2410 results about "Process equipment" patented technology

The invention relates to the technical field of manufacturing process control, and discloses a multi-dimensional process data co-simulation control method and system and a storage medium. The method comprises the following steps: firstly, collecting a multi-dimensional process parameter set of a plurality of process equipment in a manufacturing production line, carrying out cross-dimensional feature extraction, and generating a comprehensive feature matrix containing a time sequence feature, a spatial distribution feature and an energy consumption feature; according to feature relevance of different dimensions in the comprehensive feature matrix, a process parameter dynamic coupling model is constructed, co-simulation is carried out on interaction between process equipment, and a process state evolution sequence is output; extracting abnormal fluctuation characteristics in the sequence, and generating a process parameter adjustment instruction set; and finally, according to the adjustment instruction set and real-time process feedback data, dynamically correcting model simulation parameters, generating an optimized process control strategy, and executing the optimized process control strategy. According to the method, collaborative analysis and dynamic control of multi-dimensional process parameters are realized, and the accuracy and adaptability of process control are improved.

The invention relates to an agricultural microbial preparation production line multi-device collaborative control method and system, and the method comprises the steps: calculating a device health score based on operation state information, combining the device health score with a biological risk index to generate a task release score, and generating a production task instruction when the task release score meets a preset release threshold value, constructing a cooperative interlocking matrix between the multiple types of process equipment and the material handling equipment based on the production task instruction, distributing a control execution instruction to the multiple types of process equipment and the material handling equipment, respectively obtaining equipment feedback state information and material circulation information, executing consistency verification on the equipment feedback state information and the material circulation information, and sending a verification result to the material handling equipment; a consistency verification result is obtained, during manual modification, a revision audit chain corresponding to the control event information is generated, and when the running state information or the control event information triggers a preset abnormal threshold value, a disposal control instruction is generated. The method has the effect of improving the production safety.

The invention relates to the technical field of injection molding waste plastic recovery, in particular to injection molding equipment and a process for producing plastic automobile ornaments. The equipment comprises an injection machine and an online recycling mechanism, the injection machine is provided with a double-channel solution cavity composed of a new material main runner and a waste material returning cavity, and the tail ends of the two channels converge in a 30-degree Y shape; the on-line recovery mechanism comprises a waste conveyor belt, a crushing mechanism and a transmission device, a magnetic separation impurity removal device is arranged in the crushing mechanism, and a discharge end is connected with the batching mechanism. Through double channels and a Y-shaped confluence structure, production waste is subjected to online recovery and crushing and then is fused, mixed and reused with new materials, the waste utilization rate is increased, and the cost is reduced. The magnetic separation and impurity removal device efficiently removes metal impurities through the movement of inclined avoiding, rotary impurity scraping and inclined discharging of a scraping plate; the batching mechanism removes dust to prevent impurities from affecting melt performance. The crushing device adapts to different waste materials, airflow assists discharging to improve the efficiency, and the green production concept is met.

The invention provides a cutting height adjusting method and device of a cutting knife, wafer processing equipment and a medium, and relates to the technical field of wafer processing equipment.The method comprises the steps that the surface height difference between a sample silicon wafer on an auxiliary workbench and a to-be-processed wafer on a main working disc is measured; after the cutting knife cuts the sample silicon wafer to form a cutting mark, calculating a cutting depth value corresponding to the cutting mark; calculating the surface height information of the sample silicon wafer according to the cutting depth value of the cutting mark and the height information corresponding to the lowest point of the cutting knife when the cutting knife cuts the sample silicon wafer on the auxiliary workbench; and according to a preset cutting depth value, the surface height information of the sample silicon wafer and the surface height difference between the sample silicon wafer on the auxiliary workbench and the to-be-processed wafer, target cutting height information of the cutting knife when the cutting knife cuts the to-be-processed wafer is determined. After the height of the cutting knife is adjusted according to the target cutting height information, the cutting mark cut by the cutting knife has high-precision cutting depth.

The invention discloses a vacuum cavity pressure maintaining test and leak rate rapid estimation method and system, and the method comprises the steps: achieving the test preparation of multiple sections through a public metering manifold and a multi-way isolation valve, and building a section volume database; the pressure and temperature data are synchronously collected in a fixed sampling period by exhausting air to preset pressure and isolating a pump end; obtaining an equivalent pressure change rate through temperature normalization and deflation baseline deduction in combination with filtering and regression algorithms, and performing conversion to obtain a standardized leak rate; step-by-step detection is carried out on each functional section of the cavity through a segmented bipartite isolation strategy and volume correction, and rapid positioning of a suspicious leakage section is realized; through double-threshold determination of an early warning threshold and an unqualified threshold, a detection report is automatically generated and written into a historical database, and a detection-determination-maintenance closed loop is formed. The method can improve the precision of leak rate detection, and is suitable for vacuum coating equipment, semiconductor process equipment and industrial vacuum treatment devices.

The invention discloses a gas distribution device and process equipment of a semiconductor device. The gas distribution device is connected with a plurality of gas distribution branches and comprises a buffer cavity, a gas inlet is formed in the upper end of the buffer cavity, and a plurality of flow guide holes are distributed in the side wall of the buffer cavity; the adjusting cavity is located on the downstream portion of the buffering cavity, the air inlet end of the adjusting cavity is connected with the flow guide holes, the air outlet end of the adjusting cavity serves as branch inlets of the air distribution branches, and the positions of the flow guide holes correspond to first areas between the branch inlets so that the air flow of the first areas can be increased to form a pressure supply area. According to the gas distribution device with asymmetrically distributed gas outlets, the uniformity of the gas outlet flow and the gas outlet speed of each gas outlet can be improved, so that the stability of gas flow in the technological process is improved, and the uniformity difference of technological results in each cavity can be reduced.

The invention discloses a real-time feedback method and system for a hydrogen peroxide production process, and relates to the technical field of intelligent feedback. The real-time feedback method and system for the hydrogen peroxide production process comprises the following steps: S1, preprocessing production process data and historical process data; s2, self-adaptive time sequence prediction feedback regulation and control analysis is carried out, the rotating speed of a servo motor is adjusted, and a sampling flow error value is corrected; s3, performing regulation and control characteristic attribution analysis, and performing mixed solution transfer; s4, performing process equipment self-diagnosis for efficient emulsion separation and multi-parameter mahalanobis distance discrimination; and S5, carrying out process parameter optimization and risk early warning. The problems that an existing system is difficult to achieve automatic continuous sampling and flow self-adaptive regulation and control in the hydrogen peroxide production process, and high-precision real-time monitoring and intelligent early warning are difficult to achieve are solved.

The invention discloses a block chain and digital twinborn integrated production whole process credible tracing method, and belongs to the technical field of intelligent manufacturing and digital tracing. The system comprises a digital twin construction module, a block chain evidence storage module, a tracing verification module and a data acquisition module. The method comprises the following steps: creating a digital twinborn body for each product instance, and mapping material, process, equipment and quality data of the whole manufacturing process in real time; recording the twinborn key state hash value to a block chain in real time through an intelligent contract; credible tracing verification is provided based on block chain evidence storage and digital twin data; industrial Internet of Things equipment is used for collecting manufacturing data in real time to drive twin updating. According to the method, millisecond-level slice tracing in the manufacturing process is realized, the deep description capability of digital twinning and credible guarantee of the block chain are fused, the problems of insufficient data depth and low credibility of a traditional tracing system are solved, and judicial-level evidence support is provided for quality disputes.

The invention relates to the technical field of semiconductor wet process equipment, in particular to a semiconductor substrate slow drainage system, processing equipment and a slow drainage control method. The semiconductor substrate slow drainage system provided by the invention comprises a drying container, a cleaning liquid inlet and outlet pipeline system connected to the drying container and a liquid level meter, the drying container comprises an inner container and an outer container; the liquid level meter is arranged in the inner container and comprises an air pressure conduction part connected with an air supply pipe for supplying air and a pressure difference detection assembly electrically connected with the controller, the air outlet end of the air pressure conduction part is located at the bottom of the inner container, and the pressure difference detection assembly is arranged on the air pressure conduction part; the controller detects the pressure difference between the position above the liquid level of the cleaning liquid in the inner container and the air outlet end of the air pressure conduction component through the pressure difference detection assembly so as to obtain the liquid level of the cleaning liquid in the inner container. The liquid level meter is adopted to control water feeding and discharging, precision is high, and influences of flow factors are avoided.

The invention discloses a heat transfer performance prediction and optimization method of a multi-dimensional data weighted neural network, and belongs to the field of artificial intelligence and process equipment enhanced heat transfer. The prediction method comprises the following steps: acquiring multi-physical field heat transfer data, preprocessing the data, and dividing the data into a training set and a test set; performing multi-channel independent normalization processing on the preprocessed data; establishing a neural network prediction model; globally optimizing the weight and the bias parameter of the neural network by adopting a genetic algorithm; using the optimized parameters to initialize a neural network to carry out refined training; evaluating the model performance by using the test set and outputting a heat exchange performance prediction result; and carrying out heat exchange characteristic analysis and equipment optimization design based on a prediction result. According to the method, neural network hyper-parameters are optimized through the genetic algorithm, the problem that a traditional neural network is prone to falling into local optimum is solved, high-precision prediction of heat exchange performance parameters is achieved, and reliable technical support is provided for design and optimization of efficient heat exchange equipment.

The present application discloses a stage apparatus and a semiconductor process device. The disclosed stage apparatus is used for bearing a front opening unified pod and driving same to move in a first direction outside a loading and unloading chamber of the semiconductor process device. The stage apparatus comprises a stage support, a bearing portion, a driving mechanism, and a buffering mechanism. The driving mechanism is arranged on the stage support, and the bearing portion is movably arranged on the stage support in the first direction. The driving mechanism is connected to the bearing portion via the buffering mechanism, and is used for driving, via the buffering mechanism, the bearing portion to move in the first direction. When the driving mechanism drives, via the buffering mechanism, the bearing portion to move in the first direction to a connection position, the bearing portion can, under the buffering action of the buffering mechanism, continue to move in the first direction by a preset buffering distance. The above solution can solve the problem in the related art of insufficient sealing between an opening of a front opening unified pod and a transfer port of a loading and unloading chamber when a stage apparatus drives the opening of the front opening unified pod to connect to the transfer port of the loading and unloading chamber.

The invention discloses a beneficiation optimization control method and system based on a knowledge graph, and relates to the technical field of mineral processing process control, and the method comprises the steps: collecting and preprocessing beneficiation whole process data, and generating an initial multi-modal data set; space-time process elements are extracted based on the initial multi-modal data set, and an initial beneficiation optimization knowledge graph is constructed; establishing a mineral separation process topological graph, bringing process equipment material topology into a mineral separation optimization knowledge graph, and constructing an evolutionary mineral separation optimization knowledge graph; performing timestamp alignment on the initial multi-modal data set through an evolutionary beneficiation optimization knowledge graph to obtain a time axis aligned multi-modal data set; hierarchical time sequence modeling and cross-modal correlation calculation are carried out on the multi-modal data set with the aligned time axes, and multi-modal time sequence correlation features are generated; and the multi-modal time sequence correlation characteristics are input into the evolution beneficiation optimization knowledge graph for reasoning, and an optimal beneficiation control strategy is obtained.

The invention provides an alkaline electrolytic cell temperature compound control method and system, a medium and equipment. The method comprises the steps that a full-process dynamic simulation model containing key process equipment meeting preset requirements in an electrolytic hydrogen production system is established; a feed-forward controller with current as input and feed-forward compensation amount as output is obtained through analysis of a full-process dynamic simulation model; based on the feed-forward compensation amount, the temperature of the electrolytic bath is stabilized at a set value under the change of the current I; a feedforward-cascade composite control system is constructed; and closed-loop control over the temperature of the electrolytic cell is completed based on a feedforward-cascade composite control system. According to the method, the feed-forward controller based on full-process dynamic simulation design is combined with cascade control, so that accurate lead compensation of wide-width current fluctuation is realized, the problem of response lag of single cascade control is effectively solved, and the dynamic response speed and the anti-interference capability of electrolytic bath temperature control are remarkably improved.

The invention provides a radio frequency control device and method and semiconductor process equipment, and the device comprises a radio frequency connection unit which is used for enabling a radio frequency end and a grounding end of a radio frequency source to be electrically connected with a wafer boat in a process chamber of the semiconductor process equipment, and enabling the polarities of two adjacent boat sheets in the wafer boat to be opposite; the impedance control unit is connected between the radio frequency connection unit and the grounding end of the radio frequency source and can be switched between a first impedance state and a second impedance state, and in the first impedance state, the impedance control unit is used for enabling the radio frequency current to return to the grounding end of the radio frequency source through the first radio frequency loop; and in the second impedance state, the impedance control unit is used for enabling the radio frequency current to return to the grounding end of the radio frequency source through the second radio frequency loop. According to the scheme, the problems that in the prior art, film coating cannot be conducted on the wafer between every two adjacent boat pieces, and cleaning is incomplete in the cleaning process can be solved.

The invention relates to the technical field of sewage treatment process control, in particular to a sewage treatment process control system and device based on a multi-scale time sequence diagram neural network, and the system comprises an energy consumption digital twin modeling module which constructs a whole-process equipment energy consumption and process state twin mapping model; the energy consumption trend prediction module captures three-level energy consumption association by using a multi-scale time sequence diagram neural network based on the model data to obtain a prediction result; the multi-objective optimization module constructs an optimization function containing total energy consumption and the like according to the total energy consumption and the like to obtain a balance strategy; the process self-adaptive regulation and control module adjusts process parameters and data updating network according to the inlet water quality and the optimization target; and the energy scheduling optimization module constructs a model containing peak and valley electricity price perception and outputs a scheduling result. By designing a multi-objective optimization framework and combining water quality adaptive adjustment process parameters and a peak-valley electricity price sensing mechanism, global energy consumption collaborative optimization of the sewage treatment plant can be realized, the energy utilization efficiency can be improved, the operation cost can be reduced, carbon emission can be reduced, and efficient green treatment can be realized.

The invention provides a transmission finger, a vacuum manipulator and semiconductor process equipment, relates to the technical field of semiconductor equipment, and is designed for solving the problem that a wafer is easy to slip when the transmission speed of the vacuum manipulator is relatively high. The transmission finger is used for semiconductor process equipment and comprises a finger body and a plurality of bearing assemblies, and the bearing assemblies are distributed on the same bearing circumference at intervals; the bearing assembly comprises a bearing piece, the bearing piece is installed on the finger body in a vertically-swinging mode and provided with a supporting part and a blocking part, the supporting part and the blocking part are arranged on the two sides of the swinging axis of the bearing piece, and the radius of the circumference where the supporting part is located is smaller than that of the circumference where the blocking part is located. The supporting part is used for supporting a wafer, and the blocking part is used for swinging upwards when the wafer is supported on the supporting part so as to abut against the outer edge of the wafer. According to the invention, slippage of the wafer can be avoided.

Provided in the present disclosure are a semiconductor process chamber, a unilateral footing elimination method, and a semiconductor process apparatus. In the semiconductor process chamber, an edge gas intake assembly is circumferentially arranged on a side wall of a chamber body, and when a wafer is carried on a carrying device, a gas introduced by the edge gas intake assembly can cover an edge target area of the wafer, such that by changing the gas intake direction of the edge gas intake assembly, the gas is controlled to reach the edge target area of the wafer, which specifically mitigates the problem of insufficient unilateral etching of a core column at the edge of the wafer, thereby eliminating unilateral footing and improving the product quality of the semiconductor process apparatus.

The invention discloses a fructus aurantii grading, bisection and pulp removing all-in-one machine, and relates to the technical field of traditional Chinese medicinal material processing equipment, the fructus aurantii grading, bisection and pulp removing all-in-one machine comprises a clamping and conveying device, a bisection device, a pulp removing device and a recognition device, the clamping and conveying device can clamp and convey fructus aurantii before cutting to the bisection device, and the bisection device is used for cutting the fructus aurantii into two sections; the identification device can identify the size of the fructus aurantii; the pulp removing device comprises a track adjusting device and a pulp removing body connected to the track adjusting device, the clamping and conveying device can clamp and convey the cut fructus aurantii to the pulp removing body, the track adjusting device can be in signal connection with the recognition device, and the track adjusting device can drive the pulp removing body to remove pulp of the fructus aurantii in a circular pulp removing track; the track adjusting device can adjust the diameter of the round pulp removing track of the pulp removing body according to the size of the fructus aurantii recognized by the recognition device. The machining quality can be improved; and the production efficiency can be improved.

The invention provides a rotating assembly and semiconductor process equipment, and the rotating assembly comprises a sleeve which is provided with a first step structure on the inner wall; the rotating shaft is arranged in the inner cavity of the sleeve and is provided with a second step structure; the pressing block structure is arranged on the second step structure and is connected with the sleeve; the first sealing structure is arranged in a first annular accommodating cavity between the sleeve and the rotating shaft; the first sealing structure comprises a first sealing ring and a second sealing ring; a first groove is formed in the side surface, deviating from the rotating shaft, of the first sealing ring; the second sealing ring surrounds the side face, away from the rotating shaft, of the first sealing ring and is located in the first groove. When the rotary assembly is applied to semiconductor process equipment for bearing wafers, the rotary arrangement of the bearing platform in a reaction chamber and the isolation of a vacuum environment and an external atmospheric environment can be realized, the use of magnetofluid is avoided, the cost is reduced, and the production efficiency is improved. And the risks of sealing failure and reaction chamber pollution caused by magnetic fluid leakage can be eliminated.

The invention discloses a wafer transmission pressure control system and method, the system is applied to semiconductor process equipment, the system comprises a semiconductor process platform and process cavities, the semiconductor process platform comprises an equipment front-end module, a load locking cavity and a plurality of transmission cavities, the transmission cavities are used for sequentially transmitting wafers to each process cavity, and the equipment front-end module is connected with the load locking cavity. A control valve is arranged between the transmission cavity and the process cavity and used for controlling communication between the transmission cavity and the process cavity. Particle testing is carried out through the wafer transmission pressure control system, and the optimal pressure difference between the transmission cavity and the process cavity can be determined, so that the problem that by-products in the process cavity return to the transmission cavity through the transmission channel due to improper pressure and pressure difference between the transmission cavity and the process cavity can be solved; therefore, the use effect of the semiconductor process equipment is improved.

The invention relates to the technical field of heat treatment, in particular to a procedure closed transfer flexible automatic heat treatment production line which comprises at least three sealed process devices and a workpiece conveying track. Butt joint stations used for butt joint and fixing of the sealed process equipment are arranged on the left side and the right side of the workpiece conveying track respectively; a workpiece transport vehicle is adaptively arranged on the workpiece conveying track; a sealed containing cavity is formed in the workpiece transport vehicle, and containing cavity doors capable of being opened are arranged on the left side and the right side of the sealed containing cavity correspondingly. A sealed processing cavity is arranged in the sealed processing equipment, and a processing cavity door capable of being opened is arranged on one side of the sealed processing cavity. The process sequence of the production line can be dynamically recombined according to process requirements, different sealed process devices can be flexibly called to form a new production process, and workpieces can be freely and flexibly switched among the sealed process devices according to different process requirements under the state of air isolation and constant temperature coherence in the whole process, so that the production efficiency is improved. And flexible transfer transportation and treatment are carried out.

The invention discloses a winding and cutting device, and relates to the field of winding and cutting processing equipment, the winding and cutting device comprises a cutting platform, one end of the cutting platform is provided with a winding support, the cutting platform is provided with a flattening roller structure, an interval pressing device and a cutting device, the flattening roller structure comprises two flattening rollers which are parallel up and down and are arranged side by side, and the cutting device is arranged on the flattening roller structure. The interval pressing device comprises a base and a pressing block, the cutting device comprises a lower cutting edge and an upper cutting edge, an edge cutting device is arranged between the interval pressing device and the cutting device, the edge cutting device comprises a cutting set and a trimming set, the cutting set comprises a cutting disc, and the trimming set comprises a trimming disc. The trimming set comprises a trimming disc. The cutting set can cut the edge of an unfolded coiled material, and flaws generated on the edge during interval pressing and coiling are removed; and the arranged trimming set can help the edge of the coiled material to recover to be flat after edge cutting.

The invention provides a wafer positioning device and wafer grinding equipment thereof, and belongs to the technical field of wafer processing equipment.The wafer positioning device comprises a clamping positioning system, a vacuum rotary carrying table system, a control module and an image recognition system, and the clamping positioning system, the vacuum rotary carrying table system, the image recognition system and the control module cooperate to achieve the purpose of positioning the wafer. The problem that in the prior art, the flat edge and the notch angle of a wafer cannot be recognized is accurately solved, centering is achieved only through synchronous radial movement of a plurality of clamping jaws without an additional moving shaft, and after an image recognition system confirms that the wafer is coaxial with a fixed shaft, a control module directly controls a vacuum rotating carrying table system to adsorb the wafer and rotate, and the wafer is accurately positioned. The space requirement of a clean room is met, the precision is prevented from being influenced by displacement difference, the offset recalculation link is omitted, the efficiency is improved, and the high-precision grinding requirement of the advanced manufacturing process is met.

The invention relates to a multi-level pulse power supply and semiconductor process equipment. The multi-level pulse power supply comprises a high-frequency isolation conversion module and a switch module, wherein the high-frequency isolation conversion module is electrically connected with the switch module; the high-frequency isolation conversion module is used for accessing a direct-current bus voltage and performing voltage conversion processing on the direct-current bus voltage to generate a plurality of pre-processing voltages; and the switch module is used for responding to an externally input control signal and switching the state of the switch module so as to perform voltage amplitude modulation based on the plurality of pre-processing voltages and output a target voltage. The multi-level pulse power supply can output multi-level pulses.

An offshore industrial complex for raw gas extraction, treatment, and processing includes a gravity-based structure (GBS) with a topside on it, including a drilling facility with drilling rig, flare unit, process equipment for raw gas treatment and processing as modules, and living quarters. The GBS has central and protruding parts. The central part is a rectangular prism with a top slab, on which the process equipment is installed. The protruding part stretches along the central part sides and has vertical external walls. The central and protruding parts share a base slab, the protruding part being lower in height than the central part. The central part has longitudinal and transverse walls that form compartments, including ballast compartments and compartments accommodating storage tanks for respective processed products. The protruding part has internal walls that are perpendicular to its external walls and form ballast compartments.

The invention discloses a furnace tube reaction cavity structure, and a process method and process equipment of a semiconductor. The furnace tube reaction cavity structure comprises a furnace tube body, wherein a composite coil is axially wound outside the furnace tube body; the composite coil is connected with the alternating-current power supply and the radio-frequency power supply in parallel, heats the furnace tube body through the alternating-current power supply and enables the furnace tube body to be filled with plasmas through the radio-frequency power supply; the high-frequency filter is connected in series in a circuit of the alternating-current power supply and used for preventing high-frequency signals generated by the radio-frequency power supply from entering the circuit of the alternating-current power supply; and the low-frequency filter is connected in series in a circuit of the radio-frequency power supply and is used for preventing low-frequency signals generated by the alternating-current power supply from entering the circuit of the radio-frequency power supply. According to the invention, the chamber structure can be simplified, the equipment cost can be reduced, the stability of high-frequency and low-frequency alternating-current electric signals can be improved, and the risks of non-uniform heating in the tube caused by coil current fluctuation and unstable gas ionization process caused by damage to the stability of a high-frequency magnetic field can be avoided, so that the process effect is improved.

The utility model discloses semiconductor process equipment, which comprises a chamber module (100) and a transmission device (200), the chamber module (100) comprises a plurality of process chambers, and the plurality of process chambers comprise a first process chamber (101), a second process chamber (102), a third process chamber (103) and a fourth process chamber (104); the transmission device (200) is used for conveying a silicon wafer, so that the silicon wafer sequentially passes through the first process chamber (101), the second process chamber (102), the third process chamber (103) and the fourth process chamber (104) to be processed; the chamber module (100) comprises at least one stack type chamber structure, and the stack type chamber structure comprises at least two process chambers which are stacked in sequence. According to the scheme, the problem of large occupied area of semiconductor process equipment in the prior art can be solved.

The invention discloses wafer cleaning equipment, a wafer chuck thereof and a wafer cleaning method, and belongs to the technical field of semiconductor process equipment. The wafer chuck comprises a chuck base body, an air injection assembly and a plurality of wafer lifting shafts, the air injection assembly and the wafer lifting shafts are arranged on the chuck base body, the chuck base body is provided with a bearing face used for bearing a wafer, and an air outlet of the air injection assembly is located in the central area of the bearing face and used for injecting air between the bearing face and the wafer. The multiple wafer lifting shafts are distributed on the periphery of an air outlet of the air injection assembly in the circumferential direction of the bearing face in a surrounding mode, each wafer lifting shaft can move relative to the chuck base body, each wafer lifting shaft is provided with an arc-shaped inclined table, each arc-shaped inclined table is provided with an inclined extending face extending in the circumferential direction of the corresponding wafer lifting shaft, and the inclined extending faces are used for bearing the edge of a wafer. When the wafer lifting shaft moves relative to the chuck base body, the wafer can move to different height positions along the inclined extending face. According to the invention, the height of the wafer can be accurately positioned, and the wafer cleaning efficiency is improved.

The invention discloses an equipment energy consumption simulation prediction method and system based on a discrete manufacturing system and a storage medium, and the method comprises the following steps: S1, collecting the average power data of all process equipment in the discrete manufacturing system under each state and during the conversion of different states, and constructing an equipment power database; s2, collecting process and logistics information of a workshop; s3, integrating the equipment power database into the simulation model, and calling corresponding power data in the equipment power database according to the process equipment operation state determined by simulation; s4, inputting production parameters, operating the simulation model, and calculating an energy consumption prediction result; according to the method, the state switching energy consumption can be quantified, and accurate calculation of multi-process equipment energy consumption under various production scenes is supported.

The invention discloses a steel plant high-temperature flue gas waste heat recovery system and method, and relates to the technical field of waste heat recovery, the steel plant high-temperature flue gas waste heat recovery system comprises a spiral conveyor, a flue gas pipeline and a waste heat recovery furnace, a main flue on process equipment in a steel plant is connected into a flue gas inlet of the waste heat recovery furnace through the flue gas pipeline, and a plurality of snakelike heating pipes are evenly distributed in the waste heat recovery furnace; one end of the snakelike heating pipe is connected with a water inlet pipe, the other end of the snakelike heating pipe is connected with a water outlet pipe, a plurality of ash discharge hoppers are arranged at the bottom of the waste heat recovery furnace, spiral conveyors are arranged at the bottoms of the ash discharge hoppers, a cleaning mechanism is arranged in the waste heat recovery furnace, and a smoke outlet of the waste heat recovery furnace is connected to next process equipment through a smoke exhaust pipeline. According to the system, the surfaces of the two sides of the S-shaped heating pipe can be cleaned, meanwhile, the knocking head of the knocking assembly can knock the inner wall of the waste heat recovery furnace, soot attached to the inner wall falls into the ash discharging hopper, automatic and comprehensive cleaning of heat exchange equipment is achieved, and the cleanliness of the surfaces of the heat exchange equipment is guaranteed.