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Structure of silicon micromachine resonant micro-pressure sensor chip and its manufacturing method

A micro-pressure sensor and silicon micro-mechanical technology are applied in fluid pressure measurement of elastic deformation gauge, fluid pressure measurement of acoustic method, measurement of force by measuring the frequency change of stressed vibrating elements, etc., and can solve many problems. Difficult to ensure the uniformity of ultra-thin films and other issues, to achieve the effect of eliminating complex structures, high signal-to-noise ratio, and good long-term stability

Inactive Publication Date: 2008-04-02
CHINA JILIANG UNIV
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AI Technical Summary

Problems solved by technology

In addition, due to the uneven thickness of the original silicon wafer and the difference in the corrosion rate of each point during back etching, it is difficult to ensure the uniformity of the thickness of each point of the ultra-thin film
Therefore, relying solely on the structure of lifting the pressure-sensitive diaphragm cannot meet the increasingly high requirements for micro-pressure measurement, and a strain detection method that is more sensitive to stress must be sought to realize the measurement of micro-range pressure.

Method used

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  • Structure of silicon micromachine resonant micro-pressure sensor chip and its manufacturing method
  • Structure of silicon micromachine resonant micro-pressure sensor chip and its manufacturing method
  • Structure of silicon micromachine resonant micro-pressure sensor chip and its manufacturing method

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Embodiment

[0037] A silicon micromechanical resonant micro-pressure sensor chip (without overvoltage protection) with a measuring range of 10KPa for electrothermal excitation / piezoresistive detection is manufactured by using the technical solution 1 of the present invention. Its production process is as follows:

[0038] 1) The original silicon wafer is an N-type, (100) plane SOI silicon wafer, the thickness of the top silicon layer is 10 μm, the thickness of the buried silicon dioxide layer is 1.5 μm, and the thickness of the substrate silicon wafer is 380 μm. Thermal oxidation, oxide layer thickness 1μm. (See Attachment 4[1])

[0039] 2) The backside photolithography back etches the window. Silicon is etched on the back side with an etching depth of 360 μm. (see attached drawing 4[2])

[0040] 3) The front photolithographic pressure-sensitive diaphragm 1 and the double-ended fixed support beam 2 . The length of one side of the diaphragm is 2000 μm, and the length of four sides of ...

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Abstract

The invention discloses a structure of two resonant micro pressure sensor chips and a method of manufacturing the same. The structure of two resonant micro pressure sensor chips comprises a pressure inductive diaphragm with one or two rigid cores, a double-end clamped support beam and a cover plate 3. Under the function of fluid pressure, the diaphragm with rigid cores deforms to exert the double-end clamped support beams on the surface of the diaphragm to change resonant frequency upon the function of axial stress. Fluid pressure can be reflected by measuring the change in the resonant frequency of the double-end clamped support beam. The silicon resonant micro pressure sensor of the invention has higher signal-to-noise ratio, resolution, sensitivity and measurement precision and the output of the invention is the frequency signal.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a resonant micro-pressure sensor chip, in particular to a silicon micromechanical resonant micro-pressure sensor chip composed of a pressure-sensitive diaphragm with a rigid hard core and a bridge resonator, belonging to the field of micro-electromechanical systems. Background technique [0002] The micro-range pressure sensor is used to measure the small pressure of gas or liquid, and the measurement range is generally 0-10KPa, or even lower. Its application fields mainly include the following three aspects: (1) Supporting industrial pressure transmitters. HVAC, environmental pollution control, clean engineering, oven pressurization, furnace wind pressure control, natural gas, gas pipe network monitoring, underground ventilation and power plant wind pressure monitoring and other fields have an annual demand for micro pressure sensors of about 100,000 sets . For example, the micro-pre...

Claims

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Application Information

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IPC IPC(8): G01L7/08G01L11/04G01L1/10
Inventor 韩建强
Owner CHINA JILIANG UNIV
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