1017 results about "Surface-mount technology" patented technology

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.

A low cost technique for packaging microelectronic circuit chips fixes a die within an opening in a package core. At least one metallic build up layer is then formed on the die/core assembly and a grid array interposer unit is laminated to the build up layer. The grid array interposer unit can then be mounted within an external circuit using any of a plurality of mounting technologies (e.g., ball grid array (BGA), land grid array (LGA), pin grid array (PGA), surface mount technology (SMT), and/or others). In one embodiment, a single build up layer is formed on the die/core assembly before lamination of the interposer.

The invention relates to the manufacturing technology of printed wiring board, in particular to a flexible printed circuit (FPC) surface mount technology (SMT) as well as a magnetic tool and a steel mesh which are used for the FPCSMT. The magnetic tool comprises a buckle cover board and a magnetic carrying tray, wherein the magnetic carrying tray is a magnetic baseplate, the buckle cover board is a metal sheet which can be attracted by the magnetic baseplate, and the buckle cover board is provided with a slotted hole used for the solder paste printing and the surface mounting of a FPC. The invention is characterized in that the buckle cover board is a steel sheet which can be attracted by the magnetic baseplate, the step layer which is the same as the buckle cover board in shape is etched on the magnetic carrying tray, the depth of the step layer is the same as the thickness of the steel sheet; before the circuit board printing, the magnetic carrying tray is fixed on a positioning base, and then the FPC and the buckle cover board are arranged on the magnetic carrying tray; after the accurate positioning, the FPC and the magnetic tool are taken down the positioning base to conduct the solder paste printing process, the surface mounting process and the reflow soldering process.

A flat pack blower utilizes surface mounting techniques for mounting the blower electronics on a thin laminated circuit board to reduce the blower profile. To that end, the blower includes a stator, and a rotor rotatably coupled to the stator. The stator includes a coil, a pole coupled with the coil, and a laminated circuit board having blower control circuitry and pads for electrically connecting the blower control circuitry to the coil. Use of surface mounting techniques on the laminated circuit board thus eliminates the discrete electronic components and the wires connecting such components.

This invention provides an evaluation board for evaluating one or more aspects of a surface mount technology system. In one aspect, the evaluation board has a substrate with at least one surface. A plurality of board pad patterns, each including a plurality of board pads, is formed on the surface. The different board pad patterns may have different shaped, sized and spaced board pads, allowing the characteristics of a surface mount technology to be tested on some or all of the board pad patterns at the same time and under uniform conditions. In another aspect, the surface may have a plurality of area-filled board pads similarly allowing a surface mount technology to be tested on the various area-filled board pads.

A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.

A digital core embodied within a semiconductor die is situated within any of a variety of integrated circuit packaging technologies including but not limited to Ball Grid Array or Quad Flat Pack surface mount technology. Said semiconductor die is of the variety that requires plural separate power supply voltage domains such as a digital core supply of differing voltage than the input/output pad ring supply voltage. Within the integrated circuit package including said semiconductor die also exists a high efficiency DC-to-DC voltage converter of type commonly known as a chopper or a switch mode power supply. In the preferred embodiment this switch mode power supply would be of the highest efficiency, a synchronous step-down regulator, thus to enable powering the entire integrated circuit from one supply voltage. The components contained within the integrated circuit package along with the semiconductor die include the majority if not the totality of the components comprising the switch mode power supply, which could include the power switching transistors; an inductor core and windings; the output voltage fixing circuitry; the output capacitor; and the substrate for mounting said components when integrated within a packaging technology that does not already include a substrate such as within the periphery of a lead frame for leaded devices.

The invention provides a resin composition having a laser direct-structuring function and its preparation method and use. The resin composition comprises 15-60wt% of a resin matrix, 30-70wt% of a heat-conduction filler, 5-12wt% of a laser-sensitive additive and 0-15wt% of other additives. The laser-sensitive additive has a general chemical formula of XY2O4, belongs to an isometric system and has axial length a=b=c and axial angle alpha=beta=gamma=90 degrees, wherein X and Y represent metal elements belonging to an IIIA group, an IB group, an IIB group, a VIB group, a VIIB group and a VIII group of the periodic table of elements. The resin composition has high temperature resistance and good thermal conductivity, realizes optional sedimentation of metals such as Cu, Ni and Au in a laser-scanned area and can be used for surface mounting technology (SMT) products.

The present invention provides a high definition multimedia interface (HDMI) connector with various types through combinations of the outer metallic shells and the inner terminal modules of the HDMI connector. The outer metallic shell may exhibit various types including with or without the presence of flange on the front edge of said outer metallic shell and with or without the application of the surface mount technology (SMT) to the solder pins. Therefore, the HDMI of the present invention is applicable to provide different types of connector to fulfill market requirements through the combinations of different types of module.

An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

This invention provides a surface mounting type planar magnetic device comprised of upper ferrite magnetic film, lower ferrite magnetic film and a planar coil interposed therebetween. For applying surface mount technology, an opening is formed in the upper ferrite magnetic film above a coil terminal portion and then, an external electrode conductive with the coil terminal portion through the opening is formed on the upper ferrite magnetic film. Further, this surface mounting type planar magnetic device is of a thin structure and can be mounted on the surface of a printed board. Its power loss is small, its inductance is large, its frequency characteristic is excellent, the disparity of the characteristic is small and its reliability is excellent.

The invention relates to a method for improving the graphic accuracy of a substractive process printed circuit board (PCB) by adopting a dynamic etching compensation method. The method comprises the following steps of: step 1: studying the influence of thickness differences of base copper over etching line width and line distance so as to obtain the line width difference value ability ranges corresponding to the PCB base copper in different thickness ranges, and studying the influence of different areas, different line directions and different line graphs over etching compensation parameters so as to obtain etching compensation parameter ranges of compact lines, isolated lines, surface-mount technology (SMT) bonding pads and ball grid array (BGA) bonding pads; step 2: determining an average etching compensation value according to step 1 in accordance with the base copper thickness in an original draft of the PCB so as to firstly and averagely compensate films of all line graphs; and step 3: additionally compensating films of the compact lines, the isolated lines, the SMT bonding pads and the BGA bonding pads by adopting dynamic etching compensation software. By adopting the method disclosed by the invention, the influence of the base copper thickness, the etching uniformity and the like over the line width of the areas such as the compact lines, the isolated lines, the SMT bonding pads and the BGA bonding pads can be eliminated.

Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or copper alloy layer, is plated with palladium (Pd) or a palladium alloy, and then gold (Au) or a gold alloy is deposited over the palladium or palladium alloy plated layer by an electroless substitution plating process based on ionization tendency. Having superior hardness, ductility and corrosion resistance, palladium is suitable for use between a connector and a substrate and meets requirements for the printed circuit board even when applied to a low thickness, greatly reducing the process time. Accordingly, the problem of black pad, which frequently occur on electroless nickel and electroless gold finish upon surface mount technology, can be perfectly solved. Particularly, fatal bending cracks can be prevented from occurring in the rigid-flexible or flexible printed circuit boards.

The invention discloses a PCB (Printed Circuit Board) production line combining a manual in process processing and paster processing, which is characterized by comprising a board feeding machine (1), a screen printing machine (2), as well as a first board overturning machine (3), an adhesive dispenser (4), a UV curing oven (5), a second board overturning machine (6), SMT (Surface Mounting Technology) equipment (7) and a reflow soldering heating curing oven (8). The first board overturning machine (3) is responsible for overturning a PCB subjected to low-temperature solder past printing of the screen printing machine (2) and then dispensing an adhesive, and after adhesive dispensing, a UV adhesive with a large long-pin device is cured under UV irradiation; after the PCB is overturned by the second board overturning machine, the step of paster production begins; and finally, PCB heating curing is finished in the reflow soldering heating curing oven (8). The invention combines SMT operation and manual in process operation together to realize a double-faced reflow soldering technology, solves the defects of traditional wave-soldering technology, and saves energy since reflow soldering is performed only twice and elements are heated twice.

According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.

Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.

An Electromagnetic Interference (EMI) gasket formed of a hollow, conductive material which is mechanically fastened to a metal support layer. The assembly can be installed using standard high speed SMT pick and place equipment.

A motherboard including a bus connector and a printed circuit board (PCB) is provided. The bus connector includes a plurality of pins, and each of the pins further includes a first end and a second end. The PCB includes a plurality of contact pads. The second ends of the pins are electrically connected to the contact pads of the PCB via a surface mounted technology (SMT), respectively.

Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including an upper track and a lower track disposed below the upper track.

The present invention relates to a packaging structure for high-power light emitting diode (LED) chip, comprising a metal plate, insulators and a cover plate. The metal plate comprises a containing slot and isolating slots formed on the surface by working, and the insulators can be embedded in the isolating slot. After forming a hollow slot and notches on the surface of the cover plate by working, the cover plate is combined with the metal plate and insulators and at the same time, the hollow slot and the notches are corresponding to the containing slot and the isolating slots on the metal plate to form a hollowness state, followed by application of surface treatment to form soldering portions and an anti-soldering layer at the bottom of the metal plate. Then the metal plate is cut on both sides along free ends of the insulators so as to generate electrode contacts with positive and negative electrodes, and the surface mount technology (SMT) can be adopted for assembly of the packaging structure of high-power LED chip so as to simplify manufacturing processes, facilitate mass production and achieve separation of electricity from heat, etc.

The present invention relates to the methods of construction for inductive components of, preferably, ferromagnetic materials such as inductors, chokes, and transformers when used as an integral part of the fabrication of PCB's or FLEX's. In one preferred embodiment, holes are formed through a ferromagnetic substrate and plated with conductive material. The arrangement of these holes, and the subsequent design that ensues, will form the inductive components within the plane of the media in which the device is formed; using the substrate for a magnetic core. By using this approach, the inductive components can be miniaturized to physical sizes compatible with the requirements of modem surface mount technology (SMT) for integrated circuitry (IC). This process also allows these components to be fabricated using mass production techniques, thereby avoiding the need to handle discrete devices during the manufacturing process. In another preferred embodiment, a series of thin, concentric high permeability rings are etched on a substrate to provide high permeability transformers and inductors having minimal eddy current effects.

The invention relates to a wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as a dielectric layer and a method. The packaging structure is characterized by 1) manufacturing metal ground (GND) shielding layers on a silicon substrate with cavities for embedding; 2) using the photosensitive BCB as the dielectric layers and forming an interconnected through hole structure on the BCB by utilizing photoetching and developing processes; and 3) forming a multi-layer interconnection packaging structure through alternate occurrence of metal layers and the dielectric layers. The method is characterized by eroding or etching the cavities for embedding on the silicon substrate, sputtering a metal seed layer and carrying out electroplating to form the GND, embedding MMIC (monolithic microwave integrated circuit) chips, using conductive adhesives to bond the chips and the substrate, coating the photosensitive BCB and carrying out photoetching and developing to form the interconnected through hole patterns and carrying out curing to realize multi-layer MMCM package. The thickness of the dielectric layers is 20-35mu m. Capacitors, resistors, inductors, power dividers and antenna passive devices can be integrated in the multi-layer interconnection structure or discrete components are integrated through surface mount technology, thus realizing the functionalization of the module.

A magnetic device is provided that may be employed with surface mount technology. In an advantageous embodiment, the magnetic device includes a magnetic core having a magnetic core half and a springable winding positioned about at least a portion of the magnetic core half. The springable winding includes a terminus biased against the magnetic core half.