The invention relates to a method for positioning at least two printed circuit boards (1a, 1b) in a housing (2) of a
field device in
automation engineering, wherein at least the surface of the housing is nonconductive, wherein the housing (2) has, provided in it, at least a first mounting point (3a) for mounting the first
printed circuit board (1a) and a second mounting point (3b) for mounting the second
printed circuit board (1b) at respective prescribed positions, wherein at least one conductor track (10) arranged in the housing (2) is provided, wherein the conductor track (10) is non-detachably connected to the housing (2), and wherein the conductor track (10) makes electrical contact between the first mounting point (3a) and the second mounting point (3b), comprising the steps of: prefabricating the printed circuit boards (1a, 1b) and prefabricating the housing (2), mounting the printed circuit boards (1a, 1b) at the mounting points (3a, 3b) of the housing (2), with the mounting of the printed circuit boards (1a, 1b) involving the first
printed circuit board (1a) being put into electrical contact with the first mounting point (3a) and the second printed circuit board (1b) being put into electrical contact with the second mounting point (3b), so that the first (1a) and the second (1b) printed circuit board are put into electrical contact with one another via the at least one conductor track (10).