The invention discloses a method for manufacturing a rigid-flex
printed circuit board with a crossed surface flexible layer, which comprises the following steps of: taking a double-sided flexible
copper-clad plate, manufacturing a
copper layer and an insulating medium layer on one surface of the double-sided flexible
copper-clad plate to form a groove body, forming an
etching and
ablation groove, distributing the groove body corresponding to the edge of a flexible board area, attaching a cover film in the range of the groove body, and forming an upper flexible board and a lower flexible board, manufacturing a
rigid core plate layer and prepregs, stacking and laminating to form a laminated plate, manufacturing an outer layer circuit pattern, and then forming to form the rigid-flexible combined plate; optionally, a windowing
rigid core plate and a windowing prepreg are manufactured, one layer of flexible plate is stacked and pre-pressed to form a groove body structure, a release pad is arranged in the groove body, and the other layer of flexible plate is stacked and pressed to form a pressed plate; the
etching and ablating groove is formed in the flexible plate, it is guaranteed that the problem that the flexible plate is difficult to mill during forming is solved, the mode that the release pad is arranged is selectively adopted to replace the mode that the flexible plate is broken off after depth-controlled milling, and the
machining quality and precision of the plate body are effectively improved.