2576results about How to "Improve connectivity" patented technology

Secure computation environments are protected from bogus or rogue load modules, executables and other data elements through use of digital signatures, seals and certificates issued by a verifying authority. A verifying authority-which may be a trusted independent third party-tests the load modules or other executables to verify that their corresponding specifications are accurate and complete, and then digitally signs the load module or other executable based on tamper resistance work factor classification. Secure computation environments with different tamper resistance work factors use different verification digital signature authentication techniques (e.g., different signature algorithms and / or signature verification keys)-allowing one tamper resistance work factor environment to protect itself against load modules from another, different tamper resistance work factor environment. Several dissimilar digital signature algorithms may be used to reduce vulnerability from algorithm compromise, and subsets of multiple digital signatures may be used to reduce the scope of any specific compromise.

Secure computation environments are protected from bogus or rogue load modules, executables and other data elements through use of digital signatures, seals and certificates issued by a verifying authority. A verifying authority-which may be a trusted independent third party-tests the load modules or other executables to verify that their corresponding specifications are accurate and complete, and then digitally signs the load module or other executable based on tamper resistance work factor classification. Secure computation environments with different tamper resistance work factors use different verification digital signature authentication techniques (e.g., different signature algorithms and / or signature verification keys)-allowing one tamper resistance work factor environment to protect itself against load modules from another, different tamper resistance work factor environment. Several dissimilar digital signature algorithms may be used to reduce vulnerability from algorithm.

A point of sale (POS) device may be configured to locate a payment system and transmit a payment authorization request from a remote location to a payment system, either directly, or via a payment system directory and / or a SSL Gateway. The invention also includes inserting third party account information into an encrypted portion of the payment request, so the payment request appears as a normal request to the issuing bank, but the third party account information may be used by the third party to bill the customer. The payment system directory is further configured to determine one or more payment processors to direct a payment authorization request, such that a single transaction may me allocated among multiple payment processors for authorization. Moreover, the payment system directory is able to format alternative payment methods into a format that is able to be processed over existing payment networks.

The present invention is directed to nanowire structures and interconnected nanowire networks comprising such structures, as well as methods for their production. The nanowire structures comprise a nanowire core, a carbon-based layer, and in additional embodiments, carbon-based structures such as nanographitic plates consisting of graphenes formed on the nanowire cores, interconnecting the nanowire structures in the networks. The networks are porous structures that can be formed into membranes or particles. The nanowire structures and the networks formed using them are useful in catalyst and electrode applications, including fuel cells, as well as field emission devices, support substrates and chromatographic applications.

This invention provides an apparatus and method to aggregate individual fibre channel data streams in their native mode and to extend connectivity of fibre channel storage area networks across wide geographical distances over a high-speed data channel with forward error correction

A point of sale (POS) device may be configured to locate a payment system and transmit a payment authorization request from a remote location to a payment system, either directly, or via a payment system directory and / or a SSL Gateway. The invention also includes inserting third party account information into an encrypted portion of the payment request, so the payment request appears as a normal request to the issuing bank, but the third party account information may be used by the third party to bill the customer. The payment system directory is further configured to determine one or more payment processors to direct a payment authorization request, such that a single transaction may me allocated among multiple payment processors for authorization. Moreover, the payment system directory is able to format alternative payment methods into a format that is able to be processed over existing payment networks.

A modular stent graft assembly (10) for repairing a ruptured abdominal aorta aneurysm (90) and having an aortic section tubular graft (12) and an iliac section tubular graft (14). The aortic section graft has a proximal attachment stent (32) thereon for suprarenal attachment of the assembly (10) to the aorta. A proximal end portion (50) of the iliac section graft (14) underlies the distal end portion (28) of the aortic graft (12) and presses outwardly thereagainst forming a a friction fit, at a telescoping region (64). The assembly (10) can be selected from an inventory (300) containing a set of delivery systems (100) of four size aortic section grafts (12) and a set of delivery systems (200) of four size iliac section grafts (14), that together accommodate a large majority of aneurysm sizes, and delivery systems (250) containing four standard sizes of occluders (80).

A point of sale (POS) device may be configured to locate a payment system and transmit a payment authorization request from a remote location to a payment system, either directly, or via a payment system directory and / or a SSL Gateway. The invention also includes inserting third party account information into an encrypted portion of the payment request, so the payment request appears as a normal request to the issuing bank, but the third party account information may be used by the third party to bill the customer. The payment system directory is further configured to determine one or more payment processors to direct a payment authorization request, such that a single transaction may me allocated among multiple payment processors for authorization. Moreover, the payment system directory is able to format alternative payment methods into a format that is able to be processed over existing payment networks.

The present invention discloses nanowires for use in a fuel cell comprising a metal catalyst deposited on a surface of the nanowires. A membrane electrode assembly for a fuel cell is disclosed which generally comprises a proton exchange membrane, an anode electrode, and a cathode electrode, wherein at least one or more of the anode electrode and cathode electrode comprise an interconnected network of the catalyst supported nanowires. Methods are also disclosed for preparing a membrane electrode assembly and fuel cell based upon an interconnected network of nanowires.

A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and / or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and / or may also be embedded in top and / or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and / or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.

Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrode and dielectric layers are provided in an interleaved arrangement and selected portions of the electrode layers are exposed. Electrically isolated anchor tabs may optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrode layers until exposed portions of selected such portions thereof are connected. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A mobile ad hoc network (MANET) may include a plurality of mobile nodes each including a wireless communications device and a controller connected thereto. The controller may operate in accordance with a multi-layer protocol hierarchy. More particularly, at an upper protocol layer, the controller may establish a quality-of-service (QoS) threshold. Furthermore, at at least one intermediate protocol layer below the upper protocol layer, the controller may select between unicast and multicast communications modes based upon the QoS threshold. As such, at a lower protocol layer below the at least one intermediate protocol layer, the controller may cooperate with the wireless communications device to transmit data to at least one destination mobile node based upon the selected communications mode.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

The present invention is directed to nanowire structures and interconnected nanowire networks comprising such structures, as well as methods for their production. The nanowire structures comprise a nanowire core, a carbon-based layer, and in additional embodiments, carbon-based structures such as nanographitic plates consisting of graphenes formed on the nanowire cores, interconnecting the nanowire structures in the networks. The networks are porous structures that can be formed into membranes or particles. The nanowire structures and the networks formed using them are useful in catalyst and electrode applications, including fuel cells, as well as field emission devices, support substrates and chromatographic applications.

In an information processing system having an equipment controller for enabling the digitization of complex work processes conducted during testing and / or operation of machinery and equipment, a local wireless communications network is implemented using at least one fixed point wireless communications access station and one or more voice-responsive wireless mobile computing / communications devices that are capable of accurate vocal command recognition in noisy industrial environments. The computing / communications device determines spectral characteristics of ambient non-speech background noises and provides active noise cancellation through the use of a directional microphone and an adaptive noise tracking and subtraction process. The device is carried by a user and is responsive to one or more vocal utterances of the user for communicating data to the information processing system and / or generating operational control commands to provide to the equipment controller for controlling the machinery or equipment.

The present invention discloses nanowires for use in a fuel cell comprising a metal catalyst deposited on a surface of the nanowires. A membrane electrode assembly for a fuel cell is disclosed which generally comprises a proton exchange membrane, an anode electrode, and a cathode electrode, wherein at least one or more of the anode electrode and cathode electrode comprise an interconnected network of the catalyst supported nanowires. Methods are also disclosed for preparing a membrane electrode assembly and fuel cell based upon an interconnected network of nanowires.

There is provided fiber optic hardware and hardware components adapted to provide a desired amount of fiber optic connectivity and / or functionality for a desired amount of volume, materials, etc. The fiber optic hardware components include, but are not limited to multiports, local convergence points (LCPs), particularly LCPs for multiple dwelling units or similar applications, network interface devices, equipment frames, and fiber distribution hubs. Certain fiber optic hardware components are adapted to accommodate microstructured optical fiber or other bend performance optical fiber.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Traditional High Speed Electronic Systems Interconnect experience several bandwidth bottlenecks along the multiplicity of signal paths that limits the information throughput. Here we build upon the cellular interconnect concept of PMTL, the Periodic Micro Transmission Line which was introduced in an earlier patent application, and provide a new type of transmission line VMPL, as the Vertical Micro Transmission Line approach to make all the elements of a high speed interconnect wideband, unified, scalable, and practical for high volume manufacturing. This provides total connectivity improvements from end-to-end of electronic systems that demands higher bandwidth, and increased information throughput, thermal management, and impeccable signal integrity. The technologies introduced here provide solutions for any level of the fan out from chips to systems, in CMOS, or Packages, and PCB's.

The present invention is directed to nanowire structures and interconnected nanowire networks comprising such structures, as well as methods for their production. The nanowire structures comprise a nanowire core, a carbon-based layer, and in additional embodiments, carbon-based structures such as nanographitic plates consisting of graphenes formed on the nanowire cores, interconnecting the nanowire structures in the networks. The networks are porous structures that can be formed into membranes or particles. The nanowire structures and the networks formed using them are useful in catalyst and electrode applications, including fuel cells, as well as field emission devices, support substrates and chromatographic applications.

The present invention is directed to nanowire structures and interconnected nanowire networks comprising such structures, as well as methods for their production. The nanowire structures comprise a nanowire core, a carbon-based layer, and in additional embodiments, carbon-based structures such as nanographitic plates consisting of graphenes formed on the nanowire cores, interconnecting the nanowire structures in the networks. The networks are porous structures that can be formed into membranes or particles. The nanowire structures and the networks formed using them are useful in catalyst and electrode applications, including fuel cells, as well as field emission devices, support substrates and chromatographic applications.

A novel and useful autonomous connectivity mechanism for use in user equipment (UE) connectivity in one or more cellular communications systems. The handover process is optimized by improving the selection of target base stations and optimizing the discontinuity period from the time of disconnection from a serving base station and connection to a target base station. The mechanism facilitates multiple cell connectivity in a network unaware manner while preserving single endpoint connectivity. The UE does not need to negotiate for or receive pre-allocated opportunities from the network for making neighboring base stations measurements. Measurement opportunities are created by the UE autonomously in accordance with UE activity patterns. Measurement opportunities are used to measure and maintain a candidate target base station list over the same or a plurality of access technologies. The parameter set tracked includes parameters that can be measured without any assistance from the target base station and which can effect the handover process, e.g., link quality, etc.

A modular stent graft assembly (10) for repairing a ruptured abdominal aorta aneurysm (90) and having an aortic section tubular graft (12) and an iliac section tubular graft (14). The aortic section graft has a proximal attachment stent (32) thereon for suprarenal attachment of the assembly (10) to the aorta. A proximal end portion (50) of the iliac section graft (14) underlies the distal end portion (28) of the aortic graft (12) and presses outwardly thereagainst forming a friction fit, at a telescoping region (64). The assembly (10) can be selected from an inventory (300) containing a set of delivery systems (100) of four size aortic section grafts (12) and a set of delivery systems (200) of four size iliac section grafts (14), that together accommodate a large majority of aneurysm sizes, and delivery systems (250) containing four standard sizes of occluders (80).

Provided are a nitride semiconductor light emitting element having a nitride semiconductor layered on an AlN buffer layer with improved qualities such as crystal quality and with improved light emission output, and a method of manufacturing a nitride semiconductor. An AlN buffer layer (2) is formed on a sapphire substrate (1), and nitride semiconductors of an n-type AlGaN layer (3), an InGaN / GaN active layer (4) and a p-type GaN layer (5) are layered in sequence on the buffer layer (2). An n-electrode (7) is formed on a surface of the n-type AlGaN layer (3), and a p-electrode (6) is formed on the p-type GaN layer (5). The n-type AlGaN layer (3) serves as a cladding layer for confining light and carriers. The AlN buffer layer (2) is manufactured by alternately supplying an Al material and an N material at a growing temperature of 900° C. or higher.

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.