281results about "Non-printed jumper connections addition" patented technology

A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.

A field programmable gate array assembly (100, 200, 300) offers the unique functionality typically reserved for custom ICs and application specific integrated circuits (ASICs) with the flexibility of a programmable gate array. This is accomplished by modifying a package for a programmable IC (102), such as a programmable gate array, to electrically and mechanically couple to another IC (104). The preferred electrical and mechanical coupling occurs by stacking the IC on the programmable IC.

Current sensing resistors are connected directly to output terminals of MOSFETs forming the series switching stage of a PWM sinewave dimmer. An analog sensed current signal is coupled through an EMI resistant current link to comparators that provide an overcurrent indication in response to an overcurrent condition. A logic circuit overrides PWM control signals from a programmable controller, and operates drivers to render the series switching stage nonconductive and to render a clamp switching stage conductive until after the end of the current PWM duty cycle power on segment. The logic circuit sends an overcurrent signal through an optocoupler to an input of the programmable controller. The input of the controller is polled at a clock frequency for overcurrent signals and if the count exceeds a limit in any half cycle, or a maximum sum in sixteen half cycles of the AC supply, the series switching stage is rendered nonconductive and the clamp switching stage is rendered conductive pending a reset signal.

A solid state multi-pole switching device has input terminals for a plurality (n) of input control circuits, output terminals for a plurality (m) of output circuits each having an associated solid-state switch unit for switching a respective external circuit load, and a field-programmable unit coupled between the n input control circuits and the m output circuits for selectively establishing an electrical connection of any input control signal to any selected output circuit. The device components are carried on a main circuit board, with the solid state switch units (Triacs) mounted on plug-in boards selectively installed in an array of sockets on the main circuit board. The field-programmable unit may be a simple pin-and-jumper array, or a CPU coupled to an LCD display and settings control device. Timer controls may be programmed through the CPU for automatic on/off switching without the need to manually activate the input control circuits. The device allows a field installer or user to program the desired input/output switching connections onsite, with output circuits being grouped and controlled by input control signals in any desired combination. The device can be used in a wide range of multi-circuit switching control applications such as commercial, industrial or home lighting applications including, but not limited to, stadium lighting, office space lighting, industrial plant lighting, school lighting, home interior or exterior lighting, or store lighting and display.

A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure. The cable can be coupled to destination components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.

A technique and mechanism for reducing memory latency asymmetry in a multiprocessor system by replacing one (or more) processors with a bypass or pass-through device. Using the pass-through mechanism, the reduced number of processors in the system enables all of the remaining processors to connect to each other directly using the interconnect links. The reduction in processor count improves symmetry and reduces overall latency thereby potentially improving performance of certain applications despite having fewer processors. In one specific implementation, the pass through device is used to connect two HyperTransport links together where each of the links is connected to a processor at the other end.

A method and apparatus for impedance matching in systems configured for multiple processors is disclosed. In one embodiment, a computer system includes a first processor socket and a second processor socket, each configured to accommodate a processor. The processor sockets may be electrically coupled to each other. A first I/O node may be electrically coupled to the first processor socket and a second I/O node may be electrically coupled to the second processor socket. A processor may be mounted in the first processor socket, while an impedance matching circuit may be mounted in the second processor socket. The impedance matching circuit may electrically couple the processor mounted in the first processor socket to the second I/O node, thereby allowing the computer system to utilize the I/O capability provided by the second I/O node even when a second processor is not present in the system.

A wireless device includes a ground plane with at least two portions. On each of the at least two portions at least one connecting means is provided. The two connecting means are connected with an electric component for connecting the at least two portions of the ground plane. The ground plane is partially covered with an insulating material and the connecting means are given by a part of the ground plane which is not covered by any insulating material.

Disclosed herein is a battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) electrically connected to the battery cell, wherein the PCM is provided with a safety device of which a circuit is cut off when temperature is high or a large amount of current flows.

A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.