116 results about "Low inductance" patented technology

The application discloses a kind of low resistance low inductance high reliable electrode connecting structure for high voltage Pockels cell, belongs to Pockels cell electrode connecting technical field, solve the existing Pockels cell electrode connecting structure connection reliability problem, electric contact medium performance is not good;Including anti-drop insulating sleeve, pin, input electrode, metal hair button, shell and crystal;The top of pin is equipped with anti-drop insulating sleeve, the bottom of pin is connected with input electrode, input electrode is installed in the mounting hole of shell, the inside of shell is provided with crystal, and the outer side surface of both ends of crystal is provided with gold plating layer;Metal hair button at the bottom of input electrode is pressed on gold plating layer.In the application, pin and input electrode are inserted into position and wrapped by anti-drop insulating sleeve, input electrode is not exposed, and the personal safety hazard of high-voltage electric shock is fundamentally eliminated;Metal hair button is used instead of conductive rubber, to ensure that the contact pressure with crystal electrode is constant, and the anti-vibration and anti-impact performance is strong.

A capacitor capable of exhibiting good electrical properties under a wide variety of conditions is provided. The capacitor comprises a capacitor element consisting of a sintered porous anode body, a dielectric material covering the anode body, and a solid electrolyte containing a conductive polymer, also covering the dielectric. The capacitor also includes multiple anode conduction sections extending from the ends of the capacitor element. Furthermore, the capacitor includes a housing that defines an internal cavity in which the capacitor element is arranged and hermetically sealed.

The invention belongs to the field of manufacturing of printed circuits and assemblies thereof, and discloses a low-inductance lamination assembly method of a pulse power module, which comprises the following steps: placing a power semiconductor device and a decoupling capacitor into a cavity of a core substrate in a coplanar manner; laminating insulating layers and selectively windowing by using a closed-loop control method based on plasma spectrum monitoring; and finally, a bridging conductive layer directly bridging the top terminal of the element is formed through metal deposition. According to the invention, a lamination step is multiplexed as a key electrical connection forming process, and the dimension of a traditional three-dimensional commutation loop is reduced to a quasi-two-dimensional plane on a topological structure; therefore, current path geometric abrupt change and inductance bottleneck caused by vertical via holes are broken, and a structural basis is established for improving the electrical performance and electromagnetic compatibility of the module.

The utility model relates to a low-noise inductor, which belongs to the technical field of inductors and comprises a mounting plate, the top of the mounting plate is fixedly connected with a shielding cover, and a substrate is embedded in the top end of the mounting plate. The inductor has the advantages that the shielding cover outside the inductor body is of a structure with a plurality of shielding layers, each layer is made of conductive materials, electromagnetic interference can be effectively shielded, magnetic materials such as ferrite are embedded in the shielding cover outside the inductor body, the materials have a good electromagnetic shielding effect, and the electromagnetic shielding effect is good. The common-mode noise is reduced and the consistency and symmetry of the winding are ensured in a mode of symmetrically winding the annular inductor, and in the aspect of optimization of a packaging structure, a flip chip technology is adopted, a chip is directly welded on a substrate, and the length of a lead and parasitic inductance are reduced, so that the packaging structure can be optimized without remarkably increasing the size and the cost. The electromagnetic noise of the inductor is effectively reduced by improving the packaging material and process, and the overall performance and reliability of the inductor are improved.

The invention relates to the technical field of voltage regulation, and discloses a voltage regulation device, a manufacturing method and electronic equipment, and the device comprises an inductor which comprises a magnetic core, a first winding wire and a second winding wire; the first winding wire and the second winding wire are Z-shaped, the middle parts of the first winding wire and the second winding wire penetrate through the magnetic core, and the middle parts of the first winding wire and the second winding wire are parallel to the bottom plate or the top plate of the voltage regulating device; two ends of the first winding wire and two ends of the second winding wire are led out from the magnetic core; the two ends of the first winding wire are opposite to the two ends of the second winding wire; the first winding and the second winding are used for generating magnetic flux perpendicular to the top plate or the bottom plate, and the magnetic flux is used for adjusting voltage. The middle part of the Z-shaped first winding wire and the middle part of the Z-shaped second winding wire are parallel to the bottom plate or the top plate of the inductor, so that the first winding wire and the second winding wire generate magnetic flux in a plane vertical to the top plate or the bottom plate, the height of the winding wires of the inductor is reduced, and the height of the voltage regulating device is reduced.

The invention relates to the technical field of impulse voltage generating devices, in particular to a compact low-inductance impulse voltage generator device which comprises a butt-joint inflatable insulating shell and a movable crawler which are connected through a butt-joint flange, and an insulating supporting piece comprises a vertical supporting rod and a high-density PP insulating isolation plate. An annular shielding electrode is arranged on the outer side surface of each high-density PP insulating isolation plate; a low-inductance impulse voltage generator is arranged on each layer of high-density PP insulating isolation plate; single bilateral charging impulse voltage generator loops are isolated and insulated through high-density PP insulation isolation plates. Therefore, the device can be directly butted with a test object, a sleeve is not needed, a butting building block totally-enclosed insulation barrel type structure is adopted, the height of the device is effectively controlled, transportation and installation are facilitated, the number of building block sections can be selected according to field test requirements, the voltage grade can be changed, the inherent inductance of a loop can be effectively reduced, and steep waveforms can be output.

The invention discloses a low-inductance cable assembly and a manufacturing method thereof, the low-inductance cable assembly comprises a power supply end multi-core electric connector plug, an ignition tube end electric connector plug and ribbon cables, and the number of the ribbon cables is the same as that of the ignition tube end electric connector plug; wherein the tail end of a first plug jack of the power supply end multi-core electric connector plug is electrically connected with one end of the ribbon cable, and the tail end of a second plug pin of the ignition tube end electric connector plug is electrically connected with the other end of the ribbon cable; and cavities in the first plug shell of the power supply end multi-core electric connector plug and the second plug shell of the ignition tube end electric connector plug which are connected with the ribbon cable are encapsulated and cured by insulating pouring sealant. The low-inductance ribbon cable is adopted, loss and attenuation of high-voltage pulse current in the transmission process can be reduced to the maximum extent, it is ensured that the slapper ignition tube obtains enough energy at the key moment, and therefore reliable ignition is achieved.

The invention discloses a feed-through capacitor with ultralow inductance, which relates to the technical field of capacitors, and comprises a capacitor core, a positive bus, a negative bus, a shell and a filler, the capacitor core is formed by continuously winding the same metallized film, and comprises a plurality of groups of positive annular belt layers and reverse annular belt layers which are coaxially and alternately distributed; insulating sleeves are arranged between the adjacent forward annular belt layers and the reverse annular belt layers, axial openings are formed in the pipe walls of the insulating sleeves, a through copper pipe is arranged in the center of the capacitor core, insulating coatings are arranged on the inner wall and the outer wall of the through copper pipe, and the positive bus and the negative bus are arranged in the through copper pipe in parallel in a penetrating mode and are separated through an insulating plate. The positive bus is conducted with all the forward annular belt layers at one end of the capacitor core, the negative bus is conducted with all the reverse annular belt layers at the other end of the capacitor core, the outer side of the capacitor core is sleeved with the shell, and the filler is poured between the capacitor core and the shell. According to the invention, the inductance of the capacitor is effectively reduced, and a more reliable solution with better performance is provided.

The utility model discloses a low-cost support type high-heat-dissipation inductor, which relates to the field of inductor structures and comprises an inductor body, two metal supports symmetrically arranged on two sides of the inductor body, an insulating heat-conducting gasket arranged between the metal supports and the side face of the inductor body, and an insulating cover arranged between the metal supports and the insulating heat-conducting gasket. The insulating cover covers one side of the inductor body, and the plurality of insulating connecting assemblies are arranged between the two metal supports; according to the low-cost support type high-heat-dissipation inductor, the heat dissipation performance of the inductor can be improved, the temperature of the inductor in the working process is reduced, meanwhile, the manufacturing cost and the process difficulty are reduced, and the requirements of the industry for high heat dissipation and low cost of the inductor can be met.

The invention discloses a power module and a power module group, the power module comprises power units, and each power unit comprises an upper bridge power unit and a lower bridge power unit; a lower bridge power unit; the printed circuit board comprises at least N prefabricated layers, N is larger than or equal to 3, each prefabricated layer comprises an insulating layer and a conductive structure, the adjacent prefabricated layers are isolated through the insulating layers and sequentially connected through the conductive structures, the first prefabricated layer to the Nth prefabricated layer are sequentially arranged from top to bottom, and N is a positive integer; the first end, the second end and the third end of the upper bridge power unit are located on the ith prefabricated layer, and the first end, the second end and the third end of the lower bridge power unit are located on the jth prefabricated layer. By directly embedding the power device in the printed circuit board and utilizing high-density interconnection and advanced packaging processes, ultralow stray inductance and high power density are realized, meanwhile, the system cost is saved, and the power conversion circuit can be widely applied to power conversion systems in the fields of new energy automobiles, industrial automation, renewable energy sources, consumer electronics and the like.

The present invention provides a capacitor module that can reduce inductance while miniaturizing the capacitor module. [Solution] The capacitor module of this disclosure comprises a capacitor element having a first electrode, a second electrode, and a side surface; a first busbar electrically connected to the first electrode; and a second busbar electrically connected to the second electrode, wherein the first busbar has a first extension, a first connection, a second extension, and a first terminal; and the second busbar has a second contact, a third extension, a second connection, a fourth extension, and a second terminal, wherein the second extension and the fourth extension are arranged to overlap at least a portion when viewed from a direction perpendicular to the planes on which the second and fourth extensions extend.

The invention relates to a low-inductance intermediate circuit (1) between a power switch (2) and a passive electrical component (3). The low-inductance intermediate circuit (1) comprises a DC + bus bar (11), a DC-bus bar (12) and an insulating film (15) which is arranged between the DC + bus bar (11) and the DC-bus bar (12). The low-inductance intermediate circuit (1) is at least partially cast from a gel (4).

In one or more embodiments, a PSU comprises a bridgeless PFC circuit with a hold-up time extension. If a voltage drop is detected, a relay switches operation to a first boost converter action to store energy in a PFC choke. If voltage remains low, the PFC choke may transfer energy to a bulk capacitor, increasing the amount of time an information handling system can operate before a shut-down procedure needs to start. If power returns, selected switches are turned on in an order such that an inrush current does not damage components in the PSU.

The utility model belongs to the technical field of electromagnetism, and provides an inductance element structure and a multilayer circuit board structure, the inductance element structure comprises a magnetic core and a winding which is arranged in the magnetic core and penetrates out of the magnetic core, and the winding is provided with a terminal at an opening of the magnetic core; meanwhile, a conductor sheet is additionally arranged on the magnetic core of the inductance element structure, and the conductor sheet and the terminal are simultaneously used for forming external electric connection; when the inductance element structure is connected with a PCB (Printed Circuit Board), a novel multilayer circuit board structure can be formed, the space is saved, the packaging volume of a PCB multilayer product can be further reduced, and the energy storage filtering inductance function of the inductance element structure can be exerted while the through-flow is realized; meanwhile, due to the fact that the conductor piece is attached to the magnetic core, heat dissipation of the magnetic core can be accelerated, working loss of the inductance element structure is reduced, and overall power consumption of the multi-layer circuit board structure is reduced.

Disclosed is a cable (100) having low inductance property. The cable (100) includes a first conductor (104), a first insulation layer (102) disposed on and surrounding the first conductor (104), a second conductor (106) disposed on and surrounding the first insulation layer (102), a second insulation layer (108) disposed on and surrounding the second conductor (106), and a metal tape (110) disposed on and surrounding the second insulation layer (108). The cable (100) may further include one or more conductive wires (112) disposed on the metal tape (110) and a sheath (114) disposed on the conductive wires (112). A method (200) of manufacturing the cable (100) is also disclosed, including forming the first conductor (104), disposing the first insulation layer (102), forming the second conductor (106), disposing the second conductor (106), disposing the second insulation layer (108), and disposing the metal tape (110).

The present disclosure relates to a device that includes a plurality of electrically conductive layers, a plurality of dielectric layers, and at least two recesses positioned in at least one electrically conductive layer, each recess configured to receive an electronic element. Further, the electrically conductive layers are positioned parallel to a reference plane, the dielectric layers are positioned parallel to the reference plane, and the electrically conductive layers and the dielectric layers are positioned to form a stack that is aligned symmetrically in the direction of a reference axis that is perpendicular to the reference plane and in a substantially circular arrangement around the reference axis.

The utility model relates to the technical field of capacitors, in particular to a metallized polypropylene film capacitor, which comprises a main body, a low-inductance electrode assembly, a heat dissipation assembly and a packaging shell, the main body comprises metallized polypropylene films and metal electrode layers, and the main body is formed by alternately stacking multiple layers of metallized polypropylene films and metal electrode layers. An electrode material of the low-inductance electrode assembly adopts a copper-silver alloy, the low-inductance electrode assembly is welded on the main body, the low-inductance electrode assembly adopts a planar electrode, the heat dissipation assembly is arranged between the main body and the packaging shell, the heat dissipation assembly comprises a heat dissipation sheet and heat conduction silica gel, the heat dissipation sheet adopts a high-heat-conductivity aluminum alloy material, and the heat conduction silica gel is arranged in the heat dissipation sheet. And the heat-conducting silica gel is filled among the radiating fins, the main body and the packaging shell. According to the utility model, through the optimization design of the laminated structure of the main body and the low-inductance electrode structure, the equivalent series inductance is greatly reduced, and the performance of the capacitor in a high-frequency environment is remarkably improved.

The inductor base comprises an inductor base part, and the inductor base part comprises a ceramic seat, two Z-shaped pins fixedly connected to the surface of the bottom of the ceramic seat and a buckle assembly arranged on the surface of the bottom of the ceramic seat. Four to five transverse heat dissipation channels are transversely formed in the ceramic base, four to five longitudinal heat dissipation channels are longitudinally formed in the ceramic base, and the transverse heat dissipation channels and the longitudinal heat dissipation channels are arranged in a criss-cross mode. According to the scheme, the crisscrossed net-shaped channels are arranged on the inductor base, the heat dissipation area is increased, the inductor temperature rise is reduced in cooperation with the high thermal conductivity of ceramic materials, the Z-shaped pins are reinforced through the triangular supporting plates, the mechanical stress resistance is improved, pressing type installation is achieved through the buckle assemblies, welding or screws are not needed, the assembly time is saved, and the production efficiency is improved. And meanwhile, the buckle assembly has an anti-rotation design, so that rotation displacement after connection is avoided.

The utility model provides a low inductance capacitor and circuit system relates to capacitor technical field, low inductance capacitor includes main part, first electrode and second electrode, said first electrode and said second electrode have the same size, the central axis of first electrode and the central axis of second electrode are mutually parallel, said first electrode and said second electrode are mutually parallel, said first electrode and said second electrode are mutually parallel, said first electrode and said second electrode are mutually parallel, said first electrode and said second electrode are mutually parallel. And the first electrode and the second electrode are electrically connected with the main body. The first electrode and the second electrode which are electrically connected with the main body are arranged on the main body of the capacitor, the positive electrode and the negative electrode of the capacitor are led out respectively, the first electrode and the second electrode are identical in shape and size, and the central axis of the first electrode and the central axis of the second electrode are parallel to each other. According to the right-hand spiral rule, magnetic induction lines generated by the first electrode and the second electrode can offset each other to a great extent, so that the inductance of the capacitor is reduced.

This invention provides a semiconductor module and a method for manufacturing a semiconductor module. It reduces thermal resistance and inductance. The semiconductor module (1) includes: a laminated substrate (2) formed by a circuit pattern (22) disposed on the upper surface of an insulating plate (20) and a heat sink (21) disposed on the lower surface of the insulating plate; a semiconductor element (3) having a collector electrode (30) disposed on its upper surface and an emitter electrode (32) and a gate electrode (31) disposed on its lower surface, the emitter electrode and the gate electrode being bonded to the upper surface of the circuit pattern via bumps (B); and a block electrode (4) bonded to the collector electrode. The block electrode has: a flat plate portion (44) covering the top of the semiconductor element; and a pair of protrusions (45) protruding from both ends of the flat plate portion toward the circuit pattern and bonded to it.

The application discloses a combined inductor and a mounting method thereof. The combined inductor comprises a coil, a skeleton assembly composed of a first skeleton and a second skeleton, the coil being clamped between the first skeleton and the second skeleton, the first skeleton being provided with a glue dispensing through hole filled with heat-conducting glue in contact with the coil, and a magnetic core assembly composed of a first magnetic core and a second magnetic core provided with a magnetic column, the skeleton assembly being clamped between the first magnetic core and the second magnetic core, the first magnetic core being clamped on the first skeleton and in contact with the heat-conducting glue, and the second magnetic core being sleeved on the second skeleton, the magnetic column penetrating through the second skeleton and extending into a center hole of the coil. The application reduces the assembly difficulty of the inductor by simple structure design, effectively reduces the production cost and improves the production efficiency.

The invention relates to a low-inductance electrical conductor unit for electrically connecting a power semiconductor module to a capacitor module. The conductor unit comprises a first electrical conductor, a second electrical conductor, a first connecting element and an insulator arranged between the first electrical conductor and the second electrical conductor for insulating isolation of the first electrical conductor from the second electrical conductor. The first electrical conductor and the second electrical conductor are plate members extending along a horizontal plane. The first electrical conductor and the second electrical conductor are arranged parallel to each other in an overlapping manner. The first connection element is electrically connected to the first electrical conductor via the first contact surface and is arranged to be in contact with the power semiconductor module. In addition, the second electrical conductor is arranged overlapping the first contact surface.

The invention discloses a low-inductance silicon carbide power module with an electromagnetic symmetrical interconnection structure, which comprises a bottom surface and a top surface, the power module specifically comprises a top-layer aluminum nitride substrate, a top-layer substrate induction copper layer, a bottom-layer aluminum nitride substrate, a bottom-layer substrate induction copper layer, a top-layer DC + conductive copper layer, a bottom-layer DC + conductive copper layer, a DC-conductive copper layer, an AC conductive copper layer, an upper tube SiC MOSFET chip driving copper layer, a lower tube SiC MOSFET chip driving copper layer, a DC + power terminal, a DC-power terminal, an AC power terminal and an upper tube chip driving terminal. The device comprises an upper tube chip driving terminal, a lower tube chip driving terminal, an upper tube SiC MOSFET chip, a lower tube SiC MOSFET chip and a molybdenum block. According to the invention, the current balance degree between the power loops can be improved, the aging degree of each power loop is balanced, and the service life of the power module is prolonged. The low-inductance silicon carbide power module with the electromagnetic symmetrical interconnection structure can be widely applied to the technical field of semiconductor power module layout.

The utility model relates to the technical field of resistors, in particular to a column-type wire-wound resistor, which comprises a first disc body and a second disc body which are arranged in parallel at intervals, and a first support column is arranged between the first disc body and the second disc body; a plurality of insulated supporting plates are arranged on the opposite side portions of the first disc body and the second disc body in the circumferential direction at intervals. Each supporting plate is provided with a plurality of threading rings which are arranged at intervals in the length direction of the supporting plate. The flexible resistance wire alternately bypasses the threading rings of the supporting plates of the first disc body and the second disc body, the resistance wire is arranged in a plurality of wave shapes, and the plurality of wave shapes are distributed in the length direction of the supporting plates; and two adjacent wave crests are arranged in a staggered manner in the length direction of the supporting plate. Compared with the prior art, the heat dissipation effect is good, the two adjacent wave-shaped wave crests are arranged in the length direction of the supporting plate in a staggered mode, the mutual heating influence of the resistance wires is reduced through the inner and outer adjacent staggered mode, meanwhile, the inductance can be reduced, and even the non-inductance effect can be achieved.

The application discloses a low-inductance silicon carbide power module, which comprises a large-area current planning interconnection structure and a terminal direct-connection capacitor structure with a very short path, the mutual inductance between the large-area current planning interconnection structure and the conductive circuit of a ceramic substrate is used to greatly reduce the parasitic inductance in the silicon carbide power module, and the terminal direct-connection capacitor structure is used to shorten the path length from the terminal leading-out position in the power module to the external capacitor, thereby reducing the parasitic inductance of the external connecting circuit of the silicon carbide power module, reducing the parasitic inductance of the whole commutation loop, suppressing the switching voltage overshoot and oscillation, and reducing the working loss.

The invention relates to the technical field of electronic equipment, in particular to a low-DCR integrally-formed inductor and a preparation method thereof.The low-DCR integrally-formed inductor comprises a first magnet, a second magnet, a winding and an outer electrode; the first magnet is of a laminated structure; the first magnet is composed of Fe-based nanocrystals, and the Fe-based nanocrystals comprise the following components in percentage by weight: 85.3%-91.5% of Fe, 4.0%-6.6% of Si, 4.0%-6.6% of B and 0.5%-1.5% of Cu; the second magnet is formed by compounding Fe-based nanocrystalline powder and metal powder; and the Fe-based nanocrystalline comprises the following components in percentage by weight: 85.3 wt%-91.5 wt% of Fe, 4.0 wt%-6.6 wt% of Si, 4.0 wt%-6.6 wt% of B and 0.5 wt%-1.5 wt% of Cu. Compared with the prior art, the low-DCR integrally-formed inductor and the preparation method thereof have the advantages that the effective magnetic conductivity is increased in a manner that the nanometer coating laminations of the flaky nanocrystals and the windings are stacked in parallel, the effect of reducing the number of winding turns is achieved, the number of winding turns is greatly reduced, and the effect of reducing the DCR of the inductor is achieved; therefore, the requirement of application on the low height of the power device is met.

The invention discloses a novel low-inductance high-power module which comprises a heat dissipation substrate, an insulation substrate, an injection molding shell, an electronic component, an upper cover and at least three power terminals. A mounting surface is formed on the heat dissipation substrate, the mounting surface is detachably connected with an injection molding shell, and a mounting cavity is formed in the injection molding shell; the insulating substrate is arranged on the mounting surface, the insulating substrate is arranged in the mounting cavity, the upper surface of the insulating substrate is provided with a conductive copper layer, and the electronic component is arranged on the conductive copper layer; the two sides of the upper surface of the injection molding shell are provided with a first installation opening and a second installation opening correspondingly. An opening is formed in the upper portion of the injection molding shell, an upper cover is detachably installed at the opening, a glue injection hole is formed in the upper cover, and the installation cavity is filled with the insulation silica gel through the glue injection hole. The power terminals and the signal terminals are partially wrapped by the injection molding shell in an injection molding mode to resist thermal stress and external installation stress, and the overall firmness is improved.

The utility model discloses a laser gyro and dithering power supply thereof, dithering power supply includes BOOST power supply module, positive and negative output rectification circuit and feedback circuit, positive and negative output rectification circuit includes positive voltage output module and negative voltage output module, positive voltage output module includes resistor R1, diode D2, diode D1 and capacitor C4, and negative voltage output module includes resistor R1, diode D2, diode D1 and capacitor C4. The negative voltage output module comprises a capacitor C3, a diode D3, a resistor R8, a diode D4 and a capacitor C6. The jitter power supply of the laser gyroscope is formed by the BOOST power supply module, the positive and negative output rectification circuit and the feedback circuit, and the BOOST power supply module has higher switching frequency than a Royal circuit, so that a higher peak current can be obtained by using a lower inductance value, the volume of an inductor can be reduced, the volume occupied by the circuit is reduced, and meanwhile, the switching frequency is increased, so that the power consumption of the laser gyroscope is reduced. And the ripple voltage output of the circuit can be reduced, so that the precision of the laser gyroscope is improved.

The invention discloses a low-inductance direct current pulse capacitor, which relates to the technical field of capacitors, and specifically comprises a capacitor shell and a capacitor body sleeved in the capacitor shell, a filling space is arranged between the capacitor shell and the capacitor body, and the top and the bottom of the capacitor shell are both provided with conical blind holes and composite flow channels. The adjacent conical blind holes are communicated with the composite flow channel space, and composite plug blocks are embedded in the conical blind holes. According to the low-inductance direct-current pulse capacitor, the conical blind holes and the composite runners are formed in the top and the bottom of the capacitor shell, so that the two conical blind holes and the two composite runners are matched in pairs to form two glue injection channels, and then the two composite plug blocks, the glue injection mechanism and the jig mechanism are matched; glue injection filling can be carried out on a gap between the capacitor shell and the capacitor body from bottom to top, air can be discharged without penetrating through a glue layer, bubble residues in a top dead zone are effectively avoided, and the processing quality is improved.

The application provides a low-impedance inductor and a preparation method and application thereof. The low-impedance inductor comprises a magnetic middle column with recesses; the volume of the recessed part accounts for 1-10% of the volume of the magnetic middle column; the preparation method comprises the following steps: firstly, mixing magnetic powder and glue to obtain mixed raw materials; then, carrying out coating granulation and screening treatment in sequence, and placing the magnetic middle column with recesses in a mold to carry out first pressing treatment to obtain the magnetic middle column with recesses; after the first solidification treatment of the magnetic middle column, the conductor coil is assembled, and then the second pressing treatment and the second solidification treatment are carried out in sequence to obtain a semi-finished product; and finally, the semi-finished product is subjected to insulation protection, laser paint stripping and electroplating in sequence to obtain the low-impedance inductor. The magnetic middle column with recesses in the low-impedance inductor can effectively reduce the deformation degree of the conductor coil, and further reduce the direct current impedance of the inductor.