The invention discloses a
silicon substrate
gallium nitride wafer containing a large mismatch
stress regulation and control structure and a preparation method and application thereof, and relates to the technical field of
semiconductor materials. The
silicon substrate
gallium nitride wafer containing the large mismatch
stress regulation and control structure is formed by stacking a
silicon substrate, an aluminum
nitride amorphous film
barrier layer, an ultrathin porous aluminum
oxide weak bonding decoupling layer, an aluminum nitride
single crystal film nucleating layer template layer and a
gallium nitride
single crystal film quality improvement layer in sequence. According to the invention, by regulating and controlling the pore size and pore density in the ultrathin porous
alumina weak bonding and decoupling layer, the weak bonding and decoupling effect of the aluminum nitride
single crystal film nucleating layer template layer on the ultrathin porous
alumina weak bonding and decoupling layer is regulated and controlled; and therefore, large mismatch
stress regulation and control of the silicon substrate
gallium nitride material are realized, and the crack-free thickness, the material
crystallization quality and the material preparation efficiency are improved. The silicon substrate
gallium nitride wafer containing the large mismatch stress regulation and control structure can be applied to development and production of
gallium nitride-based power electronic devices,
microwave radio frequency devices and optoelectronic devices.