A vapor chamber element of a heterogeneous plate comprises a
metal upper cover and a
ceramic metal-clad lower plate, the
ceramic metal-clad lower plate comprises a
ceramic substrate and a first metal layer, the
ceramic substrate is provided with a substrate upper surface and a substrate lower surface, the first metal layer is formed on the substrate upper surface opposite to the metal upper cover, and the first metal layer is formed on the substrate lower surface opposite to the metal upper cover. When the metal upper cover is coupled to the
ceramic metal-clad lower plate, a vapor chamber element with a closed
air cavity is formed, and the lower surface of the substrate is used for being in contact with a heat source; therefore, the ceramic
copper-clad substrate is used as the lower plate of the uniform-temperature
plate element, and the ceramic material has the advantages of high rigidity, high
thermal conductivity and the like, so that the uniform-temperature
plate element of the heterogeneous plate not only can ensure the
phase change and two-phase flow circulation efficiency of
working fluid in the element, but also can provide good structural strength for a heat absorption area of the lower plate; therefore, the problem that
heat resistance is increased due to
structural deformation of a heat absorption area of the vapor chamber caused by insufficient strength of a known vapor chamber lower plate metal structure under a high-power-density heat source is effectively solved.