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4521 results about "Lower face" patented technology

Process for producing a sealing and mechanical strength ring between a substrate and a chip hybridized by bumps on the substrate

Process for the production of a sealing and mechanical strength ring between a substrate and a chip hybridized by bumps on the substrate. The invention provides a process for producing an encapsulating ring (13) ensuring the sealing and mechanical strength of a chip (1) hybridized by bumps on a substrate (5). More particularly, contemporaneously with the production of the hybridization bumps (9) on the lower face (1a) of the chip or the substrate by a first meltable material, a sealing and mechanical strength ring is formed by depositing on the substrate or lower face of the electronic component a ring (13) of a second meltable material. The lower face of the chip then is placed on the substrate so as to produce the connections between said chip and said substrate by means of the first meltable material, and the thus formed assembly is heated to a temperature at least equal to the highest melting point of the first and second meltable materials, in order simultaneously to produce the hybridization bumps of the first material and the sealing ring of the second material. The ring is sized to have a height (h) and a width (d) in accordance with the following equation:in which alpha is a shape coefficient factor and D is the largest dimension of the electronic component.
Owner:COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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