87 results about "Photosensitive glass" patented technology

A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device.

A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device.

An optical component having a diffractive element and/or refractive element is provided. The optical component includes a photosensitive glass and/or a photosensitive glass ceramic and a plurality of structures influencing propagation of light in at least a part of the photosensitive glass and/or a photosensitive glass ceramic.

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

This invention provides an inexpensive and rapid method for fabricating a high-anisotropic-etch ratio, shaped glass structures using a novel photosensitive glass composition. Structures of the photosensitive glass may include micro-channels, micro-optics, microposts, or arrays of hollow micro-needles. Furthermore, such shaped glass structures can be used to form a negative mold for casting the shape in other materials.

The present invention provides a method and system for manufacturing a microstructure in a photosensitive glass substrate, which include the steps of generating first femtosecond laser pulses by a femtosecond laser source and focusing the first femtosecond laser pulses on a surface or an interior of the photosensitive glass substrate by a focus lens to define a modified region; generating second femtosecond laser pulses by the femtosecond laser source, adjusting a frequency of the second femtosecond laser pulses to be higher than that of the first femtosecond laser pulses by a frequency adjustment unit and an energy adjustment unit; focusing the adjusted second femtosecond laser pulses on the modified region of the photosensitive glass substrate to crystallize a substance of the modified region; and, after crystallization, etching off the crystallized region to obtain the microstructure in the photosensitive glass substrate.

an inkjet print head wherein the surface (front surface) for ejecting ink droplets coming from an ink channel partitioned by a drive wall composed of a piezoelectric device is arranged opposite to the surface (back surface) for supplying ink coming to the ink channel. The connection electrode for driving the piezoelectric device is pulled out to the back surface, and the back surface is a photosensitive glass substrate wherein the ink feed apertures manufactured by exposure and etching process, and the drive wires electrically connected with the connection electrode are formed.

A method for forming a three-dimensional microstructure includes providing a photosensitive glass substrate; exposing the photosensitive glass substrate to energy through a continuous tone, variable transmission photomask so as to form opaque portions in the photosensitive glass substrate, each of the opaque portions having one of a variety of depths extending through the entire thickness of the photosensitive glass substrate; and removing the opaque portions so as to form three-dimensional features in the photosensitive glass substrate.

Silicate glasses for storing holographic data and for producing computer-generated holograms, including photo-darkenable-refractive (PDR) and photo-bleachable-refractive (PBR) glasses. In one embodiment, a PBR glass plate contains a photosensitive glass layer of a silver ion-exchanged holographic recording (SIHR) glass, with a base glass composition that has been ion-exchanged in an aqueous ion-exchange solution containing silver ions. The SIHR glass is uniformly darkened with darkening-light radiation, causing a refractive index change in the photosensitive glass layer upon exposure to bleaching-light radiation without any post-exposure steps. In another embodiment, an optical information recording medium includes a PDR glass plate containing SIHR glass optimized for multiplex recording and for reproducing information, which utilizes holography with darkening-light radiation as recording beams. In still another embodiment, an optical information recording medium includes a PBR glass plate containing SIHR glass optimized for multiplex recording and for reproducing information, which utilizes holography with bleaching-light radiation as recording beams.

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising form one or more micro lens on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photo sensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more a micro lens.

A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 μm thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.

The invention discloses low-dielectric loss sensitized photosensitive glass and a production method belonging to the technical field of glass production. The photosensitive glass is prepared from the following chemical components in percentage by weight: 63-72wt% of SiO2, 6-12wt% of Li2O, 1-5wt% of Na2O, 3-9wt% of K2O, 2-5wt% of Al2O3, 1-4wt% of ZnO, 0.5-0.9wt% of Sb2O3, 0.02-0.06wt% of Ce2O3, 0.09-0.16wt% of Ag2O, 2-5wt% of B2O3, 0.5-2wt% of BaO and/or 0.5-3wt% of CaO and 1-5wt% of MgO. The production method comprises the steps of material preparation, primary preparation of a mixture, ball-mill mixing, melting, molding and annealing treatment. According to the photosensitive glass, the dielectric coefficient at a room temperature or above 1MHz is 4.2-5.6 and the dielectric loss is 2*10<-3> to 4*10<-3>. The low-dielectric loss sensitized photosensitive glass has the characteristics that the strength and the photochemical stability of a glass body of the un-sensitized part are high, the dielectric coefficient and the dielectric loss during high-frequency working are low, the stability during working is high, the etching depth-to-width ratio of the sensitized glass is high and the production process is simple and convenient.

A photosensitive glass paste that can be fired at a low temperature for a short period of time and that can suppress generation of voids and diffusion of Ag in glass layers formed by firing, and a high-performance multilayer wiring chip component manufactured by using the above photosensitive glass paste are provided. As a sintering aid glass which is combined with a ceramic aggregate and a primary glass, a glass having a contact angle to the ceramic aggregate smaller than that of the primary glass to the ceramic aggregate is used, and the content of the sintering aid glass is set to 5 to 10 percent by volume of the inorganic component. As the sintering aid glass, a glass containing SiO₂, B₂O₃, CaO, Li₂O, and ZnO at a predetermined ratio is preferably used. As the primary glass, a glass containing 70 to 90 percent by weight of SiO₂, 15 to 20 percent by weight of B₂O₃, and 1 to 5 percent by weight of K₂O can be used.

A method of increasing the refractive index in a photosensitive glass is disclosed so as to induce an refractive index change of at least 10⁻⁵ within a region of the glass. The method includes the step of providing a hydrogen or deuterium loaded doped glass material wherein a dopant within the glass is photosensitive to infrared radiation in the presence of hydrogen or deuterium. The hydrogen or deuterium loaded doped glass is subsequently irradiated with femtosecond pulses of infrared light having an intensity of at least 10⁹ W/cm² and less than 5×10¹³ W/cm².