The invention relates to the technical field of thin-film materials and particularly relates to a high-power pulse plasma reinforced composite magnetron sputtering deposition device. The device comprises a vacuum chamber, magnetic control targets, a work rest and a rotary support, wherein the magnetic control targets comprise a high-power pulse magnetron sputtering target and pulse direct-current magnetic control targets, fixed in the vacuum chamber, and are arranged in opposite direction in a right angle, the magnetic field arrangement manners of all magnetic control targets are opposite, and a closed field is formed; the magnetic fields of all magnetic control targets are unbalanced magnetic fields; through the implementation of the structure, the better magnetic field distribution and ion plating effects are achieved, high-quality coating with good coating binding force, compact coating, good mechanical performance, accurate and controllable chemical components can be deposited conveniently and the device is applied to high-speed cutting tools.