This invention discloses a slope-gradient
cutting simulation method for complex surfaces of
crystalline materials. This method utilizes a slope function to define the
cutting path, breaking away from the constraints of traditional constant depth-of-
cut simulation. It can accurately simulate the entire process of tool entry, exit, and
variable load during the
machining of complex structures such as
microlens arrays, significantly improving the accuracy of the
simulation. Atomic
coordination number variation data is obtained through atomic
structure analysis, clarifying the
phase transition critical points of the crystalline material before, during, and after the
cutting depth, determining whether they are fixed values, and providing theoretical support for the dynamic adjustment of process parameters.
Chip formation data is obtained through
chip formation analysis, judging the influence of cutting depth and
entry angle on
chip morphology.
Crystal plane optimization is performed before cutting to select the plane that minimizes lattice damage during cutting, guiding the selection of
wafer crystal orientation and clamping positioning in actual
machining, ensuring that actual
machining is based on sound theoretical foundations.