2901results about "Printed circuits structural associations" patented technology

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

The invention discloses a PDU module and a charging device, and relates to the technical field of power distribution, the PDU module comprises a control board, PCBs, a first control group and a first conductive assembly, the PCBs are connected to the control board at intervals, the first control group comprises a plurality of first relays forming an n * n triangular matrix, and the first relays are fixed on the PCBs. The first conductive assembly respectively realizes electrical communication and cross bridging of relays in the same row and in the same column through the first conductive member, the second conductive member and the bridging busbar. According to the scheme, through the triangular matrix layout, the total number of relays is remarkably reduced on the premise that the same control function as a traditional full matrix is achieved; and meanwhile, the relays are integrated on the PCB and are uniformly controlled by the control panel, so that a large number of connectors and wire harnesses are omitted, the module volume, the material cost and the assembly cost are effectively reduced, and a flexible power distribution function is realized.

A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and the pads on the other surface electrically interconnect to pads on a system board, such as a motherboard. With the pad layout on the memory module, the pad layout of the system board can be the same for a memory-down implementation and for a removable memory module. The pad layout provides good signal-to-noise performance and can enable a memory module for low power double data rate (LPDDR) memory, double data rate (DDR) memory, and graphics double data rate (GDDR) memory.

A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.

The short-time high-temperature-resistant connector optical cable assembly comprises a printed board assembly, the printed board assembly comprises a first rigid printed board and two second rigid printed boards arranged side by side, and the second rigid printed boards and the first rigid printed board are electrically connected through flexible printed boards; energy storage cover plates are arranged at the top and the bottom of the shell, a molybdenum copper block is installed on the second rigid printed board in an embedded mode, one side of the molybdenum copper block is flush with the inner side of the second rigid printed board, a photoelectric / electro-optical conversion chip is installed on the side of the molybdenum copper block in a surface-mounted mode, and the other side of the molybdenum copper block protrudes out of the outer side of the second rigid printed board and is in lap joint with the energy storage cover plates through heat conduction pads; the outer side of the shell is sleeved with a heat insulation sheath, and the inner wall of the heat insulation sheath abuts against the outer wall of the energy storage cover plate after assembly. According to the invention, electrical interconnection of double-backup high-density contact elements can be realized, and short-time high temperature resistance of the active electric connector optical cable assembly can be ensured.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The invention discloses a production method of an anti-falling combined type double-layer circuit board, and relates to the technical field of production of combined type double-layer circuit boards, and the production method comprises the following steps: S1, milling an annular groove I in the bottom surface of a first circuit board; s2, an annular groove II is milled in the top surface of the second circuit board; s3, embedding the frame-shaped curing adhesive into the annular groove II of the second circuit board from top to bottom; s4, buckling the annular groove I of the first circuit board outside the upper half part of the frame-shaped curing adhesive from top to bottom; s5, taking out one stent; s6, enabling the exposed part of the protection plate to be tightly attached to the bottom surface of the second circuit board; s7, the exposed part of the protection plate is tightly attached to the outer side wall of the strip-shaped through groove; s8, the two exposed parts of the support are supported on the table top of the machine table; and S9, after the pressure is maintained for a period of time, a first combined double-layer circuit board B can be finally produced. The method has the beneficial effect that the production quality of the combined double-layer circuit board is improved.

A camera assembly includes a first printed circuit board separated from a second printed circuit board. A flex circuit electrically connects the first printed circuit board to the second printed circuit board. An image sensor is attached to the first printed circuit board and a connector is attached to the second printed circuit board. The image sensor of the camera assembly is mechanically and physically separate from the connector. The first printed circuit board is connected to the second printed circuit board via a flexible circuit. The flexible circuit is elastically moveable between an assembled state and a disassembled state.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

The embodiments of the present disclosure provide a synchronous rectifier module, comprising: a transformer provided with a plurality of secondary windings, a first circuit board and a second circuit board disposed on opposite sides of the transformer, and a first connecting piece electrically connected to the first circuit board and a second connecting piece electrically connected to the second circuit board; the first connecting piece and the second connecting piece comprise current sharing portions connected to the first circuit board and the second circuit board respectively, and inductor portions which penetrate an inductance core side by side to form an output inductor, resistance values of the current sharing portions of the first connecting piece and the second connecting piece being equal or a resistance difference value therebetween being within a preset range. The present disclosure can quickly, accurately and conveniently improve the efficiency and the heat dissipation of the synchronous rectifier module, and achieve a better current sharing effect of the connecting pieces by adjusting the resistance value numerical range of the two connecting pieces.

The utility model discloses an FPC, CCS subassembly, battery module and vehicle, said FPC includes FPC body and FPC branch, said FPC branch includes and at least one connecting portion, one end of said connecting arm is conductively connected with said FPC body, the other end of said connecting arm overhangs and is equipped with NTC fixed portion, said connecting arm is bent to form at least one bending portion, and said bending portion is equipped with the NTC fixed portion. The orthographic projection of the connecting part in the thickness direction of the FPC body covers the FPC body, and at least one bending part is connected with at least one connecting part. According to the FPC provided by the utility model, the orthographic projection in the thickness direction of the FPC body covers the FPC body, so that the connecting part can be connected with the FPC body, and the FPC body can be used for limiting the warping problem of the bending part. Therefore, the risk of warping of the FPC branches can be reduced, and the reliability of the battery module is improved.

The utility model relates to a circuit board module. The circuit board module comprises a first circuit board, a second circuit board and a connecting piece, a first power device is arranged on the first circuit board; the first circuit board is provided with first heat dissipation holes, and the second circuit board is provided with second heat dissipation holes. The second heat dissipation hole is arranged corresponding to the first power device and is provided with a first heat dissipation piece; the first heat dissipation piece is provided with at least one opening, an inner space is formed among the first circuit board, the second circuit board and the connecting piece, and the opening is communicated with the inner space and the second heat dissipation hole. According to the utility model, the first heat dissipation holes are formed in the first circuit board, the second heat dissipation holes are formed in the second circuit board, and the first heat dissipation piece is arranged at the first power device, so that heat dissipation management is carried out on the internal space, particularly, efficient heat dissipation can be carried out on the first power device, and in the whole test process, the test efficiency is improved. And the working temperature is maintained in a safe range, so that the accuracy of a test result and the overall performance of equipment are improved.

According to the printed circuit board and the preparation method thereof provided by the invention, the glass core plate is used for replacing a traditional resin material, and the characteristics of low thermal expansion coefficient, low humidity coefficient and low dielectric constant of the glass core plate are utilized, so that warping and signal interference caused by temperature change and environment humidity are effectively reduced, and the stability and reliability of the PCB are remarkably improved. Meanwhile, by repeatedly constructing a multilayer layer-adding structure, adopting an ABF layer at the position adjacent to the glass substrate and adopting dielectric layers with Dk < = 3.0 and Df < = 0.001 for the rest, signal attenuation and interference can be effectively reduced, signal integrity and transmission efficiency can be ensured, overall buckling deformation of the PCB structure can be reduced or even avoided, and the PCB structure is more stable in performance. The multi-layer adding meets the requirements of different application scenarios for the number of layers of the PCB, improves the flexibility and applicability of the PCB, and enables the PCB to be especially suitable for the application scenarios of high-frequency and high-speed signal transmission.

A fixing assembly is suitable for being arranged on a circuit board and configured to fix an expansion card. The fixing assembly includes a body and a buckle structure. The buckle structure includes a pressing part, a buckle part, an elastic member, and a base. The pressing part is away from the circuit board. An end of the buckle part is connected to the pressing part and has an inclined surface and a blocking surface connected to each other. The blocking surface has a gap with the top surface. The elastic member is connected to another end of the buckle part. When a first end of the expansion card is connected to the connector, a second end of the expansion card slides along the inclined surface to the top surface and is fixed in the gap by being abutted by the blocking surface.

An interface apparatus for installing an add-in module to an information handling system includes the add-in module and an add-in module socket. The add-in module includes a card-edge connector on a first edge of the add-in module, and an electrical contact finger on a second edge of the add-in module. The add-in module socket is affixed to the information handling system and receives the add-in module. The add-in module socket includes a card-edge connector interface for receiving the card edge connector, and a slot channel for receiving the second edge of the add-in module. The slot channel includes an electrical contact pad configured such that, when the add-in module is installed into the add-in module socket, a current is provided between the add-in module socket and the add-in module through the electrical contact pad and the electrical contact finger.

The invention relates to the technical field of PCBs, and provides a laminated PCB manufacturing method and a laminated PCB, and the method comprises the steps: S1, an upper sub-board and a lower sub-board are manufactured, the upper sub-board corresponds to a PCB top-layer connector wiring region, and the lower sub-board corresponds to a PCB bottom-layer connector wiring region; s2, forming a first through hole penetrating through the thickness of the upper daughter board in the upper daughter board, and forming a second through hole penetrating through the thickness of the lower daughter board in the lower daughter board; s3, back drilling processing is carried out on the first through holes and the second through holes so as to eliminate stubs on the inner layers of all the wires, and the stub length L meets the formula # imgabs0 #, wherein f is the cut-off frequency, c is the light velocity, epsilon r is the PCB dielectric constant, and L is the length of the stubs; and S4, laminating the upper daughter board and the lower daughter board which are subjected to the back drilling treatment to form an integral PCB structure. The problems of high cost and poor machinability in traditional blind hole production are solved by utilizing a method of respectively processing the two daughter cards and then carrying out through hole and back drilling.

A display device may include a main flexible printed circuit including a first alignment mark and electrically connected to a first panel; and a touch flexible printed circuit including a second alignment mark and electrically connected to a second panel that is perpendicular to the first panel, wherein the main flexible printed circuit is electrically connected to the touch flexible printed circuit through a pad region, and the touch flexible printed circuit includes a first overcoat region disposed between the first alignment mark and the second alignment mark.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

Features relating to a cartridge for use with a vaporizer body are provided. The cartridge mates with the vaporizer body in a cartridge receptacle. The cartridge may include a cartridge body defining a reservoir configured to contain vaporizable material; a mouthpiece coupled to a proximal end region of the cartridge body; at least one proximal absorbent pad wedged within an internal volume of the mouthpiece; a mouthpiece seal with sealing ribs; a cannula defining a vaporization chamber extending through the cartridge body; a resistive heating element; a porous wick configured to draw the vaporizable material in the reservoir towards the vaporization chamber; an internal sealing gasket positioned in a distal end region of the cartridge body; a lower support structure positioned in the distal end region of the cartridge body; and at least one distal absorbent pad configured to wedge within a recess located in the lower support structure.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

A deformable display is provided, particularly a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). Methods of use and applications of such deformable display, including systems and methods making use of such deformable display. In addition a flexible, stretchable and transparent display is provided being deformable in real-time while maintaining deformability.

The present disclosure relates to flexible printed circuit boards (FPCBs) for augmented reality (AR) eyewear. Disclosed examples provide an FPCB with air gaps for enhanced bending flexibility and an Electromagnetic Interference (EMI) film for consistent ground reference, enabling high-speed signal transmission with controlled impedance. The FPCB may include asymmetrical dielectric thicknesses and a crosshatch pattern in the ground reference layer to further support signal integrity and mechanical durability.

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.

A semiconductor device (100, 100A, 100B, 100C, 100D, 100E) comprises: an insulating substrate (10); at least one semiconductor element (20); a printed circuit board (30); and a connecting material (41). The insulating substrate has a first surface and a first electrode (12) disposed on the first surface. Each of the at least one semiconductor element is disposed on the first electrode, and has a second surface as well as a second electrode (21) and a third electrode (22) that are disposed on the second surface. The third electrode has a potential differing from that of the second electrode. The printed circuit board has: a circuit that drives the at least one semiconductor element; an input pattern (36a) and an output pattern (36c) that are disposed inside the printed circuit board; an input terminal (37a) and an output terminal (37c) that protrude from the printed circuit board; a third surface that faces the first surface and the second surface; and a plurality of third electrodes (31) that are disposed on the third surface.