318 results about "Surface-mount technology" patented technology

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention relates to the technical field of electronic manufacturing, in particular to a PCB SMT mounting method and system based on optical recognition, and the method comprises the steps: carrying out the datum point collection of a pre-confirmed circuit board, obtaining an actual datum point image, carrying out the deviation calculation through employing a theoretical datum point image and the actual datum point image, obtaining an offset, obtaining a plurality of qualified mounting elements, and carrying out the recognition of the qualified mounting elements. The method comprises the following steps: carrying out offset analysis on qualified surface-mounted components to obtain a component center coordinate offset value, carrying out movement compensation on surface-mounted coordinates by utilizing the offset and the component center coordinate offset value to obtain target surface-mounted coordinates, and carrying out surface-mounted on a plurality of qualified surface-mounted components corresponding to a plurality of target surface-mounted coordinates based on the plurality of target surface-mounted coordinates. And carrying out continuous tin defect detection on the surface-mounted circuit board, and taking the surface-mounted circuit board of which the defect score is greater than a defect score threshold as a finished product circuit board. According to the invention, the problems of positioning deviation and tin connection welding quality defects during circuit board mounting can be solved.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The invention discloses a bus type feeder communication method of an SMT (Surface Mount Technology) high-speed chip mounter, which comprises the following steps of: performing intelligent hot plug detection: when any feeder is inserted into any standard slot, immediately sending a hot plug signal to a corresponding feeder communication board by the feeder; as long as the feeder communication board receives a hot plug signal, the automatic unibus identification and automatic addressing step is automatically executed immediately, and in addition, when the feeder communication board detects that a feeder is pulled out, the bit mask step and the online slot ID listing step are automatically executed immediately; according to the invention, many technical problems of the current SMT high-speed chip mounter in the aspect of hot plugging are effectively solved, intelligent automatic detection, automatic identification and dynamic binding of the slot ID are realized, and the communication efficiency is high, efficient and reliable.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to a quick release device for an SMT red glue printing screen. Comprising a frame, a supporting plate and a printing screen plate, an inserting groove is formed in the frame, the supporting plate is installed on the frame through the inserting groove, and the printing screen plate is detachably installed on the supporting plate; a push-out assembly is arranged in the frame, and the supporting plate is pushed out of the inserting groove through the push-out assembly so that the printing screen can be replaced conveniently. The device has the effect of improving the mounting or dismounting and replacing efficiency of the printing screen plate, and has the characteristics of simple structure and convenience in operation.

The utility model relates to the technical field of SMT (Surface Mount Technology), in particular to a narrow terminal for preventing scaling powder from climbing, which comprises a terminal main body, a welding part arranged at the bottom of the terminal main body, and a contact surface part arranged on the terminal main body and positioned above the welding part, and a blocking step is convexly arranged between the welding part and the contact surface part; according to the utility model, the climbing path of the soldering flux can be prolonged, the soldering flux can be ensured not to climb upwards to the contact surface part in the manufacturing process, the condition of poor products caused by the fact that the soldering flux climbs upwards to the contact surface part can be avoided, and the yield can be greatly improved.

The disclosed front end architectures are configured to conglomerate duplexer transmission (TX) contours into a specific or targeted region. This enables the power amplifier (PA) to match a larger number of frequency bands without the help of additional matching networks. The disclosed architectures are advantageous because they reduce the number of components (e.g., surface mount technology components (SMTs)) required for radio-frequency (RF) modules, such as front end modules, power amplifier modules, and the like. The disclosed architectures are also advantageous because they improve performance of the modules across a wider range of frequency bands.

A surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material is presented herein. A surface mount technology (SMT) optoelectronic device includes a substrate, a housing, at least one optoelectronic chip, and an encapsulant material. The substrate includes electrical terminals that facilitate attachment and electrical coupling of the SMT optoelectronic device to a printed circuit board. The housing includes an opaque material and a cavity, in which the substrate is positioned at a bottom portion of the cavity, and a top portion of the housing includes a group of slot openings. The at least one optoelectronic chip is electrically connected to the electrical terminals, and is mounted, within the cavity, to the substrate. The encapsulant material is translucent or transparent, and has been included in the cavity and the slot openings.

The invention discloses a field calibration method and system for SMT 3D AOI equipment, and relates to the surface mounting technology, and the method comprises the steps: feeding a calibration board into the SMT 3D AOI equipment according to the same board feeding mode as a common PCB, and carrying out the initialization; multiple groups of horizontal and vertical grating images are acquired; performing phase calculation on the grating image acquired by the camera by using a phase shift method to obtain a plurality of groups of horizontal and vertical phase diagrams; performing image processing on the calibration plate image acquired by the camera, calculating circle center coordinates of all the circular patterns, and calculating corresponding point coordinates of the circle center coordinates on the imaging plane of each projector; calculating coordinate values of all circle centers on the calibration plate in a world coordinate system according to the adopted Z-axis height and the distance between the circular patterns of the calibration plate; repeatedly calculating world coordinates; and determining optimized system parameters according to the projection process of conversion from the coordinate values of the world coordinate system to the camera pixel coordinate system. According to the invention, the internal parameters and the external parameters of the equipment can be quickly optimized, and the precision of the imaging system is recovered to the initial state.

The present disclosure provides apparatuses and methods for operating a flash memory for programming operating system (OS) data before an surface mount technology (SMT) process. In some embodiments, the method includes erasing a plurality of memory cells in a memory block, reducing a lateral charge loss of the plurality of memory cells due to high temperature degradation during the SMT process by applying a pre-program voltage to word lines coupled to the memory block, and performing multi-bit programming of the OS data in the plurality of memory cells, prior to performing the SMT process. The applying of the pre-program voltage causes threshold voltages of the plurality of memory cells to increase.

The utility model relates to the technical field of automation equipment, in particular to SMT (Surface Mount Technology) first workpiece automatic detection equipment, which comprises an equipment body, and the equipment body comprises a rack, and a probe detection mechanism, a clamping mechanism, a first driving mechanism, a second driving mechanism and a detector which are respectively arranged above the rack; the probe detection mechanism is arranged above the clamping mechanism; the clamping mechanism is connected above the first driving mechanism, and the clamping mechanism is used for fixing a circuit board; the first driving mechanism is used for driving the clamping mechanism to move; the second driving mechanism is used for driving the probe detection mechanism to move; and the detector is connected to the probe detection mechanism and is used for detecting the resistance value, the capacitance value and the inductance value of the circuit board through the probe detection mechanism. The utility model provides the SMT first workpiece automatic detection equipment which replaces manual detection and improves the detection precision and efficiency.

The invention discloses a multi-level double-bin feeding device for SMT (surface mount technology) material strip coils. The multi-level double-bin feeding device comprises a base, a plurality of material rails and bins slidably mounted on the material rails. On one hand, on the basis of the upper bin body and the lower bin body which are arranged in a complementary and staggered mode, feeding of two SMT material strip coils at the same position is met, the upper bin body can form tension assistance (floating or constant tension) for unwinding of the SMT material strip coils on the lower portion, and strip feeding interference among multiple stations is avoided; meanwhile, the side-by-side layout of complementary interference of a plurality of SMT material strip coils can be met in a limited space, and the continuity of automatic feeding is improved; and on the other hand, on the basis of movement avoidance formed by overturning of the upper bin bodies, a plurality of material levels are coordinated, so that the vertical distance between two SMT material strip coils placed in each bin is shortened to optimize the structure of the bin, and displacement of each bin is also facilitated to supplement the SMT material strip coils.

The utility model discloses a positioning jig for fixing a longer FPC (Flexible Printed Circuit) in SMT (Surface Mount Technology), which comprises a jig body, a plurality of convex hulls are arranged at the upper end part of the jig body, and a positioning pin is arranged on each convex hull. According to the utility model, through the arrangement of the convex hulls and the positioning pins, each bonding pad on the FPC can be fixed on the convex hulls, thereby counteracting the position change of the bonding pads caused by the expansion and contraction of the FPC in production, ensuring that the positions of the bonding pads on the same FPC produced in the same batch or different batches are kept fixed relative to the positioning jig, and improving the production efficiency. Therefore, it is ensured that the same screen or the screen of the same structure can be always suitable for production of the FPC, stable and consistent SMT quality can be kept, design and production of the screen and first-batch production of the FPC can be carried out at the same time, production timeliness is improved, waiting time of subsequent procedures is avoided or shortened, and production efficiency is improved.

The utility model discloses a suction nozzle for automatic lossless surface mounting of light-emitting diode materials with lenses for SMT (Surface Mount Technology), which is characterized in that a first clamping groove and a second clamping groove are respectively arranged on the upper surface of a connecting disc from left to right, a reflector is arranged on the lower surface of the connecting disc, a suction nozzle head is arranged on the lower surface of the reflector, and a lens is arranged on the suction nozzle head. The upper end of the suction nozzle head is further integrally connected with a connector, a second cavity and an air suction port are formed in the suction nozzle head from top to bottom, a first cavity communicated with the second cavity is formed in the mounting rod, and a sealing protection pad is further arranged at the lower end of the suction nozzle head. The utility model relates to the technical field of SMT surface mounting. According to the suction nozzle for automatic lossless surface mounting of the light emitting diode material with the lens for SMT, the suction nozzle head can effectively avoid important and sensitive working areas on the upper surface of the diode material, so that protection is achieved, and the purpose of efficient sealing and lossless adsorption of the light emitting diode can be achieved through the sealing protection pad.

The present invention discloses a support pin arrangement system and arrangement method, which are applied to the field of surface mounting technology, wherein the support pin arrangement system includes: a simulation planning system for determining the target support point of the support pin on the base plate; a positioning and identification component for obtaining the position of the base plate and the support pin; a picking component for taking the support pin and installing it on the target support point to obtain a finished support pin; and a control system for controlling the movement of the picking component according to the position of the target support point and the position of the base plate and the support pin. The system disclosed in the present invention can improve the rationality of the arrangement position of the support pin, reduce the interference of human factors, and improve efficiency; moreover, it operates independently of the equipment in the SMT production line, does not occupy the equipment in the SMT production line, reduces the impact on the SMT production line, improves the line change efficiency, and ensures the working efficiency of the SMT production line.

A method of manufacturing an electronic assembly (100, 400) includes: forming a support member (130, 430) by applying a first adhesive layer (133, 433) to an inner surface of a support frame (131, 431) and applying a second adhesive layer (134, 434) to a bottom surface of the support frame (131, 431) (S501); attaching the support member (130, 430) to a component (110, 410) of the ball grid array comprising solder balls (111, 411) by a first adhesive layer (133, 433) (S502) such that an inner surface of the support frame (131, 431) covers a portion of a first side surface of the component (110, 410) and a portion of a bottom surface of the component (110, 410); mounting the support member (130, 430) to a substrate (120, 420) comprising an array of contact pads (121, 421) through a second adhesive layer (134, 434), the pattern of the array of contact pads (121, 421) matching the ball grid array (S503); and curing the first adhesive layer (133, 433) and the second adhesive layer (134, 434), and connecting the solder ball (111, 411) to the contact pad (121, 421) by reflow soldering at a temperature higher than the melting point of the solder ball (111, 411) (S504).

The invention relates to the technical field of flip chips, and provides a semiconductor level flip chip surface mounting technology production process, which comprises the following steps: obtaining a circuit board and a flip chip; first solder paste is printed on the circuit board, and the flip chip is pasted to the first solder paste of the circuit board; welding the flip chip to the circuit board through a reflow soldering process; filling the bottom of the flip chip; according to the semiconductor-level flip chip surface mounting technology production process provided by the embodiment of the invention, the flip chip is welded to the circuit board, so that the flip chip has higher connection density and better electrical performance, and the bottom of the flip chip is filled, so that the filler can enhance the mechanical bonding force between the flip chip and the circuit board, thereby improving the reliability of the flip chip. The probability that the flip chip falls off from the circuit board or the welding point is loosened due to external force or temperature change can be effectively reduced.

The utility model provides an LED device based on mini LED lamp drive integrated design, which is characterized in that a drive chip and LED chips are arranged on the front surface of a substrate, extraction electrodes are arranged on the back surface of the substrate, and the LED chips comprise mini LED chips; the leading-out electrodes comprise a red light power supply electrode, a blue-green light power supply electrode, a grounding electrode and three communication electrodes, three positive electrodes of the mini LED chip are respectively connected to the driving chip and are respectively and correspondingly connected to the red light power supply electrode and the blue-green light power supply electrode through the driving chip and the conducting holes so as to respectively drive the red light power supply electrode and the blue-green light power supply electrode, and the driving chip is provided with three communication ports. According to the LED device based on the mini LED lamp drive integrated design, the drive chip and the LED chip are both arranged on the front face of the substrate, only one-time surface mounting technology needs to be executed to the production of a backlight plate, and the production cost of downstream manufacturers can be effectively reduced; the red lamp is driven separately, communication channels are multiple, the controllability of the mini LED chip can be improved, and convenience is provided for power consumption regulation and control and light emitting effect regulation and control.

This application relates to an SMT (Surface Mount Technology) material delivery scheduling method and system. It includes: executing a material delivery task; when reading the identification code of a material tray fails, identifying the failure type as optical overexposure, and reporting the failure information to a central scheduling system; the central scheduling system updates the execution history information of the material delivery task based on the failure information; when the central scheduling system needs to allocate an automated guided vehicle (AGV) to the material delivery task, it queries the execution history information of the material delivery task; if the query results indicate that the material delivery task has failed, it identifies the type of AGV that caused the failure in the execution history information, excludes the AGV type that caused the failure from the available AGVs, and selects AGVs with different physical configurations for allocation. This solves the problem of code reading failure caused by optical overexposure of high-gloss material trays in the SMT production environment.

The utility model discloses a cover plate, a braid type feeding assembly adopting the cover plate and an SMT assembly system. The cover plate comprises a cover plate seat body and a hollow containing cavity which is formed in the cover plate seat body and penetrates through the top end and the lower end of the cover plate seat body. Connecting parts which are turned outwards are arranged on the outer side walls of at least one pair of cover plate seat bodies and located on the edges of the bottom ends of the cover plate seat bodies; and an annular positioning part suitable for being adsorbed is arranged at the top end of the cover plate seat body and is positioned on the circumferential side of the hollow accommodating cavity.

Embodiments of the present application provide a method and apparatus for generating optimized parameters. The method is suitable for generating optimized parameters related to solder paste printing in surface mount technology. In the method, a cluster parameter model is used to determine whether at least one input parameter deviates from at least one parameter cluster. A global parameter model is used to determine the printing result of a plurality of target parameters in the input parameter. A heuristic algorithm is used to select at least one candidate parameter from the target parameters. An individual parameter model is used to modify the candidate parameter. As a result, the optimized parameters with high operation cycle and low failure rate can be obtained.

The utility model relates to interphone SMT paster technical field, in particular to an SMT paster dispenser, including bottom plate, two support frame, transmission subassembly and dispensing mechanism, the two support frame with bottom plate fixed connection, transmission subassembly includes drive motor, drive roller, rolling roller, conveyer belt, limit piece and fixed piece, drive motor with drive roller one end fixed connection, and drive roller one end fixed connection, rolling roller one end fixed connection, conveyer belt one end fixed connection. The other end of the driving roller is rotationally connected with the supporting frame, the rolling roller is rotationally connected with the supporting frame, the conveying belt is arranged on the outer side of the driving roller and the outer side of the rolling roller, the limiting piece is fixedly connected with the supporting frame, the fixing piece is fixedly connected with the supporting frame, and the dispensing mechanism is fixedly connected with the bottom plate. The surface of the circuit board is effectively prevented from moving, so that the reject ratio of the circuit board and the labor intensity of operators are reduced.

The utility model relates to the technical field of surface mounting, in particular to an SMT (Surface Mount Technology) material receiving device with an accurate cutting function, which comprises a bottom plate, the upper end surface of the bottom plate is fixedly connected with a first material placing platform, and the upper end surface of the bottom plate is slidably connected with a second material placing platform; the precise cutting assembly comprises a linear guide rail fixedly connected to the upper end face of the bottom plate, a sliding seat is slidably connected to the linear guide rail, a cutter is fixedly installed on the sliding seat and located between the first discharging platform and the second discharging platform, and a cutting driving part is fixedly installed on the upper end face of the bottom plate. According to the material cutting device, materials can be accurately cut, the cutting consistency of the materials and the tidy degree of connectors can be kept, the phenomenon of equipment alarm caused by insufficient material receiving is reduced, material mounting deviation caused by deviation of the material connectors is reduced, the materials can be fully fixed, and accurate cutting operation of the materials is facilitated.

This invention discloses a compact UAV flight control board core component layout and efficient connection method, belonging to the field of UAV flight control design technology. The layout scheme centers on the main control module, achieving a radial and compact arrangement of various functional modules on a flight control board body with an area not exceeding 50cm²: sensor modules surround the main control module with a spacing not exceeding 5mm, power management and communication modules are diagonally distributed at the edges, and interface expansion modules are dispersed in the remaining edge areas. Independent digital and analog ground copper foils are provided, using single-point grounding. The connection method utilizes surface mount technology for direct soldering of core chips. The power link employs a tree topology and array filtering, while the signal link optimizes impedance matching and wiring. Connection detection and thermal adhesive reinforcement ensure reliability. This invention significantly reduces the size and weight of the flight control board, effectively reduces signal interference and transmission loss, improves connection stability and flight control accuracy, and is suitable for the needs of miniaturized UAVs.

The utility model discloses a cooling frame of an SMT (Surface Mount Technology) jig. The cooling frame comprises a cooling frame main body, a supporting plate and a bottom plate, according to the SMT patch heat dissipation device, the mounting groove, the ventilation opening and the fixing sleeve are arranged, the connecting sleeve is movably mounted through the mounting groove, the fixing groove is formed through the connecting sleeve, the filter plate is mounted through the fixing groove, and the filter plate filters air blown to SMT patch heat dissipation at the heat dissipation fan; according to the utility model, the fixing sleeve is arranged on the cooling frame, and the fixing sleeve is installed through the connecting plate, so that the problems that the cooling frame is not provided with a filtering structure at the cooling fan used for SMT mounting, the cooling fan without the filtering structure may suck dust, impurities and other small particles in the air in the operation process, and the particles can be blown to an SMT mounting area subsequently, so that the service life of the cooling frame is prolonged, and the service life of the cooling frame is prolonged are solved. Due to the fact that the working precision of the SMT chip mounter is extremely high, installation of electronic elements can be affected even if extremely small dust exists, and the problems of poor welding, short circuit or element damage are caused.

The utility model belongs to the technical field of SMT (Surface Mount Technology), and discloses a steel mesh, which comprises a supporting mesh and a covering mesh, the supporting mesh is provided with an accommodating hole and an avoiding hole, the covering mesh is provided with an operation hole, when operation is carried out at an operation position on a substrate with an existing structure, the supporting mesh is clamped between the substrate and the covering mesh, and the covering mesh is provided with an operation hole. The containing hole annularly sleeves the periphery of the existing structure, the operation hole is communicated with the avoiding hole, the containing hole annularly sleeves the periphery of the operation position, and the covering mesh and the existing structure in the containing hole are spaced. According to the utility model, the supporting mesh and the covering mesh can be processed only through simple punching, the production cost is low, the processing precision is high, the supporting mesh is matched with the covering mesh, the supporting mesh protects the existing structure on the substrate through the accommodating holes, the covering mesh is prevented from contacting, extruding, damaging or polluting the existing structure, and the service life of the substrate is prolonged. And the receding holes in the supporting net piece communicate with the operation holes in the covering net piece, and operation can be conducted on the operation position on the base plate.

The utility model relates to the technical field of SMT (Surface Mount Technology) mounting, and discloses a modular SMT mounting jig convenient to replace, which comprises a base and further comprises supporting plates which are symmetrically arranged above the base, moving plates are arranged on opposite sides of the two supporting plates, rotating rods are rotatably connected to opposite sides of the two moving plates, and the rotating rods are connected with the moving plates. And the other ends of the two rotating rods are fixedly connected with fixing plates. According to the utility model, the distance between the two fixing assemblies can be effectively adjusted through the adjusting assembly, so that patch bodies of different specifications can be effectively fixed, the patch bodies can be effectively fixed through the fixing assemblies, and the patch bodies can be overturned through the overturning assembly. By means of the technical scheme, the patch body can be conveniently turned over, workers do not need to manually turn over the patch body and then fix the patch body again, the processing efficiency of the patch body is effectively improved, and the workload of the workers is relieved.

This invention discloses a staged quality inspection method and system for SMT (Surface Mount Technology) semi-finished products, specifically relating to the field of electronic manufacturing quality management technology. The method includes the following steps: quality inspection is performed at each stage of the production line, the inspection results are recorded and a result set is formed, and early signs of production rhythm imbalance are identified using time interval distribution analysis; if imbalance is present, the defect frequency fluctuation index and the production line dynamic disorder index are further calculated to quantify the dynamic fluctuations and systemic problems of non-conforming phenomena; the two indices are input into a pre-trained machine learning model, and the model output distinguishes the quality status of the production line as high quality or low quality; for low-quality production lines, optimization is performed according to a preset adjustment strategy; this method can monitor the quality status of the production line in real time, accurately distinguish between accidental and non-accidental problems, improve quality management efficiency, ensure stable operation of the production line, and reduce the proportion of non-conforming products.

The utility model provides a magnetic core winding antenna structure suitable for SMT (Surface Mount Technology) assembly, which reduces the volume of an antenna module, enables the antenna module to be mounted in an SMT mode, and enables the connection of the antenna module to be rapid and efficient. The plastic seat comprises a mounting cavity and a welding support plate, and the non-welding surface of the welding support plate is provided with a raised mounting cavity; a magnetic core including a winding shaft; a winding coil; a red copper sheet assembly; and a mylar film; the winding coil is wound around the winding shaft, the two ends of the winding coil are arranged in an outward protruding mode to form connecting parts, the bottom of the magnetic core and the bottom of the winding coil are arranged in an installation cavity of the plastic base, and a red copper sheet assembly is arranged in a supporting plate at the bottom of the plastic base in advance. The connecting parts of the red copper sheet and the winding coil are combined to form corresponding welding spots exposed out of the bottom of the welding support plate; the inner surfaces of the two ends of the mylar in the length direction are connected with the upper surface of the integral structure formed by the magnetic core and the winding coil in an attached mode.