2 results about "Microelectronic circuits" patented technology

The application provides a manufacturing method of glass direct copper clad circuit, relates to the technical field of microelectronic circuit manufacturing, and comprises the following steps: S01, copper foil surface planarization: the copper foil is adhered to a UV photosensitive adhesive film, and the surface of the adhered copper foil is ground; after the surface of the copper foil is ground to reach a target roughness, the copper foil is cleaned and dried; S02, laminated static pressure: a glass substrate, the UV photosensitive adhesive film with the adhered copper foil and a carrier plate are sequentially laminated and fixed, vacuum is drawn and sealed, static pressure is applied to the formed sealed body, and a structure to be welded is obtained; and S03, laser selective welding: an ultrashort pulse laser and a short pulse are combined, and multiple compound scans are performed by using an energy gradient, so that the problem that an interface gap cannot be effectively reduced and the interface is easy to be ablated when a laser is used for welding to manufacture a glass copper clad circuit is solved, and the interface fusion capacity between the copper foil and the glass is improved.

This application discloses a movable package, a testing apparatus, and a testing method. The movable package includes: a movable package body comprising a first component and a second component for holding a substrate therebetween, the substrate carrying microelectronic circuitry and having a plurality of substrate terminals connected to the microelectronic circuitry; a plurality of movable package contacts on the second component, the movable package contacts mating with the substrate terminals to contact the substrate terminals; a fixing system; and a first electrical interface on the movable package body and connected to the movable package contacts, for connecting to a second electrical interface on the frame when the movable package body is removably held by a frame.