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8359 results about "Boron nitride" patented technology

Boron nitride is a thermally and chemically resistant refractory compound of boron and nitrogen with the chemical formula BN. It exists in various crystalline forms that are isoelectronic to a similarly structured carbon lattice. The hexagonal form corresponding to graphite is the most stable and soft among BN polymorphs, and is therefore used as a lubricant and an additive to cosmetic products. The cubic (sphalerite structure) variety analogous to diamond is called c-BN; it is softer than diamond, but its thermal and chemical stability is superior. The rare wurtzite BN modification is similar to lonsdaleite but slightly softer than the cubic form...

Method for preparing C/SiC composite material through low-cost fused silicon impregnation method

The invention relates to a method for preparing a C/SiC composite material through a low-cost fused silicon impregnation method, which comprises the following steps: performing calcining pretreatment on a carbon felt or graphite felt at 400-600 temperature; immersing the pretreated carbon felt or graphite felt in a melamine and boric acid solution, thus coating a boron nitride protective layer; immersing in a carbon/silicon carbide slurry water solution, performing impregnation to ensure that pores of the carbon felt or graphite felt are fully filled with carbon/silicon carbide, placing in a sintering furnace, and performing primary fused silicon impregnation treatment at 1600-1800 DEG C; immersing in liquid phenolic resin, and performing carbonization treatment under the protection of an inert atmosphere at 800-1000 DEG C to ensure that all the resin is carbonized; and finally, performing secondary fused silicon impregnation treatment to ensure that carbon produced by carbonization of the resin totally reacts with silicon to generate silicon carbide, thus obtaining the C/SiC composite material. The obtained C/SiC composite material is high in density, low in air pore and free silicon content, and favorable in material strength, toughness and frictional wear performance, and can be used for manufacturing of brake pads.
Owner:山东宝纳新材料有限公司

Heat-conduction heat-dissipation interface material and manufacturing method thereof

The invention provides a heat-conduction heat-dissipation interface material and a manufacturing method thereof, wherein the heat-conduction heat-dissipation interface material is applied to the field of heat dissipation of electronic products. The heat-conduction heat-dissipation interface material comprises a heat-conduction heat-dissipation layer and a surface protective material layer, wherein the heat-conduction heat-dissipation layer consists of one or more of graphite, nano graphite, crystalline flake graphite, graphene, pyrolytic carbon, pyrolytic graphite, graphite powder, carbon nano tubes, carbon fibers, graphite fibers, resin, ceramic fibers, quartz fibers, metal fibers, zirconia, boron nitride, silicon nitride, boron carbide, silicon carbide, magnesia powder, metasillicio acid fibers, calcium silicate aluminum fibers, aluminium oxide fibres, copper power, aluminium power, silver power, tungsten power and molybdenum power; and the surface protective material layer is a polymeric membrane. The heat-conduction heat-dissipation interface material manufactured according to the materials and the method provided by the invention has the advantages of effectively improved heat-dissipation performance, small volume, light weight and small thickness, can be used for prolonging the service life of an electronic component, and simultaneously is easy to produce and process.
Owner:SHANGHAI QI JIE CARBON MATERIALS
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