77 results about "Giga-" patented technology

A matrix multiplication module and matrix multiplication method are provided that use a variable number of multiplier-accumulator units based on the amount of data elements of the matrices are available or needed for processing at a particular point or stage in the computation process. As more data elements become available or are needed, more multiplier-accumulator units are used to perform the necessary multiplication and addition operations. To multiply an N×M matrix by an M×N matrix, the total (maximum) number of used MAC units is “2*N−1”. The number of MAC units used starts with one (1) and increases by two at each computation stage, that is, at the beginning of reading of data elements for each new row of the first matrix. The sequence of the number of MAC units is {1, 3, 5, . . . , 2*N−1} for computation stages each of which corresponds to reading of data elements for each new row of the left hand matrix, also called the first matrix. For the multiplication of two 8×8 matrices, the performance is 16 floating point operations per clock cycle. For an FPGA running at 100 MHz, the performance is 1.6 Giga floating point operations per second. The performance increases with the increase of the clock frequency and the use of larger matrices when FPGA resources permit. Very large matrices are partitioned into smaller blocks to fit in the FPGA resources. Results from the multiplication of sub-matrices are combined to form the final result of the large matrices.

A circuit board assembly includes a circuit board having an outer surface that is configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts / centimeter (MV / cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

A high speed computer processor system has a high speed interface for a graphics processor. A preferred embodiment combines a PowerPC microprocessor called the Giga-Processor Ultralite (GPUL) 110 from International Business Machines Corporation (IBM) with a high speed interface on a multi-chip module.

A continuous time sigma delta converter has a filter and converter components having known non-ideal characteristics. A compensation circuit has error modelling components arranged to model the non-ideal characteristics of the converter. A summation block combines a compensation signal from the compensation circuit with a non-ideal output signal from the converter in order to provide a compensated output signal. This has substantially no effect on other modulator performance characteristics and contributes to the implementation of giga sample-per-second Continuous Time sigma deltas having the dynamic range capabilities of traditional DT sigma deltas.

LC resonant voltage control oscillators are adopted as voltage control oscillators for the purpose of providing a clock generating and distributing apparatus that can generate and distribute a clock signal of high precision even in a high-frequency region of several giga hertz or higher, and of providing a distributive VCO-type clock generating and distributing apparatus in which voltage control oscillators oscillate in the same phase, and which can generate a clock signal of a desired frequency and distributes a high-frequency clock signal to each part within a chip more stably even in a high-frequency region reaching 20 GHz. Furthermore, an inductor component of a wire connecting the oscillation nodes of the oscillators is made relatively small, or the LC resonant oscillators are oscillated in synchronization by using injection locking, whereby the LC resonant voltage control oscillators stably oscillate in the same phase.