Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

306 results about "Rigid core" patented technology

Rigid-flexible combined circuit board and manufacturing method thereof

The invention discloses a rigid-flexible combined circuit board and a manufacturing method thereof and belongs to the technical field of printed circuit boards. The manufacturing method comprises the steps of manufacturing of flexible core boards, manufacturing of rigid core boards, manufacturing of rigid-flexible sub-boards and depth-controlling and groove-milling; the manufacturing step of the flexible core boards comprises the steps of: (1) drilling holes: choosing flexible boards with two copper layers having thicknesses of H1 and H2, in which H1 is less than H2); and drilling blind holes on the copper surface with the thickness of H1 by a laser drill; (2) plating holes; and (3) circuits; the manufacturing step of the rigid-flexible core boards comprises laminating the flexible core boards and the rigid core boards with non-flowing prepregs; the depth-controlling and groove-milling step comprises performing depth-controlling and groove-milling to open windows and expose the flexible zones. According to the rigid-flexible combined circuit board and the manufacturing method thereof, the difficulty of drilling blind holes on the flexible substrate is reduced to lay a foundation for realizing mass production of the rigid-flexible combined circuit boards. The rigid-flexible combined circuit board prepared by the method has the advantages of high accuracy and dimension stability of the blind holes, good uniformity of surface copper and good flexibility of flexible zones.
Owner:GUANGZHOU FASTPRINT CIRCUIT TECH +2

Semi-flexible circuit board and preparation method thereof

ActiveCN104519682AGuaranteed interlayer bondingReduce the degree of glue overflowPrinted circuits structural associationsMultilayer circuit manufactureFlexible circuitsEngineering
The invention belongs to the technical field of printed circuit boards and discloses a semi-flexible circuit board and a preparation method thereof. The preparation method includes manufacturing of a rigid auxiliary board, manufacturing of a semi-flexible core board, laminating of a main board, manufacturing of an outer layer of the main board and a windowing procedure. Manufacturing of the rigid auxiliary board includes: (1) manufacturing an inner-layer circuit of a rigid core board; (2) adopting a flowing type prepreg for laminating the rigid core board to make the rigid auxiliary board, and pressing the prepreg and temporary copper foils onto a surface, adjacent to the semi-flexible core board, of the inner-layer circuit; (3) removing the temporary copper foils by etching; (4) milling grooves. In the procedure of laminating of the main board, the rigid auxiliary board and the semi-flexible core board are laminated by the aid of a non-flow type prepreg. Therefore, a dielectric layer between the rigid auxiliary board and the semi-flexible core board is made by means of twice lamination, interlayer binding force between the rigid auxiliary board and the semi-flexible core board is guaranteed while glue overflowing in a semi-flexible area is reduced, and the problem of proneness to glue overflowing in the prior art is solved.
Owner:GUANGZHOU FASTPRINT CIRCUIT TECH +2
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products