2309 results about "Functional testing" patented technology

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

When, in the course of an integrated circuit's functional test an assertion fires at clock k, the operational clock is stopped, the sequence is reapplied to capture inputs to the assertion circuit that fired, signals within the assertion circuit are computed, and the error is backtraced. Once one or more inputs of the assertion circuit are identified as potentially the source of the error, the process of backtracing is performed for each such input. When the input that is potentially the source of the error emanates from a memory circuit, the fanin cone of the memory circuit is identified and the process of backtracing through the last-identified fanin cone is undertaken for clock k−1. This is repeated iteratively until either a module of the integrated circuit is found to be the source of the error, or the error is extended to inputs of the SoC.

A method and system are provided that minimize wafer or package level test time without adversely impacting yields in downstream manufacturing processes or degrading outgoing quality levels. The method provides optimization by determining, a priority, the most effective set of tests for a given lot or wafer. The invention implements a method using a processor-based system involving the integration of multiple sources of data that include: historical and realtime, product specific and lot specific, from wafer fabrication data (i.e., process measurements, defect inspections, and parametric testing), product qualification test results, physical failure analysis results and manufacturing functional test results. These various forms of data are used to determine an optimal set of tests to run using a test application sequence, on a given product to optimize test time with minimum risk to yield or product quality.

A three-dimensional application program framework structure; a method for implementing an application program based on the same; and an automatic testing system based on a three-dimensional application software framework and a method therefor. The three-dimensional application program framework structure provides a framework comprising functions and management of the environment of the system and events to be implemented by the user (developer), and the developer can easily expand the graphic user interface (GUI) and an actual modeling function as required, and user model. In addition, by using an automatic test system based on the framework, it is possible to record the function-execution history of the user and to automatically generate a test case, and to thereby test the functioning of the application software through the use of the test case regardless of changes in the source code and the GUI.