4015 results about "Optical Module" patented technology

The invention discloses an artificial intelligence machine vision image acquisition system, and the system comprises a multi-mode perception layer which integrates a self-adaptive optical module, inhibits metal reflection, captures a visible light to short wave infrared image, and captures a motion edge; the dynamic adaptive layer adopts an illumination compensation and motion compensation module to dynamically adjust camera parameters and micro displacement compensation, feeds back an illumination trend, outputs a motion vector to the cognitive layer, generates a confrontation sample through a GAN, simulates virtual defects in combination with a physical engine, and expands training data; the cognitive reasoning layer is used for deploying a dynamic routing network, distributing computing resources according to image complexity and optimizing feature extraction efficiency; reducing data deviation through anti-fact analysis, and generating a thermodynamic diagram to explain a detection basis; and the collaborative decision-making layer is used for rapidly screening samples by edge nodes, training a global model by cloud aggregated data, automatically triggering manual rechecking when the confidence coefficient of the model is insufficient, synchronously optimizing a training set and a causal reasoning module by a rechecking result, and improving the labeling efficiency through AR assistance.

The invention discloses a temperature control and noise reduction method for an analog optical module, and relates to the technical field of data processing. The method comprises the following steps: collecting and preprocessing an original temperature signal, environment temperature time sequence data and an optical wavelength original detection value of an optical module; improving the LSTM model, constructing a junction temperature dynamic prediction model, and outputting prediction data; a pre-trained BP neural network is utilized to calculate the temperature compensation amount according to the real-time wavelength offset, and a PPO reinforcement learning algorithm is adopted to optimize with the temperature stability, the wavelength offset and the TEC power consumption as multiple targets to obtain an optimal PID parameter mapping table; and finally, predicting, compensating and optimizing parameters are fused, and control output for driving the TEC is generated through a multi-mode intelligent decision. The problems of insufficient control precision and response lag are effectively solved, cooperative high-precision control over the junction temperature and the emission wavelength of the laser is achieved, transmission noise is remarkably reduced, and meanwhile system energy consumption and the self-adaptive capacity are considered.

An optical system includes an optical module with a main axis is provided. The optical module includes a fixed portion, a movable portion, a driving mechanism, and a supporting assembly. The movable portion is connected to an optical element and is movable relative to the fixed portion. The driving mechanism drives the movable portion to move relative to the fixed portion. The supporting assembly is connected to the movable portion and the fixed portion. When viewed along a direction that is parallel with the main axis, the fixing portion is a polygonal structure with a first side, a second side, a third side, and a fourth side. The first side is parallel with the third side, the second side is parallel with the fourth side, and the first side is not parallel with the second side.

The invention relates to a terahertz-Raman integrated detection system and method. The detection system comprises a fusion mainframe box and an integrated probe arranged at a sample detection end on the fusion mainframe box, a Raman spectrum module, a terahertz spectrum module, a terahertz optical module and a data analysis module are arranged in the fusion mainframe box; the Raman spectrum module is composed of a Raman laser, a Raman light filter, a Raman grating and a Raman detector which are sequentially connected through a light path; the terahertz spectrum module is composed of a terahertz femtosecond laser, a transmitting photoconductive antenna, a receiving photoconductive antenna and a terahertz detector which are sequentially connected through a light path; the data analysis module is in communication connection with the Raman detector and the terahertz detector and is used for synchronously processing data transmitted by the Raman detector and the terahertz detector. Compared with the prior art, the integrated probe synchronously collects two kinds of spectral data and carries out fusion processing on the two kinds of spectral data through the data analysis module, and the device has the remarkable effects that the device integration degree is high, the detection efficiency and accuracy are greatly improved, and the application range is wide.

The utility model provides a photoelectric co-packaging structure and an optical module, and relates to the technical field of optical communication. The photoelectric co-packaging structure comprises a multi-layer circuit board, a photon integrated circuit chip and an anti-warping piece. An optical waveguide and an optical coupling port connected with the optical waveguide are arranged in the photon integrated circuit chip; and the optical coupling port is used for optically coupling with an optical element outside the photonic integrated circuit chip. The photon integrated circuit chip is flip-chip welded on the multilayer circuit board and is electrically connected with the multilayer circuit board. The anti-warping piece is arranged in the multi-layer circuit board; the projection of the photonic integrated circuit chip on the surface of the multilayer circuit board and the projection of the anti-warping piece on the surface of the multilayer circuit board are at least partially overlapped. The multi-layer circuit board is provided with the anti-warping piece, so that the packaging stress can be reduced, the warping deformation of the multi-layer circuit board and the photon integrated circuit chip is reduced, and the packaging quality and reliability are improved.

The utility model relates to the field of microfluidic detection and fluorescence immunoassay, in particular to a portable biochemical blood coagulation and fluorescence immunoassay integrated analysis device, which comprises a shell, a power supply arranged in the shell, two support plates arranged in the shell, a fluorescent bracket fixedly connected to the upper ends of the support plates, a support arranged in the shell, a lamp source arranged at the upper end of the support, and a light source arranged at the lower end of the lamp source. A microfluidic detection module is mounted in the support, a fluorescence immunodetection module is mounted at the upper end of the fluorescence bracket, an optical module is arranged in the fluorescence immunodetection module, and a bar code scanner for confirming information of a detection chip or a reagent strip is arranged on one side of the optical module; compared with the traditional detection equipment with a single function, the double detection functions of biochemistry and fluorescence immunity are realized, the detection efficiency and comprehensiveness are greatly improved, meanwhile, the kit also supports the simultaneous detection of three reagent strips with different specifications, and the flexibility and convenience of the detection are further enhanced.

The invention relates to the technical field of optical communication, in particular to a vapor chamber and an optical module. Heat generated by a heat source is absorbed through the lower shell, then heat absorbed by the lower shell is absorbed by the heat dissipation working medium in the steam cavity, the heat dissipation working medium is changed into a gas state from a liquid state after absorbing heat, and the gas-state heat dissipation working medium is adsorbed on the inner surface of the upper shell, is cooled into a liquid state again and returns to the bottom of the steam cavity again. Therefore, heat dissipation of a heat source in the optical module is realized. The interface contact thermal resistances are only between the heat source and the lower shell and between the upper shell and the external environment, the number of the interface contact thermal resistances on a heat transfer path is greatly reduced, the uniform temperature plate is arranged as a part of the optical module, an integrated enhanced heat dissipation structure is formed, the interface contact thermal resistances caused by split design are prevented from being increased, and the heat dissipation efficiency is improved. The heat dissipation performance of the whole optical module is improved, and the heat dissipation requirement of the high-speed optical module is met.

The optical module provided by the invention comprises a circuit board, a base, a first light emitting component, a second light emitting component, a first light receiving component and a second light receiving component. The surface of the circuit board is provided with a first notch part and a second notch part, and the base is embedded in the first notch part and the second notch part, so that the base is fixed on the circuit board. The first light emitting component and the second light emitting component are located on the top surface of the base. The first light emitting component and the second light emitting component are respectively located in different gap portions, so that the first light emitting component and the second light emitting component can utilize a circuit board routing space between the first gap portion and the second gap portion to increase the wiring area. The top surface of the base is used for bearing the first light emitting component and the second light emitting component, and the bottom surface of the base is used for bearing a first refraction piece in the first light receiving component and bearing two second refraction pieces at the terminal of the second light receiving component. The top surface and the bottom surface of the base are fully utilized, three-dimensional deployment and integrated deployment are achieved, wiring is better facilitated, and the occupied space of a circuit board is better reduced.

The invention discloses a PON-based multi-protocol communication method and device, and the method comprises the steps: distributing a corresponding internal scheduling time slot to each network protocol processing unit for data uploading to each network protocol processing unit when a data processing module detects that the network protocol processing units connected with each field bus device have to-be-uploaded service data; and when one internal scheduling time slot is used up, interrupting the uploading of the service data until the next internal scheduling time slot allocated to the internal scheduling time slot is recovered from interrupting the uploading of the data. And the PON module monitors a global scheduling time slot allocation instruction issued by the optical line terminal in real time, converts an uploaded data frame into an electric signal, transmits the electric signal to the optical module through an internal link, converts the electric signal into an optical signal through the optical module in an allocated global scheduling time slot, and uploads the optical signal to the optical line terminal through an optical distribution network. Real-time performance and orderliness of transmission of service data in multiple field bus devices in a PON network are achieved, the requirement of industrial communication for data transmission is met, and transmission resource distribution is optimized.

The invention relates to the technical field of optical module coupling, and discloses optical module product double-Lens coupling equipment and a coupling method thereof.The coupling equipment comprises a jig module, a stock bin streamline module, a carrying module and two coupling modules arranged on the left side and the right side of the jig module, and the two coupling modules can be coupled with two Lens on an optical module product at the same time; an optical module clamping jaw of the carrying module can rotate around a Z axis, so that the direction of an optical module product reversely placed in a Tray can be corrected, and the coupling efficiency and quality of the optical module product are improved; in the coupling method, the stock bin streamline module can automatically provide and collect the Tray carrying the optical module product, and the carrying module can carry the optical module product between the stock bin streamline module and the jig module in a reciprocating manner, so that the coupling module can realize the coupling of the Lens and the optical module product, that is, the coupling method can coordinate the cooperation among the modules of the coupling equipment, and the coupling efficiency is improved. Therefore, the coupling logic is rigorous and orderly, and stable operation of the equipment is ensured.

The invention relates to the technical field of optical communication, and discloses FA coupling equipment and a coupling method thereof.A feeding and discharging part of the coupling equipment comprises a feeding streamline module, a carrying mechanism, a cleaning module and a detection module, a coupling part of the coupling equipment comprises a jig module, a coupling module and a dispensing vision module, an optical module and FA are clamped on an outer support together, and the optical module and the FA are arranged on the outer support. An MPO plug used in the coupling process is integrally clamped on an MPO clamp, automatic feeding and discharging of an optical module and an FA and automatic cleaning, wiping, detection and plugging of the end face of an MPO optical fiber jumper wire can be achieved through coupling equipment, dependence on personnel is reduced, the feeding and discharging difficulty is lowered, and dependence on the skill of an operator is lowered; through the coupling method, the product coupling working efficiency can be improved, the production quality stability is improved, the yield is improved, and the production cost is reduced.

The invention relates to the technical field of optical communication, and discloses an optical module adaptive test and rapid convergence method based on reinforcement learning, which can dynamically generate and execute an optimal test sequence for optical modules of different types or states through an off-line trained RL intelligent agent module, avoids redundant steps in a fixed process, and improves the test efficiency. On the premise of ensuring the test coverage, the test time is obviously shortened, and meanwhile, the detection probability of potential defects is improved; through the closed-loop test of the integrated RL intelligent agent module, the test action can be adjusted in real time according to the state of a single optical module, so that the test process can quickly adapt to the individual difference and process fluctuation of the device, the online quick convergence of the test strategy is realized, and the accuracy and stability of the test are guaranteed; and through online iterative optimization of the RL agent module, new data and new changes in the production process can be continuously learned, so that a test strategy is continuously evolved, and the optimal performance is kept for a long time.

The invention relates to a packaging structure and packaging method for an optical module and an optical chip, and the packaging structure comprises a receiving end assembly, a stepped metal heat sink, and a silicon-based optical interconnection assembly which is pasted on the stepped metal heat sink. The silicon-based optical interconnection assembly comprises a laser, a silicon light beam splitter, a lens group, a light transmission compensation gasket, a silicon light modulator and an optical fiber array; coplanar coupling is formed between the laser and the silicon light beam splitter. The silicon light beam splitter and at least part of the collimating lens in the lens group are fixed on the light transmission compensation gasket; the optical fiber array and the silicon light modulator realize waveguide matching in an active coupling mode; the silicon light modulator and the receiving end assembly are separately arranged at least at a preset interval, and the optical fiber array and / or the receiving end assembly are / is covered with a metal isolation cover. According to the invention, the problems of high cost of multiple light sources, easy pollution of an open light path and yield bottleneck caused by low-reliability glue in the prior art are solved, and finally, a packaging scheme which is compact in structure, stable in process and high in mass production is formed.

The invention provides a method and a device for keeping butt joint of optical module channels. The method comprises the following steps: setting a mapping port of each local optical module channel to be in an MAC layer forced working state; sending a local speed reduction capability negotiation message; receiving an opposite terminal speed reduction capability negotiation message from an opposite terminal; when it is detected that a receiving end signal of a mapping port of any local optical module channel is abnormal, generating a fault channel notification message carrying a local fault optical module channel identifier, and sending the fault channel notification message through any local optical module channel; and according to the channel combination corresponding to each local support speed reduction rate and the channel combination corresponding to each opposite end support speed reduction rate, selecting an optical module channel combination which is commonly supported and has the maximum support speed reduction rate.

The utility model provides a laser radar optical machine and a laser radar. The laser radar ray machine comprises a transmitter, a transmitting optical module, a transmitting lens cone, a receiver, a receiving optical module and a receiving lens cone, and the transmitter is configured to emit a detection light beam; the transmitting optical module is arranged in the transmitting lens cone and is located on a light path of the detection light beam emitted by the transmitter; the receiver is configured to receive echoes formed by reflecting the detection light beams by an object; the receiving optical module is arranged in the receiving lens cone and is positioned on the light path of the echo; a first light leakage hole is formed in the barrel wall of the transmitting lens barrel, and / or a second light leakage hole is formed in the barrel wall of the receiving lens barrel. The first light leakage hole is formed in the barrel wall of the transmitting lens barrel, and / or the second light leakage hole is formed in the barrel wall of the receiving lens barrel, so that stray light can be emitted from the first light leakage hole / the second light leakage hole, and interference of the stray light to the laser radar is reduced.

The invention relates to the technical field of optical communication, in particular to an optical module cooling system which comprises a switch shell, a PCB, a socket, a radiator and a lifter, and the PCB, the socket, the radiator and the lifter are arranged in the switch shell. A cage is arranged in the switch shell; the PCB is arranged at the bottom end of the cage; the socket is arranged in the cage and is connected with the PCB; an opening is formed in the top end of the cage; the lifter is connected with the radiator so as to drive the radiator to vertically pass through the opening; and a heat-conducting silicone grease layer is arranged on the bottom surface of the radiator. The radiator is not in direct contact with the optical module, the heat-conducting silicone grease layer is filled between the radiator and the optical module, the radiator is in hard contact with the shell of the optical module through the heat-conducting silicone grease layer, a gap between abutting faces is effectively eliminated or reduced, air reserved in the gap is reduced, and therefore heat resistance between the radiator and the shell of the optical module is reduced, and the service life of the optical module is prolonged. And the heat exchange efficiency is improved.

The invention relates to the technical field of optical modules, and provides a firmware upgrading method, device and equipment for an optical module and a storage medium, and the method comprises the steps: after receiving a firmware upgrading request corresponding to the optical module, extracting a firmware version identifier and a check code, obtaining version information and an operation abstract of operating firmware in the optical module, and storing the version information and the operation abstract in the optical module; the version information and the operation abstract are compared with the firmware version identifier and the check code and analyzed and verified, a comparison result and an analysis result are obtained, if any one of the results is abnormal, the optical module is rolled back to an initial state and an error is reported, if the result is not abnormal, the optical module is subjected to multiple rounds of self-inspection, and if a preset threshold value is met, the optical module is subjected to self-inspection. If yes, the original version data in the optical module is cleared, and if the preset threshold value is not met, the optical module is recovered to the pre-upgrading state. Through a multi-round self-checking and conditional clearing mechanism, the fault recovery capability and the system stability are remarkably enhanced, and the problem of upgrading failure caused by weak checking mechanism and insufficient stability analysis in the firmware upgrading process of the existing optical module is solved.

The invention relates to the technical field of optical communication, in particular to a power adjustment method and system applied to an optical module and a storage medium, and the method comprises the following steps: S1, synchronously collecting a total transmitting optical power value and a target wavelength shunt power value of a transmitting end of the optical module in real time; s2, calculating a non-target wavelength interference power value; s3, dynamically generating a wavelength interference coefficient; s4, inputting the wavelength interference coefficient into a preset weight factor mapping relation to generate a dynamic weight factor; s5, calculating a target wavelength power adjustment value; and S6, outputting the target wavelength power adjustment value to a laser driver of the optical module so as to adjust the transmitting power. According to the invention, through an interference perception and adaptive adjustment linkage mechanism, accurate control and stable output of the target wavelength emission power in a complex environment are realized.

A method for mounting, preferably bonding, an optical element (14) for microlithography to a mounting element (2) is presented and described, as is a mounting device (1) for mounting, preferably bonding, an optical element (14) for microlithography to a mounting element (2). The described method and mounting device are proposed to enable fast and precise mounting of an optical element (14) for microlithography to a mounting element (2), regardless of the diameter of the receiving opening (11) of the mounting element (2). An optical module for microlithography is also described.

The invention provides an optical module cold plate type liquid cooling assembly and network switching equipment, and relates to the technical field of network equipment heat dissipation. The optical module cold plate type liquid cooling assembly comprises a cold plate main body which extends along a first direction and comprises a first side and a second side which are opposite to each other; the floating heat conduction blocks are connected to the first side of the cold plate body and can float in the second direction perpendicular to the first direction; the floating heat conduction blocks are arranged at intervals in the first direction and are used for making contact with the optical modules sequentially arranged in the first direction. The heat conduction pad is arranged between the cold plate main body and the floating heat conduction block and is in contact with the cold plate main body and the floating heat conduction block; and the at least one liquid cooling pipe is arranged on the second side of the cold plate main body. The optical module cold plate type liquid cooling assembly is in close contact with the optical module inserted into the connector of the network switching equipment, heat generated during operation of the optical module can be smoothly and timely led out, the heat dissipation efficiency is high, and the heat dissipation effect is good.

The invention relates to the technical field of optical modules, in particular to a heat dissipation optical module and an optimization method thereof, and the heat dissipation optical module comprises a heat dissipation assembly, a circuit board assembly and an upper cover plate. A first window is arranged on the surface of the upper cover plate; the heat dissipation assembly comprises a plurality of heat conduction blocks, and the heat conduction blocks penetrate through the first window to abut against chips needing heat dissipation correspondingly arranged on the circuit board assembly while being fixed to the upper cover plate based on the heat dissipation assembly. The heat of the chip needing heat dissipation on the circuit board assembly is conducted out to the device, located outside, of the heat dissipation assembly through the heat conduction block, and the heat conducted out of the chip needing heat dissipation can be dissipated to the external environment. The heat dissipation assembly is exposed out of the upper cover plate, heat can be directly conducted out, and the heat dissipation efficiency is higher.

The invention discloses a programmable hyperspectral laser radar device and a real-time registration method thereof.The programmable hyperspectral laser radar device comprises an optical module and a real-time signal processing module, the real-time signal processing module carries out real-time processing on received laser echo signals, and selects a windowing position and a spectral wavelength width based on converted non-laser echo signals; acquiring a plurality of arbitrary programmable spectrum channels, and reconstructing the acquired image information of the plurality of spectrum channels through a spectrum separation method to obtain different spectrum images corresponding to the target scanning area; and the data integration module is used for real-time registration of the laser point cloud and the hyperspectral image and assigning the three-dimensional coordinate information and the spectral information needing to be reserved to the laser point cloud. According to the technical scheme, a user is supported to define the windowing position and the spectral wavelength width, only the specific wave band is extracted, full-wave band data redundancy is avoided, the processing efficiency can be improved, meanwhile, key spectral features are reserved, and the method is suitable for specific scenes.

The invention provides a multi-chip packaging structure, an optical module and an optical communication system, and the structure comprises a substrate, the top surface of the substrate is provided with a plurality of chips, and the plurality of chips comprise at least one electric chip and one optical chip; wherein the top surface of the substrate comprises a first area and a second area, the distance between the first area and the bottom surface of the substrate is greater than the distance between the second area and the bottom surface of the substrate, the first area is used for configuring an electric chip in the at least one electric chip, the second area is provided with an optical chip, and the material of the first area is different from that of the second area. According to the technical scheme, the two surfaces are arranged in the substrate, so that the surfaces used for packaging the electric chip and the optical chip in the packaging structure are distinguished, and the two surfaces are correspondingly arranged on one of the two surfaces according to the actual material of the optical chip. While the stress packaging risk is reduced, the reliability of the packaging structure is improved, and the space of the packaging structure is saved.

The invention relates to the technical field of optical communication, in particular to an optical module which comprises a PCB, a bare DIE DSP chip, a PD chip, a TX PIC chip, an RX optical path element and a TX optical path element, the bare DIE DSP chip and the PD chip are both arranged on the front face of the PCB in an inverted mode, the RX optical path element is arranged on the front face of the PCB, the TX PIC chip and the TX optical path element are both arranged on the back face of the PCB, and the PD chip and the TX PIC chip are both electrically connected with the bare DIE DSP chip. According to the invention, the bare DIE DSP chip and the PD chip are inversely arranged on the front surface of the PCB, the TX PIC chip is arranged on the back surface of the PCB, and the RX optical path element and the TX optical path element are respectively arranged on the front surface and the back surface of the PCB, so that the length of a high-speed signal line among the PD chip, the TX PIC chip and the DSP chip can be obviously shortened by adopting the front and back double-sided layout design, and the reliability of the high-speed signal line is improved. Therefore, signal distortion caused by loss, reflection and the like in the transmission process of the electric signals is effectively reduced, and the signal transmission quality and the overall performance of the optical module are improved.

A co-packaged electro-optical module includes: a first planar light circuit (PLC) block; a silicon photonics chip electrically coupled to one or more chips; a splitter embedded in the first PLC block and to receive laser light from an optical fiber, to split the laser light into two portions, and to provide respective portions of the laser light to two planar waveguides; a planar surface of the silicon photonics chip to receive the portions of the laser light from the two planar waveguides in a direction perpendicular to the planar surface; modulators embedded in the silicon photonics chip and to modulate the portions of the laser light; a side edge of the silicon photonics chip extending perpendicular to the planar surface and to output the modulated portions of the laser light; and a second PLC block coupled to the side edge and to transmit the modulated portions of the laser light.

The embodiment of the invention provides a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of liquid cooling heat dissipation. The liquid cooling heat dissipation device comprises a cold plate, at least two heat conduction pieces and at least two elastic assemblies. The cold plate is provided with at least two sliding grooves. The heat conduction pieces are inserted into the sliding grooves in a one-to-one correspondence mode, can slide in the sliding grooves in the vertical direction and are used for being in contact with the surface of an optical module of at least one electronic device for heat transfer. The elastic assemblies are fixedly connected with the heat conduction pieces in a one-to-one correspondence mode, the elastic assemblies are fixedly connected with the cold plate, and the elastic assemblies are configured to apply elastic force and act on the heat conduction pieces when the optical modules are installed so that the heat conduction pieces can be tightly pressed on the surfaces of the corresponding optical modules. According to the liquid cooling heat dissipation device provided by the embodiment of the invention, the number of the cold plates can be reduced, so that the number of connection points between the cold plates and the liquid separator can be reduced, the number of positions where leakage possibly occurs on the electronic equipment can be reduced, and the probability of cooling medium leakage can be reduced.

The embodiment of the invention provides an optical module heat dissipation device and electronic equipment, and relates to the technical field of optical module heat dissipation. The optical module heat dissipation device comprises a circuit board, an optical mouse cage, a heat dissipation assembly and a liquid separator, the optical mouse cage is provided with a mounting group, the mounting group comprises a plurality of mounting cavities arranged side by side, and the mounting cavities are used for mounting optical modules; the heat dissipation assembly comprises a heat dissipation group corresponding to the installation group, the heat dissipation group comprises a plurality of heat dissipation plates arranged side by side, the heat dissipation plates form the top wall of the installation cavity, and heat exchange runners are arranged in the heat dissipation plates; the liquid separator is arranged on the side, back on to the mounting cavity, of the heat dissipation plates, and the liquid separator communicates with the heat exchange runners of the multiple heat dissipation plates so as to provide a cooling medium for the multiple heat dissipation plates; when the optical module is inserted into the mounting cavity, the optical module is suitable for driving the heat dissipation plate to move towards the liquid separator in the second direction. According to the optical module heat dissipation device, each heat dissipation module independently exchanges heat with the corresponding optical module, so that the heat dissipation uniformity of the optical module is improved.

The embodiment of the invention provides an optical module, an optical communication system and a communication method, relates to the technical field of optical communication, and reduces the energy consumption of the optical communication system. According to the specific scheme, the first optical module comprises a laser driving unit, a light emitting assembly and a control unit. The laser driving unit and the light emitting assembly form a high-speed channel, the laser driving unit, the light emitting assembly and the control unit form a low-speed channel, and the high-speed channel is used for transmitting service signals. The control unit is used for controlling the laser driving unit to generate a low-speed modulation signal, the light emitting assembly is used for obtaining a first low-speed light signal based on the low-speed modulation signal and sending the first low-speed light signal to the light receiving assembly of the second light module, and the first low-speed light signal is a non-service signal between the first light module and the second light module. The embodiment of the invention is used for the optical communication process between the first network equipment and the second network equipment.

The utility model discloses a liquid cooling heat dissipation module, an optical module assembly and communication equipment, and relates to the technical field of optical module communication. The tolerance heat conduction structure is arranged on one side surface of the liquid cooling plate; the floating structure is arranged on the side, away from the liquid cooling plate, of the tolerance heat conduction structure in a floating mode and used for installing a heating element, and the tolerance heat conduction structure has the trend of driving the floating structure to move away from the liquid cooling plate; the heating element abuts against the side face, away from the tolerance heat conduction structure, of the floating structure, so that the floating structure moves towards the liquid cooling plate to be matched with the liquid cooling plate to clamp the tolerance heat conduction structure. According to the technical scheme, the heat dissipation effect of an existing liquid cooling heat dissipation structure is improved.

The invention relates to a performance monitoring method of a forward transmission network, an optical module, equipment and a storage medium. The method comprises the following steps: acquiring an optical signal which is sent from a far-end radio frequency unit and is transmitted to a receiving unit of a performance monitoring optical module, and converting the optical signal into an electric signal; performing eye pattern analysis on the electric signal to generate an eye pattern distribution histogram; the eye pattern distribution histogram is used for representing distribution conditions of different signal amplitudes in different intervals; determining a multipath interference deformation factor according to the deformation condition of the eye pattern distribution histogram of the electric signal compared with the eye pattern distribution histogram before signal transmission; and determining a signal-to-noise ratio estimation value according to the multipath interference deformation factor, and determining a performance monitoring result of the forward transmission network according to the signal-to-noise ratio estimation value. By adopting the method, the link quality of the forward network can be accurately evaluated.