1040 results about "Reflow soldering" patented technology

The invention relates to the technical field of data processing, and discloses a method and system for monitoring the running state of reflow soldering equipment. The method comprises the steps of collecting data through a multi-point sensor, extracting temperature gradient, tension fluctuation and gas concentration characteristics, constructing a state recognition model, calculating a health index and setting an early warning threshold value, constructing a fault precursor extraction model to predict a future state, and finally establishing a maintenance strategy optimization system and generating an equipment maintenance plan based on fault early warning information. Through multi-dimensional data fusion and intelligent analysis, early accurate identification of the abnormal state of the equipment, accurate prediction of the fault development trend and active maintenance decision based on quality influence and cost optimization are realized, so that the welding quality stability is improved, the non-planned downtime is shortened, and the maintenance cost is reduced.

The invention discloses a visual inspection method and device for reflow soldering quality and computer equipment. The method comprises the steps of obtaining a to-be-detected product image entering a detection area; preprocessing the to-be-detected product image and extracting a welding spot ROI region; the welding spot ROI is put into a defect classification model for welding defect identification and classification, and a classification result is obtained; and determining an equipment parameter adjustment scheme according to the classification result in combination with a preset adjustment rule, and adjusting the reflow soldering equipment according to the equipment parameter adjustment scheme. By implementing the method, the welding spot quality can be automatically recognized in the welding process, the production parameters are automatically adjusted according to the detection result, the welding quality is effectively improved, potential quality problems are avoided, the production efficiency can be improved, manual intervention is reduced, and the labor cost is saved.

According to the device and method for controlling the connection void rate of the large-area thermal interface of the power electronic device provided by the invention, the device part ensures that an organic solvent and water vapor in a soldering paste layer can be smoothly discharged by optimizing the grid structure shape design of a steel mesh printing module, so that the void rate in the welding process is effectively reduced; according to the method, through optimization of the reflow soldering technology, temperature control and vacuum degree optimization of all stages such as the heating process, the heat preservation process, the pre-reflow process and the reflow process are included, the gas escape time is properly prolonged, the voidage is controlled to be 1% or below, the interface thermal resistance is reduced, and the heat dissipation performance is improved. Through optimization design and process, the production process is simplified, the operation is more convenient, the cost is low, and the method is suitable for large-scale production; and meanwhile, the voidage is effectively controlled, so that the product quality consistency in the production process is guaranteed, the heat dissipation efficiency of the power electronic device is improved, and the service life of the power electronic device is prolonged.

The invention discloses an intelligent assembly method of a precise connector, which comprises the following steps of: adding phase change particles with different melting points into tin-silver-copper-based solder according to the difference of functional areas of welding spots in the connector, generating an area formula index, and obtaining composite solder with partition identification; according to the area formula index, the composite welding flux is deposited to preset welding spot positions according to the functional areas, and particle distribution information is recorded; performing reflow soldering on different functional areas by adopting corresponding temperature curves according to the melting point parameters of the phase change particles, and recording the temperature history of each area; applying pulse thermal excitation to the packaged connector, and collecting a surface temperature change curve of each welding spot to obtain thermal response data; and performing correlation comparison on the thermal response data and process historical data, identifying the welding spot defect type according to curve deviation characteristics, and generating process adjustment parameters. According to the scheme, after the connector is completely packaged, rapid nondestructive detection of internal tiny welding spots can be realized, hidden defects can be effectively identified, and intelligent optimization and adjustment of process parameters can be realized.

The invention relates to the technical field of semiconductor chip packaging, in particular to a photoelectric co-packaging optical coupling passive alignment packaging structure and method. According to the invention, high-precision automatic alignment of the grating coupler in the optical chip and the through hole of the adapter plate is realized by using the solder ball tension effect in the flip reflow soldering process of the optical chip, and a stable optical limiting structure is formed. The passive coupling of the optical elements (such as bare optical fibers, optical fiber arrays, reflectors and the like) and the grating coupler is realized by placing the optical elements with matched sizes in the via holes of the adapter plate and completing refractive index matching and structure fixing by using curing glue. The whole process does not need additional active alignment equipment, is the same as a traditional chip packaging process, has the advantages of being simple in process, low in cost and high in packaging efficiency, and is a key packaging technology of a photoelectric co-packaging system in the future.

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor packaging process which comprises the following steps: obtaining a circuit board, and preprocessing the circuit board; performing SMT assembly operation on the bottom surface of the circuit board; silk-screening solder paste on the top surface of the circuit board; a tin cap of the flip chip is dipped with a soldering flux; mounting a flip chip and other elements on the top surface of the circuit board; performing reflow soldering operation on the top surface of the circuit board; according to the semiconductor packaging process provided by the embodiment of the invention, the tin cap of the flip chip can be dipped with the soldering flux before confluence welding operation is carried out on the flip chip, so that in the reflow soldering process, the soldering flux can effectively protect the tin cap and a PCB bonding pad and prevent oxidation, the collapsed tin cap can recover the original state of the tin cap to the greatest extent during reflow soldering, and the reliability of the flip chip is improved. The tin cap can be in contact with the PCB bonding pad more effectively, good welding is formed, the wettability is improved, oxidation is reduced, the welding strength is enhanced, and the problems of pseudo soldering, open circuit and the like are reduced.

An electronic package is mainly characterized in that a dam body is formed at the edge of the electronic package to prevent a packaging material from overflowing to the lower part, so that the packaging material does not contact a conductive element below the packaging material, and the problem that the conductive element is not wetted during subsequent reflow soldering of the conductive element can be avoided.

The invention relates to the technical field of semiconductor processing, in particular to an optical detection and repair system and method for a MiniLED chip after tin brushing and die bonding. The manufacturing method comprises a Mini LED production line, and a die bonding process, a repairing process and a reflow soldering process which are arranged on the Mini LED production line, through an automatic and precise production process, including key technologies such as SPI solder paste detection, double automatic optical detection, ultra-precise intelligent solder paste printing and nanoscale positioning die bonding, the production quality and efficiency of the MiniLED chip are remarkably improved, and the high qualified rate of products is ensured; through the synergistic effect of the optical detection module and the intelligent analysis module, the defects of the MiniLED chip are recognized and positioned, the efficient positioning and removing module is combined, defective products can be removed in time, production interruption is avoided, meanwhile, the stability of the product quality is guaranteed through bonding pad cleaning, activating treatment and re-detection procedures, and follow-up tracking management is facilitated.

The utility model relates to the technical field of aluminum substrate processing, in particular to a lead positioning tool for solving skewing of a reflow soldering lead of a double-layer aluminum substrate. The lead positioning tool comprises a carrier, two long lead positioning clamps and a short lead positioning clamp, the carrier is horizontally arranged, the upper end face of the carrier is provided with an assembling groove matched with the double-layer aluminum substrate, the short lead positioning clamp is detachably installed at the upper end of the carrier, and the long lead positioning clamps are detachably installed at the lower end of the carrier. A plurality of groups of short lead channels vertically penetrating through the double-layer aluminum substrate are arranged on the double-layer aluminum substrate, the two long lead positioning clamps are detachably arranged at two ends of the upper part of the double-layer aluminum substrate respectively, and the long lead positioning clamps are respectively provided with long lead channels vertically penetrating through the long lead positioning clamps. The structure has the advantages that the structure design is simple and reasonable, the long lead of a product can be ensured to be in a vertical state after being welded with the double-layer aluminum substrate, the stress caused by lead deflection in the assembly process is avoided, and the lead distance is ensured to meet the design requirement.

The invention discloses a controller based on patch silicon carbide power tubes, a control circuit board and a control method. The controller comprises a plurality of patch silicon carbide power tubes, the control circuit board, an insulation pad and a shell. A pin of each patch silicon carbide power tube in the plurality of patch silicon carbide power tubes is welded on the control circuit board by adopting over-reflow soldering, and a welding point arranged on a heat dissipation surface of each patch silicon carbide power tube is welded with the control circuit board; one end of the insulating pad is attached to the bottom in the shell, and the other end of the insulating pad is coated with heat-conducting silicone grease; the control circuit board is arranged in the shell, and the heat dissipation face of each patch silicon carbide power tube abuts against the end, coated with the heat conduction silicone grease, of the insulation pad. The SMD silicon carbide power tube is adopted, so that the installation process of the controller becomes simple, the installation cost is low, and the temperature of the wafer of the SMD silicon carbide power tube can be monitored more accurately.

The application relates to the technical field of integrally-formed inductors, in particular to a moisture-resistant soft magnetic composite material and a preparation method thereof and an integrally-formed inductor. The moisture-resistant soft magnetic composite material comprises the following components by mass: 100 parts of soft magnetic powder, 2-5 parts of a resin bonding agent and silicon resin, wherein the mass ratio of the silicon resin to the resin bonding agent is (0.3-2.0):100. The moisture-resistant soft magnetic composite material can avoid the phenomenon of explosion of the integrally-formed inductor during a reflow soldering process after moisture absorption.

Provided are a solder alloy, a solder ball, a preformed solder, a solder joint, and a circuit, which are excellent in wettability and shear strength, suitable in failure mode, capable of suppressing the growth of an intermetallic compound at a bonding interface even after multiple reflow soldering, excellent in drop impact resistance, and suitable in the shape of a bump. The solder alloy has an alloy composition comprising, in mass%, 0.10 to 3.00% of Ag, 0.80 to 6.00% of Cu, 0.08 to 0.60% of Ni, 0.0010 to 0.0150% of Ge, and the balance of Sn. It is preferable that the alloy composition further contains 0.1% or less of at least one of Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and rare earths in total.

The invention relates to a method for predicting the thermal stress of a flip-chip bonding micro-welding spot interconnection structure, which comprises the following steps of: performing a flip-chip bonding test on an electronic device based on a reflow soldering process, establishing a three-dimensional geometric model, and calculating the thermal stress of the micro-welding spot interconnection structure based on the change of the interconnection structure between the micro-welding spot and a Ni-P / Cu bonding pad in the flip-chip bonding process of the electronic device. Coupling the material attributes of the chip, the substrate, the micro-solder joint and the Ni-P / Cu bonding pad in the flip-chip bonding test to obtain an equivalent finite element model, and simulating corresponding flip-chip bonding based on a birth-death element method in the equivalent finite element model; and finally, calculating and identifying the maximum equivalent thermal stress distribution rule at the interface of the micro welding spot layer, the intermetallic compound layer and the bonding pad by using the equivalent finite element model, namely predicting the thermal stress of the flip-chip micro welding spot interconnection structure. Theoretical support is provided for improving the reliability of the flip-chip bonding micro-welding spot interconnection structure, and a theoretical foundation is laid for thermal stress regulation and control.

The invention belongs to the technical field of electronic packaging and welding materials, and relates to lead-free solder powder for reflow soldering and a preparation method of the lead-free solder powder. The lead-free solder powder is based on a Sn-Ag-Cu alloy system, and melt purification, beta-Sn grain refinement and interface IMC stabilization are achieved by compositely adding trace Ce and Ni elements. The Sn-Cu-Ce alloy comprises the following components in percentage by mass: 2.9%-3.1% of Ag, 0.45%-0.55% of Cu, 0.01%-0.10% of Ce, 0.01%-0.05% of Ni and the balance of Sn and impurities. During preparation, a Ce-Ni intermediate alloy is adopted to introduce microalloy elements, and the spherical solder powder is obtained through vacuum melting, inert gas atomization and surface treatment. The obtained solder powder is low in oxygen content, good in wettability, slow in interface IMC growth after backflow, high in welding spot strength and excellent in thermal cycle reliability, and is suitable for the field of high-reliability electronic packaging.

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

The invention provides a simulation simplification method for a reflow soldering packaging process. The simulation simplification method comprises the following steps: acquiring parameters of a plurality of components in a packaging structure and establishing a geometric model corresponding to each component; establishing an equivalent geometric model corresponding to each component; delimiting an equivalent area according to the density in the equivalent geometric model, performing material thermal equivalence on a part in the equivalent area, and generating an equivalent material model corresponding to the equivalent geometric model; establishing an equivalent simplified geometric model according to the equivalent geometric model and the equivalent material model corresponding to the equivalent geometric model; and establishing a simulation model according to the plurality of equivalent simplified geometric models. According to the invention, the problems of low simulation efficiency and large resource consumption of a simulation method of a reflow soldering packaging process in the prior art are solved.

The invention discloses a high-strength photovoltaic welding flux for a photovoltaic welding strip and a preparation method of the high-strength photovoltaic welding flux, and belongs to the technical field of energy conservation and environmental protection. According to the solder, the Sn-Zn-Bi alloy is used as a matrix, and the performance is comprehensively improved by introducing a dual nano reinforced phase of the multi-walled carbon nanotubes and the nano nickel particles. The preparation method comprises the steps of matrix alloy melting, a hydrothermal method, a liquid phase reduction method, ultrasonic dispersion, gas atomization powder preparation, silane coupling agent surface modification, scaling powder compounding, reflow soldering and the like. The obtained solder has excellent comprehensive performance, excellent thermal fatigue resistance and long-term reliability. The welding flux is suitable for interconnection welding of a main grid, a fine grid and a welding strip of a crystalline silicon photovoltaic cell, and provides technical guarantee for the service life of a photovoltaic module more than 25 years.

The invention provides an electronic component intelligent production control method and system, electronic equipment and a storage medium, and relates to the technical field of electronic component intelligent manufacturing, and the method comprises the steps: synchronously collecting second-level power consumption data, temperature field distribution information and environment temperature and humidity data of a chip mounter, reflow soldering equipment and optical detection equipment; and fusing to generate multi-source time sequence stream data. And generating thermal imaging data based on temperature field distribution, identifying an abnormal power consumption region, extracting cross-equipment cycle correlation characteristics through expansion convolution operation in combination with multi-source time sequence flow data, and predicting future energy efficiency state change points. And decomposing the global energy efficiency target into chip mounter start-stop time sequence constraint, reflow soldering power parameter constraint and optical detection sampling frequency constraint by using a time sequence target cascading algorithm to realize multi-device coordinated regulation and control. According to the invention, the energy efficiency management level and the product yield stability of the electronic component production line are improved.

The utility model provides a small-sized integrated diode device, which comprises a tube shell provided with a cavity and more than two groups of diode functional components arranged in the cavity of the tube shell, each group of diode function components comprises a diode bare chip, a packaging electrode and a metal wire; a plurality of welding islands are arranged on the wall of the cavity; the diode bare chips and the packaging electrodes are respectively arranged on the welding islands; the cathode of the diode bare chip is attached to the welding island so that the welding island where the diode bare chip is located forms a cathode welding island, and the anode of the diode bare chip is bonded with the packaging electrode through a metal wire so that the welding island where the packaging electrode is located forms an anode welding island; and an electric gap is formed between every two adjacent welding islands. According to the diode device, a plurality of diodes are integrated, and the space size occupied by the diodes in a circuit can be greatly optimized, so that the size and the weight of equipment are reduced, the time for reflow soldering is reduced, the efficiency is higher, and the requirements of miniaturization, light weight and high efficiency of the current market are met.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The utility model discloses a testing device for a damp-heat test of a plastic package device, which comprises a test board system and a high-acceleration test system, and the test board system is connected with the high-acceleration test system. The test board system comprises a PCB, a golden finger, a power supply jumper wire, a device welding area, a protective tube welding area and a support, the golden finger is connected with the PCB, and the golden finger, the power supply jumper wire, the protective tube welding area and the device welding area are electrically connected in sequence. According to the utility model, the test board is provided with the power supply jumper wire and the protective tube welding area, so that the electrical connection abnormity of a plug-in jumper wire structure and a plug-in protective tube caused by the oxidation of a connector lug in a humid and hot environment is avoided; the device welding area and the corresponding welding station are arranged, a to-be-tested device product is placed at the position of the welding pad during welding, welding is conducted through reflow soldering, and the situation that electric connection is abnormal due to the fact that a probe head is oxidized in a hot and humid environment in a testing seat connection mode is avoided.

The invention relates to the technical field of MEMS radiator processing, in particular to a processing method of an MEMS radiator, which comprises the following steps of: 1, manufacturing an air inlet grid opening, a gas advection bin body, a vibration upper opening binding ring, a piezoelectric vibrator, a flexible circuit board, a vibrator amplification layer, a gas beam dense hole layer and an impact platform according to the size; 2, the flexible circuit board and the piezoelectric vibrator form a circuit piezoelectric vibrator through reflow soldering; 3, the air inlet advection bin body, the vibration upper opening binding ring, the circuit piezoelectric vibrator, the vibrator amplification layer, the air beam dense hole layer and the impact platform are assembled from top to bottom. According to the machining method of the MEMS radiator, firstly, solder paste is printed on a flexible circuit board steel mesh to lead welding spots, the flexible circuit board steel mesh and the piezoelectric vibrator are placed into a clamp together to be fixed, and then the flexible circuit board steel mesh is welded to the piezoelectric vibrator; the circuit piezoelectric vibrator prepared by the method is reliable and durable, and welding spots are not easy to fall off, so that the piezoelectric vibrator can have better stability in high-frequency vibration.

The invention relates to the technical field of fluid machinery, in particular to a heater and a compressor assembly, a ceramic heating plate is arranged on a heat conducting plate through nickel plating, reflow soldering and the like, heat is transferred to a containing space of the heater through the heat conducting plate, and the situation that the ceramic heating plate directly makes contact with fluid, boiling is generated, and consequently the heat exchange efficiency is reduced is avoided. The combination mode of nickel plating bottom welding can enable the ceramic heating plate and the heat conduction plate to be combined more tightly, heat loss is small during heat conduction, and heat exchange efficiency is not affected.

The utility model discloses a copper gasket welding positioning and clamping tool which comprises a plurality of positioning pins arranged at intervals, elastic pieces are sleeved on the positioning pins, and detachable limiting pieces are horizontally inserted at the upper ends of the positioning pins. In the production process, even if part of parts are damaged, the parts can be replaced in time, the comprehensive time consumption can be effectively reduced, clamping and positioning are achieved through a spring structure after positioning of the positioning pin is completed, the clamping tool is convenient to assemble and use, assembly line work during reflow soldering can be achieved through a convenient and rapid disassembly and assembly mode, and the production efficiency is remarkably improved.

The invention relates to the technical field of industrial control, in particular to an SMT production process quality control method and system. The SMT production process quality control system comprises a soldering paste distribution condition real-time acquisition module, an electromagnetic coil array parameter adjustment module and a reinforcement learning module. The electromagnetic coil array is arranged around the reflow soldering furnace, the infrared thermal imaging technology is combined, the thermal image of the PCB is obtained in real time and sent into the soldering paste segmentation model to be processed, the flowing state of the soldering paste is accurately represented, the system can dynamically adjust the control parameters of the electromagnetic coil array based on the soldering paste distribution thermodynamic diagram, and the stability of the reflow soldering system is improved. Comprise current intensity, current frequency, waveform and the like, so that the electromagnetic field is accurately adjusted, the flowability of the solder paste is optimized, excessive or too little solder paste accumulation is avoided, and the risks of solder bridge and insufficient solder are reduced.

The invention discloses an intelligent temperature control vacuum reflow soldering machine in a negative pressure environment, which comprises a vacuum reflow soldering machine main body, the vacuum reflow soldering machine main body comprises a lower rack, an upper machine cover, an intelligent control module, a feeding transmission part, a discharging transmission part and a negative pressure vacuum part, the intelligent control module is arranged at the left end of the lower rack, and a soldering furnace pipe is arranged in the lower rack; the feeding transmission part, the discharging transmission part and the negative pressure vacuum part are arranged in the welding furnace pipe, and the upper machine cover is movably arranged on the lower machine frame and can cover the welding furnace pipe in a buckled mode. According to the intelligent temperature control vacuum reflow soldering machine in the negative pressure environment, the whole vacuum reflow soldering machine body provides the reflow soldering environment with the temperature exceeding 400 DEG C and the absolute vacuum degree smaller than 1 mbar, segmented fast and slow vacuumizing is carried out, the service life of a sealing ring in the high-temperature environment can be longer than 3 months, and the service life of the sealing ring in the high-temperature environment can be prolonged. And compared with common reflow soldering, the low voidage of product soldering is achieved.

The invention discloses a reflow soldering curve measuring method. The method comprises the steps that S1, a temperature measuring plate is manufactured; the temperature measuring plate comprises an aluminum substrate, a device is fixedly arranged above the aluminum substrate by smearing silver adhesive, a thermocouple is arranged on the device, the front end of the thermocouple is fixedly arranged on a device body through conductive adhesive, and a wire body on the thermocouple is fixed through high-temperature-resistant adhesive tape. One end, far away from the thermocouple, of the wire body is connected to a furnace temperature measuring instrument, and the surface temperature of the device is detected and recorded in the measuring process; s2, measuring a curve; and S3, data management. The invention belongs to the field of reflow soldering curve measuring methods, and particularly relates to a reflow soldering curve measuring method. According to the method, by designing and combining existing test methods, furnace temperature curves of reflow corresponding to devices of different packaging types are innovated on the basis of IPC-JEDEC J-STD-020F-2022 Moisture Reflow Sensitivity for Non-Hermetic Surface Mount Devices (SMDs), and the accuracy rate of selecting the reflow curve during a pretreatment test is improved.

The present invention provides an acrylate composition containing a BMI resin and a use. A conductive silver adhesive is obtained by using a liquid BMI resin with maleimide as a terminal group and maleic anhydride grafted polybutadiene as oligomers, combining with monofunctional and bifunctional acrylate monomers, a peroxide initiator, a silane coupling agent and silver powder, and fully and uniformly dispersing same, and the conductive silver adhesive can be rapidly cured under the mild condition of 120°C×30 min, so as to achieve low-temperature rapid curing. In addition, a cured product obtained by the acrylate composition of the BMI resin and the maleic anhydride grafted polybutadiene has low volume resistivity, low thrust at normal temperature (23°C), good failure surface, good bonding strength at a high temperature (300°C) and good reflow soldering resistance. The acrylate composition can be applied to semiconductor device packaging, especially IC chip mounting.

The invention discloses reflow soldering equipment and process for SMT patch production. The reflow soldering equipment comprises a furnace body base, a conveying unit, a hearth and a sealing top cover. A conveying unit is horizontally laid on the furnace body base, the hearth is installed on the upper end face of the furnace body base in a sealed mode, and the interior of the hearth is evenly divided into three independent working areas which are the preheating area, the backflow area and the cooling area in sequence from left to right. A visual inspection chamber is installed at the position, located at the feeding end of the hearth, of the upper portion of the furnace body base. A heating device is arranged in each working area of the hearth; in the heating device of the backflow area, each microplate is slidably provided with a vertically arranged hot spray pipe, and the hot spray pipes can perform hot air pulse direct blowing on large-size surface-mounted elements on a PCB, directly heat pin welding spots, realize micro-swing attachment of the elements in cooperation with surface tension of solder paste, and eliminate mechanical stress when the chip mounter is placed.