413 results about "Surface-mount technology" patented technology

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention relates to the technical field of electronic manufacturing, in particular to a PCB SMT mounting method and system based on optical recognition, and the method comprises the steps: carrying out the datum point collection of a pre-confirmed circuit board, obtaining an actual datum point image, carrying out the deviation calculation through employing a theoretical datum point image and the actual datum point image, obtaining an offset, obtaining a plurality of qualified mounting elements, and carrying out the recognition of the qualified mounting elements. The method comprises the following steps: carrying out offset analysis on qualified surface-mounted components to obtain a component center coordinate offset value, carrying out movement compensation on surface-mounted coordinates by utilizing the offset and the component center coordinate offset value to obtain target surface-mounted coordinates, and carrying out surface-mounted on a plurality of qualified surface-mounted components corresponding to a plurality of target surface-mounted coordinates based on the plurality of target surface-mounted coordinates. And carrying out continuous tin defect detection on the surface-mounted circuit board, and taking the surface-mounted circuit board of which the defect score is greater than a defect score threshold as a finished product circuit board. According to the invention, the problems of positioning deviation and tin connection welding quality defects during circuit board mounting can be solved.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The invention discloses a bus type feeder communication method of an SMT (Surface Mount Technology) high-speed chip mounter, which comprises the following steps of: performing intelligent hot plug detection: when any feeder is inserted into any standard slot, immediately sending a hot plug signal to a corresponding feeder communication board by the feeder; as long as the feeder communication board receives a hot plug signal, the automatic unibus identification and automatic addressing step is automatically executed immediately, and in addition, when the feeder communication board detects that a feeder is pulled out, the bit mask step and the online slot ID listing step are automatically executed immediately; according to the invention, many technical problems of the current SMT high-speed chip mounter in the aspect of hot plugging are effectively solved, intelligent automatic detection, automatic identification and dynamic binding of the slot ID are realized, and the communication efficiency is high, efficient and reliable.

The invention discloses an SMT device with high adaptability and a mounting method thereof, the SMT device comprises a mounting table, an adjusting mechanism is mounted on the mounting table, the adjusting mechanism comprises a bidirectional threaded rod, a movable frame, a fixed rod and a limiting plate, the bidirectional threaded rod is connected to the mounting table through a bearing, the bidirectional threaded rod is connected with the movable frame through threads, and the limiting plate is connected with the movable frame through a bearing. The movable frame is in sliding connection with the fixed rod, and the fixed rod is fixed on the mounting table. According to the SMT device with the high adaptation degree and the SMT method thereof, the distance between the front movable frame and the rear movable frame can be adjusted under the action of a bidirectional threaded rod, so that the distance between the front conveying belt and the rear conveying belt can be adjusted, PCBs with different widths can be conveyed and machined, and the mounting efficiency is improved by matching with the sliding action between a connecting shaft and a clamping strip and a mounting shaft. Normal operation of adjustment can be guaranteed, the normal transmission effect can be achieved through the clamping effect between the clamping strips and the mounting shafts, and it is guaranteed that the double-shaft motor can drive the rolling wheels and the conveying belt to operate normally.

The invention discloses anti-sputtering SMT (surface mount technology) welding equipment, which belongs to the technical field of electric element assembling and welding and comprises a sleeve frame, a movable electric cylinder, a connecting column and a multi-point spaced anti-sputtering welding mechanism. The multi-point-position interval splash-proof welding mechanism comprises a gear motor, an L-shaped rotating shaft, a rotating ring, a fulcrum shaft, a plurality of pulling strips, a plurality of pulling shafts, a sleeve rod, a linkage shaft, a concave block, a pressing plate, a plurality of interval splash-proof strips, a protective groove frame and a push-up electric cylinder, and further comprises a multi-corner interval splash-proof welding mechanism and a top covering splash-proof welding assembly. The multi-point-position interval splash-proof welding mechanism has the advantages that each pin has an independent limiting welding space, multi-point-position interval splash-proof welding of each pin can be achieved, the assembling and welding quality of a circuit board can be guaranteed, and the welding qualification rate is greatly increased; therefore, the problems that the assembling and welding quality of the circuit board is difficult to guarantee and the welding qualification rate is greatly reduced are solved.

The invention relates to the technical field of solder paste connecting surface detection, in particular to a solder paste connecting surface optical detection device applied to SMT surface mounting processing, which comprises a support plate and a conveying table used for conveying a PCB, the front side of the support plate is provided with a recess compensation detection mechanism and a position adjusting shooting mechanism, the recess compensation detection mechanism comprises a rectangular plate, and the rectangular plate is provided with a position adjusting shooting mechanism. A plurality of rectangular boxes with the bottoms open are fixedly connected to the right side of the rectangular plate, rectangular bases are slidably connected to the inner sides of the rectangular boxes, and circular blocks are fixedly connected to the bottoms of the rectangular bases. The device can effectively detect the thickness of the solder paste, can compensate and eliminate a recess formed at a probe entering position, improves the accuracy of detection through the probe, can sequence the infiltrated probes, avoids shielding and other conditions during observation, enables the plurality of infiltrated probes to be located at effective observation positions of a camera, and improves the detection accuracy. And the accuracy of solder paste detection is further improved.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The invention relates to an FPCA (Flexible Principal Component Analysis) product dispensing method and an FPCA product. The method comprises the following steps: assembling a flexible circuit board and an assembly element by adopting a surface mounting technology to obtain an FPCA product; carrying out preheating treatment on the FPCA product, and then carrying out dispensing treatment on the FPCA product; and performing high-temperature curing treatment on the dispensed FPCA product. The technical problems that in the prior art, high-temperature curing is directly carried out after dispensing filling is carried out between the switch key and the flexible plate, the phenomenon of glue splashing can occur, the flexible plate can be polluted, and the product quality is affected can be solved.

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to a quick release device for an SMT red glue printing screen. Comprising a frame, a supporting plate and a printing screen plate, an inserting groove is formed in the frame, the supporting plate is installed on the frame through the inserting groove, and the printing screen plate is detachably installed on the supporting plate; a push-out assembly is arranged in the frame, and the supporting plate is pushed out of the inserting groove through the push-out assembly so that the printing screen can be replaced conveniently. The device has the effect of improving the mounting or dismounting and replacing efficiency of the printing screen plate, and has the characteristics of simple structure and convenience in operation.

The invention discloses an adhesive dispensing device for SMT machining, and relates to the technical field of SMT machining, the adhesive dispensing device comprises a shell and an adhesive injection assembly, a moving assembly is arranged on the upper portion of the shell, a bottom plate is arranged below the moving assembly, and the adhesive injection assembly is arranged on one side of the bottom plate; the glue injection assembly comprises limiting rods, limiting cylinders, a base plate, a base, a mounting groove, a rotating groove, a transmission wheel, a magnetic ring, a driving wheel, a stirring motor, a clamping cavity, a clamping spring and a clamping block, one side of the bottom plate is symmetrically connected with the limiting rods, the limiting rods are sleeved with the limiting cylinders, one sides of the limiting cylinders are connected with the base plate, and the other sides of the limiting cylinders are connected with the base. A mounting groove is formed in the middle of the base. When the glue injection device is used, glue liquid can be continuously stirred, blockage caused by standing condensation of the glue liquid is avoided, during glue injection, the glue liquid can be pumped back, bubbles in the glue liquid can be removed, glue liquid leakage is avoided, and the glue barrel can be conveniently replaced after the glue liquid is dripped off.

The invention discloses a PCB (Printed Circuit Board) chip mounting device matched with an SMT (Surface Mount Technology) chip mounter for use, which relates to the field of PCB chip mounting processing and comprises a bottom plate mounted on the SMT chip mounter; the bearing box is installed on the bottom plate, the top end of the bearing box is arranged in an opening shape, and a concave table used for supporting the PCB is arranged on the side wall of the top end of the bearing box; the ejector pins are arranged in the bearing box and used for conducting auxiliary supporting on the PCB, and moving driving pieces are arranged at the bottoms of the ejector pins; according to the PCB chip mounting device matched with the SMT chip mounter for use, the bearing box and the detachable ejector pin are arranged, so that PCBs of different versions and different models can be effectively supported, various jigs do not need to be used, the manufacturing cost of an enterprise is reduced, turnover and double-sided chip mounting of the PCBs can be realized on the same station through the integrated turnover mechanism, and the production efficiency is improved. The problem that an additional turn-over step is needed in a traditional process is avoided, and the production process is greatly simplified.

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to a narrow terminal for preventing scaling powder from climbing, which comprises a terminal main body, a welding part arranged at the bottom of the terminal main body, and a contact surface part arranged on the terminal main body and positioned above the welding part, and a blocking step is convexly arranged between the welding part and the contact surface part; according to the utility model, the climbing path of the soldering flux can be prolonged, the soldering flux can be ensured not to climb upwards to the contact surface part in the manufacturing process, the condition of poor products caused by the fact that the soldering flux climbs upwards to the contact surface part can be avoided, and the yield can be greatly improved.

The disclosed front end architectures are configured to conglomerate duplexer transmission (TX) contours into a specific or targeted region. This enables the power amplifier (PA) to match a larger number of frequency bands without the help of additional matching networks. The disclosed architectures are advantageous because they reduce the number of components (e.g., surface mount technology components (SMTs)) required for radio-frequency (RF) modules, such as front end modules, power amplifier modules, and the like. The disclosed architectures are also advantageous because they improve performance of the modules across a wider range of frequency bands.

The invention discloses a surface mounting technology (SMT) material feeding mistake proofing method, belongs to the field of electronic manufacturing SMT material feeding management and control, and solves the problems of material mismatching, inaccurate information, nonstandard operation and the like in the SMT material feeding process. According to the method, an SMT material feeding database is constructed, and a material neat set information database and a material feeding information database are covered; creating a feeding operation specification database, and defining an operation specification data set; a voice control instruction database is established, and a feeding operation checking and executing instruction set is arranged. Through cooperation of multiple databases, materials and operation processes are accurately controlled. The invention further provides a material feeding system based on the SMT material feeding mistake proofing method. The automatic feeding device is used for the SMT production line, accurately manages material feeding, reduces the risk of wrong materials, improves the production efficiency, guarantees the manufacturing quality of electronic products, and reduces the production cost.

The utility model belongs to the technical field of SMT (Surface Mount Technology) plate transmission, and discloses SMT turnover transmission equipment, which comprises a rack used for bearing or installing various parts of the turnover transmission equipment; the control mechanism comprises an operation panel and a control box, and the operation panel and the control box are both installed on the rack; the conveying mechanism is used for conveying the PCBs in the horizontal plane and is controlled by the control mechanism; the turnover mechanism is used for turning over the PCB in a vertical plane, is controlled by the control mechanism and is matched with the conveying mechanism so as to complete the PCB turning and conveying process; according to the utility model, through the arrangement of the control mechanism, the conveying mechanism, the turnover mechanism and other parts, the purpose of automatically turning over the front and back surfaces of the PCB on the production line is realized.

The invention relates to the field of electronic engineering, and provides an intelligent position error correction method and system based on automatic SMT patching, and the method comprises the steps: firstly obtaining a to-be-corrected circuit board welding spot image and position data, carrying out the image enhancement and description marking, associating the welding spot description data with the preset SMT patching equipment historical operation data, and carrying out the image enhancement and description marking; potential abnormal data are inquired, deviation degree values of the potential abnormal data to real-time operation parameters are calculated, equipment fault types are analyzed according to the deviation degree values, abnormal parts and specific fault points are positioned, then an error correction planning target is formulated, error correction measures are analyzed, error correction standards are inquired, an error correction operation instruction is generated and sent to equipment to execute error correction operation, and an error correction circuit board is obtained; and finally, obtaining an error correction welding spot image for position verification, and generating a position error correction report based on verification data. According to the invention, the accuracy of the SMT position can be improved.

A surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material is presented herein. A surface mount technology (SMT) optoelectronic device includes a substrate, a housing, at least one optoelectronic chip, and an encapsulant material. The substrate includes electrical terminals that facilitate attachment and electrical coupling of the SMT optoelectronic device to a printed circuit board. The housing includes an opaque material and a cavity, in which the substrate is positioned at a bottom portion of the cavity, and a top portion of the housing includes a group of slot openings. The at least one optoelectronic chip is electrically connected to the electrical terminals, and is mounted, within the cavity, to the substrate. The encapsulant material is translucent or transparent, and has been included in the cavity and the slot openings.

The invention discloses a field calibration method and system for SMT 3D AOI equipment, and relates to the surface mounting technology, and the method comprises the steps: feeding a calibration board into the SMT 3D AOI equipment according to the same board feeding mode as a common PCB, and carrying out the initialization; multiple groups of horizontal and vertical grating images are acquired; performing phase calculation on the grating image acquired by the camera by using a phase shift method to obtain a plurality of groups of horizontal and vertical phase diagrams; performing image processing on the calibration plate image acquired by the camera, calculating circle center coordinates of all the circular patterns, and calculating corresponding point coordinates of the circle center coordinates on the imaging plane of each projector; calculating coordinate values of all circle centers on the calibration plate in a world coordinate system according to the adopted Z-axis height and the distance between the circular patterns of the calibration plate; repeatedly calculating world coordinates; and determining optimized system parameters according to the projection process of conversion from the coordinate values of the world coordinate system to the camera pixel coordinate system. According to the invention, the internal parameters and the external parameters of the equipment can be quickly optimized, and the precision of the imaging system is recovered to the initial state.

The present disclosure provides apparatuses and methods for operating a flash memory for programming operating system (OS) data before an surface mount technology (SMT) process. In some embodiments, the method includes erasing a plurality of memory cells in a memory block, reducing a lateral charge loss of the plurality of memory cells due to high temperature degradation during the SMT process by applying a pre-program voltage to word lines coupled to the memory block, and performing multi-bit programming of the OS data in the plurality of memory cells, prior to performing the SMT process. The applying of the pre-program voltage causes threshold voltages of the plurality of memory cells to increase.

The utility model relates to the technical field of automation equipment, in particular to SMT (Surface Mount Technology) first workpiece automatic detection equipment, which comprises an equipment body, and the equipment body comprises a rack, and a probe detection mechanism, a clamping mechanism, a first driving mechanism, a second driving mechanism and a detector which are respectively arranged above the rack; the probe detection mechanism is arranged above the clamping mechanism; the clamping mechanism is connected above the first driving mechanism, and the clamping mechanism is used for fixing a circuit board; the first driving mechanism is used for driving the clamping mechanism to move; the second driving mechanism is used for driving the probe detection mechanism to move; and the detector is connected to the probe detection mechanism and is used for detecting the resistance value, the capacitance value and the inductance value of the circuit board through the probe detection mechanism. The utility model provides the SMT first workpiece automatic detection equipment which replaces manual detection and improves the detection precision and efficiency.

The invention relates to an SMT material belt material receiving device and method. The SMT material belt material receiving device comprises a rack, a material receiving runner assembly for conveying a material belt, a film pasting assembly for pasting a material film to the material belt, a film folding assembly for bending the edge of the material film and pasting the edge of the material film to the side wall of the material belt, and a camera assembly for detecting and feeding back position information of the material belt. The material receiving runner assembly is fixedly arranged at the upper end of the rack assembly; the camera assembly is arranged above the material receiving runner assembly; a cutting assembly for cutting the material belt is arranged on the material receiving runner assembly; the two cutting assemblies are sequentially arranged on the same side of the material receiving runner assembly from left to right. A material receiving area is arranged between the two cutting assemblies, the film pasting assembly is arranged on one side of the material receiving area, and the film folding assembly is arranged between the film pasting assembly and the material receiving area. According to the SMT material receiving device provided by the invention, automation of the steps of cutting, film pasting and film folding in the splicing process of an old material belt and a new material belt can be realized; the labor cost is reduced, and the production efficiency is effectively improved.

The invention discloses a multi-level double-bin feeding device for SMT (surface mount technology) material strip coils. The multi-level double-bin feeding device comprises a base, a plurality of material rails and bins slidably mounted on the material rails. On one hand, on the basis of the upper bin body and the lower bin body which are arranged in a complementary and staggered mode, feeding of two SMT material strip coils at the same position is met, the upper bin body can form tension assistance (floating or constant tension) for unwinding of the SMT material strip coils on the lower portion, and strip feeding interference among multiple stations is avoided; meanwhile, the side-by-side layout of complementary interference of a plurality of SMT material strip coils can be met in a limited space, and the continuity of automatic feeding is improved; and on the other hand, on the basis of movement avoidance formed by overturning of the upper bin bodies, a plurality of material levels are coordinated, so that the vertical distance between two SMT material strip coils placed in each bin is shortened to optimize the structure of the bin, and displacement of each bin is also facilitated to supplement the SMT material strip coils.

The utility model discloses a positioning jig for fixing a longer FPC (Flexible Printed Circuit) in SMT (Surface Mount Technology), which comprises a jig body, a plurality of convex hulls are arranged at the upper end part of the jig body, and a positioning pin is arranged on each convex hull. According to the utility model, through the arrangement of the convex hulls and the positioning pins, each bonding pad on the FPC can be fixed on the convex hulls, thereby counteracting the position change of the bonding pads caused by the expansion and contraction of the FPC in production, ensuring that the positions of the bonding pads on the same FPC produced in the same batch or different batches are kept fixed relative to the positioning jig, and improving the production efficiency. Therefore, it is ensured that the same screen or the screen of the same structure can be always suitable for production of the FPC, stable and consistent SMT quality can be kept, design and production of the screen and first-batch production of the FPC can be carried out at the same time, production timeliness is improved, waiting time of subsequent procedures is avoided or shortened, and production efficiency is improved.

The utility model discloses a suction nozzle for automatic lossless surface mounting of light-emitting diode materials with lenses for SMT (Surface Mount Technology), which is characterized in that a first clamping groove and a second clamping groove are respectively arranged on the upper surface of a connecting disc from left to right, a reflector is arranged on the lower surface of the connecting disc, a suction nozzle head is arranged on the lower surface of the reflector, and a lens is arranged on the suction nozzle head. The upper end of the suction nozzle head is further integrally connected with a connector, a second cavity and an air suction port are formed in the suction nozzle head from top to bottom, a first cavity communicated with the second cavity is formed in the mounting rod, and a sealing protection pad is further arranged at the lower end of the suction nozzle head. The utility model relates to the technical field of SMT surface mounting. According to the suction nozzle for automatic lossless surface mounting of the light emitting diode material with the lens for SMT, the suction nozzle head can effectively avoid important and sensitive working areas on the upper surface of the diode material, so that protection is achieved, and the purpose of efficient sealing and lossless adsorption of the light emitting diode can be achieved through the sealing protection pad.

The present invention discloses a support pin arrangement system and arrangement method, which are applied to the field of surface mounting technology, wherein the support pin arrangement system includes: a simulation planning system for determining the target support point of the support pin on the base plate; a positioning and identification component for obtaining the position of the base plate and the support pin; a picking component for taking the support pin and installing it on the target support point to obtain a finished support pin; and a control system for controlling the movement of the picking component according to the position of the target support point and the position of the base plate and the support pin. The system disclosed in the present invention can improve the rationality of the arrangement position of the support pin, reduce the interference of human factors, and improve efficiency; moreover, it operates independently of the equipment in the SMT production line, does not occupy the equipment in the SMT production line, reduces the impact on the SMT production line, improves the line change efficiency, and ensures the working efficiency of the SMT production line.

A method of manufacturing an electronic assembly (100, 400) includes: forming a support member (130, 430) by applying a first adhesive layer (133, 433) to an inner surface of a support frame (131, 431) and applying a second adhesive layer (134, 434) to a bottom surface of the support frame (131, 431) (S501); attaching the support member (130, 430) to a component (110, 410) of the ball grid array comprising solder balls (111, 411) by a first adhesive layer (133, 433) (S502) such that an inner surface of the support frame (131, 431) covers a portion of a first side surface of the component (110, 410) and a portion of a bottom surface of the component (110, 410); mounting the support member (130, 430) to a substrate (120, 420) comprising an array of contact pads (121, 421) through a second adhesive layer (134, 434), the pattern of the array of contact pads (121, 421) matching the ball grid array (S503); and curing the first adhesive layer (133, 433) and the second adhesive layer (134, 434), and connecting the solder ball (111, 411) to the contact pad (121, 421) by reflow soldering at a temperature higher than the melting point of the solder ball (111, 411) (S504).

The invention relates to the technical field of flip chips, and provides a semiconductor level flip chip surface mounting technology production process, which comprises the following steps: obtaining a circuit board and a flip chip; first solder paste is printed on the circuit board, and the flip chip is pasted to the first solder paste of the circuit board; welding the flip chip to the circuit board through a reflow soldering process; filling the bottom of the flip chip; according to the semiconductor-level flip chip surface mounting technology production process provided by the embodiment of the invention, the flip chip is welded to the circuit board, so that the flip chip has higher connection density and better electrical performance, and the bottom of the flip chip is filled, so that the filler can enhance the mechanical bonding force between the flip chip and the circuit board, thereby improving the reliability of the flip chip. The probability that the flip chip falls off from the circuit board or the welding point is loosened due to external force or temperature change can be effectively reduced.

The utility model provides an LED device based on mini LED lamp drive integrated design, which is characterized in that a drive chip and LED chips are arranged on the front surface of a substrate, extraction electrodes are arranged on the back surface of the substrate, and the LED chips comprise mini LED chips; the leading-out electrodes comprise a red light power supply electrode, a blue-green light power supply electrode, a grounding electrode and three communication electrodes, three positive electrodes of the mini LED chip are respectively connected to the driving chip and are respectively and correspondingly connected to the red light power supply electrode and the blue-green light power supply electrode through the driving chip and the conducting holes so as to respectively drive the red light power supply electrode and the blue-green light power supply electrode, and the driving chip is provided with three communication ports. According to the LED device based on the mini LED lamp drive integrated design, the drive chip and the LED chip are both arranged on the front face of the substrate, only one-time surface mounting technology needs to be executed to the production of a backlight plate, and the production cost of downstream manufacturers can be effectively reduced; the red lamp is driven separately, communication channels are multiple, the controllability of the mini LED chip can be improved, and convenience is provided for power consumption regulation and control and light emitting effect regulation and control.

This application relates to an SMT (Surface Mount Technology) material delivery scheduling method and system. It includes: executing a material delivery task; when reading the identification code of a material tray fails, identifying the failure type as optical overexposure, and reporting the failure information to a central scheduling system; the central scheduling system updates the execution history information of the material delivery task based on the failure information; when the central scheduling system needs to allocate an automated guided vehicle (AGV) to the material delivery task, it queries the execution history information of the material delivery task; if the query results indicate that the material delivery task has failed, it identifies the type of AGV that caused the failure in the execution history information, excludes the AGV type that caused the failure from the available AGVs, and selects AGVs with different physical configurations for allocation. This solves the problem of code reading failure caused by optical overexposure of high-gloss material trays in the SMT production environment.