1601results about "Printed circuits structural associations" patented technology

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

According to the printed circuit board and the preparation method thereof provided by the invention, the glass core plate is used for replacing a traditional resin material, and the characteristics of low thermal expansion coefficient, low humidity coefficient and low dielectric constant of the glass core plate are utilized, so that warping and signal interference caused by temperature change and environment humidity are effectively reduced, and the stability and reliability of the PCB are remarkably improved. Meanwhile, by repeatedly constructing a multilayer layer-adding structure, adopting an ABF layer at the position adjacent to the glass substrate and adopting dielectric layers with Dk < = 3.0 and Df < = 0.001 for the rest, signal attenuation and interference can be effectively reduced, signal integrity and transmission efficiency can be ensured, overall buckling deformation of the PCB structure can be reduced or even avoided, and the PCB structure is more stable in performance. The multi-layer adding meets the requirements of different application scenarios for the number of layers of the PCB, improves the flexibility and applicability of the PCB, and enables the PCB to be especially suitable for the application scenarios of high-frequency and high-speed signal transmission.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

Features relating to a cartridge for use with a vaporizer body are provided. The cartridge mates with the vaporizer body in a cartridge receptacle. The cartridge may include a cartridge body defining a reservoir configured to contain vaporizable material; a mouthpiece coupled to a proximal end region of the cartridge body; at least one proximal absorbent pad wedged within an internal volume of the mouthpiece; a mouthpiece seal with sealing ribs; a cannula defining a vaporization chamber extending through the cartridge body; a resistive heating element; a porous wick configured to draw the vaporizable material in the reservoir towards the vaporization chamber; an internal sealing gasket positioned in a distal end region of the cartridge body; a lower support structure positioned in the distal end region of the cartridge body; and at least one distal absorbent pad configured to wedge within a recess located in the lower support structure.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

A deformable display is provided, particularly a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). Methods of use and applications of such deformable display, including systems and methods making use of such deformable display. In addition a flexible, stretchable and transparent display is provided being deformable in real-time while maintaining deformability.

A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.

An electronic device includes a hinge, a first housing and a second housing rotatably connected to each other by the hinge, a flexible display disposed in the first housing and the second housing, a first circuit board disposed in the first housing, a flexible circuit board which is electrically connected to the first circuit board and extends from the first housing and across the hinge, and a slide structure which is connected to the flexible circuit board and is slidably connected with the first housing, wherein the slide structure slides together with a portion of the flexible circuit board in the first housing while the electronic device is being folded or unfolded via the hinge.

According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.

A reflective member driving device including a housing; a holder which is disposed within the housing; a reflective member which is disposed in the holder; a moving plate which is disposed between the housing and the holder; a driving magnet and a sensing magnet which are disposed in the holder; a coil which electromagnetically interacts with the driving magnet; and a first sensor which senses the sensing magnet. The driving magnet includes a first magnet which tilts the reflective member about a first axis and a second magnet which tilts the reflective member about a second axis perpendicular to the first axis. The sensing magnet is disposed at a location where the sensing magnet does not electromagnetically interact with the coil.

The invention relates to an electronic assembly (1), having - a main printed circuit board (2) and - a semiconductor component (28) arranged on the main printed circuit board (2), characterized by - a measuring printed circuit board (26) arranged in thermally conducting contact with the semiconductor component (28), and - a temperature sensor (16) arranged on the measuring printed circuit board (26) and configured to measure a temperature, on the basis of which a junction temperature (θ_J) of the semiconductor component (28) can be determined.

A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

An optical system (100) for a lithography system (1), comprising at least one optical element (202), at least one actuator / sensor device (202) associated with at least one optical element (202), an interface device (206) which is optically connected (208) to the at least one actuator / sensor device (202) for data transmission and which can be electrically and / or optically connected to a control device (300), wherein the interface device (206) comprises a first microcomponent (212) with a first processor element (214) and an integrated first optical interface element (216), and comprising at least one actuator / sensor device (204), a second micro component (218) with a second processor element (220) and an integrated second optical interface element (222) which is optically connected to the first optical interface element (216).

The invention discloses a manufacturing method of a packaging circuit board and the packaging circuit board, and belongs to the technical field of packaging circuit boards, and the manufacturing method comprises the following steps: carrying out groove fishing treatment on a substrate, attaching a back film to the bottom surface of the substrate, placing the substrate on a supporting plate, placing devices to be embedded in corresponding grooves one by one, and pasting the devices to the back film; pouring a resin material into the scooping groove, covering the non-back film side of the substrate with a protective steel plate, and then carrying out curing treatment to obtain a resin layer; removing the back film on the substrate, grinding the resin layer, sequentially adding an insulating layer and a metal layer on the two sides of the substrate, carrying out lamination treatment, carrying out circuit processing treatment on the circuit board after lamination treatment, realizing communication between the embedded device and the metal layer, and manufacturing a first layer of circuit board; a plurality of functional circuit layers are overlaid on the two sides of the first layer of circuit board, and manufacturing of the packaging circuit board is achieved. According to the invention, low-cost and high-precision embedded circuit board packaging manufacturing can be realized.

A cooling technology for a backside power delivery system is provided. In some embodiments, the backside power delivery system includes a substrate, a first electronic component and a second electronic component. The substrate includes a front side and a back side. The first electronic component is arranged on the front side, and the second electronic component is arranged on the back side. A first cooling component is arranged on the first electronic component, and a second cooling component is arranged on the second electronic component. The second electronic component may be a power supply component.

An electronic device may have a hinge that allows the device to bend about a bend axis. The display may span the bending axis. The apparatus may have a grooved stainless steel and / or carbon fiber reinforced polymer layer. The grooves may overlap the bending axis. The slots may have at least one property that varies in a non-linear manner as a function of positioning on the layer. The device may include an adhesive layer having cutouts overlapping the slots. An interface defining the cutout may have a plurality of recesses of varying depth. A flexible printed circuit may be attached to an edge of the display panel. The display cover layer may overlap a bonding area between the flexible printed circuit and the edge of the display panel. A UV curable gap filler may be interposed between the flexible printed circuit and the display cover layer.

An Embodiment includes a stationary unit including a second circuit board, a moving unit including a first circuit board disposed on the second circuit board and an image sensor conductively connected to the first circuit board, and a support unit connecting the first circuit board and the second circuit board and configured to support the moving unit so as to be movable in a direction perpendicular to an optical axis direction, wherein the support unit includes an extension member that includes a plurality of wirings conductively connected to the second circuit board, and the support unit includes a bent region, and a width of a first wiring firstly closest to the bent region among the plurality of wirings is larger than a width of a second wiring secondly closest to the bent region among the plurality of wirings.

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

An electronic device according to an embodiment of the present disclosure may comprise: a housing including at least one first conductive portion segmented along at least a portion of a sidewall and a second conductive portion disposed on the inner side of the sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first conductive portion to the second conductive portion; and a printed circuit board disposed inside the housing and electrically connected to the first conductive portion through the connecting member. The connecting member may include a first metal layer configured to have at least a portion bonded to the first conductive portion, a second metal layer configured to have at least a portion bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer.

This invention provides an interposer electronic module used in the semiconductor production and manufacturing fields, a method for manufacturing an interposer electronic module, an interposer electronic module structure, and a semiconductor package structure. [Solution] The interposer electronic module M1 comprises an insulating layer 10 and a plurality of conductors 20 that completely or partially cover the insulating layer. The insulating layer is made of a material that has an insulating effect, and the conductors are columnar in shape and have excellent conductivity. In the interposer electronic module, at least one end face 21 of each conductor is exposed from the surface of the insulating layer. The aforementioned interposer electronic module has the same effect as a passive element and can be used as an interposer module to connect chips to chips, chips to circuit boards, or circuit boards to circuit boards, improving upon the complex manufacturing process of conventional methods and offering greater versatility.

According to an embodiment of the disclosure, there may be provided a foldable electronic device. A foldable electronic device may include a flexible printed circuit board (FPCB). The foldable electronic device may comprise a first housing including a first component, a second housing including a second component, a hinge assembly rotatably connecting the first housing and the second housing, a flexible display disposed from the first housing across a folding area where the hinge assembly is disposed to the second housing, and a flexible printed circuit board electrically connecting the first component and the second component, including a plurality of layers, and including a flexible portion corresponding to the folding area and rigid portions at one end and another end of the flexible portion. A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board may include a metal material and include a first area, a second area, and a third area classified according to a degree of bending in a folding area of the flexible printed circuit board. At least one layer among the plurality of layers may be formed so that the metal material has different thicknesses in the first area, the second area, and the third area on a same layer. Other various embodiments may also apply.

The circuit board comprises a circuit board body, a flexible conductive assembly and an electrostatic discharge assembly, the circuit board body comprises a main board and an auxiliary board, the main board is provided with an integration area and a first conduction area, the integration area is used for installing a first electronic component set, the first conduction area is provided with a first conduction interface, and the first conduction interface is used for installing a second electronic component set. The auxiliary board comprises a second conduction area, and the second conduction area is provided with a second conduction interface. The main board and the auxiliary board are movably connected through the flexible conductive assembly, the main board and the auxiliary board are combined to form an integral circuit board, the main board is used for placing a first electronic component group, and the auxiliary board is used for discharging static electricity, so that the static electricity can be received from the auxiliary board, and then flows through a transmission structure position to be mostly discharged. The influence of a small part of static electricity on the first electronic component group is small, so that the overall operation is protected, and the damage of the static electricity to the first electronic component group is avoided.

The invention relates to the technical field of active subarrays, in particular to an ultra-wideband high-power high-integration blade type active subarray. According to the technical scheme, the antenna comprises an active sub-array frame, an antenna unit integrated with a calibration network, a T / R assembly and a driving assembly which adopt floating coaxial connectors and are inserted in a double-face manner, a multifunctional comprehensive network board integrated through a hot melting pressing process, and a side edge integrated external port. According to the invention, through the design of module double-side plug-in, a blind plug-in structure and floating connection, high-density integration, high performance and high maintainability of the active sub-array are realized; light weight and efficient heat dissipation are achieved through frame hollowing and S-shaped water channel design; and the manufacturing cost is effectively reduced through split pressing of the network board and standardized board splicing of the antenna. The invention is particularly suitable for an airborne radar platform with strict requirements on weight, volume and maintainability.

A power module and an auxiliary supporting device adapted thereto are provided. The auxiliary supporting device is used to maintain a first circuit board in a vertical state on a second circuit board. The auxiliary supporting device includes a first plate and a second plate. The first plate is parallel to and fixed to the first circuit board. The second plate is extended from the first plate in a direction away from the first circuit board. A bottom edge of the second plate is disposed on a surface of the second circuit board facing the first circuit board. The auxiliary supporting device is universally suitable for different combinations between the first plate and the second plate without the need of customized tool.

A locking device (100) configured to lock a secondary circuit board in a fixed position on a primary circuit board (1), comprising: - a base portion (101) configured to be inserted into a hole (5) formed in the primary circuit board, - a head portion (102) configured to protrude from the primary circuit board, comprising an actuation interface configured to enable rotation of the locking device from an unlocking to a locking position, - at least one axial interlock member and a rotational interlock mechanism (130) configured to engage with the primary circuit board in the locking position, wherein the head portion further comprises a board locking structure (140) configured to engage with an edge portion of the secondary circuit board in the locking position, and to disengage from the secondary circuit board in the unlocking position.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A power assembly is disclosed that includes a first printed circuit board (PCB), a second PCB vertically spaced apart from the first PCB, and a switch supported on the second PCB. The power assembly further includes a conductive post coupling the first PCB to the second PCB, wherein current output by the switch flows from the switch to the first PCB via the conductive post.

The embodiments described in the present disclosure relate to a circuit board assembly, its assembly method, and a control unit. The circuit board assembly comprises: a first circuit board; a second circuit board; a first contact part attached to a first surface; a second contact part attached to a second surface; and several connecting elements, each connecting element extending along a second direction; and a first end piece coupled to a first contact point on the first contact part, a second end piece coupled to a second contact point on the second contact part, and a flexible section between them. The flexible section is configured to deform elastically when the first contact point and the second contact point are not aligned in the second direction, in response to the displacement of the first end piece relative to the second end piece in the first direction.In this way, an overall deflection along the direction of the pressure emanating from the circuit board can be achieved, thereby compensating for positioning deviations between the circuit boards, avoiding stress between plug pins and sockets, and increasing the overall service life of the circuit board assembly.