4108results about "Printed circuits structural associations" patented technology

A heat transfer device may be used to provide a thermal conduit from heat generating components mounted on transversely oriented circuit boards. The heat transfer device generally includes a base portion for supporting and thermally coupling with at least one heat generating component on a main circuit board and a transverse portion for supporting and thermally coupling with at least one heat generating component on a daughter circuit board that is oriented transverse to the main circuit board. The base and transverse portions may be made of a thermally conductive material with raised pedestals providing the thermal coupling with the heat generating components. The transverse portion of the heat transfer device may also be designed to facilitate connecting the daughter circuit board to the main circuit board. The heat transfer device may be used in an opto-electronic communications module, such as a broadband digital access (BDA) module used in a hybrid fiber-coaxial (HFC) network.

The utility model is suitable for the technical field of LEDs, and provides a sound transmission LED box body with an anti-piracy function, a screen and a movie hall. The sound transmission LED box body comprises a box frame, and a plurality of LED modules which are arranged in sequence are fixed in the box frame. Each LED module comprises a first PCB and a second PCB which are perpendicular to each other, a driving chip is arranged on the back face of each first PCB, LED lamp beads are arranged on the front faces of the second PCBs, sound transmission areas without wiring are arranged between the second PCBs, sound emitted by a loudspeaker box placed on the back of the screen can reach an auditorium through the sound transmission areas, and the sound transmission effect is good. The size specification of the sound transmission area can be designed according to the expected sound effect, so that the whole screen structure achieves the ideal sound transmission effect. Moreover, the HUB board on the back of the box body is covered with the rear cover with the lock, whether the HUB board receives the video signals or not is determined by detecting the state of the locking piece through the sensor, the safety of video resources is improved, and the video resources are prevented from being leaked from the LED box body.

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

The invention discloses a PDU module and a charging device, and relates to the technical field of power distribution, the PDU module comprises a control board, PCBs, a first control group and a first conductive assembly, the PCBs are connected to the control board at intervals, the first control group comprises a plurality of first relays forming an n * n triangular matrix, and the first relays are fixed on the PCBs. The first conductive assembly respectively realizes electrical communication and cross bridging of relays in the same row and in the same column through the first conductive member, the second conductive member and the bridging busbar. According to the scheme, through the triangular matrix layout, the total number of relays is remarkably reduced on the premise that the same control function as a traditional full matrix is achieved; and meanwhile, the relays are integrated on the PCB and are uniformly controlled by the control panel, so that a large number of connectors and wire harnesses are omitted, the module volume, the material cost and the assembly cost are effectively reduced, and a flexible power distribution function is realized.

The invention discloses a multilayer three-dimensional stacked circuit board and a preparation method thereof, and the method specifically comprises the steps: obtaining a substrate with a single conductive surface, and carrying out the spraying of a stress buffer layer on the conductive surface of the substrate; covering a layer of insulating material on the stress buffer layer, and forming a pattern insulating layer through photoetching; performing pulse electroplating processing on the exposed pattern of the pattern insulating layer to obtain a first circuit board; silk-screening a flexible connection layer on the pattern bonding pad layer of the first circuit board, and carrying out three-dimensional stacking processing on the flexible connection layer to obtain a second circuit board; and assembling a circuit protection layer on the second circuit board, and processing a stress release groove between the second circuit board and the circuit protection layer to obtain the multi-layer three-dimensional stacked circuit board. Through the design of the stress buffer layer and the stress release groove, interlayer stress can be reduced, circuit board breakage or cracking caused by overlarge interlayer stress is avoided, and the technical problem that large interlayer stress is generated in the circuit board preparation process in the prior art is solved.

The invention provides a multilayer circuit board and a processing method thereof, a chip system and electronic equipment, and the processing method comprises the steps: processing a second hole channel, a first conductive pattern and a second conductive pattern on a first substrate, and processing a third hole channel on a second substrate; the first substrate, the second substrate and the first insulating layer are stacked, pressed and fixed; the processing method further comprises the following steps: carrying out electroplating hole filling on the first substrate to form a second conductive channel; the processing method further comprises the steps that the second substrate is electroplated so that a sixth conductive pattern and a third conductive channel can be formed, the first insulating layer comprises a first conductive part, and the first conductive pattern, the second conductive pattern and the sixth conductive pattern are electrically connected with the second conductive channel through the third conductive channel and the first conductive part. The second hole channel and the third hole channel are filled in an electroplating hole filling mode, so that the wiring density and the chip signal transmission capability of the multilayer circuit board are improved, and the electrical performance and the thermal performance of the multilayer circuit board are improved; electroplating hole filling is suitable for mass production, and the process yield is stable.

A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and the pads on the other surface electrically interconnect to pads on a system board, such as a motherboard. With the pad layout on the memory module, the pad layout of the system board can be the same for a memory-down implementation and for a removable memory module. The pad layout provides good signal-to-noise performance and can enable a memory module for low power double data rate (LPDDR) memory, double data rate (DDR) memory, and graphics double data rate (GDDR) memory.

Embodiments of the present application relate to the technical field of heat dissipation of chips, and provide a circuit board, a circuit board assembly, and a computer device, used for dissipating heat of an electronic device, and having a simple structure. The circuit board comprises: a first circuit substrate, comprising a first wiring layer and a first electrically conductive column, the first electrically conductive column being electrically connected to the first wiring layer, and the first electrically conductive column being led out to a first side of the first circuit substrate; a first heat dissipation plate, stacked on a second side of the first circuit substrate, the second side being the opposite side of the first side; and a heat dissipation column, connected to the first heat dissipation plate and passing through a first through hole on the first circuit substrate so as to extend to the first side of the first circuit substrate. The circuit board provided by the embodiments of the present application has a simple structure, and can dissipate heat for chips of different heights at the same time.

A method of assembling a personal care appliance by providing a flexible bridge between a first rigid circuit board and a second rigid circuit board. At least one electronic component emitting electromagnetic waves is mounted to the first rigid circuit board or the second rigid circuit board. The first rigid circuit board is folded over the second rigid circuit board. A flexible antenna in electrical communication with first rigid circuit board is folded to face a copper track on a top surface of the flexible antenna away from the first rigid circuit board.

The utility model relates to the technical field of PCB manufacturing, and provides a PCB makeup, which comprises a plurality of PCB units with the same shape, the PCB units are rectangular, the plurality of PCB units are arranged into an array, the vertex positions of the PCB units in the array are connected through connecting ribs, and a makeup gap is formed between the adjacent PCB units outside the connecting ribs. According to the PCB, the PCB makeup connection is carried out by utilizing the four corner spaces of the single PCB unit, so that the utilization rate of the board can be improved, the production efficiency can be improved, and the working procedures and the production cost can be effectively reduced.

The invention relates to a rigid-flex board and a manufacturing method thereof. A first covering film and a second covering film are respectively attached to the upper surface and the lower surface of a preset flexible area of a flexible board; a first flexible through window is formed in the position of the first prepreg in the preset flexible area, and a second flexible through window is formed in the position of the second prepreg in the preset flexible area; a first adhesive tape is pre-attached to the first rigid plate, a second adhesive tape is pre-attached to the second rigid plate, and the first adhesive tape and the second adhesive tape are milled; and sequentially laminating the first rigid plate, the first adhesive tape, the first prepreg, the first covering film, the flexible plate, the second covering film, the second prepreg, the second adhesive tape and the second rigid plate, arranging the first adhesive tape in the first flexible through window, arranging the second adhesive tape in the second flexible through window, and laminating to obtain the rigid-flexible combined plate. Compared with the prior art, the rigid-flex printed circuit board can be prevented from being attacked by liquid medicine and kept intact, the manufacturing reliability and the production efficiency of the rigid-flex printed circuit board are improved, and the production cost is reduced.

The utility model discloses a voltage-multiplying rectifying device with an integrated heat dissipation structure, which is used for a high-power electric flame stove and comprises a plurality of PCBs (printed circuit boards) and bolt studs, the PCBs are sequentially arranged in a layered manner from top to bottom, and the bolt studs are arranged among the PCBs. Gaps for heat dissipation are reserved between the layers of PCBs, and meanwhile, the blank of each PCB is hollowed out. According to the utility model, the plurality of PCBs are sequentially arranged in a layered manner from top to bottom, so that the voltage doubling rectifier module is integrated, the occupied space is saved, and the centralized heat dissipation is simple; in addition, gaps for heat dissipation are reserved between the PCBs, and the blank of each PCB is hollowed out, so that the LED lamp is good in ventilation and ideal in heat dissipation effect. Compared with the prior art, a radiator does not need to be installed, and the heat dissipation effect is better than that of the prior art.

A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.

The invention discloses a multilayer printed circuit board of a millimeter wave active phased-array antenna and a manufacturing method, the multilayer printed circuit board comprises a first layer board, a second layer board, a fourteenth layer board, a nineteenth layer board, a 22th layer board, a first via hole, a second via hole and a third via hole, the outer side surface of the first layer board is provided with a radio frequency module and a power supply module; the second layer board is provided with a power division network module; the fourteenth layer of board is used for transmitting radio frequency signals; the nineteenth layer plate is provided with a radiation excitation module; the 22th layer plate is provided with an antenna array radiation module, and the antenna array radiation module is in gap coupling with the radiation excitation module; the first via hole is used for realizing signal transmission between the radio frequency module and the power division network module; the second via hole is used for transmitting a radio frequency signal output by the radio frequency module to the fourteenth layer plate; and the third via hole is used for transmitting the radio frequency signal of the fourteenth layer of board to the radiation excitation module. The system has the advantages of high integration level, reasonable spatial layout, low production and manufacturing cost, stable signal transmission performance and the like.

The short-time high-temperature-resistant connector optical cable assembly comprises a printed board assembly, the printed board assembly comprises a first rigid printed board and two second rigid printed boards arranged side by side, and the second rigid printed boards and the first rigid printed board are electrically connected through flexible printed boards; energy storage cover plates are arranged at the top and the bottom of the shell, a molybdenum copper block is installed on the second rigid printed board in an embedded mode, one side of the molybdenum copper block is flush with the inner side of the second rigid printed board, a photoelectric / electro-optical conversion chip is installed on the side of the molybdenum copper block in a surface-mounted mode, and the other side of the molybdenum copper block protrudes out of the outer side of the second rigid printed board and is in lap joint with the energy storage cover plates through heat conduction pads; the outer side of the shell is sleeved with a heat insulation sheath, and the inner wall of the heat insulation sheath abuts against the outer wall of the energy storage cover plate after assembly. According to the invention, electrical interconnection of double-backup high-density contact elements can be realized, and short-time high temperature resistance of the active electric connector optical cable assembly can be ensured.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.

An information handling system main printed circuit board having a CPU couples to a graphics printed circuit board having a GPU with an interposer that includes contacts and wirelines that communicate signals between the separate boards. For example, an interposer couples to an upper and lower side of the main and graphics printed circuit boards to align spring contacts with contact pads of the main and graphics printed circuit so that signals are transferred through the interposer, which also provides a physical structure to define a motherboard with the assembly of the main and graphics printed circuit boards into a single piece.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

The invention relates to the technical field of electronic products, in particular to a flexible circuit board and electronic equipment. The flexible circuit board is used for connecting a USB interface and a mainboard in the electronic equipment. The flexible circuit board comprises two flexible boards which are detachably connected, namely a first flexible board and a second flexible board, the first flexible board is arranged on the rear side of the battery and connected with the USB interface, and the second flexible board is arranged on the front side of the battery and connected with the mainboard. When the USB interface needs to be disassembled, the first flexible plate can be seen by opening the cover plate on the rear side of the electronic equipment, and due to the fact that the first flexible plate and the second flexible plate are detachably connected, the first flexible plate can be conveniently disconnected from the second flexible plate, the first flexible plate is taken down, and then subsequent processing is conducted on the USB interface. Therefore, the battery does not need to be disassembled, the disassembly step of the USB interface is simplified, the complexity of disassembly can be reduced, the battery does not need to be installed again, and the assembly difficulty and the maintenance cost are reduced.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

The embodiment of the utility model belongs to the technical field of FPC makeup. The utility model also relates to an FPC make-up structure, which comprises an FPC make-up main body, the FPC make-up main body is provided with a plurality of single-grain FPC main bodies, the plurality of single-grain FPC main bodies are divided into a plurality of rows, the bending cutting lines located on the FPC make-up main body are arranged between two adjacent rows of single-grain FPC main bodies, and the bending cutting lines are arranged in a bending manner. The bending cutting line is designed according to the waste material area formed by the appearance of the single-grain FPC main body, the bending cutting line is arranged in a bending mode and is matched with the appearance of the single-grain FPC main body, and the area of the waste material area can be reduced, so that the typesetting number of the single-grain FPC main body can be increased under the same typesetting area, the utilization rate of the FPC makeup main body material is improved, and the production cost is reduced. And the production cost is reduced, and the competitiveness of the product is improved.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The invention discloses a production method of an anti-falling combined type double-layer circuit board, and relates to the technical field of production of combined type double-layer circuit boards, and the production method comprises the following steps: S1, milling an annular groove I in the bottom surface of a first circuit board; s2, an annular groove II is milled in the top surface of the second circuit board; s3, embedding the frame-shaped curing adhesive into the annular groove II of the second circuit board from top to bottom; s4, buckling the annular groove I of the first circuit board outside the upper half part of the frame-shaped curing adhesive from top to bottom; s5, taking out one stent; s6, enabling the exposed part of the protection plate to be tightly attached to the bottom surface of the second circuit board; s7, the exposed part of the protection plate is tightly attached to the outer side wall of the strip-shaped through groove; s8, the two exposed parts of the support are supported on the table top of the machine table; and S9, after the pressure is maintained for a period of time, a first combined double-layer circuit board B can be finally produced. The method has the beneficial effect that the production quality of the combined double-layer circuit board is improved.

Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.

A camera assembly includes a first printed circuit board separated from a second printed circuit board. A flex circuit electrically connects the first printed circuit board to the second printed circuit board. An image sensor is attached to the first printed circuit board and a connector is attached to the second printed circuit board. The image sensor of the camera assembly is mechanically and physically separate from the connector. The first printed circuit board is connected to the second printed circuit board via a flexible circuit. The flexible circuit is elastically moveable between an assembled state and a disassembled state.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.