21results about "Orthogonal PCBs mounting" patented technology

A printed circuit board having signal contact receiving vias positioned in rows and ground contact receiving vias positioned in line with the signal contact receiving vias in the rows. Signal integrity vias are positioned between the signal contact receiving vias, between the ground contact receiving vias, and between respective signal contact receiving vias and respective ground contact receiving vias. The signal integrity vias form a ground fence which reduces cross talk in a foot print of a connector mated with the printed circuit board.

Embodiments of the present application provide a PCB module, a power electronic device and a method for assembling the power electronic device. The PCB module includes: a PCB support plate, configured to be assembled with a base plate via slot-column structure, wherein the base plate is assembled in a power electronic device; and a PCB, configured to be assembled on the PCB support plate. The technical solutions of the present application can achieve PCB automatically assembly.

A printed circuit board laminated device includes a circuit board unit, a bracket unit, a cover plate unit and a coupled unit. The circuit board unit includes a first control circuit and a second control circuit disposed on a circuit board body. The bracket unit includes a hollow bracket body disposed on the circuit board unit along a laminating direction. The cover plate unit is disposed on the bracket unit along the laminating direction and opposite to the circuit board unit to cooperatively define a compartment. The coupled unit includes first and second coupled elements which are securely connected with the circuit board body and in the compartment and which are respectively and electrically connected with the first and second control circuits. The second coupled element responds to the first coupled element to generate a sensing signal.

Embodiments of this application provide a printed circuit board and a communications device, and relate to the field of circuit board technologies, to resolve a problem that severe signal crosstalk still exists between two adjacent pairs of signal crimping holes. The printed circuit board includes a connector insertion area. A plurality of rows of crimping holes are arranged in the connector insertion area, each row of crimping holes includes at least two pairs of signal crimping holes, and each pair of signal crimping holes includes two signal crimping holes. In a row arrangement direction of the crimping holes, at least one ground crimping hole is arranged on either side of each pair of signal crimping holes. A depth of the ground crimping hole is greater than or equal to a depth of the signal crimping hole, the ground crimping hole includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the signal crimping hole in the first direction. The communications device includes the foregoing printed circuit board and a connector that fits with the printed circuit board.

To reduce the crosstalk noise while achieving both the ease of extracting wires and the high density in a through hole of an electronic circuit board.SOLUTION: An electronic circuit board includes a plurality of through-hole units including a combination of a pair of signal through-holes 1a and 1b for differential signals, ground through-holes 2a and 2b disposed on a line connecting the pair of signal through-holes 1a and 1b, guard through-holes 10a to 10d, and an anti-pad 3 disposed surrounding the pair of signal through-holes 1a and 1b. The through-hole units are arranged in an X-axis direction and a Y-axis direction while the arrangement positions in the X-axis direction are displaced alternately in the Y-axis direction. The guard through-holes 10a and 10b are disposed to have the pair of signal through-holes 1a and 1b therebetween on an equal distance line 200 existing at an equal distance from the pair of signal through-holes 1a and 1b.SELECTED DRAWING: Figure 4

Provided is a power conversion device which comprises a main circuit board, a first board, and a second board and which has a reduced size. The main circuit board has a rectifier circuit and an inverter circuit which are disposed in a high-power section, the rectifier circuit rectifying AC voltage and The second board is provided with a The first board is connected to the main circuit board and to the second board, and is provided with: a first circuit disposed in a low-power section. The second board is provided with a second circuit disposed in a low-power section, section from each other in a reinforced manner; an insulating transformer disposed in the reinforced insulation region and constituting a constituent component of a power supply circuit for receiving the DC voltage and supplying power to the first circuit and to the second circuit; and an insulating element disposed in the reinforced insulation region and allowing a signal to be exchanged between the first circuit and the second circuit.

The invention relates to a method for positioning at least two printed circuit boards (1a, 1b) in a housing (2) of a field device in automation engineering, wherein at least the surface of the housing is nonconductive, wherein the housing (2) has, provided in it, at least a first mounting point (3a) for mounting the first printed circuit board (1a) and a second mounting point (3b) for mounting the second printed circuit board (1b) at respective prescribed positions, wherein at least one conductor track (10) arranged in the housing (2) is provided, wherein the conductor track (10) is non-detachably connected to the housing (2), and wherein the conductor track (10) makes electrical contact between the first mounting point (3a) and the second mounting point (3b), comprising the steps of: prefabricating the printed circuit boards (1a, 1b) and prefabricating the housing (2), mounting the printed circuit boards (1a, 1b) at the mounting points (3a, 3b) of the housing (2), with the mounting of the printed circuit boards (1a, 1b) involving the first printed circuit board (1a) being put into electrical contact with the first mounting point (3a) and the second printed circuit board (1b) being put into electrical contact with the second mounting point (3b), so that the first (1a) and the second (1b) printed circuit board are put into electrical contact with one another via the at least one conductor track (10).

The invention provides an electrical connector with a high-speed mounting interface. Electrical interconnects for communicating high speed signals through an electronic system having high signal density and high signal integrity. The interconnect includes an electrical connector and a transition to a printed circuit board to which the electrical connector is mounted. Edge-to-pad mounting is used to connect signal conductors to pads on a surface of the PCB. The pad is aligned with the intermediate portion of the signal conductor such that transitions within the electrical connector that may degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupling pairs extending in rows within the electrical connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. A ground plane beneath the surface trace facilitates a transition from a signal path in the electrical connector to a signal path in the PCB, where the low mode transition avoids resonances in the connector shield.

The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.

An electrical interconnect for transmitting high-speed signals through an electronic system with high signal density and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the electrical connector is mounted. Edge-to-pad mounting is used to connect signal conductors to pads on the surface of the PCB. The pads are aligned with the middle portion of the signal conductors so that transitions within the electrical connector that may degrade signal integrity are avoided. The signal conductors can be positioned as individually shielded broadside coupled pairs extending in rows within the electrical connector. Surface traces on the PCB connect the pads to signal vias that are aligned for vertical routing out of the connector footprint. A ground plane beneath the surface traces facilitates the transition from a signal path in the electrical connector to a signal path in the PCB, wherein low mode conversion avoids resonances in the connector shield.

To provide a circuit board assembly in which an angle between circuit boards and a positional relationship between the circuit boards are strictly adjusted, and which also enables cost reduction.SOLUTION: A circuit board assembly 100 has a first circuit board 10, a second circuit board 20, and a metal fitting 50. The metal fitting 50 is made by punching out a metal plate into a strip shape and then bending over both ends of the strip such that they are inserted into through-holes 13, 23. The metal fitting 50 used here is made of such a material and with such dimensions that, once the metal fitting 50 has been bent over, a preset tolerance of an angle between the first circuit board 10 and the second circuit board 20 may be ensured even if the posture of the circuit board assembly 100 relative to the gravity direction is changed.SELECTED DRAWING: Figure 4

A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.

The utility model provides a socket assembly and a substrate obtained by researching inner layer wiring arrangement. A plurality of wires among the plurality of first inner layer wires (134) are led out toward the second electrode row (L2) when viewed from the depth direction (Dd), and a plurality of wires among the plurality of second inner layer wires (134) are led out toward the first electrode row (L1) when viewed from the depth direction (Dd).

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and / or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and / or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

The embodiment of the invention provides a PCB module, a power electronic device and a method for assembling the power electronic device. The PCB module includes: a PCB support plate configured to be assembled with a base plate via a slot pillar structure, where the base plate is assembled in a power electronic device; and a PCB (printed circuit board) configured to be assembled on the PCB support plate. According to the technical solution of the invention, automatic assembly of the PCB can be realized.

Provided are a receptacle assembly and a circuit board in which routing of internal layer wirings is taken into consideration. Some of the plurality of first internal layer wirings 134 are drawn toward the second electrode line L2 when viewed in the depth direction Dd, and some of the plurality of second internal layer wirings 134 are drawn toward the first electrode line L1 when viewed in the depth direction Dd.

To make a power conversion device having a main circuit board, a first circuit board, and a second circuit board small, the main circuit board has a rectifier circuit that rectifies an alternating voltage to output a direct current voltage and an inverter circuit that inverts the direct current voltage to output an alternating power in a strong electric section, the second circuit board has a second circuit disposed in a weak electric section, the first circuit board is connected to the main circuit board and the second circuit board, and the first circuit board includes a first circuit disposed in the strong electric section, an insulation reinforcement region for reinforcing insulation between the strong electric section and the weak electric section, an insulation transformer disposed in the insulation reinforcement region as a component of a power supply circuit that receives the direct current voltage and supplies power to the first circuit and the second circuit, and an insulation element disposed in the insulation reinforcement region that transmits a signal between the first circuit and the second circuit.

This invention describes an improved backplane connector operating at speeds over 25 Gbps including a single-piece configuration that eliminates the insertion point present in 2-gender connectors. As a result, the signal path matches more closely the same path geometry that is found on the daughterboard and on the backplane permitting superior signal integrity and lower losses through the signal transmission line from source to destination. The single-piece backplane connector comprises a protective cover slidably attached over a staggered body assembly. The protective cover comprises a plurality of contact orifices to permit the path through of a corresponding plurality of pin contacts located in a front portion of the staggered body assembly, and at least two guide orifices to permit the path through of at least two corresponding guide pins located in the front portion of the staggered body assembly. The staggered body assembly comprises a plurality of alternating PCB layers and dielectric spacers, wherein the PCB layers include a plurality of traces, wherein each trace electrically connects each of the pin contacts on the front end with a corresponding pin contact on the bottom mating with the corresponding plurality of plated through holes in the daughterboard PCB. Finally, the protective cover further comprises a return spring mechanism to slide from an unpressed position to a pressed position, and the protective cover slides towards the staggered body assembly to permit the pin contacts to protrude through the orifices and to mate with the corresponding plurality of plated through holes in the backplane PCB.