274 results about "Low inductance" patented technology

The invention provides a 2.5 D substrate packaging method and packaging structure, and relates to the technical field of semiconductor packaging. The 2.5 D substrate packaging method comprises the following steps: providing a carrier; wherein the carrier is provided with a flat part and a boss part; the boss part protrudes out of the flat part. Forming a first wiring layer on the boss part; forming a second wiring layer on the flat part; the first wiring layer and the second wiring layer are independent from each other. Mounting a first chip; the first chip comprises a plurality of first electric connection parts, at least one first electric connection part is electrically connected with the first wiring layer, and at least one first electric connection part is electrically connected with the second wiring layer; the length of the first electric connection part connected with the first wiring layer is smaller than that of the first electric connection part connected with the second wiring layer. Removing the carrier; and forming a solder ball on one side, far away from the first chip, of the second wiring layer. The inductance effect and the parasitic effect are reduced, the transmission path is shortened, the transmission efficiency is improved, and the chip integration level and the product performance are improved.

The invention belongs to the technical field of semiconductor device packaging, and discloses a power semiconductor module three-dimensional stacking vertical commutation low-inductance packaging structure. The two vertical commutation structures are stacked and integrated on the same substrate; different from traditional two-dimensional packaging in which all elements are laid on a two-dimensional plane, three-dimensional stacked packaging suitable for power devices is proposed for the first time, and power loops are stacked and integrated; the magnetic fluxes of the stacked power loops are cancelled, so that ultra-low inductance (pH level) integration is realized; under the condition that the areas of the substrates are the same, the capacity of the module is doubled; meanwhile, dynamic current sharing design is considered, and one driving chip simultaneously drives eight GaN chips to realize parallel dynamic current sharing for the first time; the method is suitable for various topological structures including half-bridge structures, full-bridge structures, three-level ANPC structures and the like; the method is suitable for various packaging schemes, including PCB on DBC packaging, DBC substrate welding / sintering packaging and embedded packaging. Taking the packaging of the half-bridge module double-sided parallel PCB on DBC as an example, low-inductance, low-thermal-resistance and high-power-density integration is realized.

The invention discloses a novel ultra-low stray inductance and double-sided heat dissipation silicon carbide power module. The novel ultra-low stray inductance and double-sided heat dissipation silicon carbide power module comprises a power module assembly, a plastic package body and a double-sided heat dissipation assembly, the power module assembly is formed by connecting a lower bridge assembly and an upper bridge assembly which are oppositely and symmetrically arranged through a molybdenum block. During working, stray inductance in the upper bridge arm and stray inductance in the lower bridge arm are counteracted, and the stray inductance of the whole module is reduced. The power module assembly is divided into an upper layer heat dissipation water channel and a lower layer heat dissipation water channel through the two double-sided heat dissipation assemblies, so that the contact area between cooling liquid and the module is doubled, the heat dissipation capacity of the module is improved, the maximum junction temperature of the silicon carbide module is effectively reduced, and the working efficiency of the silicon carbide module is improved. The heat dissipation columns which are small in area and are distributed more densely are arranged at the bottom of the high-heat chip, the heat dissipation columns which are large in area and small in number are arranged in the low-heat area, the heat dissipation columns are reasonably arranged according to the arrangement of the chip, the situation that the overall heat exchange efficiency is affected due to excessive temperature rise of local cooling liquid is avoided, and therefore the overall heat dissipation effect is guaranteed.

A capacitor that is capable of exhibiting good electrical properties under a wide variety of different conditions is provided. The capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and includes a conductive polymer. The capacitor also contains multiple exposed anode lead portions that are electrically connected to respective anode terminations and a planar cathode termination that is electrically connected to the solid electrolyte.

The utility model relates to a laminated circuit structure and a power module. The laminated circuit structure comprises a substrate, a first chip group, a second chip group and a circuit structure. The first chip set and the second chip set are arranged on one side of the substrate, the first chip set comprises a first chip, the second chip set comprises a second chip, and the circuit structure is arranged on one side, away from the substrate, of the first chip set or the second chip set and comprises a first conductive part, an insulating layer and a second conductive part which are stacked in the direction away from the substrate. Wherein the first chip, the first conductive piece, the second chip and the second conductive piece are sequentially connected in series. According to the laminated circuit structure, the parasitic inductance of the first conductive part and the parasitic inductance of the second conductive part can be counteracted due to opposite current directions when the first conductive part and the second conductive part carry current, so that the whole loop has lower inductance performance, and the parasitic inductance of the laminated circuit structure can be reduced.

Approaches, techniques, and mechanisms are disclosed for packaging electric power components. A power module comprises: a three-dimensional (3D) cooling structure that has a plurality of planar sides; a first set of mountable power components that are mounted on a first planar side in the plurality of planar sides of the 3D cooling structure; a second set of mountable power components that are mounted on a second planar side in the plurality of planar sides of the 3D cooling structure. The second planar side represents an opposing side, of the 3D cooling structure, to the first planar side. The 3D cooling structure includes an interior space containing one or more cooling channels in which cooling fluid is to flow. The interior space of the 3D cooling structure is spatially surrounded by other planar sides in the plurality of planar sides in combination with the first and second planar sides.

The application discloses a kind of low resistance low inductance high reliable electrode connecting structure for high voltage Pockels cell, belongs to Pockels cell electrode connecting technical field, solve the existing Pockels cell electrode connecting structure connection reliability problem, electric contact medium performance is not good;Including anti-drop insulating sleeve, pin, input electrode, metal hair button, shell and crystal;The top of pin is equipped with anti-drop insulating sleeve, the bottom of pin is connected with input electrode, input electrode is installed in the mounting hole of shell, the inside of shell is provided with crystal, and the outer side surface of both ends of crystal is provided with gold plating layer;Metal hair button at the bottom of input electrode is pressed on gold plating layer.In the application, pin and input electrode are inserted into position and wrapped by anti-drop insulating sleeve, input electrode is not exposed, and the personal safety hazard of high-voltage electric shock is fundamentally eliminated;Metal hair button is used instead of conductive rubber, to ensure that the contact pressure with crystal electrode is constant, and the anti-vibration and anti-impact performance is strong.

The utility model discloses a coupling hot-pressing double inductor which is composed of a T-shaped magnetic core, a cover type magnetic core and two coils which are preformed, the T-shaped magnetic core is provided with a bottom plate and a stand column body, the top face of the stand column body extends upwards in an integrated mode, and each coil is wound into a hollow spiral shape with more than three turns through a metal wire. The center axes of the spiral parts of the two coils coincide and are connected to the stand column body in a sleeved mode, the two ends of each coil extend in the same direction and are continuously bent to form a toggle clip, the toggle clips wrap the bottom plate and fix the coils to form an assembly, and the cover type magnetic core fully wraps the assembly in a hot-press forming mold and is packaged into a whole in a hot-press mode. And an electrode bonding pad communicated with the coil is arranged at the bottom of the position, corresponding to the toggle clip, of the double inductor. According to the utility model, the space occupied by the inductor in a high-density PCB (Printed Circuit Board) and the interference influence on the periphery can be reduced, and the performance of the inductor is improved, so that the mutual coupling coefficient k between the inductor is more than 0.98. And hardware performance development in various intelligent application scenes is facilitated.

Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.

The invention relates to an integrally-formed inductor and a preparation method thereof.The preparation method of the integrally-formed inductor comprises the following steps that a cylindrical iron core is attracted to a base to serve as a mold for winding, winding is conducted, and the height of a coil is made to be larger than the height of the iron core by 0.6 mm or above; after winding is completed, magnetic sealing glue is dropped from the top, so that the magnetic sealing glue permeates into a coil area from the top of the iron core, and then the magnetic sealing glue is shaped and solidified through hot air; placing the shaped and cured iron core and coil in the center of a square mold cavity; filling magnetic powder is poured into the mold cavity from the four corners of the square mold cavity; pressing by adopting an up-and-down simultaneous pressurizing mode, and then demolding to obtain a first green body; taking out the green body, cutting off the lead end, bending the lead end exposed out of the green body, and baking to obtain an integrally formed inductor; according to the method, the internal and external densities of the inductor are uniform, so that the saturation current of the inductor is effectively improved, and the direct-current resistance of the inductor is reduced.

The invention provides an inductance device and electronic equipment, the inductance device comprises a magnetic core shell, a magnetic core column and a winding, the magnetic core shell is internally provided with a winding cavity, and the winding cavity is provided with a top wall and a bottom wall which are oppositely arranged; the magnetic core column is arranged on the bottom wall and extends along one side close to the top wall, and an air gap is formed between the magnetic core column and the top wall; the winding is wound on the magnetic core column; the winding is limited between the air gap and the bottom wall, that is, the air gap and the winding are arranged in a staggered mode, the situation that eddy current loss is generated due to the fact that the air gap is arranged in the winding is avoided, energy consumption of the inductor device is reduced, and working stability of the inductor device is improved.

A capacitor capable of exhibiting good electrical properties under a wide variety of conditions is provided. The capacitor comprises a capacitor element consisting of a sintered porous anode body, a dielectric material covering the anode body, and a solid electrolyte containing a conductive polymer, also covering the dielectric. The capacitor also includes multiple anode conduction sections extending from the ends of the capacitor element. Furthermore, the capacitor includes a housing that defines an internal cavity in which the capacitor element is arranged and hermetically sealed.

The invention belongs to the field of manufacturing of printed circuits and assemblies thereof, and discloses a low-inductance lamination assembly method of a pulse power module, which comprises the following steps: placing a power semiconductor device and a decoupling capacitor into a cavity of a core substrate in a coplanar manner; laminating insulating layers and selectively windowing by using a closed-loop control method based on plasma spectrum monitoring; and finally, a bridging conductive layer directly bridging the top terminal of the element is formed through metal deposition. According to the invention, a lamination step is multiplexed as a key electrical connection forming process, and the dimension of a traditional three-dimensional commutation loop is reduced to a quasi-two-dimensional plane on a topological structure; therefore, current path geometric abrupt change and inductance bottleneck caused by vertical via holes are broken, and a structural basis is established for improving the electrical performance and electromagnetic compatibility of the module.

The application provides a method for solving an inductive encoder, the inductive encoder and an executor, wherein the inductive encoder comprises a single-pole pair code channel and a multi-pole pair code channel, the method comprises the following steps: collecting a first electric signal generated by the single-pole pair code channel to obtain a first angle; collecting a second electric signal generated by the multi-pole pair code channel to obtain a second angle; obtaining an original pole pair interval and an original angle of the multi-pole pair code channel based on the first angle; determining an actual pole pair interval of the multi-pole pair code channel based on the original pole pair interval, the original angle and the second angle; and obtaining an actual angle according to the second angle and the actual pole pair interval. In the above manner, the position detection can be effectively and reliably performed, the measurement accuracy is improved, the measurement stability and reliability are ensured, the measurement efficiency is improved, and the maintenance cost of the inductive encoder is reduced.

The utility model discloses a thin integrally-formed double inductor which is formed by combining two pre-formed and identical sheet-type magnetic cores and two coils, the surface of one side of any sheet-type magnetic core is flat, and the surface of the other side of any sheet-type magnetic core is provided with two parallel vertical containing grooves which are spaced by a certain distance. Notch grooves corresponding to the vertical containing grooves are formed in the bottoms of the sheet-type magnetic cores, each coil is a pre-bent Z-shaped copper sheet, the two sheet-type magnetic cores are closed to form holes according to the vertical containing grooves, the notch grooves are assembled in different directions, the coils are embedded in the vertical containing grooves in a one-to-one mode, and the folded edges at the two ends of each coil are in lap joint in the notch grooves. The two sheet-type magnetic cores are seamlessly spliced and packaged into a whole in a hot pressing mode, and exposed parts corresponding to the two ends of the coil are provided with electrode bonding pads. According to the utility model, the space occupied by the inductor in components in a high-density PCB (Printed Circuit Board) and the interference influence on the periphery are reduced, the performance of the inductor is improved, the mutual coupling coefficient k in the inductor is less than 0.1, and the hardware performance development under multiple application scenes is promoted.

The utility model relates to a low-noise inductor, which belongs to the technical field of inductors and comprises a mounting plate, the top of the mounting plate is fixedly connected with a shielding cover, and a substrate is embedded in the top end of the mounting plate. The inductor has the advantages that the shielding cover outside the inductor body is of a structure with a plurality of shielding layers, each layer is made of conductive materials, electromagnetic interference can be effectively shielded, magnetic materials such as ferrite are embedded in the shielding cover outside the inductor body, the materials have a good electromagnetic shielding effect, and the electromagnetic shielding effect is good. The common-mode noise is reduced and the consistency and symmetry of the winding are ensured in a mode of symmetrically winding the annular inductor, and in the aspect of optimization of a packaging structure, a flip chip technology is adopted, a chip is directly welded on a substrate, and the length of a lead and parasitic inductance are reduced, so that the packaging structure can be optimized without remarkably increasing the size and the cost. The electromagnetic noise of the inductor is effectively reduced by improving the packaging material and process, and the overall performance and reliability of the inductor are improved.

The invention relates to the technical field of voltage regulation, and discloses a voltage regulation device, a manufacturing method and electronic equipment, and the device comprises an inductor which comprises a magnetic core, a first winding wire and a second winding wire; the first winding wire and the second winding wire are Z-shaped, the middle parts of the first winding wire and the second winding wire penetrate through the magnetic core, and the middle parts of the first winding wire and the second winding wire are parallel to the bottom plate or the top plate of the voltage regulating device; two ends of the first winding wire and two ends of the second winding wire are led out from the magnetic core; the two ends of the first winding wire are opposite to the two ends of the second winding wire; the first winding and the second winding are used for generating magnetic flux perpendicular to the top plate or the bottom plate, and the magnetic flux is used for adjusting voltage. The middle part of the Z-shaped first winding wire and the middle part of the Z-shaped second winding wire are parallel to the bottom plate or the top plate of the inductor, so that the first winding wire and the second winding wire generate magnetic flux in a plane vertical to the top plate or the bottom plate, the height of the winding wires of the inductor is reduced, and the height of the voltage regulating device is reduced.

The invention relates to the technical field of impulse voltage generating devices, in particular to a compact low-inductance impulse voltage generator device which comprises a butt-joint inflatable insulating shell and a movable crawler which are connected through a butt-joint flange, and an insulating supporting piece comprises a vertical supporting rod and a high-density PP insulating isolation plate. An annular shielding electrode is arranged on the outer side surface of each high-density PP insulating isolation plate; a low-inductance impulse voltage generator is arranged on each layer of high-density PP insulating isolation plate; single bilateral charging impulse voltage generator loops are isolated and insulated through high-density PP insulation isolation plates. Therefore, the device can be directly butted with a test object, a sleeve is not needed, a butting building block totally-enclosed insulation barrel type structure is adopted, the height of the device is effectively controlled, transportation and installation are facilitated, the number of building block sections can be selected according to field test requirements, the voltage grade can be changed, the inherent inductance of a loop can be effectively reduced, and steep waveforms can be output.

The present invention discloses a controller and control method for a five-phase motor, including a power circuit, a control circuit, and an isolation circuit. The power circuit includes a five-phase inverter circuit and a neutral point three-level modulator circuit. The control circuit includes a main control circuit, an angle sensor, and a current sensor. The signal output of the main control circuit is connected to the control signal input of the five-phase inverter circuit and the control signal input of the neutral point three-level modulator circuit via the isolation circuit. The signal input of the main control circuit is connected to the angle sensor of the five-phase motor, and the current sensors of each phase of the five-phase inverter circuit are connected to the signal input of the main control circuit. The present invention reduces current and torque fluctuations in such low-inductance five-phase motors in both healthy and faulty operating conditions, and has the advantages of low cost, high control accuracy, and high fault tolerance.

A transceiver front-end (FE) includes a receiver from an I / O pad to an amplifier (e.g., a low noise amplifier (LNA)) and a transmitter from the I / O pad to another amplifier (e.g., a power amplifier (PA)). The receiver further includes a variable inductor connected at one end to the I / O pad and connectable at the opposite end to ground by a switch. The LNA is connected to a node between portions of the inductor. When receiving, the switch is opened so the inductor exhibits low inductance for LNA impedance matching. When transmitting, the switch is closed so the inductor exhibits high inductance for blocking leakage to the LNA. Additionally, or alternatively, the transmitter includes a variable capacitor connected to the I / O pad. When receiving, the capacitor is programmed to exhibit low capacitance for optimal LNA performance. When transmitting, the capacitor is programmed to exhibit high capacitance for optimal PA performance.

A power module and method for making the same, comprising a substrate, one or more semiconductor devices positioned on the substrate, an auxiliary substrate positioned on the substrate, and a first busbar located on the auxiliary substrate. A second busbar electrically is connected to the substrate such that, in use, a power loop current path extends between the first and second busbars via the substrate and the auxiliary substrate.

The invention discloses a low-inductance cable assembly and a manufacturing method thereof, the low-inductance cable assembly comprises a power supply end multi-core electric connector plug, an ignition tube end electric connector plug and ribbon cables, and the number of the ribbon cables is the same as that of the ignition tube end electric connector plug; wherein the tail end of a first plug jack of the power supply end multi-core electric connector plug is electrically connected with one end of the ribbon cable, and the tail end of a second plug pin of the ignition tube end electric connector plug is electrically connected with the other end of the ribbon cable; and cavities in the first plug shell of the power supply end multi-core electric connector plug and the second plug shell of the ignition tube end electric connector plug which are connected with the ribbon cable are encapsulated and cured by insulating pouring sealant. The low-inductance ribbon cable is adopted, loss and attenuation of high-voltage pulse current in the transmission process can be reduced to the maximum extent, it is ensured that the slapper ignition tube obtains enough energy at the key moment, and therefore reliable ignition is achieved.

A method for manufacturing a separation membrane according to the present invention includes: preparing a precursor layer that contains Si, O, and C; and carrying out plasma treatment using inductively coupled plasma on a first surface of the precursor layer to obtain the separation function layer. The plasma treatment is, for example, a treatment performed using inductively coupled plasma of a gas that contains at least one selected from the group consisting of argon, oxygen, and nitrogen, said gas being generated by application of high-frequency power to a low-inductance antenna.

The purpose of the present invention is to inexpensively provide a large-current inductor having low inductance.　This inductor comprises: a coil conductor having a pair of leads, the coil conductor comprising a conductive wire having a conductor and an insulating film covering the outer periphery of the conductor; an element containing metallic magnetic particles and a resin and enclosing the coil conductor; and an external electrode connected to the exposed portion of the lead that is exposed from the surface of the element body. The element has a mounting surface facing the side of a mounting substrate when mounted. The coil conductor has a winding part in which a conductive wire is wound in a helix. A winding shaft of the winding part is embedded in the element in an orientation following a direction substantially parallel to the mounting surface of the element. Each of the two leads is led out from the outer periphery on the mounting surface side of the winding part to the mounting surface while a part of the outer periphery of the conductive wire faces the mounting surface.

The invention discloses a feed-through capacitor with ultralow inductance, which relates to the technical field of capacitors, and comprises a capacitor core, a positive bus, a negative bus, a shell and a filler, the capacitor core is formed by continuously winding the same metallized film, and comprises a plurality of groups of positive annular belt layers and reverse annular belt layers which are coaxially and alternately distributed; insulating sleeves are arranged between the adjacent forward annular belt layers and the reverse annular belt layers, axial openings are formed in the pipe walls of the insulating sleeves, a through copper pipe is arranged in the center of the capacitor core, insulating coatings are arranged on the inner wall and the outer wall of the through copper pipe, and the positive bus and the negative bus are arranged in the through copper pipe in parallel in a penetrating mode and are separated through an insulating plate. The positive bus is conducted with all the forward annular belt layers at one end of the capacitor core, the negative bus is conducted with all the reverse annular belt layers at the other end of the capacitor core, the outer side of the capacitor core is sleeved with the shell, and the filler is poured between the capacitor core and the shell. According to the invention, the inductance of the capacitor is effectively reduced, and a more reliable solution with better performance is provided.

The utility model discloses a low-cost support type high-heat-dissipation inductor, which relates to the field of inductor structures and comprises an inductor body, two metal supports symmetrically arranged on two sides of the inductor body, an insulating heat-conducting gasket arranged between the metal supports and the side face of the inductor body, and an insulating cover arranged between the metal supports and the insulating heat-conducting gasket. The insulating cover covers one side of the inductor body, and the plurality of insulating connecting assemblies are arranged between the two metal supports; according to the low-cost support type high-heat-dissipation inductor, the heat dissipation performance of the inductor can be improved, the temperature of the inductor in the working process is reduced, meanwhile, the manufacturing cost and the process difficulty are reduced, and the requirements of the industry for high heat dissipation and low cost of the inductor can be met.

The utility model discloses a power module used for an energy storage inverter, comprising a sheet metal rack, the sheet metal rack is a square frame body, one side surface of the sheet metal rack is provided with a radiator, the radiator is respectively provided with an IGBT power module, a heating resistor, a temperature control switch and a voltage-sharing resistor, and the IGBT power module is respectively connected with a laminated bus, an AC output copper bar and a driving board. According to the utility model, the structure is compact, different severe environments can be adapted under the condition of ensuring high power, and the power density is improved, the load of a single IGBT is reduced and the service life of the IGBT is prolonged through the use of three parallel IGBTs; the voltage equalization of the small laminated busbar is realized through the voltage equalizing resistor, and the anti-interference capability of the small laminated busbar is enhanced; through a temperature control switch and a heating resistor, the functions of moisture-proof heating dehumidification, low-temperature starting heating and the like are achieved; through the low-inductance design of the laminated busbar, the IGBT voltage spike is reduced, and the operation reliability of the device is improved.

Provided is a capacitor capable of exhibiting good electrical performance under a variety of different conditions. The capacitor includes a capacitor element including a sintered porous anode body, a dielectric overlying the anode body, and a solid electrolyte overlying the dielectric and including a conductive polymer. The capacitor also includes a plurality of anode lead portions extending from an end of the capacitor element. The capacitor also includes a housing defining an interior cavity in which the capacitor element is positioned and hermetically sealed.

The invention discloses a power module and a power module group, the power module comprises power units, and each power unit comprises an upper bridge power unit and a lower bridge power unit; a lower bridge power unit; the printed circuit board comprises at least N prefabricated layers, N is larger than or equal to 3, each prefabricated layer comprises an insulating layer and a conductive structure, the adjacent prefabricated layers are isolated through the insulating layers and sequentially connected through the conductive structures, the first prefabricated layer to the Nth prefabricated layer are sequentially arranged from top to bottom, and N is a positive integer; the first end, the second end and the third end of the upper bridge power unit are located on the ith prefabricated layer, and the first end, the second end and the third end of the lower bridge power unit are located on the jth prefabricated layer. By directly embedding the power device in the printed circuit board and utilizing high-density interconnection and advanced packaging processes, ultralow stray inductance and high power density are realized, meanwhile, the system cost is saved, and the power conversion circuit can be widely applied to power conversion systems in the fields of new energy automobiles, industrial automation, renewable energy sources, consumer electronics and the like.

The present invention provides a capacitor module that can reduce inductance while miniaturizing the capacitor module. [Solution] The capacitor module of this disclosure comprises a capacitor element having a first electrode, a second electrode, and a side surface; a first busbar electrically connected to the first electrode; and a second busbar electrically connected to the second electrode, wherein the first busbar has a first extension, a first connection, a second extension, and a first terminal; and the second busbar has a second contact, a third extension, a second connection, a fourth extension, and a second terminal, wherein the second extension and the fourth extension are arranged to overlap at least a portion when viewed from a direction perpendicular to the planes on which the second and fourth extensions extend.