1760 results about "Open cell" patented technology

The embodiment of the invention discloses an embedded substrate, a power supply device and electronic equipment. The embedded substrate comprises a front surface first adding layer jointed with the first surface of the core part maintaining body, a conduction structure electrically connected with a circuit layer of the dielectric layer is arranged in the dielectric layer of the front surface first adding layer, and the conduction structure comprises a first conduction structure electrically connected with a bonding pad on the chip; the dielectric layer of the first additional layer on the front side is made of an exposable and developable material, an open pore for constructing the conduction structure is formed through exposure and development, the open window of the outer protection layer has a first projection on the first surface, the first open pore for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. Through the arrangement, the first conduction structure with a larger through-flow cross section is constructed and formed by utilizing the windowing size of the chip side, so that the through-flow capability is effectively improved, and the heat conduction capability is high. In addition, the bonding stress between the circuit layer and the front surface of the chip can be reduced, the layering risk is reduced, and the reliability is better.

The invention relates to the technical field of lithium ion batteries, and provides a lithium ion battery. A negative plate of the battery comprises a negative current collector and a negative active material layer arranged on at least one side surface of the negative current collector, the negative active material layer comprises a negative active material, and the negative active material comprises a silicon carbon material; the open pore volume of the silicon carbon material is recorded as x mm < 3 > / g; the electrolyte comprises a compound A, and based on the total mass of the electrolyte, the mass ratio of the compound A is recorded as y%; the chemical formula of the compound A is shown as a formula I and / or a formula II; x and y meet the condition that y / x is more than 0.05 and less than or equal to 120, the fast charging performance of the battery can be improved, the thermal safety performance of the battery is improved, and the cycle life of the battery is prolonged.

A foam earplug for reception at least partially within the ear canal and including a body portion formed of resilient foam plastic material having a multiple open cell structure and having a size and shape for at least partial reception within the ear canal. A transdermal material having a particular beneficial action, and with an outer layer of the foam earplug infused with the transdermal material so that the benefits of the transdermal material is in transdermal contact with the ear canal. One example is a humectant material and, specifically, a moisturizer / lubricating material, for providing an increase to the lubrication and moisturizing in the ear canal. A second example is where the beneficial action is provided by systemic distribution such as a sleep aid, i.e., Melatonin, so that when the earplugs are worn during sleep, the earplugs will provide a sleep aid to the wearer.

The multifunctional acoustic device is formed by periodically arranging unit cells in the horizontal direction, and each unit cell comprises an upper frame body, a lower frame body and a vibration absorption sandwich layer located between the upper frame body and the lower frame body; the upper frame body is provided with a through hole; the vibration absorption sandwich layer comprises a central cantilever beam located at the transverse center position, a sandwich plate surrounding the periphery of the central cantilever beam and fixed between the upper frame body and the lower frame body, and vibrator mass blocks arranged above and below the central cantilever beam; the sandwich plate is connected with the central cantilever beam through a plurality of L-shaped beams; and the plurality of L-shaped beams surround the periphery of the central cantilever beam. The lattice sandwich structure is used as a basic frame, a local resonance system with a spring mass part is formed, a sub-wavelength elastic wave band gap frequency band is obtained, a low-frequency vibration reduction effect is generated, holes are formed in the upper frame body, the remaining part in the structure is used as an air spring, a Helmholtz resonant cavity is formed, and meanwhile low-frequency vibration reduction and broadband sound absorption are achieved.

An embedded substrate, a power supply apparatus, and an electronic device. The embedded substrate comprises a front first additional layer, which is joint with a first surface of a chip holding body, wherein a conduction structure which is electrically connected to a circuit layer of the front first additional layer is provided in a dielectric layer of the front first additional layer, the conduction structure comprising a first conduction structure electrically connected to a pad on a chip; the dielectric layer of the front first additional layer is made of an exposable and developable material, and openings for constructing the conduction structure are formed by means of exposure and development; and a window of an outer protection layer has a first projection on the first surface, a first opening for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. By means of such arrangements, a first conduction structure having a relatively large through-flow section is constructed by using the size of a window on a chip side, thereby effectively improving a through-flow capability, and achieving a good thermal conductivity capability. In addition, the joining stress between a circuit layer and the front surface of the chip can be reduced, thereby lowering the risk of delamination, and providing relatively good reliability.

The invention relates to the field of manufacturing of sensitive elements and sensors in the electronic core industry, in particular to a piezoelectric MEMS acoustic device and a manufacturing method thereof. The device structurally comprises a substrate, an insulating layer, a silicon substrate, a multi-layer composite film structure and a protective layer from bottom to top in sequence, wherein the multi-layer composite film structure is formed by alternately growing electrode layers and piezoelectric layers, and the first layer and the last layer of the multi-layer composite film are the electrode layers; a bonding pad is arranged on the multi-layer composite film structure; the protective layer covers the upper surface of the device; a suspended back cavity structure is arranged between the substrate and the insulating layer; the silicon substrate, the multi-layer composite film structure and the protective layer are connected through an opening communicated with the back cavity; according to the device provided by the invention, the volume of the piezoelectric material is increased mainly by adding the piezoelectric layer, and the energy conversion efficiency of the structure is effectively improved, so that the sensitivity of the transducer is improved.

An optical cavity includes a cell having at least one structure with a first end and a second end, a first end-cap configured to removably receive a first mirror, and a second end-cap configured to removably receive a second mirror. The first end-cap is attached to the structure at the first end and has an opening with a center axis. The second end-cap is attached to the structure at the second end and has an opening with a center axis that is axially aligned with the center axis of the first end-cap. The cell can be a closed cell, wherein the structure is a tube axially aligned with the center axis. The cell can be an open cell, wherein the structure is a tube that includes one or more openings through its wall. The cell can be an open cell, wherein the structure includes one or more rods, each off axis from the center axis.

Ground-engaging components for articles of footwear include an outer perimeter boundary rim that at least partially defines an outer perimeter of the ground-engaging component, wherein the outer perimeter boundary rim defines an upper-facing surface and an opposite ground-facing surface. The outer perimeter boundary rim defines an open space at least at a forefoot support area of the ground-engaging component. A matrix structure extends from the outer perimeter boundary rim (e.g., the ground-facing surface and / or the upper-facing surface) and across the open space at least at the forefoot support area to define an open cellular construction with plural open cells across the open space at least at the forefoot support area. The matrix structure defines one or more sets of adjacent open cells, the set(s) including at least three open cells that are substantially aligned in the forefoot support area along a line extending in a forward medial-to-rear lateral direction.

A heat protective sleeve includes a body being cylindrical extending along a longitudinal direction and comprising a triply periodic minimal surfaces (TPMS) structure, an open cell foam structure, or a lattice structure. A strip extends along the longitudinal direction of the body. The strip is a same material as the TPMS structure, the open cell foam structure, or the lattice structure. The material of the strip is solid and without holes through it. An endcap removably couples to the body. In some examples, the body has fastening threads and the endcap has mating threads. The mating threads of the endcap are configured to engage with the fastening threads of the body to releasably couple the endcap to the body.

The invention discloses a battery device and a power utilization device, and the battery device comprises a box body which is internally provided with a containing cavity and comprises a first plate; the heat exchange assembly comprises a first heat exchange part and a second heat exchange part which communicate with each other, the first heat exchange part is arranged outside the box body, and the second heat exchange part is arranged on the face, facing the containing cavity, of the first plate; the connecting block is arranged on the first heat exchange part; the heat exchange connector penetrates through the connecting block in the first direction and then is connected with the open hole in the first heat exchange part in a sealed mode, and the heat exchange connector is located outside the connecting block and welded to the connecting block. According to the scheme, the sealing performance of connection between the heat exchange connector and the first heat exchange part can be guaranteed, the sealing performance of the heat exchange connector and the connecting block can be guaranteed, and the sealing performance of the heat exchange connector during connection is effectively improved. Due to the fact that the heat exchange connector is connected with the first heat exchange part and the connecting block in a sealed mode, the sealing reliability can be improved.

A panel including a primary and a secondary substrate layer, an intermediate layer, and a top layer. The intermediate layer is located between the primary and secondary substrate layers. The top layer is applied on the secondary substrate layer. The intermediate layer has at least one of the following properties: the intermediate layer has a Shore A hardness that is 10 units lower than the Shore A hardness of the primary and / or secondary substrate layer; the intermediate layer has an elastic modulus that is at least 10.0% lower than the elastic modulus of the primary and / or secondary substrate layer; the intermediate layer includes a material with a substantially open cell structure; or the intermediate layer includes a foamed thermoplastic material or a foamed thermosetting material. Methods are provided for manufacturing the panel.

The invention relates to the technical field of chip embedded module packaging, in particular to a blind hole processing method and a substrate. An embedded chip substrate is prepared, a chip is embedded in the embedded chip substrate, and the chip is covered with an insulating layer; determining a hole opening position on the insulating layer, wherein the hole opening position corresponds to the embedding position of the chip on the chip embedding substrate; laser ablation is conducted on the hole opening position through ultraviolet laser according to preset laser parameters, so that an initial blind hole is machined in the hole opening position; and performing residue removal processing on the initial blind hole through plasma equipment to obtain a target blind hole. Therefore, the initial blind hole is machined in the hole opening position through the ultraviolet laser, molecular bonds can be directly destroyed, cold ablation is achieved and thermal damage is reduced on the basis of the characteristic that photon energy of the ultraviolet laser is high, meanwhile, the target blind hole with the smooth hole wall can be obtained by conducting residue removing treatment on the initial blind hole through plasma equipment, and the hole opening precision is improved. Compared with the prior art, high-precision and high-quality machining of the blind hole is achieved.

To provide a cooling heating instrument for providing a 'cooling comfortable temperature duration time' or 'heating comfortable temperature duration time' in which a cooling comfortable temperature or heating comfortable temperature lasts for a long time, by efficiently cooling or heating a human body affected part by inhibiting cooled air or heated air from being caused to diffuse to the outside by a cooling heating medium when being attached to the human body affected part.SOLUTION: A cooling heating instrument comprises: a surface member 2 that comprises foamed plastic material 20 including closed cell foamed plastic material having porous closed cells and / or open cell foamed plastic material having porous open cells and can be attached so as to cover a human body affected part; and a cooling heating medium 3 provided on the inner surface side of the surface member 2. The cooling heating instrument is configured so that when being attached so as to cover the human body affected part, the cooling heating medium 3 is positioned between the surface member 2 and the human body affected part and can cool or heat the human body affected part.SELECTED DRAWING: Figure 1

The invention relates to a solid-state battery positive electrode material layer and a solid-state battery, belongs to the technical field of solid-state batteries, and is used for solving at least one of the problems that an existing solid-state battery is easy to crack, poor in contact and large in resistance, and a solid-state electrolyte battery prepared by a physical vapor deposition method is thin in electrode thickness, low in capacity and the like. A plurality of holes are formed in the positive electrode material layer, the diameter of each hole is 0.1-10 [mu] m, the opening area of each hole in the unit area of the positive electrode material layer accounts for 20-60% of the total area, and each hole is of a through hole structure. The positive electrode material layer of the solid-state battery is provided with a plurality of holes with through hole structures, the solid electrolyte is embedded into the holes, the holes are filled with the solid electrolyte, the solid electrolyte covers the positive electrode material layer, and the holes have specific diameters and opening areas, so that the ionic conductivity is improved, and the service life of the solid-state battery is prolonged. The thickness of the prepared positive electrode material layer can be designed as required.

The present invention discloses a wireless ultrasonic measurement system and a construction method thereof, wherein the measurement system includes a sensing module and a detection module; the sensing module includes a piezoelectric layer on the surface of the detection object, a first lead-out electrode structure, a first grounding electrode structure, a first insulating plate, and a sensing coil; the first insulating plate is provided with a first opening; the first lead-out electrode structure includes a first lead-out electrode on the top of the piezoelectric layer and a second lead-out electrode in the first opening; the first grounding electrode structure includes a first grounding electrode and a second grounding electrode; the second lead-out electrode and the second grounding electrode are respectively connected to the first lead-out electrode and the first grounding electrode; the sensing coil is provided at the top of the first insulating plate. The detection system of the present invention uses an insulating plate to isolate the sensing coil away from the surface of the detection object, which is conducive to the sensing coil generating a non-zero induced voltage U ind , thereby enhancing the signal of the receiving coil, and realizing contactless ultrasonic signal reception with a receiving distance of up to 20mm.

The embodiment of the invention provides an indoor embellished antenna, and belongs to the technical field of communication antennae, the indoor embellished antenna comprises a dielectric substrate, and one side of the dielectric substrate is provided with a ground layer substrate; the patch substrate is arranged on the side, away from the stratum substrate, of the dielectric substrate, and hole sets arranged in an array mode are formed in the circumferential edge of the patch substrate and penetrate through the dielectric substrate and the stratum substrate. The main open groove is formed in the patch substrate, the main open groove is formed in an annular closed mode, any two opposite sides of the main open groove are respectively provided with a guide groove, the guide grooves extend to the open hole set, and the guide grooves, the main open groove and the open hole set jointly divide the patch substrate into two resonance areas; wherein the main slot forms a central patch resonant cavity, and each resonant region forms a substrate integrated waveguide resonant cavity. According to the indoor embellished antenna provided by the invention, the central patch resonant cavity and the substrate integrated waveguide resonant cavity are integrated in one frequency band, so that multi-resonance-point operation can be realized under the low-profile size design.

A power end frame of a reciprocating pump includes a first ring, a second ring, and a plurality of connections extending between the first ring and the second ring. The first ring, the second ring, and the plurality of connections are integral with one another, and the plurality of connections comprises a plurality of struts that form a plurality of open cells between the first ring and the second ring.

A connector assembly is provided and includes a shielding cage, a receptacle connector and a light guiding member. The shielding cage has a plurality of walls, a receiving space defined together by the plurality of walls, a front end opening communicated to the receiving space and an aperture communicated to the receiving space. The receptacle connector is received in a rear segment of the receiving space of the shielding cage. The light guiding member has at least two light guiding pipes, each light guiding pipe has a first segment positioned to the front and a second segment positioned to the rear. The first segments of the two light guiding pipes are positioned outside the shielding cage and the second segments of the two light guiding pipes pass through the aperture and enter into the rear segment of the receiving space of the shielding cage.

The present disclosure relates to the technical field of earphone equipment, and describes a hybrid dual unit earphone, comprising an earphone casing, an inside cavity arranged in the earphone casing, a sound output port configured to communicate with the inside cavity and provided on the earphone casing, an independent sound guiding cavity arranged in the inside cavity, wherein an opening of the sound guiding cavity is arranged toward the sound output port; a dynamic unit component comprising a dynamic speaker arranged in the inside cavity, where the sound output direction of the dynamic speaker is set towards the sound output port; a high-frequency unit component comprising a high-frequency speaker arranged in the sound guiding cavity, where the sound output direction of the high-frequency speaker is set towards the sound output port.

The utility model relates to the technical field of electric power fitting processing, and discloses a clamping tool for electric power fitting processing, which comprises a base, connecting rods and a supporting seat, the surface of the base is symmetrically and fixedly connected with the connecting rods, the top ends of the connecting rods are fixedly connected with the supporting seat, and the surface of the supporting seat is fixedly connected with a U-shaped frame. An adjusting screw rod is inserted into the U-shaped frame, the adjusting screw rod is in threaded connection with the U-shaped frame, and the bottom end of the adjusting screw rod extends into the U-shaped frame and is rotationally connected with a movable mounting base arranged in the U-shaped frame. The problems that according to an existing perforating mode mentioned in the background technology, an arc-shaped clamp is generally pressed by one hand, perforating operation is conducted through a drilling gun by the other hand, errors are large in the operation process, and drilling may fail once the arc-shaped clamp moves are solved.

The invention provides a design method of a Bump module at the rear end of a digital integrated circuit, and belongs to the field of power consumption analysis of the rear end of a digital chip of the integrated circuit. The invention provides a Bump module design process for solving the problems of inaccurate power consumption analysis and low analysis efficiency caused by insufficient power supply points during voltage drop analysis. The method comprises the steps of preparing digital back-end layout wiring data, selecting a metal layer according to project indexes to create a power strip line, setting a power strip mode, opening holes and connecting the metal layer, creating Bump specific data information, selecting a corresponding Bump to connect a power line and a ground wire, exporting specific position information of the Bump and marking the specific position information to an AP layer, and creating Physic Pin and exporting a def.gz file. The method is mainly applied to providing a power supply point for voltage drop analysis after digital back-end layout wiring and before voltage drop analysis, facilitates subsequent RC parasitic parameter extraction, further reduces dynamic voltage drop through the power supply point, is more convenient to operate, reduces the design cycle of a digital integrated circuit, and shortens the sign-off time.

The utility model relates to the technical field of batteries, in particular to a battery cell cover plate and a battery cell. The battery cell cover plate comprises a pole and a cover plate, wherein the pole comprises a pole body part and a plate body part, and the pole body part penetrates through a mounting hole of a cover plate main body; the terminal post is riveted with the riveting piece, so that the circumferential side wall of part of the post body part expands outwards to form a material expansion part; the section, perpendicular to the axis of the pole, of the pole forms a strip-shaped structure, K is equal to (1 / 3-2 / 3) L, and M is equal to (1 / 3-2 / 3) W. The section, perpendicular to the axis of the pole, of the pole is of the strip-shaped structure, so that compared with a traditional cylindrical pole structure, the pole has the advantages that the overflowing capacity is improved, and the size proportion relation between the pole body part and the plate body part of the pole is defined as K = (1 / 3-2 / 3) L and M = (1 / 3-2 / 3) W, so that the overflowing capacity of the pole is effectively improved; and the structural strength of the cover plate main body is not influenced by the opening size of the mounting hole, so that the structural strength of the battery cell cover plate meets the battery cell use requirement.

The present invention relates to the field of semiconductors. Provided are a semiconductor structure and a preparation method therefor, and an electronic device, which are used for simplifying semiconductor structures and preparation methods therefor. The preparation method for the semiconductor structure comprises: forming 2n stacked material layer groups (2101) on a first substrate (100), wherein each stacked material layer group (2101) comprises a first material film layer (2111) and a second material film layer (2121); forming n first openings (10) with different depths, and among the first openings (10) from shallow to deep, forming first isolation layers (310) at ends of the first (i-1) first material film layers (2111) penetrated by the ith first opening (10); forming a second opening (20) below each first opening (10), and forming second isolation layers (320) at ends of the first (n-1) first material film layers (2111) penetrated by each second opening (20); and below each second opening (20), forming a third opening (30) extending to the first substrate (100), and forming third isolation layers (330) at ends of the first material film layers (2111) penetrated by each third opening (30).

The invention relates to the technical field of noise treatment, and discloses a composite sound absorption and insulation device which comprises a cavity, a Fabry-Perot resonance structure, gradient structure sound absorption felt, two-dimensional dot matrix scatterer sound insulation rubber and a cover plate. An opening is formed in one side of the cavity, and the two-dimensional dot matrix scatterer sound insulation rubber, the gradient structure sound absorption felt, the Fabry-Perot resonance structure and the cover plate are sequentially arranged at the bottom of the cavity in the direction towards the opening. Wherein an opening is formed in the middle of the top of the cover plate; the Fabry-Perot resonance structure comprises a micro-perforated plate and a space coiling channel, and the micro-perforated plate is arranged right above an opening of the space coiling channel and penetrates through the cover plate to be matched with the opening of the cover plate, so that the cover plate covers the rest part of the space coiling channel; through the combination of a plurality of advanced sound absorption and insulation structures, the low-frequency noise of 100Hz and frequency multiplication of the transformer substation is effectively treated.

The utility model provides a three-position switch and a ring main unit, the three-position switch comprises a first fixed seat and a plurality of grounding contacts, each grounding contact corresponds to one phase in a power supply network, and the plurality of grounding contacts are arranged on the first fixed seat; the grounding shielding base is arranged on the first fixing base, the grounding shielding base is configured to be an integrally-formed metal piece, a plurality of open holes are formed in the grounding shielding base, and the grounding contacts are exposed out of the corresponding open holes; each second fixing seat is correspondingly provided with an isolation static contact. And a plurality of moving contacts are arranged on the third fixed seat at intervals, and the moving contacts can rotate relative to the third fixed seat so as to be electrically connected with the grounding contact or the isolation static contact selectively. By optimizing the electric field of the three-position switch, the three-position switch can have a better insulation level, and the overall size of the three-position switch is reduced. Furthermore, the three-position switch can be applied to a small-size ring main unit with space limitation and higher insulation requirements.

The double-spiral Helmholtz resonator comprises a cavity, an upper cover of the cavity is provided with at least two open holes, each open hole is internally embedded with a spiral pipe, the spiral pipes surround downwards along the interior of the cavity, the openings located above the spiral pipes are connected with a water area, a rubber coating is arranged in the cavity, and the rubber coating is arranged in the cavity. The spiral pipes are hollow spiral pipes which are not overlapped with one another, it is guaranteed that the water cavity and the resonant cavity are connected and communicated, and Helmholtz resonance is triggered through the physical interaction between the rubber coating and the embedded spiral pipes. Helmholtz resonance is triggered through the physical interaction of the rubber coating and the embedded spiral neck, an excellent sound absorption effect is achieved, theoretical prediction is well matched with a finite element simulation result, the sound absorption coefficient of the proposed double-spiral Helmholtz resonator structure cell element at 105Hz reaches 0.91, and the sound absorption coefficient of the double-spiral Helmholtz resonator structure cell element at 105Hz reaches 0.91. The wavelength k of the sound wave is 300 times of the thickness H of the metamaterial, and perfect absorption is achieved on the deep sub-wavelength scale.

The invention discloses a BIM (Building Information Modeling)-based suspended ceiling advanced accurate positioning and trepanning construction method, which comprises the following steps of: S1, establishing a construction model of each specialty in a suspended ceiling, performing collision inspection, and adjusting the construction model; s2, establishing a three-dimensional model including suspenders, keels and the like by utilizing BIM software; s3, comprehensive collision inspection is carried out, and the ceiling structure is prevented from conflicting with other professional equipment; s4, generating a construction drawing and organizing field implementation according to comprehensive suspended ceiling deepening typesetting; s5, a trepanning positioning plate is manufactured, and the trepanning positioning plate is used for accurately positioning the trepanning point position of the veneer plate on site; s6, paying off the trepanning point, confirming a central point and implementing accurate trepanning; and S7, after trepanning is completed, point location installation is conducted on facility equipment needing to be installed in advance. Advanced coordination of the keel in the suspended ceiling and various equipment point positions can be achieved, precise positioning of suspended ceiling trepanning is achieved, disassembly and rework are reduced, and the construction precision and efficiency are improved.

The invention provides an automatic disassembling and recycling system and method for waste electric energy meters, the system comprises a disassembling line and a PCB panel and further comprises a junction box on the PCB panel, the disassembling line is provided with a disassembling device, the disassembling device comprises a first processing platform and a second processing platform which are arranged on the disassembling line, and the first processing platform and the second processing platform are arranged on the PCB panel. The top end of the first processing platform and the top end of the second processing platform are each provided with an adjusting rail and a machining platform, and each machining platform is provided with a lifting assembly, a positioning assembly, a conversion assembly, a collection assembly, a transfer assembly, an air inlet assembly, an air outlet assembly, a limiting assembly and an output assembly. And the discharged electric energy is collected and used for doing work, and the collected electric energy is used for tapping the capacitor and collecting electrolyte, so that the safety on a disassembly line is greatly improved, and meanwhile, pollution is reduced.

The invention discloses a method for preparing open-cell zeolite molecular sieve homogeneous dispersion liquid under mild conditions. The method comprises the following steps: dispersing a molecular sieve containing a template agent in a quartz container filled with methyl pyrrolidone and hydrogen peroxide, and carrying out ultraviolet radiation on a solution in a continuous stirring state to obtain the activated open-pore zeolite molecular sieve dispersion liquid. According to the method provided by the invention, the organic template agent in micropores of the zeolite molecular sieve nanosheets or nanoparticles can be effectively removed at a temperature close to room temperature, the operation is simple, the condition is mild and pollution-free, and the problem that the zeolite molecular sieve nanosheets or nanoparticles are seriously agglomerated during traditional high-temperature roasting and pore opening is effectively solved. The highly dispersed open-pore zeolite molecular sieve nanosheet or nanoparticle dispersion liquid has a wide application prospect in construction of a two-dimensional zeolite molecular sieve membrane or a mixed matrix membrane.

The invention provides a three-dimensional porous material, a negative electrode composite material and application, the three-dimensional porous material has specially designed opening aperture distribution, the volume ratio of open pores with the opening aperture less than or equal to 2nm is greater than or equal to 70%, and the volume ratio of open pores with the opening aperture of 1nm-2nm is greater than or equal to 50%, so that the proportion of effective deposition pores in the three-dimensional porous material is relatively high; and the concentration ratio of aperture distribution of the openings is relatively high, so that a relatively excellent threshold limiting effect can be realized, and the negative electrode composite material with high gram volume and relatively high structural stability can be provided.