205 results about "Microelectronic circuits" patented technology

The present invention relates generally to sub-microelectronic circuitry, and more particularly to nanometer-scale articles, including nanoscale wires which can be selectively doped at various locations and at various levels. In some cases, the articles may be single crystals. The nanoscale wires can be doped, for example, differentially along their length, or radially, and either in terms of identity of dopant, concentration of dopant, or both. This may be used to provide both n-type and p-type conductivity in a single item, or in different items in close proximity to each other, such as in a crossbar array. The fabrication and growth of such articles is described, and the arrangement of such articles to fabricate electronic, optoelectronic, or spintronic devices and components. For example, semiconductor materials can be doped to form n-type and p-type semiconductor regions for making a variety of devices such as field effect transistors, bipolar transistors, complementary inverters, tunnel diodes, light emitting diodes, sensors, and the like.

Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

A process for controlling focus parameters in a lithographic process used in manufacture of microelectronic circuits. The process comprises initially providing a lithographic mask having a target mask portion containing a measurable dimension sensitive to defocus, projecting an energy beam through the target mask portion onto a first location of a substrate at a first focus setting, and lithographically forming a first target on the substrate corresponding to the first focus setting, the first target containing a measurable dimension sensitive to defocus. The process then includes projecting an energy beam through the target mask portion onto a second location of the substrate at a second focus setting, lithographically forming a second target on the substrate corresponding to the second focus setting, the second target containing a measurable dimension sensitive to defocus, and measuring the defocus sensitive dimension for each of the first and second targets on the substrate. The defocus sensitive dimension of the first and second targets are then compared and there is determined a desired focus setting of the energy beam based on the comparison of the dimensions of the first and second target. The process may be used to form focus setting targets on a semiconductor wafer for use in manufacture of microelectronic circuits.

The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

A method and apparatus for cleaning, drying, coating, baking etching and deposition of surfaces on glass substrate as it transitions thru and between small gaps between hydro-static porous media bearings. Due to the non-contact nature of the device extremely high pressures can be induced upon the work piece through various fluids without damage to the substrate, allowing the system to utilize the viscous nature of fluids to accomplish the desired cleaning, drying, coating, etching or baking. The process also allows for simultaneous and immediately sequential ordering of processes.