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4results about How to "Improve exit efficiency" patented technology

Screen-dominating exit method, screen-dominating exit device, electronic device, and storage medium

This application provides a method, device, electronic device, and storage medium for exiting screen-dominating mode, belonging to the field of communication technology. It involves sending a heartbeat packet to a device management platform and receiving heartbeat response information from the platform. The heartbeat response information includes server connection parameters. The system connects to a message server based on these parameters and subscribes to message topics on the message server. These message topics include a screen-dominating exit command, which is sent from the device management platform to the message topic on the message server. In response to the exit command, the system obtains the screen-dominating status. If the screen-dominating status indicates that the terminal device is in screen-dominating mode, a pop-up component is generated. Clicking the pop-up component exits the screen-dominating mode. This allows exiting the screen-dominating mode without disassembling the device, reducing the difficulty and improving the efficiency of screen-dominating exit.
Owner:SHENZHEN XINGUODU TECH

High light efficiency COB packaging structure

ActiveCN224419209Uperformance is not affectedImprove exit efficiencyAdhesiveLight particle
The utility model discloses a kind of high light efficiency COB packaging structures, including substrate, LED chip and encapsulation adhesive layer;Dam is equipped on the substrate, the LED chip is located in the dam and is electrically connected with the substrate, the encapsulation adhesive layer covers the LED chip;The encapsulation adhesive layer includes first encapsulation adhesive layer and second encapsulation adhesive layer stacked in turn, the first encapsulation adhesive layer is used to seal the LED chip and realizes preset color temperature and / or luminous color, the second encapsulation adhesive layer includes diffused light particle and the second encapsulation adhesive layer is provided with graphical structure in the side away from the substrate. High light efficiency COB packaging structure provided by the utility model can improve luminous efficiency while not affecting color temperature and / or luminous color.
Owner:FOSHAN EVERCORE OPTOELECTRONICS TECH

Gallium nitride device and preparation method thereof

PendingCN121968809ABreak the limit of total reflectionExpanded exit angle coverageDevice materialOhmic contact
The invention discloses a gallium nitride device and a preparation method thereof, and relates to the technical field of semiconductor devices. The gallium nitride device comprises a sapphire substrate, an AlN nucleating layer, an N-type AlGaN buffer layer, an intrinsic AlGaN active layer, an electron blocking layer and a P-type AlGaN layer which are sequentially stacked from bottom to top, a gradient doping edge stop layer is arranged on the edge of the P-type AlGaN layer, and meanwhile a bottom electrode in ohmic contact with the N-type AlGaN buffer layer and a top electrode in ohmic contact with the P-type AlGaN layer are formed respectively. According to the invention, by optimizing the structural design of the substrate, the nucleating layer, the buffer layer, the active layer, the electron blocking layer, the edge termination layer and the electrode, and combining with the seagull optimization algorithm to accurately regulate and control the preparation process parameters, the comprehensive improvement of the light extraction efficiency, the carrier recombination efficiency, the breakdown voltage and the long-term working stability is realized; and the photoelectric property and the reliability of the gallium nitride device are obviously enhanced.
Owner:ZHONGKE (SHENZHEN) WIRELESS SEMICON CO LTD +1

COB high light efficiency packaging structure

ActiveCN224419214UImprove exit efficiencyImprove diffusion abilityReflective layerPhysics
The utility model discloses a kind of COB high luminous efficiency packaging structures, including substrate, multiple LED chips and encapsulation adhesive layer;Dam is equipped on the substrate, multiple the LED chip is spaced and located in the dam and is electrically connected with the substrate, the encapsulation adhesive layer covers the LED chip;White reflective layer is equipped between multiple the LED chip, the bottom of the white reflective layer and adjacent the LED chip between there is preset distance, the sidewall of the white reflective layer and the surface of the substrate form preset included angle, the preset included angle is less than or equal to 90 °. The COB high luminous efficiency packaging structure provided by the utility model can improve macula problem while improving luminous efficiency.
Owner:FOSHAN EVERCORE OPTOELECTRONICS TECH