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1252 results about "Superstructure" patented technology

A superstructure is an upward extension of an existing structure above a baseline. This term is applied to various kinds of physical structures such as buildings, bridges, or ships having the degree of freedom zero (in the terms of theory of machines).

Resilient contact structures formed and then attached to a substrate

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.
Owner:FORMFACTOR INC

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.
Owner:FORMFACTOR INC

Shear wall structure building based on cross-hole prefabricated reinforced concrete template and construction method thereof

The invention relates to a shear wall structure building based on a cross-hole prefabricated reinforced concrete template and a construction method thereof, belonging to the technical field of buildings and construction thereof. In the building, a wall template, an L-shaped column template, a T-shaped column template, a rectangular column template, a cruciform column template, a coupling beam template and a superstructure template which are free of removal are mutually connected to form a polyhedral space template system; all templates are the cross-hole prefabricated reinforced concrete templates; a longitudinal through hole and a lateral through hole, which are parallel to the surface, are arranged in the templates to form hollow hole paths in all directions; reinforcing steel bars and filling concrete are alternately inserted in the hollow hole paths to form a one-layer building unit or a single-layer building with the cast-in-place concrete shear wall structure; and multiple-layer building units are lapped and combined to form the multiple-layer building with the cast-in-place concrete shear wall structure. The shear wall structure building disclosed by the invention has the advantages of simpleness of processing, low production equipment investment, reduced construction working procedures, quickened construction speed, labor saving and the like.
Owner:ZHONGQINGDA TECH HLDG CO LTD

Amphibious mechanical crab step control device and control method

The invention provides a hierarchical control device for an amphibian machinery crab and a control method thereof. The device comprises a superstructure-level control part composed of a B3C44B0-cored ARM system, a coordination-level control part composed of an AVR single chip computer ATmega128L, eight walking-leg drive modules and an execution-level control part which is composed of a multi-sensor signal collecting module; wherein control signals are input to the superstructure-level control part; the coordination-level control part is connected between the superstructure-level control part and the execution-level control part; and the execution-level control part communicates with joint drive units through bus communication protocols. The invention divides the system into superstructure level, monitoring coordination level and execution level based on the design principle of hierarchical distribution, each dispersed controller not only can work independently but also can communicate and exchange information with a higher level controller or a peer level controller through communication circuits. The hierarchical structure has the advantages of a centralized structure and a dispersed structure, thereby overall and partial control performances are high, and the operation is reliable.
Owner:HARBIN ENG UNIV
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