17results about How to "Efficient heat conduction" patented technology

The utility model relates to PCB board processing technical field discloses a kind of PCB soft board processing heat curing equipment, including the processing box for the storage of PCB soft board, the lower end of the processing box is fixedly connected with the support frame for supporting processing box, hot air component for drying and curing to PCB soft board is installed in the processing box, and placing assembly for fixing PCB soft board is installed between the hot air component. The utility model realizes two-way heating by the hot air disc of symmetry up and down, makes PCB soft board double side synchronous heating, forms uniform temperature field, effectively prevents one-sided heating deformation, improves solvent evaporation and resin curing efficiency, and adopts knob type clamping mechanism cooperation rotation design, so that board material rotates at uniform speed in curing process, realizes three-dimensional heating, eliminates local overheating phenomenon, and heating uniformity deviation is lower, prevents material thermal deformation.

This application proposes a modified polyimide composite material and its preparation method, belonging to the field of polymer composite material technology, to solve the problems of poor thermal conductivity of existing PI materials, the need for blending with fillers to improve thermal conductivity, and the resulting interfacial compatibility issues and damage to the material's physical properties. The modified polyimide composite material includes a polyimide matrix and a three-dimensional covalently bonded hybrid network dispersed within the polyimide matrix. The surface of the three-dimensional covalently bonded hybrid network is modified with unreacted carboxyl groups and / or amino groups, which can form chemical bonds with the polyimide matrix. The three-dimensional covalently bonded hybrid network is composed of one-dimensional carbon nanotubes and two-dimensional boron nitride nanosheets covalently linked by bifunctional bridging molecules, and the bonding between the bifunctional bridging molecules and the carbon nanotubes and / or boron nitride nanosheets includes dynamic covalent bonds. The carbon nanotubes and / or boron nitride nanosheets are modified with amino groups. This network synergistically improves the mechanical, thermal, and electrical properties of the composite material.

This invention provides a low-temperature resistant energy storage battery for new energy vehicles, comprising a base housing as the basic installation structure; a bottom protective module that adapts to low-temperature heating and high-temperature heat dissipation requirements via a heating plate; a battery support tray that supports the battery module and guides airflow circulation via a support panel and battery enclosure frame; and a heat exchange module that uses a flow divider and elastic clamping components to achieve airflow distribution and heating plate positioning, ensuring uniform thermal management. This invention balances the temperature difference between the center and sides of the battery module through a flow divider design with a large airflow on the outside and a small airflow on the inside, ensuring uniform temperature distribution throughout the battery module. This achieves temperature consistency during charging and discharging, reduces the negative impact of localized overheating or overcooling on battery performance, and extends battery life.

The invention provides a heat dissipation assembly and an antenna, and relates to the technical field of heat dissipation. The heat dissipation assembly comprises a reflection base and a plurality of heat conductors. The reflection base is used for being arranged on the outer side of a heat source, a plurality of concave reflection grooves are formed in the outer side of the reflection base, and all the reflection grooves are provided with through holes extending to the inner side of the reflection base. Each heat conductor comprises a heat conduction rod and a radiation ball connected with the heat conduction rod, the heat conduction rods of all the heat conductors are inserted into the through holes in a one-to-one correspondence mode and can act on the heat source, and heat of the heat source can be transmitted to the radiation balls through the heat conduction rods so that the heat can be conducted outwards through radiation of the radiation balls and reflection of the reflection grooves. The heat dissipation assembly can meet the requirements for heat dissipation performance and light weight, and therefore the heat dissipation assembly can be better applied to equipment sensitive to weight.

This utility model relates to the field of fuel cell technology, and in particular to a buffer device for a solid oxide fuel cell stack with overheat protection and combined heat and power functions. A biomimetic grapefruit peel structure protective shell is provided between the solid oxide fuel cell stack and several helical spring components. Several symmetrically arranged metal liquid cooling pipes are located on the biomimetic grapefruit peel structure protective shell along the fuel flow direction. A temperature sensor connected to the liquid cooling system is installed inside the biomimetic grapefruit peel structure protective shell to collect the internal temperature signal of the solid oxide fuel cell stack and control the start / stop and flow rate of the cooling water in the metal liquid cooling pipes. The outermost layer of the biomimetic grapefruit peel structure protective shell is resistant to mechanical vibration and has good thermal insulation, providing a good buffering effect while reducing heat loss from the stack. Smaller pores are provided in the middle layer, and larger pores are provided in the inner layer, improving the system's buffering efficiency through the porous structure. The metal liquid cooling pipes are located within the middle layer of the protective shell, achieving efficient heat conduction.

The application discloses a kind of high gap change tolerance heat-conducting silicone gel and its preparation method and application, belong to heat-conducting material technical field, to different viscosity end vinyl polysiloxane and vinyl MQ silicone resin, with end containing hydrogen polysiloxane Construction composite crosslinking system, through the compounding of different viscosity end vinyl polysiloxane The entanglement state and flexibility of matrix molecular chain are regulated, while the system SiH / Vi molar ratio is accurately controlled in the adaptive range, to build uniform, dense and excellent flexibility three-dimensional crosslinking network;And be prepared by matching multi-particle-size gradation heat-conducting powder etc..The thermal conductivity of silicone gel is stable at 6W / (m·K) or more, and has excellent bonding strength and flexibility, and has excellent gap change tolerance.

The utility model provides an electric heating constant-temperature vacuum cup with an embedded temperature measuring module, which relates to the technical field of articles for daily use, and comprises a cup body and a cup cover arranged on the cup body, and further comprises an embedded component, and the embedded component comprises a knob rotationally connected to the cup cover. The second limiting groove in the temperature measuring module is inserted into the first limiting groove in the cup cover, then the rotary knob is rotated to drive the clamping plate to slide in the cup cover, the temperature measuring module can be fixedly embedded into the cup cover through the clamping plate, meanwhile, the first magnetic block and the second magnetic block attract each other, it is ensured that the temperature measuring module is stably embedded, and the temperature of liquid in the cup can be accurately measured; in the constant-temperature assembly, a heating plate is arranged in an inner cavity of the cup body, a graphene coating on the surface of the heating plate conducts heat efficiently and heats liquid, during heating, a temperature measuring module monitors the temperature in real time, data is transmitted to a control unit, the working state of the heating plate is controlled, the temperature is visually displayed through a display screen, and therefore the constant-temperature effect is achieved.

The utility model discloses a kind of heat dissipation waistcoat for data storage, the heat dissipation waistcoat includes fixed base, metal heat dissipation bottom plate, metal heat dissipation seat and multiple groups of heat dissipation structure. Fixed base is set below data storage, is U-shaped groove structure, slot wall is provided with air hole, inside is equipped with telescopic link and support spring, to support and fix metal heat dissipation bottom plate. Heat dissipation bottom plate is pasted with the lower surface of data storage by heat conduction pad, and is equipped with vertical heat dissipation fin, forms air duct with the direction consistent with air hole. The upper surface of data storage is set metal heat dissipation seat, heat dissipation seat is pasted with storage by heat conduction pad, heat dissipation seat has fin group on and cooperates heat conduction copper pipe, improves overall heat dissipation efficiency. The present application can effectively improve the heat dissipation performance of data storage under high load operation, reduce temperature rise, improve system stability and service life.

This invention discloses a modified current collector for a cathode-free sodium metal battery and its preparation method, belonging to the field of electrochemical energy storage device materials technology. The modified current collector comprises a metal substrate and an artificial solid electrolyte interface layer. The interface layer is an interpenetrating network structure composed of a porous ceramic coating and a permeable polymer coating. The porous ceramic coating contains two-dimensional MXene and cubic boron nitride nanoparticles, and the permeable polymer coating is multi-branched polyacrylic acid, whose molecular chains vertically penetrate the pores of the ceramic coating and chemically bond with the metal substrate. This invention utilizes the sub-nanometer rectification effect of MXene to homogenize the sodium ion flow, utilizes the high thermal conductivity and high modulus of cubic boron nitride to dissipate Joule heat and suppress dendrites, and combines this with the tenon-and-mortise anchoring effect of the polymer chains to solve the coating peeling problem. The modified current collector exhibits an interfacial peel strength ≥8.5 N / m and a cycle life exceeding 600 cycles, providing a high-safety and long-life solution for cathode-free sodium metal batteries.

This invention discloses a graphene-aluminum composite heat sink for high-power integrated circuits and its fabrication method. The method includes an aluminum film mold, inside which a graphene film is disposed. The graphene film has lateral and longitudinal heat dissipation channels. A second graphene film is disposed on the first graphene film, and an aluminum film frame is disposed outside the second graphene film. The second graphene film has heat conduction channels. In this invention, by combining graphene material with traditional aluminum alloy material, the extremely high thermal conductivity and thermal emissivity of graphene, together with the aluminum structure, form a unique and highly efficient heat conduction channel on a macroscopic scale.

The invention provides a modified polyimide composite material and a preparation method thereof, belongs to the technical field of polymer composite materials, and aims at solving the problems that an existing PI material is poor in thermal conductivity, the thermal conductivity is improved when the existing PI material is blended with filler, interfacial compatibility exists, and the physical property of the material is damaged. The modified polyimide composite material comprises a polyimide matrix and a three-dimensional covalent stitched hybrid network dispersed in the polyimide matrix, the surface of the three-dimensional covalent stitched hybrid network is modified with unreacted carboxyl and / or amino, and the three-dimensional covalent stitched hybrid network can form chemical bond combination with the polyimide matrix; the three-dimensional covalent stitched hybrid network is formed by covalently connecting one-dimensional carbon nanotubes and two-dimensional boron nitride nanosheets through difunctional bridging molecules, and connecting bonds between the difunctional bridging molecules and the carbon nanotubes and / or the boron nitride nanosheets comprise dynamic covalent bonds; the carbon nanotube and / or the boron nitride nanosheet are / is modified by amination. The network synergistically improves the mechanical, thermal and electrical properties of the composite material.

The invention belongs to the technical field of optical instruments, and particularly relates to a lateral heat dissipation structure for refrigeration of an electric vacuum detector and the electric vacuum detector. The lateral heat dissipation structure for refrigeration of the electric vacuum detection device comprises a refrigeration module and a lateral heat dissipation module, and the refrigeration module is connected with a cathode of the electric vacuum detection device and used for conducting refrigeration and heat conduction on the cathode; and the lateral heat dissipation module is connected with the refrigeration module, is parallel to the axial direction of the cathode, is arranged at the lateral position of the electric vacuum detection device, and is used for laterally conducting and dissipating heat generated by the refrigeration module. The lateral heat dissipation structure for refrigeration of the electric vacuum detection device is a refrigeration structure which is compact in structure, efficient in heat conduction and adaptive to various electric vacuum detection devices, thermal noise and hot electron emission of a core component are remarkably restrained, and the overall performance of the device is improved.

The utility model discloses a kind of low-voltage reactive power compensation controllers, including control casing, mainboard, heat-conducting paste and air cooler. The mainboard is arranged in the inside of control casing, heat-conducting paste is attached on the surface heating device of mainboard, air cooler is installed in the outside of control casing. Air cooler includes duct pipe, motor, air cooling cabin, cooling coil, rectifier blade and air wheel, motor is installed in motor sleeve seat and drives air wheel rotation, air cooling cabin is arranged in the both ends of motor sleeve seat, is equipped with the cooling coil that is communicated with heat-conducting paste, air cooling cabin both ends are communicated with motor outer periphery by air gap, form ventilation path. Cooling coil and heat-conducting paste are equipped with capillary circulation flow channel and inject cooling liquid, airflow passes through coil and takes away heat. Rectifier blade and guide vane direct airflow discharged by air wheel to axial direction, improve heat dissipation efficiency. The utility model has the advantages of compact structure, high heat dissipation efficiency, good sealing, suitable for long time stable operation scene.

The invention provides a low-emission heat-conducting reinforced PET material and a preparation method thereof, and belongs to the technical field of high polymer material modification. The material comprises the following components in parts by weight: 10-60 parts of PET; 5-50 parts of a reinforcing filler; 1-5 parts of zeolite; 1 to 5 parts of MOF; 5-20 parts of a heat-conducting filler; 0.1 to 2 parts of a toughening agent; 0.5 to 5 parts of a coupling agent; and 0.1 to 2 parts of an antioxidant. Wherein 1-2 parts of zeolite and 1-2 parts of MOF are compounded to form a low-emission adsorption system; the heat-conducting filler comprises a one-dimensional heat-conducting filler and a two-dimensional heat-conducting filler which are compounded to form a heat-conducting network. Through the synergistic effect of the low-emission adsorption system and the three-dimensional heat conduction network, the technical contradiction that the high heat conduction performance and the low emission performance of the material are difficult to consider at the same time is successfully solved. The obtained material simultaneously meets the requirements of high rigidity, high heat conductivity, low emission and the like, has excellent comprehensive performance, and is particularly suitable for workpieces with strict requirements on heat dissipation and cleanliness, such as automobile lamp brackets, camera shells and the like. The preparation process is simple and suitable for industrial production.

The present application relates to the technical field of medical auxiliary equipment, in particular to a multifunctional nurse station integrated with cabinet modules, comprising a table body structure, wherein the table body structure comprises a front desk table body, the top end of the front desk table body is fixedly connected with a table top baffle, and the inner walls of the front desk table body are both fixedly connected with internal ventilation racks; the outer walls of the front desk table body are both provided with integrated structures; the inner wall of the integrated box body is provided with an internal heat dissipation structure on one side; and the inner wall of the integrated box body is provided with a liquid cooling circulation structure on the other side. The multifunctional nurse station integrated with cabinet modules has the advantages that it can quickly take away the heat generated by the integrated equipment, avoid equipment overheating failure, improve operation stability, realize centralized storage and management of various types of equipment, avoid the problem of disorderly placement of traditional nurse station equipment, greatly improve the utilization rate of diagnosis and treatment space, and improve the operation stability and reliability of the equipment.

The utility model provides an air cooling heat dissipation device, and belongs to the technical field of heat dissipation. The device comprises a heat conduction pipe and heat dissipation fins arranged on the heat conduction pipe, the heat conduction pipe and the heat dissipation fins are jointly arranged in a closed box body in a closed mode, the box body is provided with an air inlet and an air outlet, the air outlet is connected with an air source through a guide pipe, and the air source is an axial flow fan. The heat conduction pipe is of a snakelike structure and penetrates through a plurality of heat dissipation fins arranged in parallel, and airflow flows in the direction of the fins in parallel. The heat conduction pipe comprises a first exchange pipe and a second exchange pipe which are used for inflow and outflow of a heating medium respectively and are in airtight connection with the wall of the box body. The air source can comprise a plurality of axial flow fans connected in series, the air inlets and the air outlets between the box bodies can be connected in series, the box bodies can be arranged in a stacked mode, and the heat conduction pipes in the different box bodies can be connected in series. The utility model has the advantages of compact structure, good dustproof effect, high heat exchange efficiency, modular expansion and the like, and is suitable for heat dissipation application of high-performance electronic equipment.

This utility model discloses an impact-resistant encapsulated PCBA circuit board, including a cover block. Mounting blocks are fixedly connected to the front edges of both sides of the support mounting groove, and a second locking knob is inserted into the inner wall of the mounting block. Air channels are formed at the upper and lower ends of the cover block, and heat dissipation fins are embedded in the inner walls of the air channels. One end of each heat dissipation fin is attached to the support cover plate and the other end of the support mounting groove. This impact-resistant encapsulated PCBA circuit board can achieve double-layer support and protection through the cover block, support cover plate, and support mounting groove. Furthermore, the PCBA circuit board can be symmetrically supported by support plates, resulting in excellent protection. It also achieves efficient heat conduction through the heat dissipation fins, support plates, air channels, and vents, resulting in excellent heat dissipation. Moreover, the support cover plate and support mounting groove can be easily pulled out quickly using a sliding groove or slider, and the PCBA circuit board can be quickly disassembled and assembled by flipping the support cover plate, making it convenient to use.