The invention provides a
semiconductor epitaxial laminated layer of a light-emitting
diode, an LED
chip and a light-emitting device. An
active layer in the
semiconductor epitaxial lamination comprises a multi-
quantum well structure of multiple periods, the
active layer comprises M sequences, the sequence closest to an N-type
semiconductor layer is a first sequence, a Qth sequence comprises
potential well layers and potential barrier
layers of ZQ periods, M is larger than or equal to 2, ZQ is larger than or equal to 1, and Q is larger than or equal to 1 and smaller than or equal to M; the
potential well layers in the M sequences have the same material composition, the potential barrier layers are AlGaInP material layers with different aluminum component contents, the material composition of the potential
barrier layer in the Qth sequence is (AlyQGa1-yQ) InP, yQ is larger than or equal to 0.5 and smaller than or equal to 1, the values of yQ in the M sequences are different, and y1 of the first sequence pair has the maximum value. In this way, the material of the
barrier layer in the sequence close to one side of the N-type semiconductor has a
high aluminum component, so that the
barrier layer has high
crystal bonding energy, defects such as
dislocation extending from the growth substrate during growth of the semiconductor epitaxial lamination can be effectively overcome,
diffusion migration of doped atoms can be effectively blocked, and the performance of the semiconductor epitaxial lamination is improved. The maximum
radiation recombination of electrons and holes is ensured, the aging
light attenuation level is effectively improved, and the service life of an LED is prolonged.