of the embodiment of the application can perform independent amplitude modulation and phase modulation on multi-beam signals, great flexibility and scalability can be brought to the design of the multi-beam TR component, the size, weight and versatility of TR component application system equipment can be adjusted according to actual needs, and the technical effects of very extensive application values and applicability can be achieved in the field of microwave and millimeter wave radar communication with strict requirements for the above applications.