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456 results about "Polysilane" patented technology

Polysilanes are organosilicon compounds with the formula (R₂Si)ₙ. They are relatives of traditional organic polymers but their backbones are composed of silicon atoms. They exhibit distinctive optical and electrical properties. They are mainly used industrially as precursors to silicon carbide.

Linear and cross-linked high molecular weight polysilanes, polygermanes, and copolymers thereof, compositions containing the same, and methods of making and using such compounds and compositions

Methods are disclosed of making linear and cross-linked, HMW (high molecular weight) polysilanes and polygermanes, polyperhydrosilanes and polyperhydrogermanes, functional liquids containing the same, and methods of using the liquids in a range of desirable applications. The silane and germane polymers are generally composed of chains of Si and/or Ge substituted with R′ substituents, where each instance of R′ is, for example, independently hydrogen, halogen, alkenyl, alkynyl, hydrocarbyl, aromatic hydrocarbyl, heterocyclic aromatic hydrocarbyl, SiR″3, GeR″3, PR″2, OR″, NR″2, or SR″; where each instance of R″ is independently hydrogen or hydrocarbyl. The cross-linked polymers can be synthesized by dehalogenative coupling or dehydrocoupling. The linear polymers can be synthesized by ring-opening polymerization. The polymers can be further modified by halogenation and/or reaction with the source of hydride to furnish perhydrosilane and perhydrogermane polymers, which are used in liquid ink formulations. The synthesis allows for tuning of the liquid properties (e.g., viscosity, volatility, and surface tension). The liquids can be used for deposition of films and bodies by spincoating, inkjetting, dropcasting, etc., with or without the use of UV irradiation. The deposited films can be converted into amorphous and polycrystalline silicon or germanium, and silicon or germanium oxide or nitride by curing at 400-600 DEG C. and (optionally) laser- or heat-induced crystallization (and/or dopant activation, when dopant is present).
Owner:ENSURGE MICROPOWER ASA

Light emitting diode (LED) high-power encapsulation silica gel

The invention relates to a light emitting diode (LED) high-power encapsulation silica gel, which consists of gel A and gel B in parts by weight, wherein the gel A comprises an ingredient of a resin part, and the gel B comprises an ingredient of a cross linking agent part, wherein the gel A comprises ingredients consisting of 100 parts of vinyl phenyl polysiloxane, 50 to 100 parts of vinyl polysiloxane and 0.02 to 2 parts of catalysts, the gel B comprises ingredients consisting of 100 parts of hydrogen phenyl polysiloxane, 50 to 100 parts of hydrogen polysiloxane and 0.01 to 2 parts of polymerization inhibitors, catalysts are platinum catalysts with the platinum content between 1000 and 7000ppm, and the polymerization inhibitors are alkynol substances. The LED high-power encapsulation silica gel provided by the invention adopts the storage modes of the gel A and the gel B, the production process is simple and can be easily implemented, the storage is convenient without special requirements, the storage life is long, and the silica gel is favorable for production. In the use process, the silica gel formed through simple mixing has the advantages of strong bonding force, high intensity, high light transmission rate, good light refractivity and excellent high-temperature-resistance and aging-resistance capability.
Owner:东莞市永固绝缘材料有限公司
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