366 results about "Low inductance" patented technology

The invention provides a 2.5 D substrate packaging method and packaging structure, and relates to the technical field of semiconductor packaging. The 2.5 D substrate packaging method comprises the following steps: providing a carrier; wherein the carrier is provided with a flat part and a boss part; the boss part protrudes out of the flat part. Forming a first wiring layer on the boss part; forming a second wiring layer on the flat part; the first wiring layer and the second wiring layer are independent from each other. Mounting a first chip; the first chip comprises a plurality of first electric connection parts, at least one first electric connection part is electrically connected with the first wiring layer, and at least one first electric connection part is electrically connected with the second wiring layer; the length of the first electric connection part connected with the first wiring layer is smaller than that of the first electric connection part connected with the second wiring layer. Removing the carrier; and forming a solder ball on one side, far away from the first chip, of the second wiring layer. The inductance effect and the parasitic effect are reduced, the transmission path is shortened, the transmission efficiency is improved, and the chip integration level and the product performance are improved.

The invention belongs to the technical field of semiconductor device packaging, and discloses a power semiconductor module three-dimensional stacking vertical commutation low-inductance packaging structure. The two vertical commutation structures are stacked and integrated on the same substrate; different from traditional two-dimensional packaging in which all elements are laid on a two-dimensional plane, three-dimensional stacked packaging suitable for power devices is proposed for the first time, and power loops are stacked and integrated; the magnetic fluxes of the stacked power loops are cancelled, so that ultra-low inductance (pH level) integration is realized; under the condition that the areas of the substrates are the same, the capacity of the module is doubled; meanwhile, dynamic current sharing design is considered, and one driving chip simultaneously drives eight GaN chips to realize parallel dynamic current sharing for the first time; the method is suitable for various topological structures including half-bridge structures, full-bridge structures, three-level ANPC structures and the like; the method is suitable for various packaging schemes, including PCB on DBC packaging, DBC substrate welding / sintering packaging and embedded packaging. Taking the packaging of the half-bridge module double-sided parallel PCB on DBC as an example, low-inductance, low-thermal-resistance and high-power-density integration is realized.

The invention discloses a common-mode EMI noise suppression method combining a passive filter and a modulation strategy, and belongs to the technical field of power electronics and electricians. According to the method, an improved random switching frequency SVPWM (Space Vector Pulse Width Modulation) method is used, a common-mode voltage frequency spectrum without an EMI (Electro-Magnetic Interference) filter is obtained through measurement, a common-mode voltage amplitude is reduced from the source, the reduction of a common-mode electromagnetic interference frequency spectrum is further realized, required insertion loss is determined according to an EMC (Electro Magnetic Compatibility) standard, and an intersection point of the insertion loss and the minimum frequency is reached. And taking the frequency corresponding to the point as the cut-off frequency of the EMI filter, determining the element parameters of the filter according to the cut-off frequency, and verifying the element parameters. By using a common-mode interference comprehensive suppression means combining the filter and the random PWM strategy, the design margin of the filter can be reduced, the cut-off frequency of the EMI filter can be increased, the weight and the size of the inductor can be reduced, the light weight and the miniaturization of the filter can be realized, and the cost can be reduced. And meanwhile, the improved random switching frequency SVPWM is adopted, so that the filtering effect of the EMI filter is guaranteed.

The invention discloses a novel difference fixed-frequency boost control method suitable for resonant transformation topology, and relates to the technical field of resonant converter wide-range fixed-frequency boost control. According to the method, the switching frequency of a switching tube of a rectifier full bridge is set to be half of the switching frequency of a switching tube of an inverter side full bridge, the switching frequency of the inverter side full bridge is rated resonant frequency, a half-cycle feedback current circuit is formed, the feedback energy time is adjusted by controlling the PWM proportion of a single tube, and the output voltage of the converter is pumped up. Soft switching characteristics of part of switching tubes are inherited, wide gain of the converter on a rated frequency point can be guaranteed, the situation that tube section current is too high due to the fact that traditional frequency conversion control is in a wide under-resonance interval or a low inductance ratio is avoided, meanwhile, the problem that soft switching cannot be achieved in phase-shifting control is also avoided, and the control efficiency of the converter is improved. Meanwhile, over-wide frequency range adjustment is avoided for high-frequency application, convenience is brought to design of magnetic elements, and certain high-frequency and high-power-density application potential is achieved.

The invention discloses a novel ultra-low stray inductance and double-sided heat dissipation silicon carbide power module. The novel ultra-low stray inductance and double-sided heat dissipation silicon carbide power module comprises a power module assembly, a plastic package body and a double-sided heat dissipation assembly, the power module assembly is formed by connecting a lower bridge assembly and an upper bridge assembly which are oppositely and symmetrically arranged through a molybdenum block. During working, stray inductance in the upper bridge arm and stray inductance in the lower bridge arm are counteracted, and the stray inductance of the whole module is reduced. The power module assembly is divided into an upper layer heat dissipation water channel and a lower layer heat dissipation water channel through the two double-sided heat dissipation assemblies, so that the contact area between cooling liquid and the module is doubled, the heat dissipation capacity of the module is improved, the maximum junction temperature of the silicon carbide module is effectively reduced, and the working efficiency of the silicon carbide module is improved. The heat dissipation columns which are small in area and are distributed more densely are arranged at the bottom of the high-heat chip, the heat dissipation columns which are large in area and small in number are arranged in the low-heat area, the heat dissipation columns are reasonably arranged according to the arrangement of the chip, the situation that the overall heat exchange efficiency is affected due to excessive temperature rise of local cooling liquid is avoided, and therefore the overall heat dissipation effect is guaranteed.

A capacitor that is capable of exhibiting good electrical properties under a wide variety of different conditions is provided. The capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and includes a conductive polymer. The capacitor also contains multiple exposed anode lead portions that are electrically connected to respective anode terminations and a planar cathode termination that is electrically connected to the solid electrolyte.

The utility model provides an integrally-formed inductor which comprises a magnetic core and at least two coils. The magnetic core is formed by pressing a first forming part and a second forming part; the first forming part and the second forming part are both formed by pre-pressing magnetic powder; the coil arrangement direction is perpendicular to the axis direction of the coils; the second forming part is provided with at least two accommodating grooves; each accommodating groove is configured to accommodate at least one coil; the first forming part comprises an upper pendulum and a middle column for filling a middle gap of the coil; the upper pendulum basically covers the containing groove. The first forming part and the second forming part are pre-pressed and formed by the magnetic powder, then the first forming part and the second forming part are pressed into the magnetic core, and compared with a magnetic core structure which is directly pressed and formed by the magnetic powder, the technical scheme of the utility model can reduce gaps among powder materials and improve the density of the magnetic core, so that the direct-current resistance value of the inductor is reduced; the inductance characteristic is improved.

The invention relates to a gate unit (22) for controlling a gate commutated thyristor (21), comprising: —a voltage selector (26) for selectively applying a high supply potential (Vpos), a middle supply potential (Vmid), and a low supply potential (Vneg); —a nonlinear inductor (27) serially coupled between the output of the voltage selector (26); —a gate control unit (23) configured to control the voltage selector (26) to control switching of the gate commutated thyristor (21) in its turn-on state comprising a turn-on pulse generation, a positive-gate-voltage backporch operation, a negative-gate-voltage backporch operation and a retrigger pulse generation; wherein the nonlinear inductor (27) has a nonlinearity to have a high inductance during any of the backporch operations and to have a low inductance during the turn-on pulse generation and retrigger pulse generation.

The invention discloses a control method, a control device, a medium, a processor and a switching power supply, and the control method comprises the steps: the driving pulses of a switching tube S1 and a switching tube S2 are complementary, and the duty ratio adjustment range is [0, 1]; driving pulses of the switching tube S3 and the switching tube S4 are complementary, and the duty ratio adjusting range is [0, 1]; the power factor correction of the alternating current side is realized by adjusting the duty ratio of a switching tube S1 and the duty ratio of a switching tube S3, and the adjusting strategy is as follows: when the instantaneous value of an alternating current voltage source is greater than or equal to 0, the driving pulse of the switching tube S3 lags behind the switching tube S1, the phase difference between the driving pulse of the switching tube S1 and the driving pulse of the switching tube S3 is theta 1, and the adjusting range of theta 1 is [0, 180 degrees]; when the instantaneous value of the alternating current voltage source is smaller than 0, the driving pulse of the switching tube S3 is ahead of the switching tube S1, the phase difference between the driving pulse of the switching tube S1 and the driving pulse of the switching tube S3 is theta 2, and the adjusting range of theta 2 is [-180 degrees, 0]. According to the invention, switching tubes can be reduced, the cost is reduced, and the ripple of PFC inductive current is reduced.

The utility model relates to an inductor heat dissipation device and an electric energy conversion device, and relates to the field of new energy electrical equipment. The utility model provides an inductor heat dissipation device which comprises at least one inductor, a shell and a sealing and filling material. The shell is detachably connected with an external cabinet body, a flow channel used for circulating cooling liquid is arranged in the shell, the shell is further provided with an installation cavity, a first opening and a second opening, the first opening and the second opening are communicated with the flow channel, and the installation cavity is used for containing at least one inductor; and the sealing and filling material is filled in the mounting cavity and is used for conducting heat. By arranging the shell with the flow channel and the sealing and filling material, efficient heat dissipation of the inductor is achieved, then the working environment temperature and the internal hot spot temperature of the inductor are reduced, and the long-term reliability is improved; and meanwhile, the shell is detachably connected with the cabinet body of the electric energy conversion device, and the surface of the cabinet body does not need to be perforated to reserve an air duct, so that the reliability problems of radiator blockage, fan aging and the like are avoided, and the invalidation problems of corrosion, insulation aging and the like in the cabinet body can also be avoided.

The utility model provides an inductor assembly and a boosting system. The inductor assembly comprises a shell, an inductor and a heat conduction gasket. An accommodating cavity is formed in the shell, and the inductor is mounted in the accommodating cavity; the first side surface of the heat-conducting gasket is in multi-surface contact with an inductance coil of the inductor, and the second side surface of the heat-conducting gasket is in multi-surface contact with the shell corresponding to the accommodating cavity; and a cooling channel is arranged in the shell. According to the utility model, the inductor is placed in the accommodating cavity of the shell, the first side surface of the heat-conducting gasket is in multi-surface contact with the inductance coil of the inductor, and the second side surface of the heat-conducting gasket is connected with the inner wall of the shell corresponding to the accommodating cavity, so that the contact area of the heat-conducting gasket with the inductance coil and the inner wall of the shell corresponding to the accommodating cavity is enlarged; heat generated by the inductance coil can be quickly transferred into the shell; the cooling channel used for being filled with the cooling liquid is arranged in the shell, the cooling liquid flows in the cooling channel, heat received by the shell can be taken away, and the temperature of the inductance coil is reduced.

The utility model relates to a laminated circuit structure and a power module. The laminated circuit structure comprises a substrate, a first chip group, a second chip group and a circuit structure. The first chip set and the second chip set are arranged on one side of the substrate, the first chip set comprises a first chip, the second chip set comprises a second chip, and the circuit structure is arranged on one side, away from the substrate, of the first chip set or the second chip set and comprises a first conductive part, an insulating layer and a second conductive part which are stacked in the direction away from the substrate. Wherein the first chip, the first conductive piece, the second chip and the second conductive piece are sequentially connected in series. According to the laminated circuit structure, the parasitic inductance of the first conductive part and the parasitic inductance of the second conductive part can be counteracted due to opposite current directions when the first conductive part and the second conductive part carry current, so that the whole loop has lower inductance performance, and the parasitic inductance of the laminated circuit structure can be reduced.

The utility model discloses a low-inductance power module, which comprises an insulating shell, a heat dissipation bottom plate and a plurality of power conversion units, and is characterized in that the heat dissipation bottom plate is connected with the insulating shell; the plurality of power conversion units are arranged on the heat dissipation bottom plate, each power conversion unit comprises a substrate, a plurality of copper clamps and a plurality of chips, the front surfaces of the plurality of chips are provided with source electrodes and are respectively connected with the first conductive layer through the copper clamps, and the back surfaces of the plurality of chips are provided with drain electrodes and are connected with the second conductive layer; grid electrodes of a plurality of chips are connected with the third conductive layer through metal leads, the adopted chips are metal oxide semiconductor field effect transistors, source electrodes of the chips adopt copper clamp structures to achieve electrical interconnection between the chips and the substrate, and compared with a connection mode of the metal leads, the copper clamps can offset more magnetic flux generated by current, so that the reliability of the device is improved. The chip and the substrate, the chip and the copper clamp, and the copper clamp and the substrate are interconnected by adopting a nano-metal sintering process, so that the thermal reliability of the interconnection part is improved, the copper clamp and nano-metal sintering process is conveniently realized through the overall layout design of the substrate, the effect of low parasitic inductance of the module is realized, and the reliability of the module is improved. And module reliability is improved.

The utility model discloses an inductor structure and electric reactor, including shell and the inductor main part that is encapsulated in the shell in potting mode, the inductor main part includes skeleton main part, magnetic core main part and the winding that sets up in the magnetic core main part, the magnetic core main part and the winding as one piece install in the skeleton main part; the framework body is of a framework structure made of high-thermal-conductivity insulating plastic. According to the inductor structure, the framework main body is made of the high-thermal-conductivity insulating plastic, so that heat can be quickly transferred to the heat-conducting glue through the framework main body, and finally, the heat is transferred to the shell through the heat-conducting glue, so that quick heat conduction and cooling are realized, and the temperature rise of the inductor structure can be effectively reduced; meanwhile, compared with a traditional mode of increasing the sectional area of the winding and reducing the resistance and a mode of using a low-loss magnetic core material, the framework structure made of the high-thermal-conductivity insulating plastic can greatly reduce the cost of the inductor structure.

Approaches, techniques, and mechanisms are disclosed for packaging electric power components. A power module comprises: a three-dimensional (3D) cooling structure that has a plurality of planar sides; a first set of mountable power components that are mounted on a first planar side in the plurality of planar sides of the 3D cooling structure; a second set of mountable power components that are mounted on a second planar side in the plurality of planar sides of the 3D cooling structure. The second planar side represents an opposing side, of the 3D cooling structure, to the first planar side. The 3D cooling structure includes an interior space containing one or more cooling channels in which cooling fluid is to flow. The interior space of the 3D cooling structure is spatially surrounded by other planar sides in the plurality of planar sides in combination with the first and second planar sides.

The application discloses a kind of low resistance low inductance high reliable electrode connecting structure for high voltage Pockels cell, belongs to Pockels cell electrode connecting technical field, solve the existing Pockels cell electrode connecting structure connection reliability problem, electric contact medium performance is not good;Including anti-drop insulating sleeve, pin, input electrode, metal hair button, shell and crystal;The top of pin is equipped with anti-drop insulating sleeve, the bottom of pin is connected with input electrode, input electrode is installed in the mounting hole of shell, the inside of shell is provided with crystal, and the outer side surface of both ends of crystal is provided with gold plating layer;Metal hair button at the bottom of input electrode is pressed on gold plating layer.In the application, pin and input electrode are inserted into position and wrapped by anti-drop insulating sleeve, input electrode is not exposed, and the personal safety hazard of high-voltage electric shock is fundamentally eliminated;Metal hair button is used instead of conductive rubber, to ensure that the contact pressure with crystal electrode is constant, and the anti-vibration and anti-impact performance is strong.

The utility model discloses a coupling hot-pressing double inductor which is composed of a T-shaped magnetic core, a cover type magnetic core and two coils which are preformed, the T-shaped magnetic core is provided with a bottom plate and a stand column body, the top face of the stand column body extends upwards in an integrated mode, and each coil is wound into a hollow spiral shape with more than three turns through a metal wire. The center axes of the spiral parts of the two coils coincide and are connected to the stand column body in a sleeved mode, the two ends of each coil extend in the same direction and are continuously bent to form a toggle clip, the toggle clips wrap the bottom plate and fix the coils to form an assembly, and the cover type magnetic core fully wraps the assembly in a hot-press forming mold and is packaged into a whole in a hot-press mode. And an electrode bonding pad communicated with the coil is arranged at the bottom of the position, corresponding to the toggle clip, of the double inductor. According to the utility model, the space occupied by the inductor in a high-density PCB (Printed Circuit Board) and the interference influence on the periphery can be reduced, and the performance of the inductor is improved, so that the mutual coupling coefficient k between the inductor is more than 0.98. And hardware performance development in various intelligent application scenes is facilitated.

Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.

The invention relates to an integrally-formed inductor and a preparation method thereof.The preparation method of the integrally-formed inductor comprises the following steps that a cylindrical iron core is attracted to a base to serve as a mold for winding, winding is conducted, and the height of a coil is made to be larger than the height of the iron core by 0.6 mm or above; after winding is completed, magnetic sealing glue is dropped from the top, so that the magnetic sealing glue permeates into a coil area from the top of the iron core, and then the magnetic sealing glue is shaped and solidified through hot air; placing the shaped and cured iron core and coil in the center of a square mold cavity; filling magnetic powder is poured into the mold cavity from the four corners of the square mold cavity; pressing by adopting an up-and-down simultaneous pressurizing mode, and then demolding to obtain a first green body; taking out the green body, cutting off the lead end, bending the lead end exposed out of the green body, and baking to obtain an integrally formed inductor; according to the method, the internal and external densities of the inductor are uniform, so that the saturation current of the inductor is effectively improved, and the direct-current resistance of the inductor is reduced.

The invention provides an inductance device and electronic equipment, the inductance device comprises a magnetic core shell, a magnetic core column and a winding, the magnetic core shell is internally provided with a winding cavity, and the winding cavity is provided with a top wall and a bottom wall which are oppositely arranged; the magnetic core column is arranged on the bottom wall and extends along one side close to the top wall, and an air gap is formed between the magnetic core column and the top wall; the winding is wound on the magnetic core column; the winding is limited between the air gap and the bottom wall, that is, the air gap and the winding are arranged in a staggered mode, the situation that eddy current loss is generated due to the fact that the air gap is arranged in the winding is avoided, energy consumption of the inductor device is reduced, and working stability of the inductor device is improved.

A capacitor capable of exhibiting good electrical properties under a wide variety of conditions is provided. The capacitor comprises a capacitor element consisting of a sintered porous anode body, a dielectric material covering the anode body, and a solid electrolyte containing a conductive polymer, also covering the dielectric. The capacitor also includes multiple anode conduction sections extending from the ends of the capacitor element. Furthermore, the capacitor includes a housing that defines an internal cavity in which the capacitor element is arranged and hermetically sealed.

The invention belongs to the field of manufacturing of printed circuits and assemblies thereof, and discloses a low-inductance lamination assembly method of a pulse power module, which comprises the following steps: placing a power semiconductor device and a decoupling capacitor into a cavity of a core substrate in a coplanar manner; laminating insulating layers and selectively windowing by using a closed-loop control method based on plasma spectrum monitoring; and finally, a bridging conductive layer directly bridging the top terminal of the element is formed through metal deposition. According to the invention, a lamination step is multiplexed as a key electrical connection forming process, and the dimension of a traditional three-dimensional commutation loop is reduced to a quasi-two-dimensional plane on a topological structure; therefore, current path geometric abrupt change and inductance bottleneck caused by vertical via holes are broken, and a structural basis is established for improving the electrical performance and electromagnetic compatibility of the module.

The application provides a method for solving an inductive encoder, the inductive encoder and an executor, wherein the inductive encoder comprises a single-pole pair code channel and a multi-pole pair code channel, the method comprises the following steps: collecting a first electric signal generated by the single-pole pair code channel to obtain a first angle; collecting a second electric signal generated by the multi-pole pair code channel to obtain a second angle; obtaining an original pole pair interval and an original angle of the multi-pole pair code channel based on the first angle; determining an actual pole pair interval of the multi-pole pair code channel based on the original pole pair interval, the original angle and the second angle; and obtaining an actual angle according to the second angle and the actual pole pair interval. In the above manner, the position detection can be effectively and reliably performed, the measurement accuracy is improved, the measurement stability and reliability are ensured, the measurement efficiency is improved, and the maintenance cost of the inductive encoder is reduced.

The utility model discloses a thin integrally-formed double inductor which is formed by combining two pre-formed and identical sheet-type magnetic cores and two coils, the surface of one side of any sheet-type magnetic core is flat, and the surface of the other side of any sheet-type magnetic core is provided with two parallel vertical containing grooves which are spaced by a certain distance. Notch grooves corresponding to the vertical containing grooves are formed in the bottoms of the sheet-type magnetic cores, each coil is a pre-bent Z-shaped copper sheet, the two sheet-type magnetic cores are closed to form holes according to the vertical containing grooves, the notch grooves are assembled in different directions, the coils are embedded in the vertical containing grooves in a one-to-one mode, and the folded edges at the two ends of each coil are in lap joint in the notch grooves. The two sheet-type magnetic cores are seamlessly spliced and packaged into a whole in a hot pressing mode, and exposed parts corresponding to the two ends of the coil are provided with electrode bonding pads. According to the utility model, the space occupied by the inductor in components in a high-density PCB (Printed Circuit Board) and the interference influence on the periphery are reduced, the performance of the inductor is improved, the mutual coupling coefficient k in the inductor is less than 0.1, and the hardware performance development under multiple application scenes is promoted.

The utility model relates to a low-noise inductor, which belongs to the technical field of inductors and comprises a mounting plate, the top of the mounting plate is fixedly connected with a shielding cover, and a substrate is embedded in the top end of the mounting plate. The inductor has the advantages that the shielding cover outside the inductor body is of a structure with a plurality of shielding layers, each layer is made of conductive materials, electromagnetic interference can be effectively shielded, magnetic materials such as ferrite are embedded in the shielding cover outside the inductor body, the materials have a good electromagnetic shielding effect, and the electromagnetic shielding effect is good. The common-mode noise is reduced and the consistency and symmetry of the winding are ensured in a mode of symmetrically winding the annular inductor, and in the aspect of optimization of a packaging structure, a flip chip technology is adopted, a chip is directly welded on a substrate, and the length of a lead and parasitic inductance are reduced, so that the packaging structure can be optimized without remarkably increasing the size and the cost. The electromagnetic noise of the inductor is effectively reduced by improving the packaging material and process, and the overall performance and reliability of the inductor are improved.

The invention relates to the technical field of voltage regulation, and discloses a voltage regulation device, a manufacturing method and electronic equipment, and the device comprises an inductor which comprises a magnetic core, a first winding wire and a second winding wire; the first winding wire and the second winding wire are Z-shaped, the middle parts of the first winding wire and the second winding wire penetrate through the magnetic core, and the middle parts of the first winding wire and the second winding wire are parallel to the bottom plate or the top plate of the voltage regulating device; two ends of the first winding wire and two ends of the second winding wire are led out from the magnetic core; the two ends of the first winding wire are opposite to the two ends of the second winding wire; the first winding and the second winding are used for generating magnetic flux perpendicular to the top plate or the bottom plate, and the magnetic flux is used for adjusting voltage. The middle part of the Z-shaped first winding wire and the middle part of the Z-shaped second winding wire are parallel to the bottom plate or the top plate of the inductor, so that the first winding wire and the second winding wire generate magnetic flux in a plane vertical to the top plate or the bottom plate, the height of the winding wires of the inductor is reduced, and the height of the voltage regulating device is reduced.

The invention relates to the technical field of impulse voltage generating devices, in particular to a compact low-inductance impulse voltage generator device which comprises a butt-joint inflatable insulating shell and a movable crawler which are connected through a butt-joint flange, and an insulating supporting piece comprises a vertical supporting rod and a high-density PP insulating isolation plate. An annular shielding electrode is arranged on the outer side surface of each high-density PP insulating isolation plate; a low-inductance impulse voltage generator is arranged on each layer of high-density PP insulating isolation plate; single bilateral charging impulse voltage generator loops are isolated and insulated through high-density PP insulation isolation plates. Therefore, the device can be directly butted with a test object, a sleeve is not needed, a butting building block totally-enclosed insulation barrel type structure is adopted, the height of the device is effectively controlled, transportation and installation are facilitated, the number of building block sections can be selected according to field test requirements, the voltage grade can be changed, the inherent inductance of a loop can be effectively reduced, and steep waveforms can be output.

The present invention provides a zero-crossing resonance ZVS control circuit of a four-switch buck-boost converter, which enables some switches to work in a ZCS state to reduce the loss of circuit switch components. i >V o When the inductor current changes from negative to positive, Q4 is turned off, so that Q4 is turned off with zero current; when V i <V o When the inductor current changes from positive to negative, Q1 is turned off, so that Q1 is turned off with zero current. The present invention uses an inductor current zero-crossing control method for a four-switch buck-boost converter, breaking the limitation of the ZVS current. Under the same output current condition, the effective value of the inductor current can be reduced, and the circuit loss can be reduced; and a lower switching frequency can be obtained when the same power is output, which is beneficial to reducing the loss of the switching device; at the same time, the corresponding switching device can be turned off at the current zero-crossing point, which is beneficial to reducing the switching loss and voltage stress of the switching device, and further improving the conversion efficiency of the circuit.

The present invention discloses a controller and control method for a five-phase motor, including a power circuit, a control circuit, and an isolation circuit. The power circuit includes a five-phase inverter circuit and a neutral point three-level modulator circuit. The control circuit includes a main control circuit, an angle sensor, and a current sensor. The signal output of the main control circuit is connected to the control signal input of the five-phase inverter circuit and the control signal input of the neutral point three-level modulator circuit via the isolation circuit. The signal input of the main control circuit is connected to the angle sensor of the five-phase motor, and the current sensors of each phase of the five-phase inverter circuit are connected to the signal input of the main control circuit. The present invention reduces current and torque fluctuations in such low-inductance five-phase motors in both healthy and faulty operating conditions, and has the advantages of low cost, high control accuracy, and high fault tolerance.

A transceiver front-end (FE) includes a receiver from an I / O pad to an amplifier (e.g., a low noise amplifier (LNA)) and a transmitter from the I / O pad to another amplifier (e.g., a power amplifier (PA)). The receiver further includes a variable inductor connected at one end to the I / O pad and connectable at the opposite end to ground by a switch. The LNA is connected to a node between portions of the inductor. When receiving, the switch is opened so the inductor exhibits low inductance for LNA impedance matching. When transmitting, the switch is closed so the inductor exhibits high inductance for blocking leakage to the LNA. Additionally, or alternatively, the transmitter includes a variable capacitor connected to the I / O pad. When receiving, the capacitor is programmed to exhibit low capacitance for optimal LNA performance. When transmitting, the capacitor is programmed to exhibit high capacitance for optimal PA performance.