108994results about How to "Improve mechanical properties" patented technology

A process for producing solid nanocomposite particles for lithium metal or lithium ion battery electrode applications is provided. In one preferred embodiment, the process comprises: (A) Preparing an electrode active material in a form of fine particles, rods, wires, fibers, or tubes with a dimension smaller than 1 μm; (B) Preparing separated or isolated nano graphene platelets with a thickness less than 50 nm; (C) Dispersing the nano graphene platelets and the electrode active material in a precursor fluid medium to form a suspension wherein the fluid medium contains a precursor matrix material dispersed or dissolved therein; and (D) Converting the suspension to the solid nanocomposite particles, wherein the precursor matrix material is converted into a protective matrix material reinforced by the nano graphene platelets and the electrode active material is substantially dispersed in the protective matrix material. For a lithium ion battery anode application, the matrix material is preferably amorphous carbon, polymeric carbon, or meso-phase carbon. Such solid nanocomposite particles provide a high anode capacity and good cycling stability. For a cathode application, the resulting lithium metal or lithium ion battery exhibits an exceptionally high cycle life.

A metal nanoparticle composition for the fabrication of conductive features. The metal nanoparticle composition advantageously has a low viscosity permitting deposition of the composition by direct-write tools. The metal nanoparticle composition advantageously also has a low conversion temperature, permitting its deposition and conversion to an electrical feature on polymeric substrates.

A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of first and second polarity electrode layers. Internal and / or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups and thin-film plated deposition is formed thereon by electroless and / or electrolytic plating techniques. A solder dam layer is provided over a given component surface and formed to expose predetermined areas where solder barrier and flash materials may be deposited before attaching solder preforms. Some embodiments include plated terminations substantially covering selected component surfaces to facilitate with heat dissipation and signal isolation for the electronic components.