153 results about "Surface-mount technology" patented technology

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The utility model discloses a suction nozzle for automatic lossless surface mounting of light-emitting diode materials with lenses for SMT (Surface Mount Technology), which is characterized in that a first clamping groove and a second clamping groove are respectively arranged on the upper surface of a connecting disc from left to right, a reflector is arranged on the lower surface of the connecting disc, a suction nozzle head is arranged on the lower surface of the reflector, and a lens is arranged on the suction nozzle head. The upper end of the suction nozzle head is further integrally connected with a connector, a second cavity and an air suction port are formed in the suction nozzle head from top to bottom, a first cavity communicated with the second cavity is formed in the mounting rod, and a sealing protection pad is further arranged at the lower end of the suction nozzle head. The utility model relates to the technical field of SMT surface mounting. According to the suction nozzle for automatic lossless surface mounting of the light emitting diode material with the lens for SMT, the suction nozzle head can effectively avoid important and sensitive working areas on the upper surface of the diode material, so that protection is achieved, and the purpose of efficient sealing and lossless adsorption of the light emitting diode can be achieved through the sealing protection pad.

The utility model provides an LED device based on mini LED lamp drive integrated design, which is characterized in that a drive chip and LED chips are arranged on the front surface of a substrate, extraction electrodes are arranged on the back surface of the substrate, and the LED chips comprise mini LED chips; the leading-out electrodes comprise a red light power supply electrode, a blue-green light power supply electrode, a grounding electrode and three communication electrodes, three positive electrodes of the mini LED chip are respectively connected to the driving chip and are respectively and correspondingly connected to the red light power supply electrode and the blue-green light power supply electrode through the driving chip and the conducting holes so as to respectively drive the red light power supply electrode and the blue-green light power supply electrode, and the driving chip is provided with three communication ports. According to the LED device based on the mini LED lamp drive integrated design, the drive chip and the LED chip are both arranged on the front face of the substrate, only one-time surface mounting technology needs to be executed to the production of a backlight plate, and the production cost of downstream manufacturers can be effectively reduced; the red lamp is driven separately, communication channels are multiple, the controllability of the mini LED chip can be improved, and convenience is provided for power consumption regulation and control and light emitting effect regulation and control.

This application relates to an SMT (Surface Mount Technology) material delivery scheduling method and system. It includes: executing a material delivery task; when reading the identification code of a material tray fails, identifying the failure type as optical overexposure, and reporting the failure information to a central scheduling system; the central scheduling system updates the execution history information of the material delivery task based on the failure information; when the central scheduling system needs to allocate an automated guided vehicle (AGV) to the material delivery task, it queries the execution history information of the material delivery task; if the query results indicate that the material delivery task has failed, it identifies the type of AGV that caused the failure in the execution history information, excludes the AGV type that caused the failure from the available AGVs, and selects AGVs with different physical configurations for allocation. This solves the problem of code reading failure caused by optical overexposure of high-gloss material trays in the SMT production environment.

Embodiments of the present application provide a method and apparatus for generating optimized parameters. The method is suitable for generating optimized parameters related to solder paste printing in surface mount technology. In the method, a cluster parameter model is used to determine whether at least one input parameter deviates from at least one parameter cluster. A global parameter model is used to determine the printing result of a plurality of target parameters in the input parameter. A heuristic algorithm is used to select at least one candidate parameter from the target parameters. An individual parameter model is used to modify the candidate parameter. As a result, the optimized parameters with high operation cycle and low failure rate can be obtained.

The utility model relates to interphone SMT paster technical field, in particular to an SMT paster dispenser, including bottom plate, two support frame, transmission subassembly and dispensing mechanism, the two support frame with bottom plate fixed connection, transmission subassembly includes drive motor, drive roller, rolling roller, conveyer belt, limit piece and fixed piece, drive motor with drive roller one end fixed connection, and drive roller one end fixed connection, rolling roller one end fixed connection, conveyer belt one end fixed connection. The other end of the driving roller is rotationally connected with the supporting frame, the rolling roller is rotationally connected with the supporting frame, the conveying belt is arranged on the outer side of the driving roller and the outer side of the rolling roller, the limiting piece is fixedly connected with the supporting frame, the fixing piece is fixedly connected with the supporting frame, and the dispensing mechanism is fixedly connected with the bottom plate. The surface of the circuit board is effectively prevented from moving, so that the reject ratio of the circuit board and the labor intensity of operators are reduced.

The utility model relates to the technical field of surface mounting, in particular to an SMT (Surface Mount Technology) material receiving device with an accurate cutting function, which comprises a bottom plate, the upper end surface of the bottom plate is fixedly connected with a first material placing platform, and the upper end surface of the bottom plate is slidably connected with a second material placing platform; the precise cutting assembly comprises a linear guide rail fixedly connected to the upper end face of the bottom plate, a sliding seat is slidably connected to the linear guide rail, a cutter is fixedly installed on the sliding seat and located between the first discharging platform and the second discharging platform, and a cutting driving part is fixedly installed on the upper end face of the bottom plate. According to the material cutting device, materials can be accurately cut, the cutting consistency of the materials and the tidy degree of connectors can be kept, the phenomenon of equipment alarm caused by insufficient material receiving is reduced, material mounting deviation caused by deviation of the material connectors is reduced, the materials can be fully fixed, and accurate cutting operation of the materials is facilitated.

This invention discloses a compact UAV flight control board core component layout and efficient connection method, belonging to the field of UAV flight control design technology. The layout scheme centers on the main control module, achieving a radial and compact arrangement of various functional modules on a flight control board body with an area not exceeding 50cm²: sensor modules surround the main control module with a spacing not exceeding 5mm, power management and communication modules are diagonally distributed at the edges, and interface expansion modules are dispersed in the remaining edge areas. Independent digital and analog ground copper foils are provided, using single-point grounding. The connection method utilizes surface mount technology for direct soldering of core chips. The power link employs a tree topology and array filtering, while the signal link optimizes impedance matching and wiring. Connection detection and thermal adhesive reinforcement ensure reliability. This invention significantly reduces the size and weight of the flight control board, effectively reduces signal interference and transmission loss, improves connection stability and flight control accuracy, and is suitable for the needs of miniaturized UAVs.

This invention discloses a staged quality inspection method and system for SMT (Surface Mount Technology) semi-finished products, specifically relating to the field of electronic manufacturing quality management technology. The method includes the following steps: quality inspection is performed at each stage of the production line, the inspection results are recorded and a result set is formed, and early signs of production rhythm imbalance are identified using time interval distribution analysis; if imbalance is present, the defect frequency fluctuation index and the production line dynamic disorder index are further calculated to quantify the dynamic fluctuations and systemic problems of non-conforming phenomena; the two indices are input into a pre-trained machine learning model, and the model output distinguishes the quality status of the production line as high quality or low quality; for low-quality production lines, optimization is performed according to a preset adjustment strategy; this method can monitor the quality status of the production line in real time, accurately distinguish between accidental and non-accidental problems, improve quality management efficiency, ensure stable operation of the production line, and reduce the proportion of non-conforming products.

The utility model provides a magnetic core winding antenna structure suitable for SMT (Surface Mount Technology) assembly, which reduces the volume of an antenna module, enables the antenna module to be mounted in an SMT mode, and enables the connection of the antenna module to be rapid and efficient. The plastic seat comprises a mounting cavity and a welding support plate, and the non-welding surface of the welding support plate is provided with a raised mounting cavity; a magnetic core including a winding shaft; a winding coil; a red copper sheet assembly; and a mylar film; the winding coil is wound around the winding shaft, the two ends of the winding coil are arranged in an outward protruding mode to form connecting parts, the bottom of the magnetic core and the bottom of the winding coil are arranged in an installation cavity of the plastic base, and a red copper sheet assembly is arranged in a supporting plate at the bottom of the plastic base in advance. The connecting parts of the red copper sheet and the winding coil are combined to form corresponding welding spots exposed out of the bottom of the welding support plate; the inner surfaces of the two ends of the mylar in the length direction are connected with the upper surface of the integral structure formed by the magnetic core and the winding coil in an attached mode.

The utility model provides a multi-track feeding device for SMT (Surface Mount Technology), and relates to the technical field of SMT feeding. The multi-track feeding device for SMT comprises a base, a plurality of grooves are formed in the middle of the base, stabilizing frames are fixed to the two sides of the base, a loading frame is slidably connected to the outer surfaces of the two stabilizing frames, a plurality of track grooves are formed in the middle of the loading frame, a driving motor is fixed to one side of the base, and a fixing rod is fixed to the driving end of the driving motor. Cams are fixed in the middles of the fixing rods; limiting grooves are formed in the two sides of the loading frame, a connecting structure is arranged at the other end of the fixing rod, and a threaded frame and a sliding frame are arranged on the connecting structure. According to the multi-track feeding device for SMT, the driving motor drives the fixing rod to rotate, the effect of stable loading is achieved, the effect of improving the using effect of the multi-track feeding device is achieved, the effects of equivalent discharging and arrayed feeding are achieved, and the effect of reducing the manufacturing cost and the using cost is achieved.

The utility model relates to the technical field of surface mounting, in particular to a soldering paste printing device for mainboard production, which comprises a support frame, a first electric slide rail is mounted at the upper part of the support frame, a movable frame is mounted on the first electric slide rail in a sliding manner, an air cylinder is fixedly mounted on the movable frame, and a scraper is assembled at the tail end of a movable rod of the air cylinder. By means of the pressing mechanism composed of the push plate, the wedge-shaped block and the pressing plate, it is guaranteed that the main board is tightly attached to the bottom face of the screen template in the printing process, displacement or warping is avoided, printing consistency and accuracy are guaranteed, meanwhile, uniform and accurate smearing of soldering paste is facilitated, printing quality is improved, and the risks of poor printing and through printing are reduced; according to the device, intelligent control devices such as the electric sliding rail and the air cylinder are integrated, full-automatic operation of soldering paste printing is achieved, the printing speed is increased, manual intervention is reduced, the operation difficulty is lowered, and the device is particularly suitable for the large-scale and high-efficiency production environment.

This invention discloses an adaptive optimization method for SMT production line process parameters based on digital twins, belonging to the field of surface mount technology (SMT) data control technology. It includes constructing a digital twin to map SMT production line elements, reconstructing a model to calculate the SMT production line process status, deriving an SMT production line capacity optimization scheme, dynamically correcting process parameters, eliminating model overfitting faults caused by batch variations in incoming materials, and optimizing the joint simulation of equipment status and process parameters. This invention upgrades SMT production line process optimization from traditional reactive optimization to predictive optimization, reducing quality defects at the source and achieving a fundamental upgrade in the optimization model. Through a four-dimensional hierarchical digital twin and reduced-order model virtual sensing technology, it achieves real-time acquisition of key physical quantities that traditional methods cannot measure, such as thermal field distribution, stencil deformation, and dynamic gaps. This eliminates decision-making blind spots in process optimization, improves the accuracy and timeliness of optimization decisions, and thus fills the data dimension gap in process optimization.

This invention belongs to the field of semiconductor packaging and surface mount technology, and specifically relates to a method for mounting surface-mount LEDs based on machine vision. The method includes: acquiring 3D point cloud data of the SMD LED using a 3D vision acquisition module, calculating the component's bottom surface tilt angle and the height of key bottom points; acquiring 3D topographic data of the PCB pads, including pad surface height differences; spatially fusing the component's posture data and the pad topographic data to plan a dynamic compensation trajectory; during the mounting head's descent, a force sensor collects real-time contact force feedback values, and the controller adjusts the Z-axis descent speed and final stopping position in a closed loop according to a preset pressure target curve to complete the mounting. This invention, by introducing 3D vision perception and pressure closed-loop control, solves the problem of uneven mounting pressure and component damage caused by the inability of existing 2D vision-based surface mount machines to perceive 3D component posture deviations, achieving high-precision, low-stress, and high-reliability mounting of SMD LEDs.

This application discloses a method for fabricating a heat sink housing using SLM (Surface Mount Technology) and the heat sink housing itself. The method includes steps such as 3D modeling and path planning, optimization of wide-particle-size copper alloy powder, substrate mounting and powder spreading blade adjustment, parameter setting, laser printing and gradient energy forming, and multi-stage post-processing. 3D modeling and path planning provide precise guidance for heat sink housing manufacturing; optimization of wide-particle-size copper alloy powder improves forming efficiency; laser printing and gradient energy forming ensure the forming quality of complex heat sink housing structures; and post-processing ultimately achieves dual optimization of performance and precision. This application solves the problem that when fabricating heat sink housings using laser printing technology, the poor compatibility between wide-particle-size copper alloy powder and existing laser printing technology leads to uneven powder spreading during printing, resulting in forming defects and low density in the printed product.

This application provides a method for fabricating an adapter board and the adapter board itself. By obtaining the adapter board body and a capacitor, a mounting area is defined on the surface of the adapter board body, and the capacitor is mounted to this mounting area using a surface mount technology, thus obtaining an adapter board with integrated capacitors. This application overcomes the limitation of related technologies where adapter boards used for multilayer packaging are merely pure interconnect structures. By integrating capacitors on the adapter board, power supply noise and line voltage drop can be effectively suppressed, thereby improving power integrity and ultimately meeting the technical requirements for power integrity.

This utility model discloses a segmented wire harness connector based on an FPC (Flexible Printed Circuit) system, including a first connector and a second connector that are interconnected. A first wire harness is disposed on the side of the first connector away from the second connector, and the end of the first wire harness is soldered and fixed to the FPC board. The other end of the FPC board is connected to the surface of the first connector via SMT (Surface Mount Technology). A protective layer is provided on the soldering area between the first wire harness and the FPC board, and on the surface of the FPC board and the first connector. A second wire harness is disposed on the side of the second connector away from the first connector, and the second wire harness is crimped and fixed to the second connector. This utility model segments the wire harness, allowing for automated assembly of the shorter sections, thus improving production efficiency. The connection between the wire and the SMT connector replaces the original connection scheme between the wire harness and the housing terminal, reducing the development of multi-line housing terminals and achieving a smaller footprint than housing terminals.

The utility model discloses an SMT (Surface Mount Technology) solder paste printing device, which belongs to the technical field of SMT and comprises a supporting seat, a reciprocating carrier, a carrier driving mechanism, a transverse driving mechanism, a vertical driving mechanism and a solder paste printing structure, the reciprocating carrier is movably arranged on the supporting seat, the carrier driving mechanism is arranged below the supporting seat, and the carrier driving mechanism is in driving connection with the reciprocating carrier; the transverse driving mechanism is adjacent to the reciprocating carrier and is arranged on the supporting seat, the vertical driving mechanism is movably arranged on the side surface of the transverse driving mechanism, and the transverse driving mechanism is in driving connection with the vertical driving mechanism; the solder paste printing structure is movably arranged above the reciprocating carrier, and the vertical driving mechanism is in driving connection with the solder paste printing structure. The SMT solder paste printing device solves the technical problem of how to improve the solder paste printing efficiency.

The utility model relates to the technical field of SMT (Surface Mount Technology), and particularly discloses a stable adsorption device for SMT. Comprising a negative pressure main body for generating negative pressure, a first adsorption assembly integrally formed with the negative pressure main body and communicated with the negative pressure main body, a second adsorption assembly detachably connected with the negative pressure main body, and a first stabilizing assembly and a second stabilizing assembly which are detachably connected to the first adsorption assembly and the second adsorption assembly correspondingly and used for improving the negative pressure stability. The negative pressure action range of the second adsorption assembly is larger than that of the first adsorption assembly. The device solves the problem that a traditional adsorption device used for adsorbing surface-mounted components of the chip mounter cannot achieve stable adsorption.

The present invention relates to a wire winding, a substrate of a magnetic conductive material, and an induction component having at least two conductive connection surfaces on the underside of the substrate for assembly by SMT (surface mount technology), wherein the wire winding is formed as a flat helical wire winding, the wire winding is positioned on the upper side of the substrate, and two U-shaped clips are provided with two legs and a base connecting the legs, the U-shaped clips are positioned on the substrate such that each of the first legs is positioned on the upper side of the substrate and each of the second legs is positioned on the underside of the substrate, and in each of the U-shaped clips, at least a portion of the second leg forms a connection surface, the first winding end of the wire winding is connected to the first leg of the first clip, and the second winding end of the wire winding is connected to the first leg of the second clip.

The utility model relates to the technical field of SMT (Surface Mount Technology) processing, and discloses an SMT patch feeding mechanism which comprises a feeder main body, one end of the feeder main body is fixedly provided with a material placing disc, the material placing disc is rotatably provided with a material disc, the outer wall of the material disc is wound with a material receiving belt, the other end of the feeder main body is rotatably provided with a material pressing frame, and the material pressing frame is provided with a material conveying belt. A containing box is fixedly installed at the position, corresponding to the material pressing frame, of the upper surface of the feeder body, and two sets of symmetrically-arranged first tensioning assemblies are movably installed in the containing box. According to the utility model, the residual material receiving belt in the previous material tray can be accommodated in the accommodating box under the tensioning action of the plurality of first rotating rollers, and when an operator connects the tail end of the material receiving belt with the tail end of the material receiving belt in a new material tray, the residual material receiving belt in the previous material tray does not need to be wound on the outer wall of the new material tray again; the material receiving device can be used for saving the material receiving time between two material trays, so that the material tray replacement efficiency is improved when the device is used.

The utility model discloses a pressing buckle sinking plate type maintenance jig, which relates to the technical field of SMT (Surface Mount Technology) manufacturing, comprises a maintenance jig body, and is characterized in that a proper maintenance jig body is selected according to the size and the shape of a part needing to be maintained or processed, and the part is placed at a corresponding position of the maintenance jig body; according to the pressing buckle sinking plate type maintenance jig, in the SMT process of electronic manufacturing, for example, during maintenance, components such as a circuit board are prone to shifting due to factors such as hot air and self weight, and the quality problems of poor welding and the like are caused. According to the utility model, stable pressure and fixing effect can be provided, accurate position of a circuit board or other parts in the maintenance or processing process is ensured, position deviation is avoided, operation is simple and convenient, and working efficiency is improved.

The utility model relates to the technical field of conveyor accessories, in particular to an anti-falling SMT (Surface Mount Technology) conveying device, which comprises a conveying belt for SMT laser marking and engraving and two groups of conveying roll shafts, a negative pressure fan and a servo gear motor used for driving the conveying roller shafts to rotate are installed on the outer wall of the sealing side plate on one side. Through the conveying belt and the multiple groups of parallel SMT patch conveying areas divided on the surface of the conveying belt, a stable and ordered conveying platform can be provided for multiple groups of SMT patches, the position accuracy of the patches in the machining process is ensured, the sealing effect is improved through the sealing side plates on the two sides of the conveying belt in cooperation with the sealing rings which are tightly attached, and the service life of the SMT patches is prolonged. And meanwhile, the side slipping and falling risks of the patches in the conveying process are reduced, the negative pressure fan is communicated with the negative pressure through holes in the surface of the SMT patch conveying area, the stability of the patches on the conveying belt is enhanced, and falling of the patches is effectively prevented.

The invention discloses a silicon through hole sandwich cavity MEMS wafer level packaging method and a packaging body thereof, and belongs to the technical field of semiconductor chip packaging. Comprising an MEMS chip, an ASIC carrier plate chip, a cap wafer chip, an embedded interconnection mechanism, an upper silicon wafer bonding layer, a lower silicon wafer bonding layer, a silicon through hole, a step, a step bonding pad, a substrate, a plastic package shell, a plastic package shell cavity and an MEMS chip cavity. Through silicon via, wafer-level silicon-silicon bonding, lead bonding, SMT surface mounting technology, dry etching, chip inner cavity preparation and other technologies are comprehensively adopted, and low-cost and high-feasibility three-dimensional and miniaturized integration of the inertial MEMS chip is achieved. The problems that in an existing inertial MEMS chip three-dimensional integration technology, a wafer level scheme is complex in technology, high in initial cost, expensive in technology and equipment, poor in mechanical stress sensitivity, difficult in calibration test and low in maintainability are solved. The method is widely applied to the technical field of high-integration-density and high-power 3D packaging.

This utility model discloses a surface coating device for SMT (Surface Mount Technology) components, belonging to the technical field of SMT production and processing equipment. It includes a coating machine body, a maintenance door panel installed on the surface of the coating machine body, a feed inlet on the surface of the coating machine body, and a coating assembly disposed inside the coating machine body. An electrostatic elimination assembly is installed externally on the coating machine body. The electrostatic elimination assembly includes an assembly plate installed on the surface of the coating machine body, an assembly frame fixedly connected to the bottom end of the assembly plate, and a shaft frame mounted above the assembly frame. An automatic feeder is inserted through the feed inlet on the surface of the coating machine body. SMT components are placed on the surface of the automatic feeder and enter the interior of the coating machine body. When the SMT component moves to the inner position of the assembly frame, an ion fan is activated via an external control device to blow ion air onto the surface of the SMT component and the feeding area, eliminating static electricity and improving work safety and product coating quality.

This invention discloses a laser drilling inspection device for chip substrates, relating to the field of semiconductor manufacturing technology. The device includes a frame, a material handling mechanism, a positioning and moving platform, a laser drilling and marking assembly, a vision inspection assembly, and an industrial control computer. The material handling mechanism is mounted on the frame for picking up and placing chip substrates. The positioning and moving platform moves the chip substrate to the drilling position. The laser drilling and marking assembly is located above the positioning and moving platform for drilling reference holes and marking on the chip substrate. The vision inspection assembly detects the image information of the reference holes and markings on the processed chip substrate. The industrial control computer is mounted on the frame to determine whether the processed chip substrate is qualified based on the image information. This invention provides a laser drilling inspection device for chip substrates, offering a consistent manufacturing benchmark and corresponding traceability for subsequent processes such as surface mount technology (SMT), wire bonding, and packaging, thereby improving production efficiency.

This utility model discloses an SMT (Surface Mount Technology) dispensing equipment, aiming to achieve simultaneous or continuous dispensing and drying operations, improving efficiency, reducing floor space, and lowering costs. It includes a mounting plate, a horizontally mounted guide rail on the side wall of the mounting plate, and a sliding plate slidably connected to the guide rail and driven by a first lead screw, which is driven by a first motor. Dispensing heads and dryers are respectively located at both ends of the sliding plate's side wall, with their installation spacing equal to the station spacing between adjacent SMT substrate racks. The sliding plate can be aligned with the same coordinate point of different SMT components in a single linear movement. This innovative structural design integrates dispensing and drying processes, and with the single-axis linear motion control of the sliding plate, it completes both processes simultaneously in a single stroke, eliminating the ineffective time of reciprocating motion in traditional equipment and improving production efficiency.

The present application relates to the field of microelectronic packaging and surface mounting technology, and particularly relates to a chip hot press bonding machine based on double pressure control downstroke and a control method. The chip hot press bonding machine comprises a lifting frame, a hollow shaft slidably installed in the lifting frame along the axial direction, a vacuum suction nozzle installed at the lower end of the hollow shaft, a lifting driving mechanism connected with the lifting frame, and a small range pressure sensor and a large range pressure sensor fixed at a height relative to the lifting frame, and the hollow shaft is connected with an elastic element and an action block; the elastic element acts on the small range pressure sensor, and in the process of driving the lifting frame to move downward by the lifting driving mechanism, the vacuum suction nozzle drives the hollow shaft to ascend a preset stroke under the upward reaction force of the chip pressed by the vacuum suction nozzle, and then the action block abuts against the large range pressure sensor. The present application can adaptively control the downstroke according to the detected pressure, so as to accurately control the pressure applied to the chip by the vacuum suction nozzle in the process of chip suction and chip welding.

The utility model discloses a PCB (printed circuit board) cleaning machine for SMT (surface mount technology) production, which relates to the technical field of PCB cleaning equipment and comprises a box body, a conveying plate and a supporting plate, the conveying plate is mounted at the top of the back of the box body, and the supporting plate is mounted on one side of the front of the box body. A first servo motor can drive two threaded rods to rotate at the same time, then a movable block and a fixed plate can be driven to move, and then through arrangement of a first electric telescopic cylinder and a second electric telescopic cylinder, the position of a clamping assembly can be adjusted so as to adapt to PCBs of different sizes and shapes; and the PCB is conveyed to the ultrasonic cleaning chamber through the clamping assembly to be cleaned, the PCB can be air-dried immediately after being cleaned through the air-drying assembly installed at the top of the box body, and the PCB cleaning efficiency is improved.

The utility model relates to the technical field of SMT (Surface Mount Technology) surface mounting jigs, in particular to an SMT surface mounting jig without offset, which comprises a U-shaped bottom plate, two rotating plates rotationally connected inside the U-shaped bottom plate, two clamping mechanisms connected between the two rotating plates in a sliding manner, and a supporting mechanism mounted on the upper end surface inside the U-shaped bottom plate, a second threaded rod is rotationally connected between the left end face and the right end face in the moving frame, a third servo motor with the output end fixedly connected with the second threaded rod is installed on the outer wall of the moving frame, the two ends of the outer wall of the second threaded rod are both in threaded connection with door-shaped frames, and a sliding rod is fixedly connected between the left end face and the right end face in the moving frame; the distance between the four L-shaped clamping plates can be adjusted according to the specifications of SMT patches, so that the SMT patches of different specifications can be conveniently clamped and fixed, the lower ends of the SMT patches can be supported through cooperation of the electric push rod, the lifting plate and the supporting plate, and the SMT patches are prevented from deforming during mounting.