291results about "Force measurement by measuring frquency variations" patented technology

The invention discloses a vibrating wire sensor fault diagnosis and repair method, system and device, and a storage medium. The method comprises the steps of collecting an output signal of a vibrating wire sensor; amplitude values of all the collected output signals of the vibrating wire sensor are amplified, and a band-pass filter circuit is used for filtering; inputting the amplified and filtered data into a pre-constructed fault diagnosis and recognition model, and performing feature extraction and classification so as to recognize the vibrating wire sensor with the fault and the fault type of the vibrating wire sensor; according to the fault type, different modes are selected to repair the vibrating wire sensor with the fault; the diagnosis result and the working state of the fault diagnosis and recognition model and the real frequency of the repaired vibrating wire sensor are displayed; and storing all the data for subsequent analysis and iterative updating of a fault diagnosis and recognition model. According to the invention, fault diagnosis and online real-time monitoring can be accurately and effectively carried out on the vibrating wire sensor, and the vibrating wire sensor with faults can be rapidly repaired.

The invention relates to the technical field of MEMS microsensors, and discloses a resonant pressure sensor and a preparation method thereof, the resonant pressure sensor comprises a substrate layer and a resonant assembly, the substrate layer comprises a support substrate and a pressure sensitive film; the supporting substrate is located at the side part of the pressure sensitive film; the resonance assembly comprises a first resonance beam and a second resonance beam which are arranged in parallel, two ends of the first resonance beam are connected with the pressure sensitive film through a first anchor area and a second anchor area, and two ends of the second resonance beam are connected with the pressure sensitive film through a third anchor area and a fourth anchor area; the first resonant beam and the second resonant beam are coupled and connected together through the mass block and the spring; the resonance assembly further comprises a first driving electrode unit and a second driving electrode unit. The first driving electrode unit is positioned on one side of the first resonant beam; the second driving electrode unit is located on one side of the second resonant beam. Compared with the prior art, the detection sensitivity, precision and reliability of the sensor can be improved, the Q value is improved, and the measuring range of the sensor is increased.

The invention discloses an application method of a resonant pressure sensor, which relates to the technical field of sensor equipment, and comprises the following steps: sensor site selection and environment modeling, a resonant cavity is adjusted, a pressure buffer device is installed after adjustment, an embedded temperature compensation module is configured in the sensor, multi-frequency resonance modes are switched, a resonant frequency amplification loop is designed, abnormal pressure fluctuation is diagnosed in real time, and a sensor array is deployed in a distributed mode. According to the application method of the resonant pressure sensor, the adaptability and the reliability of the resonant pressure sensor in a complex environment are remarkably improved by embedding a temperature compensation module and a real-time diagnosis mechanism. On one hand, the temperature compensation module effectively eliminates the influence of frequency drift by using a dynamic adjustment algorithm, and guarantees the measurement precision of the sensor in a wide temperature range; on the other hand, sound wave resonance spectrum analysis is introduced, and real-time early warning of abnormal states such as blockage and leakage is achieved.

The invention provides a silicon resonance pressure sensor. The silicon resonance pressure sensor comprises a pressure sensing layer, a device layer and a substrate layer, the pressure sensing layer is arranged on one side of the device layer; a pressure film is arranged on the pressure sensing layer; the device layer is provided with a first resonator and a second resonator, and the first resonator and the second resonator are eccentrically arranged on two opposite sides of the device layer; the first resonator and the second resonator are respectively connected with a stress transfer block; the stress transfer block is connected with the pressure film; each of the first resonator and the second resonator comprises two groups of symmetrical resonance units, each group of resonance units comprises a main beam, a connecting beam, a first auxiliary beam and a second auxiliary beam, and the first auxiliary beam and the second auxiliary beam are connected with the main beam through the connecting beam. The silicon resonance pressure sensor has the technical effects that the influence of temperature on the resonance frequency of the silicon resonance pressure sensor can be reduced, the product stability and precision are greatly improved, and the service life is greatly prolonged.

The invention provides a silicon resonance pressure sensor. The silicon resonance pressure sensor comprises a pressure sensing layer, a resonance layer and a glass layer, one side, close to the resonance layer, of the pressure sensing layer is provided with a first pressure sensing groove, and two opposite sides in the first pressure sensing groove are respectively provided with a silicon island; the resonance layer comprises a cover plate, a mass block, an elastic piece, a resonance main beam, a resonance auxiliary beam, fixed comb teeth and movable comb teeth. The cover plate is arranged on the silicon island in a covering manner; the two ends of the mass block are connected with the two cover plates through elastic pieces respectively, a plurality of through holes are formed in the mass block, and the through holes form a honeycomb nest structure; the two ends of the resonance main beam are connected with the two cover plates respectively, the end, away from the resonance main beam, of the resonance auxiliary beam is connected with movable comb teeth, and the fixed comb teeth and the movable comb teeth are matched with each other to form an electrostatic comb tooth pair. One technical effect of the invention is that the temperature drift can be reduced, so that the accuracy of the measurement result of the silicon resonance pressure sensor is ensured.

The invention provides a resonant pressure sensor with adjustable measuring range and sensitivity, and relates to the technical field of sensors, and the resonant pressure sensor comprises a pressure sensitive film which is used for detecting external pressure; the resonator layer comprises a double-end clamped resonant beam, the double-end clamped resonant beam is arranged above the pressure sensitive film, a movable part of the double-end clamped resonant beam is suspended, one side of the double-end clamped resonant beam is provided with two driving electrodes for applying an alternating current driving signal and a parameter pumping alternating current signal respectively, and the other side of the double-end clamped resonant beam is provided with two detection electrodes; the silicon sealing cover layer is provided with a resonant cavity, and the resonant cavity is located above the pressure sensitive film and the double-end clamped resonant beam and used for providing a deformation space for the pressure sensitive film and providing a vibration space for the double-end clamped resonant beam; in the first working mode, the first-order mode of the resonant beam is split into two amplitude peak values by applying a parameter pumping alternating current signal, and the sensitivity of the output amplitude ratio is adjusted by adjusting the amplitude of the parameter pumping alternating current signal; the measurement range is adjusted by adjusting the frequency of the parameter pumping alternating current signal.

The invention relates to the technical field of force measurement, and provides a pressure sensor sensitive structure and a packaging method thereof, the pressure sensor sensitive structure comprises a pressure sensing layer, a vibration beam layer and a substrate layer, the pressure sensing layer comprises a pressure sensing film, the pressure sensing film is provided with a first cavity and a boss, the boss is arranged in the first cavity, and the first cavity and the boss form a stress isolation groove structure; the vibration beam layer comprises a vibration beam base body and a plurality of vibration beam structures, the vibration beam base body is connected to the side, provided with the first concave cavity, of the pressure sensing layer, the vibration beam structures are connected to the vibration beam base body, each vibration beam structure comprises a pressure measuring vibration beam and a reference vibration beam, an anchor area of the pressure measuring vibration beam is fixedly connected to the boss, and an anchor area of the reference vibration beam is fixedly connected to the vibration beam base body; the substrate layer is connected to the vibrating beam layer, and the vibrating beam layer is arranged between the pressure sensing layer and the substrate layer. Through the first concave cavity and the boss of the pressure-sensitive film, assembly stress and thermal stress can be effectively absorbed, the possibility of distortion of the pressure-sensitive film is reduced, and the boss can amplify the deformation quantity of the pressure-sensitive film.

The utility model discloses an integrated vibrating wire type stressometer, which comprises a main shell, a circuit board arranged in the main shell is provided with a minimum system unit, the minimum system unit is connected with an external communication unit, a simulation measurement unit and a power supply unit, the bottom of the main shell is provided with a battery cover plate, and the top of the main shell is provided with an upper cover. According to the utility model, the problems of inconvenient field power supply and high equipment failure rate of the vibrating wire type stress meter measuring equipment in the prior art are solved.

A leadless high-sensitivity all-quartz differential resonant pressure sensor chip comprises a quartz protection layer, the quartz protection layer is in bonding connection with a first quartz resonance layer, and the first quartz resonance layer, a quartz differential layer, a second quartz resonance layer and a quartz intermediate layer are in sealed connection through a glass frit bonding technology. The quartz middle layer and the quartz temperature sensing layer are in butt joint through a bonding technology, and the quartz temperature sensing layer and the quartz base are fixed through a glass frit bonding technology. After the conductive silver paste is subjected to high-temperature curing treatment, electrode signal conduction between the gold-plated lead columns and the first quartz resonance layer, the second quartz resonance layer and the quartz temperature sensing layer is realized; the differential output effect is remarkably improved, and conjugate interference is effectively restrained; the long-term stability of the vacuum sealing device is improved; the sensor sensitivity is improved; the reliability and the stability of electrical connection are improved; the problem of temperature measurement lag of an external temperature sensor is eliminated, and the precision of the sensor is further improved.

The utility model discloses a bridge stress-strain signal sensor, and belongs to the field of bridge stress-strain sensors, and the bridge stress-strain signal sensor comprises a vibrating wire type sensor body and fixing mechanisms disposed at two ends of the vibrating wire type sensor body. The fixing mechanism comprises positioning assemblies fixedly installed at the two ends of the vibration wire type sensor body and pre-tightening adjusting assemblies arranged on the side faces of the positioning assemblies and used for adjusting the pre-tightening force of the vibration wire type sensor body. The pre-tightening adjusting assembly comprises a connecting plate used for being connected with the surface of the bridge and sliding rods symmetrically fixed to the connecting plate and slidably connected with the positioning assembly. According to the bridge stress-strain signal sensor, through the welding frame and the friction particles on the connecting plate and filling of the epoxy resin, the fitting degree of the sensor and the surface of a bridge is effectively improved, and the problem of mounting looseness caused by deviation of the flatness of the surface of the bridge is reduced.

The invention relates to the field of geotechnical engineering monitoring. The invention provides a vibrating wire type stress meter and application thereof in tunnel surrounding rock stress monitoring. The device comprises a shaft sleeve, a steel bar, a fixing part, a steel string and an excitation sensing module, the end of the steel bar is located in the shaft sleeve, and the fixing part and the steel string are axially arranged in the shaft sleeve. Fixing parts are arranged at the two ends of the steel string, and the ends, away from the steel string, of the fixing parts are connected with the steel bars. The excitation sensing module is arranged above the steel string and installed outside the shaft sleeve. Wherein the middle part of the steel string is a twisted section, and two ends of the steel string are linear sections. According to the invention, the steel string preferentially releases geometric deformation under the action of axial tensile stress through the pre-arranged twisting section in the middle of the steel string, thereby effectively enlarging the amplitude change caused by micro stress, enhancing the response sensitivity of the steel string, breaking through the structural limitation that the stability and the sensitivity of a traditional stress meter are difficult to achieve at the same time, and improving the reliability of the stress meter. The method is suitable for high-reliability and high-precision application scenes in tunnel surrounding rock stress monitoring.

The invention relates to the technical field of force measurement, and provides a pressure sensor sensitive structure and a packaging method thereof, the pressure sensor sensitive structure comprises a pressure sensing layer, a vibration beam layer, a stress isolation layer and a substrate layer, and the pressure sensing layer comprises a pressure sensing film; the vibrating beam layer comprises a vibrating beam base body and a vibrating beam structure, the vibrating beam base body is connected to the pressure sensing film, and the vibrating beam structure is connected to the vibrating beam base body; the stress isolation layer comprises a stress isolation ring structure, the stress isolation ring structure is connected to the side, away from the pressure sensing film, of the vibration beam base body, the stress isolation ring structure is hollow to form a through hole, and the vibration beam base body covers the first end of the through hole; the substrate layer comprises a quartz substrate sheet, the quartz substrate sheet is connected to the stress isolation layer, and the quartz substrate sheet covers the second end of the through hole. The stress isolation ring structure is arranged between the substrate layer and the vibration beam layer, so that the influence of external stress on the vibration beam layer can be isolated, the stability and the precision of the vibration beam structure are protected, the assembly stress, the thermal stress and the vibration impact stress from packaging can be effectively weakened, and the stability of zero offset of the whole meter is improved.

The invention relates to a pulse width modulation silicon resonant pressure sensor closed-loop circuit and a debugging method, the pulse width modulation silicon resonant pressure sensor closed-loop circuit comprises a resonant sensor, a current and voltage conversion circuit, a comparator circuit, an amplitude control circuit and a pulse width modulation generation circuit, and the comparator circuit converts the amplified frequency signal into a square wave signal, generates a pulse signal through the pulse width modulation generation circuit, and is connected to the driving end of the resonator to generate a driving signal to form a closed-loop system. Wherein the amplitude control circuit is used for detecting the signal amplitude of the sensor and generating a control signal to adjust the impedance of the pulse width modulation generation circuit so as to adjust the pulse width of the driving signal and finally realize the stable closed loop of the sensor. According to the method of the closed-loop circuit based on pulse width modulation, the structure of the closed-loop driving circuit is optimized, the number of components is reduced, the pull-in risk is reduced, and the stability of the closed loop is improved.

The invention relates to a singular point-based high-sensitivity pressure sensor and a pressure information acquisition method. The sensor comprises a substrate, a coupled resonator, a rigidity adjusting electrode and an external feedback control circuit, and the coupled resonator is arranged on the substrate; the coupled resonator comprises a gain resonator and a loss resonator; the gain resonator and the loss resonator are connected with bias electrodes through electrostatic coupling. The bias electrode is used for controlling the initial bias of the sensor at a singular point; the rigidity adjusting electrode is used for applying bias voltage to the resonant beam of the gain resonator and the resonant beam of the loss resonator; a first external feedback control circuit in the external feedback control circuits is electrically connected with the gain resonator; and a second external feedback control circuit in the external feedback control circuits is electrically connected with the loss resonator. By adopting the sensor, the change condition of the resonant frequency can be analyzed, the accurate measurement of the pressure is realized, and the accuracy of the pressure measurement is improved.

The invention relates to the technical field of pressure sensors. The invention specifically relates to an MEMS resonant pressure sensor and a manufacturing method thereof. The MEMS resonant pressure sensor provided by the invention comprises a substrate layer; the substrate layer comprises a sensitive film; the sensitive film is suitable for converting pressure applied by the sensor into stress; an intermediate layer; the middle layer comprises a harmonic oscillator structure; the harmonic oscillator structure is connected to the sensitive film through the anchor area and is suitable for converting stress converted by the sensitive film into resonant motion of the harmonic oscillator structure. The middle layer further comprises an excitation detection structure; and the excitation detection structure is arranged at the side part of the harmonic oscillator structure and is suitable for exciting the resonant motion of the harmonic oscillator structure, detecting the frequency of the resonant motion and calculating the pressure applied by the sensor through the output electric signal. The harmonic oscillator structure comprises a resonant beam and a fixed beam which is perpendicular to the resonant beam and is connected with the resonant beam. One end of the fixed beam is connected to the midpoint of the resonant beam. The MEMS resonant pressure sensor provided by the invention has relatively high sensitivity.

An apparatus for determining an efficiency index of a process comprises processing equipment (103) for receiving data indicative of service produced by the process and data indicative of efficiency parameters needed for production of the service The apparatus comprises a memory (101) storing response quantities each associated with a predetermined stress range and expressing an upper limit for number of stress cycles at an observation point of a mechanical system used in the process, where the stress cycles have the stress range related to the response value. The processing equipment updates stress history quantities expressing number of occurred stress cycles having stress ranges related to the response quantities. A fatigue damage sum is estimated based on the response quantities and the stress history quantities. The efficiency index is formed based on the service, the efficiency parameters, and the fatigue damage sum.

The present invention relates to a mechanical monitoring sensor for a segment, and an auxiliary mounting device thereof. The sensor comprises a pressure-bearing component and a sensor body. The pressure-bearing component is independent of the sensor body. An arch-shaped shell of the pressure-bearing component deforms under external pressure to extrude a pressure-bearing liquid inside to pass through a first liquid pipe and a second liquid pipe to enter the sensor body so as to push a sensing end of a piston to move. A sensing diaphragm on the sensing end of the piston is in contact with the pressure-bearing liquid, a fixed end of the piston is connected to a steel wire by means of a spring, and the piston converts the pressure received by the sensing diaphragm into a pulling force on the steel wire. The present invention has the advantages such as long service life and high reliability of monitoring data.

The invention discloses a manufacturing method of a resonant beam type pressure sensor, which belongs to the technical field of micro electro mechanical systems and comprises the following steps of: adopting an SOI (Silicon On Insulator) silicon wafer, and processing a central deep groove and an annular deep groove on the back surface of a substrate silicon layer by utilizing anisotropic dry etching to form a pressure sensing diaphragm and a boundary region; bonding the bottom surface of the boundary area on the base; forming a resonant beam and a clamped region on the device layer by using anisotropic etching; etching through the annular deep groove by using a plasma deep silicon etching process; silicon dioxide at the bottom of the beam is removed through reactive ion etching, and a suspended beam structure and a supporting column are obtained.

The present application belongs to the technical field of engineering structure health monitoring, and discloses a photovoltaic flexible support cable force non-contact monitoring method and system based on video vibration. First, a cable video sequence is acquired, and a dynamic sensitive area is adaptively divided along the cable image. The time sequence average value of the pixel intensity in each area is calculated, the two-dimensional image information is converted into a one-dimensional vibration time history signal, and the light drift and image noise are suppressed through difference and wavelet denoising. After filtering the signal of each dynamic sensitive area, the initial frequency set is formed by preliminarily extracting the multi-order dominant frequency estimate value. The frequency observations from all areas are fused and analyzed, and the real frequency cluster is identified. The weighted centroid frequency of the cluster is used as the multi-order vibration frequency. Finally, the multi-order frequency is substituted into the model, and the real-time cable force value is output. The whole process of the method does not need to contact the measured cable, and provides an innovative and reliable solution for long-term online safety monitoring of the flexible support cable force in complex environments.

The present invention discloses a sensor system and method. The sensor system includes one or more rotor antennas on an axis moving in a stator bracket, the one or more rotor antennas are one or more of the conditions around the axis of the sensor system or along the axis of the sensor system, and the one or more rotor antennas are configured to communicate sensing data with the one or more stator antennas on the stator bracket. Each rotor antenna has a rotor signal trace disposed on an outer rotor side of a dielectric substrate of the rotor antenna and a rotor return trace disposed on the outer rotor side of the dielectric substrate, wherein the rotor signal trace and the rotor return trace are not concentric with respect to each other.

The present invention provides a stress monitoring device for a steel sheet pile cofferdam of a large-scale gate pump project along the river. A heat insulating pad is arranged in a connecting sleeve, and the connecting sleeve and a butt screw are connected through a butt screw sleeve. The end of a steel bar is fixedly connected to the butt screw, and the end of the butt screw can abut against the heat insulating pad, and the heat insulating pad can continuously cool the end of the steel bar and the butt screw. The present invention can disassemble the butt screw sleeve and the threaded shell of the welded butt screw. When welding, the butt screw and the butt screw sleeve are first disconnected, and the welding slot of the butt screw is separately sleeved on the end of the steel bar for welding. During the welding process, the butt screw is kept separated from the vibrating-wire stress gauge to avoid the influence of the temperature during the welding process on the vibrating-wire stress gauge. During the threaded connection process, the end of the butt screw will be partially isolated between the heat insulating pad and the inner wall of the butt screw sleeve, which is conducive to reducing the contact area between the butt screw and the butt screw sleeve.

To provide a pressure sensing device using a remote and passive bioimplantable pressure sensor.SOLUTION: A wireless pressure sensing unit 20 comprises a membrane forming an outer wall portion of a cavity and two permanent magnets in the cavity. One magnet is coupled to the membrane and at least one of the magnets freely oscillates by a rotational movement. The at least one freely oscillates by a rotational movement. The oscillation occurs at a resonant frequency that is a function of the pressure being sensed, and the pressure affects the space between the two permanent magnets. This oscillation frequency can be sensed remotely by measuring the magnetic field changed by the oscillation. The wireless pressure sensing unit is provided on a catheter 21 or a guide wire.SELECTED DRAWING: Figure 1

The invention relates to the technical field of anchoring measurement, in particular to a grouting type hollow interlayer multi-string anchor rod axial force meter which comprises an anchor head, a plurality of through anchor rods and steel bar meters distributed between every two adjacent through anchor rods. The steel bar meter comprises a connecting sleeve, a cable is fixed to the outer portion of the connecting sleeve in a sealed mode, and a coil connected with the cable is connected to the inner wall of the connecting sleeve in an embedded mode. The interior of the through anchor rod is designed to be of a through structure, and threaded openings are formed in the outer portions of the two ends of the through anchor rod. Threaded openings matched with the through anchor rods are formed in the two ends of the interior of the connecting sleeve in the steel bar meter, and the steel bar meter is in threaded connection with the through anchor rods through the threaded openings. The anchor head is in threaded connection with the interior of one end of the through anchor rod, and the interior of one end of the through anchor rod is in threaded connection with a fastening nut. The installation structure of the anchor rod and the reinforcement meter is simple and convenient, a user can select and install the anchor rod and the reinforcement meter conveniently according to specific use conditions, and the high-efficiency construction measurement requirement is met.

The invention relates to a sensor unit (20) for detecting forces and their directions in the XY plane, comprising at least two sensors distributed on a mechanical measuring body (10). According to the invention, the at least two sensors are surface acoustic wave (SAW) sensors (24), wherein one or more milled grooves (22) are formed in the surface of the measuring body (10) for controlling the propagation of surface acoustic waves, and wherein the SAW sensors (24) are arranged on the measuring body (10) such that a precise determination of the direction and magnitude of the acting forces in the XY plane is enabled.

The utility model provides a novel steel bar stress meter, which comprises a steel bar stress meter main body, the steel bar stress meter main body is respectively connected with corresponding modular pull rods through pull rod sleeves arranged at the two ends of the steel bar stress meter main body, each modular pull rod is respectively connected with a corresponding pile steel bar, and the two pile steel bars are arranged in a mirror symmetry manner; a wire of the steel bar stress meter main body is led to the ground surface; the splicing module type pull rod is innovatively adopted, the core of the splicing module type pull rod is that the positioning ring is ingeniously matched with the butt joint bolt, so that the welding rod is stably installed on the pile steel bar, and accurate welding can be achieved without an extra tool. During welding, the modular pull rod is separated from the pull rod sleeve of the steel bar stress meter body, high-temperature transmission is effectively blocked, the sensor is protected against damage, additional cooling measures are not needed, the stability and reliability of the system are remarkably improved, and the operation process is simplified through the design.

The invention discloses an interface soil pressure detection device and method based on a stress ring, a pressure gauge comprises an outer protection cover, an upper bearing plate, an upper supporting plate, a fixing plate, an extension rod, the stress ring, a bearing ring, a lower supporting plate, a lower bearing plate and a one-way hinge, the outer protection cover is a protection cover when the interface pressure gauge is used, the damage to the pressure gauge is reduced, and the reliability of the interface pressure gauge is improved. Pressure is borne by the upper force bearing plate and the lower force bearing plate, measurement is carried out through deformation of the stress ring in the middle of the interface pressure gauge, and the one-way hinge is used for converting the pressure of the upper force bearing plate into resultant force and uniformly transmitting the resultant force to the stress ring. And the soil arching effect caused by the pressure film sinking below the pressure gauge shell is avoided. According to the invention, a set of multi-stage decoupling interface stress transmission and sensing architecture is constructed, thorough immunity to bending moment and shear interference is realized, and the technical problem that the traditional pressure gauge fails due to unbalance loading and soil body effect is fundamentally solved.

The invention discloses an oil-filled medium isolation packaging type silicon resonance pressure sensor and a preparation method thereof, belongs to the technical field of MEMS pressure sensors, and solves the problem that an existing pressure sensor is liable to have intermittent faults. The device specifically comprises a tube body, a concave cavity is formed in the top of the tube body, and a silicon resonance chip is arranged in the concave cavity; a cap is mounted at the top of the tube body, an isolation diaphragm is arranged between the cap and the tube body, and silicone oil is filled between the isolation diaphragm and the tube body. According to the invention, a measurement medium enters the cap through the filler neck to extrude the isolation diaphragm, the isolation diaphragm generates micro deformation when sensing the pressure of the medium, the pressure is transmitted to the silicon resonance chip through silicone oil in the pipe body, and the silicon resonance chip converts the external pressure into a perceivable analog signal; in the process, an external measuring medium does not directly act on the silicon resonance chip, so that the problem of intermittent fault or complete failure of the silicon resonance sensor in a corrosive gas or liquid environment is avoided.

The utility model discloses a vibrating wire signal conditioning circuit in the field of power electronics, which comprises a filter protection circuit, the filter protection circuit is connected with an excitation power supply circuit and a clamping amplification circuit, and the clamping amplification circuit is connected with an operational amplifier power supply circuit and a hysteresis comparison circuit. Vibrating wire signals of a vibrating wire sensor are received through the filtering protection circuit, the signals are filtered and then output to the clamping amplification circuit, it is ensured that the amplitude of the vibrating wire is not too large, the vibrating wire signals are amplified and then converted into digital signals through the hysteresis comparison circuit, the digital signals are finally sent to the single-chip microcomputer to be sampled, and the output digital signals are good in stability and high in reliability. The fidelity is high, the linearity is good, and the ADC sampling result is more accurate.

An embodiment of the present disclosure relates to a method (100) particularly for checking mechanical stress acting on an induction component (210). The method (100) includes: detecting (110) one or more measurement variables related to mechanical stress when an electrical excitation signal is applied to the induction component (210). The method (100) further includes: determining (120) the mechanical stress acting on the induction component (210) based on the one or more detected measurement variables.

The invention provides a silicon resonance temperature and pressure sensor and a preparation method thereof. The silicon resonance temperature and pressure sensor comprises a pressure sensing layer, a resonance layer and a bottom silicon layer which are connected in sequence, the resonance layer comprises a cover plate and a resonance assembly, the resonance assembly comprises a resonance main beam, a first resonance auxiliary beam, fixed comb teeth, a second resonance auxiliary beam and a temperature resonance beam, the cover plate and the silicon island are correspondingly arranged, the resonance main beam is connected with the cover plate and the first resonance auxiliary beam, the first resonance auxiliary beam and the fixed comb teeth form a first electrostatic comb tooth pair, and the second resonance auxiliary beam and the temperature resonance beam form a second electrostatic comb tooth pair; the fixed comb teeth and a second resonance secondary beam form a second electrostatic comb tooth pair, and the second resonance secondary beam is connected with a temperature resonance beam; periodic driving signals are loaded to the first electrostatic comb tooth pair and the second electrostatic comb tooth pair respectively, the first resonance auxiliary beam drives the resonance main beam to vibrate periodically, and the second resonance auxiliary beam drives the temperature resonance beam to vibrate periodically. The to-be-measured pressure and the to-be-measured temperature are respectively measured by detecting the resonant frequency change of the first resonant secondary beam and the second resonant secondary beam.