A process for depositing a nanolaminate on a surface of a flat substrate, the process comprising the steps of:-mounting the substrate on a substrate support in a
peripheral region (R) of a holder rotatable about its central axis B in a vacuum process
system, the
receiver comprises at least one magnetron
sputtering station, the
sputtering target of which is mounted to and spaced apart from a
sputtering source, and at least one
plasma processing station having a
plasma source, both the sputtering target and the
plasma source being directed towards different portions of the
peripheral area (R), the method comprises the steps of:-providing a holder,-evacuating a
receiver,-rotating the holder around a central axis at a
constant speed,-introducing a sputtering gas into the
receiver, and-introducing a reaction gas directly into at least one of a sputtering
station or a plasma station,-discharging and igniting a magnetron in the sputtering station and setting a magnetron
power level (Pm), and-igniting the plasma and setting a plasma
power level (Pp) of the plasma source in the
plasma processing station,-successively exposing the substrate to a magnetron
discharge by rotating the holder to deposit a high
refractive index material layer LH, and to a
processing plasma to produce a low
refractive index material layer L1, wherein the rotational speed of the holder and the magnetron
power level (Pm) are set such that the
layer thickness dh of the well layer Lh of the high
refractive index material is 0.1 < = dh < = 5 nm.