533 results about "Reflow soldering" patented technology

The application relates to the technical field of integrally-formed inductors, in particular to a moisture-resistant soft magnetic composite material and a preparation method thereof and an integrally-formed inductor. The moisture-resistant soft magnetic composite material comprises the following components by mass: 100 parts of soft magnetic powder, 2-5 parts of a resin bonding agent and silicon resin, wherein the mass ratio of the silicon resin to the resin bonding agent is (0.3-2.0):100. The moisture-resistant soft magnetic composite material can avoid the phenomenon of explosion of the integrally-formed inductor during a reflow soldering process after moisture absorption.

The invention relates to a method for predicting the thermal stress of a flip-chip bonding micro-welding spot interconnection structure, which comprises the following steps of: performing a flip-chip bonding test on an electronic device based on a reflow soldering process, establishing a three-dimensional geometric model, and calculating the thermal stress of the micro-welding spot interconnection structure based on the change of the interconnection structure between the micro-welding spot and a Ni-P / Cu bonding pad in the flip-chip bonding process of the electronic device. Coupling the material attributes of the chip, the substrate, the micro-solder joint and the Ni-P / Cu bonding pad in the flip-chip bonding test to obtain an equivalent finite element model, and simulating corresponding flip-chip bonding based on a birth-death element method in the equivalent finite element model; and finally, calculating and identifying the maximum equivalent thermal stress distribution rule at the interface of the micro welding spot layer, the intermetallic compound layer and the bonding pad by using the equivalent finite element model, namely predicting the thermal stress of the flip-chip micro welding spot interconnection structure. Theoretical support is provided for improving the reliability of the flip-chip bonding micro-welding spot interconnection structure, and a theoretical foundation is laid for thermal stress regulation and control.

The invention belongs to the technical field of electronic packaging and welding materials, and relates to lead-free solder powder for reflow soldering and a preparation method of the lead-free solder powder. The lead-free solder powder is based on a Sn-Ag-Cu alloy system, and melt purification, beta-Sn grain refinement and interface IMC stabilization are achieved by compositely adding trace Ce and Ni elements. The Sn-Cu-Ce alloy comprises the following components in percentage by mass: 2.9%-3.1% of Ag, 0.45%-0.55% of Cu, 0.01%-0.10% of Ce, 0.01%-0.05% of Ni and the balance of Sn and impurities. During preparation, a Ce-Ni intermediate alloy is adopted to introduce microalloy elements, and the spherical solder powder is obtained through vacuum melting, inert gas atomization and surface treatment. The obtained solder powder is low in oxygen content, good in wettability, slow in interface IMC growth after backflow, high in welding spot strength and excellent in thermal cycle reliability, and is suitable for the field of high-reliability electronic packaging.

The invention discloses a high-strength photovoltaic welding flux for a photovoltaic welding strip and a preparation method of the high-strength photovoltaic welding flux, and belongs to the technical field of energy conservation and environmental protection. According to the solder, the Sn-Zn-Bi alloy is used as a matrix, and the performance is comprehensively improved by introducing a dual nano reinforced phase of the multi-walled carbon nanotubes and the nano nickel particles. The preparation method comprises the steps of matrix alloy melting, a hydrothermal method, a liquid phase reduction method, ultrasonic dispersion, gas atomization powder preparation, silane coupling agent surface modification, scaling powder compounding, reflow soldering and the like. The obtained solder has excellent comprehensive performance, excellent thermal fatigue resistance and long-term reliability. The welding flux is suitable for interconnection welding of a main grid, a fine grid and a welding strip of a crystalline silicon photovoltaic cell, and provides technical guarantee for the service life of a photovoltaic module more than 25 years.

The invention provides an electronic component intelligent production control method and system, electronic equipment and a storage medium, and relates to the technical field of electronic component intelligent manufacturing, and the method comprises the steps: synchronously collecting second-level power consumption data, temperature field distribution information and environment temperature and humidity data of a chip mounter, reflow soldering equipment and optical detection equipment; and fusing to generate multi-source time sequence stream data. And generating thermal imaging data based on temperature field distribution, identifying an abnormal power consumption region, extracting cross-equipment cycle correlation characteristics through expansion convolution operation in combination with multi-source time sequence flow data, and predicting future energy efficiency state change points. And decomposing the global energy efficiency target into chip mounter start-stop time sequence constraint, reflow soldering power parameter constraint and optical detection sampling frequency constraint by using a time sequence target cascading algorithm to realize multi-device coordinated regulation and control. According to the invention, the energy efficiency management level and the product yield stability of the electronic component production line are improved.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention relates to the technical field of MEMS radiator processing, in particular to a processing method of an MEMS radiator, which comprises the following steps of: 1, manufacturing an air inlet grid opening, a gas advection bin body, a vibration upper opening binding ring, a piezoelectric vibrator, a flexible circuit board, a vibrator amplification layer, a gas beam dense hole layer and an impact platform according to the size; 2, the flexible circuit board and the piezoelectric vibrator form a circuit piezoelectric vibrator through reflow soldering; 3, the air inlet advection bin body, the vibration upper opening binding ring, the circuit piezoelectric vibrator, the vibrator amplification layer, the air beam dense hole layer and the impact platform are assembled from top to bottom. According to the machining method of the MEMS radiator, firstly, solder paste is printed on a flexible circuit board steel mesh to lead welding spots, the flexible circuit board steel mesh and the piezoelectric vibrator are placed into a clamp together to be fixed, and then the flexible circuit board steel mesh is welded to the piezoelectric vibrator; the circuit piezoelectric vibrator prepared by the method is reliable and durable, and welding spots are not easy to fall off, so that the piezoelectric vibrator can have better stability in high-frequency vibration.

The invention relates to the technical field of fluid machinery, in particular to a heater and a compressor assembly, a ceramic heating plate is arranged on a heat conducting plate through nickel plating, reflow soldering and the like, heat is transferred to a containing space of the heater through the heat conducting plate, and the situation that the ceramic heating plate directly makes contact with fluid, boiling is generated, and consequently the heat exchange efficiency is reduced is avoided. The combination mode of nickel plating bottom welding can enable the ceramic heating plate and the heat conduction plate to be combined more tightly, heat loss is small during heat conduction, and heat exchange efficiency is not affected.

The invention relates to the technical field of industrial control, in particular to an SMT production process quality control method and system. The SMT production process quality control system comprises a soldering paste distribution condition real-time acquisition module, an electromagnetic coil array parameter adjustment module and a reinforcement learning module. The electromagnetic coil array is arranged around the reflow soldering furnace, the infrared thermal imaging technology is combined, the thermal image of the PCB is obtained in real time and sent into the soldering paste segmentation model to be processed, the flowing state of the soldering paste is accurately represented, the system can dynamically adjust the control parameters of the electromagnetic coil array based on the soldering paste distribution thermodynamic diagram, and the stability of the reflow soldering system is improved. Comprise current intensity, current frequency, waveform and the like, so that the electromagnetic field is accurately adjusted, the flowability of the solder paste is optimized, excessive or too little solder paste accumulation is avoided, and the risks of solder bridge and insufficient solder are reduced.

The invention discloses a MicroLED chip packaging unit, a head-mounted display device and a preparation method of the MicroLED chip packaging unit. The MicroLED chip packaging unit comprises a substrate and a MicroLED chip, and the substrate is provided with a plurality of first bonding pads which are insulated from one another; the MicroLED chip is arranged on the first surface and is electrically connected with the first bonding pad. According to the packaging structure of the MicroLED chip, the packaging structure can be connected with an external circuit board through the first bonding pad on the substrate, so that control over the MicroLED chip is achieved, the size of the packaging unit of the MicroLED chip can be made to be smaller, universality is better, the defect that an existing packaging structure for packaging the MicroLED chip on the flexible circuit board is insufficient in application scene is overcome, and the inventory risk is reduced. Moreover, the MicroLED chip packaging unit can be welded and connected with an external circuit board through a reflow soldering mode, and the connection is very convenient.

The invention discloses a semiconductor chip packaging method, and relates to the technical field of semiconductor packaging, and the method comprises the steps: carrying out the salient point preparation of a semiconductor chip, carrying out the data collection, obtaining a salient point shape data set, carrying out the cleaning after the preparation of a substrate, obtaining the surface data of the substrate, fusing the surface data of the substrate with the salient point shape data set, generating a shape quality data set, and carrying out the processing of the shape quality data set. The method comprises the following steps: establishing a chip prediction model, outputting a welding spot failure probability and optimized process parameters, overturning a chip, performing alignment operation to obtain a chip and a substrate assembly which are subjected to alignment, performing welding parameter optimization through a reflow soldering furnace, forming a uniform intermetallic compound, and obtaining a welded chip and substrate assembly. And according to the welded chip and substrate assembly, a dispensing machine and a molding press are used for processing, and a packaged chip assembly is obtained. According to the method, the chip prediction model is established, so that the failure rate of the welding spots is remarkably reduced, the adaptability of process parameters is improved, and missing detection of the failed welding spots is avoided.

The invention relates to the field of integrated circuit manufacturing, in particular to a high-precision positioning jig for an SMT (surface mount technology) mounting line, which comprises a tray for bearing a circuit board, the positioning mechanism is arranged on the tray and comprises a pressing assembly and a wedge-shaped assembly, and the wedge-shaped assembly is used for triggering the pressing assembly to press and position the circuit board before solder paste printing; according to the invention, the tray is used for bearing the circuit board, and the wedge-shaped assembly in the positioning mechanism is used for triggering the pressing assembly to carry out horizontal pressing positioning on the circuit board, so that the assembly is ensured to be flush with the upper surface of the tray in a non-working state, and the requirement of solder paste printing and component surface mounting for no projection interference is met; the steel mesh attaching gap or visual identification interference is avoided; and a limiting assembly is triggered by a shifting assembly in the reinforcing mechanism to tightly press the circuit board in the vertical direction, so that the fixed dimension is supplemented, and multidirectional stress generated by thermal expansion of the circuit board at high temperature in reflow soldering is effectively counteracted.

The invention relates to the technical field of reflow soldering, and discloses a jig and a reflow soldering method of a substrate chip, the jig comprises a base, a cover plate and a connecting device, the base comprises a base main body and a separation rib, the base main body is provided with a groove, the bottom wall of the groove is provided with a first heat conduction through hole, and the separation rib is arranged in the groove; the groove is divided into at least two accommodating grooves; the cover plate comprises a frame main body and a separation beam, a hollow part is arranged in the middle of the frame main body, the position of the hollow part corresponds to the position of the groove, and the separation beam is arranged on the frame main body and located in the hollow part so that the hollow part can be separated into at least two heat conduction channels; the frame body and the base body are detachably connected through a connecting device. In the structure, the groove is divided into at least two accommodating grooves for accommodating the substrate, and the area of the substrate is relatively small, so that when the jig is used for reflow soldering, the substrate does not warp and the like, and pseudo soldering and false soldering between the substrate and the chip are avoided.

The invention discloses a method for improving backboard PTH macropore explosion, which comprises the following steps: a production board is provided, an inner circuit of the production board comprises at least one thick circuit layer with the thickness of 2oz, and the rest inner circuit layers are thin circuit layers with the thickness of 1oz; a drilling position with the outer diameter of 4.5 mm is arranged on the production plate; a copper disc with the outer diameter larger than 4.5 mm is arranged at the position, corresponding to the drilling position, in the thick circuit layer, and a circle of copper-free first isolating ring is formed between the periphery of the copper disc and the surrounding copper face. Large holes are drilled in the corresponding drilling positions, so that the holes are metalized; filling resin in the large holes, curing, and removing the resin protruding out of the plate surface through a grinding plate; an outer layer circuit is manufactured on the production board, a hole ring is manufactured around the large hole, a copper-free second isolating ring is formed between the periphery of the hole ring and the peripheral copper surface, and at least one connecting rib for connecting the hole ring and the peripheral copper surface is arranged between the hole ring and the peripheral copper surface. The method provided by the invention solves the problems that the substrate is leaked from the orifice after board grinding and the board is exploded after reflow soldering.

The reflow soldering supporting device comprises a supporting frame, a lifting frame and a rotating plate, the bottom end of the lifting frame is connected with the top end of the supporting frame in an inserted mode, and the two supporting plates are arranged at the two ends of the upper surface of the lifting frame and are symmetrically arranged; the adjusting assembly is arranged on one side of the supporting plate; the lifting assembly is arranged between the lifting frame and the supporting frame; and the rotating assembly is arranged between the lifting frame and the rotating plate. According to the reflow soldering supporting device for the smt plate, the first driving motor drives the worm to rotate, the worm drives the worm gear to rotate, then the rotating plate stably rotates in the annular groove, a worm gear and worm transmission structure has the self-locking performance, the rotating angle of the rotating plate can be accurately controlled, the welding defect caused by angle deviation is avoided, and the stability and reliability of the reflow soldering supporting device are improved. According to the SMT plate welding angle adjusting device, accurate angle adjustment is provided for welding of an SMT plate, welding defects such as insufficient welding and welding skips are reduced, and therefore the yield of products is improved, and the production cost is reduced.

The invention relates to the technical field of chip mounting, and discloses a rail pressure sensor chip mounting device, which comprises a placement platform provided with a three-axis linear module and a conveying assembly; the connecting seat is fixedly mounted at the movable end of the three-axis linear module, a mounting seat is arranged at the bottom of the connecting seat, two clamping frames are fixedly mounted at the bottom of the mounting seat, and correcting grooves are formed in the opposite sides of the two clamping frames; the scraping assembly is arranged on the side edge of the mounting seat and is used for cleaning redundant soldering paste at the pin after reflow soldering; the cleaning assembly is arranged on the other side of the mounting base and used for cleaning and collecting the soldering paste left on the scraping assembly; according to the invention, through cooperation of a plurality of assemblies, the problem of dislocation of chip pins and bonding pads and the problem of connection of welding spots between the pins after welding can be effectively solved, the whole process is high in automation degree, the mounting precision and the production efficiency are greatly improved, and the welding quality of the rail pressure sensor chip is ensured.

The invention provides a lead welding method for a semiconductor chip, and belongs to the technical field of semiconductor packaging. The method comprises the following steps: processing a metal capillary tube into a through-hole-shaped female end with a preset length, and carrying out functional coating treatment on the inner surface and the outer surface of the through-hole-shaped female end; positioning the plated female end in a manner that the through hole is axially parallel to a chip bonding pad, and fixing the plated female end by reflow soldering of a first solder; carrying out pre-tinning treatment on the welding end of the metal lead; inserting a lead welding end into the female end through hole; and low-temperature reflow soldering with the peak temperature lower than the melting point of the first solder is carried out, so that the tin coating is molten and metallurgically bonded with the inner surface coating of the female end. By introducing the capillary tube female end which is low in cost and easy to process and a step-by-step low-temperature welding process, the heat damage risk of the heat-sensitive semiconductor chip is remarkably reduced while the connection reliability is ensured, the production efficiency and the process compatibility are improved, and the method is particularly suitable for wire bonding of thermoelectric refrigeration chips.

The invention discloses an oxidation improvement method for an FPC bonding pad with an electronic connector. The oxidation improvement method comprises the steps that S1, an SMT bonding pad heat insulation jig is prepared; s2, the SMT bonding pad heat insulation jig is installed on an SMT carrier plate provided with an FPC; s3, high-temperature procedures of SMT reflow soldering, FR4 / PI press fit and FR4 press fit baking are executed; s4, the SMT bonding pad heat insulation jig is removed; and S5, carrying out a wave soldering process. Before the FPC is subjected to the high-temperature working procedure, the SMT bonding pad heat insulation jig is installed at the bonding pad position of the FPC connector, and the oxidation risk of the FPC and the connector bonding pad in the high-temperature working procedure is remarkably reduced through the synergistic effect of multi-stage heat insulation and rapid positioning of the SMT bonding pad heat insulation jig. The problems that in the prior art, due to high-temperature oxidation of a bonding pad and manual wiping with an eraser, the labor cost is high, and chippings are left can be solved.

A method and apparatus for multiple flexible circuit cable connections is described. Gold bumps are bonded on the interconnect pads of the substrate to form a columnar structure, and solder or conductive epoxy is dispensed on the flexible circuit cable. The substrate and flexible circuit cable are aligned and pressed together with force or by placing a weight on the substrate or flexible circuit cable. Appropriate heat is applied to reflow the solder or cure the epoxy. With the aid of the gold bumps, the solder wets to the substrate pads and has a reduced risk of bridging due to the columnar structure. Non-conductive underfill epoxy is applied to increase mechanical strength.

The embodiment of the invention provides a manufacturing method of a test paper connector, the test paper connector and a glucometer, and relates to the field of blood glucose detection. The manufacturing method of the test paper connector comprises the following steps: adjusting the height h of the pin of the test paper seat plug-in device to be lower than the height H of the positioning column; mounting a test paper holder plug-in device and a bottom surface component on the PCB; performing reflow soldering on the test paper holder plug-in device and the bottom surface component; and mounting a top surface component on the top surface of the PCB. According to the manufacturing method disclosed by the embodiment of the invention, the sizes of the positioning columns and the pins of the test paper seat plug-in device are adjusted, the pins are prevented from scraping a steel mesh, the test paper seat plug-in device is mounted in the jacks when the components on the bottom surface of the PCB are mounted, and then reflow soldering is performed together, so that the test paper seat plug-in device does not need to be manually post-welded, the operation step of manual welding is omitted, and the production efficiency is improved. One mounting operation procedure is reduced, the production efficiency can be improved, and the production cost is reduced. The embodiment of the invention also provides a test paper connector and a glucometer.

This tool set provides a reliable reflow solder joint for electronic components to be connected to a target area, while preventing unintended melting of the solder-plated area. [Solution] A jig set according to one aspect of the present disclosure is a jig set for holding a printed circuit board when reflow soldering an electronic component to a connection portion formed on the printed circuit board having one or more solder-plated portions, comprising: a first jig disposed on a first surface of the printed circuit board on which the connection portion is formed; and a second jig supporting a second surface of the printed circuit board opposite to the first surface, wherein at least one of the first jig and the second jig has a heat conduction reduction structure in the portion that overlaps with the solder-plated portion in a plan view to reduce heat conduction to the solder-plated portion.

The invention provides a high-yield low-capacitance TVS (Transient Voltage Suppressor) diode packaging process, which comprises the following steps: S1, back metallization: a sputtering table is adopted, the thickness of Ti / Ni / Ag is 50 / 200 / 800nm, and the back temperature is lt; the contact resistance is less than or equal to 0.05 m omega.mm < 2 > and the resistance is gt; 0.08, sputtering again; s2, wafer thinning and stress release are carried out; s3, front passivation / low-k dielectric layer preparation; s4, preparing an aluminum-copper bump; s5, performing laser scribing; s6, inversely mounting a patch; s7, performing vacuum reflow soldering; s8, plasma cleaning and plasma underfilling are carried out; and S9, laser marking is carried out. According to the process, five contradictions of'extreme low capacitance, extreme yield, low temperature drift, zero cavity and green manufacturing 'are simultaneously grounded in the same package, so that the TVS device really meets the dual requirements of a 40Gbps high-speed interface and a vehicle gauge for the first time.

The utility model discloses a welding jig, the welding jig is used for supporting a board body of a PCBA and a first type of components on the PCBA, and the welding jig at least comprises a jig body, an extension part and an elastic supporting assembly. Wherein the jig body is provided with a through hole penetrating through the top surface and the bottom surface of the jig body; an extension part connected with the jig body comprises a first extension part with a first supporting part, and the first supporting part is located below the through hole and is spaced from the first type of component; the elastic supporting assembly is connected with the first supporting part and located under the first type of component, and the elastic supporting assembly makes contact with the bottom face of the first type of component under the action of the elastic force of the elastic supporting assembly so as to support the first type of component. According to the technical scheme provided by the invention, the possibility of device displacement in the secondary reflow soldering process of the PCBA can be reduced, and the soldering quality is improved.

The invention relates to the technical field of electronic packaging and welding, and provides a solder presetting and in-situ brazing method for a deep-hole three-dimensional welding seam, which comprises the following steps of: presetting a bonding pad structure at the edge of a three-dimensional welding seam of a circuit board with an integrally formed or spliced structure, continuously depositing solder balls with different melting points at fixed intervals through laser ball mounting, forming a solder ball array with a mixed solder loading structure; and reflow soldering is conducted, and accurate soft soldering of the deep hole three-dimensional welding seam is completed through supporting and surface tension constraint of the high-melting-point brazing filler metal framework on the molten brazing filler metal. According to the method, accurate connection of the deep hole three-dimensional welding seam can be achieved, and the size and components of the interconnection structure can be accurately controlled.

The invention discloses a board-level maintenance method suitable for a high-density packaging circuit board, and the method comprises the following steps: S1, dismounting a chip needing to be maintained from a circuit board; s2, cleaning residual soldering tin on the surface of a bonding pad of the chip; s3, detecting the bonding pad, and if the bonding pad is detected to be unqualified, returning to the step S2; s4, the chip is fixed and installed on a two-dimensional motion platform through a clamp, a bonding pad array of the chip is shot through a visual subsystem and sent to a numerical control printing system, a printing array point is generated, a numerical control program is started, and a spray head moves to the position of a corresponding welding spot to conduct successive printing till welding spot printing of the whole printing array is completed; s5, carrying out bump array detection on the printed bonding pad, if the bump array of the bonding pad is detected to be qualified, carrying out reflow soldering, and if the bump array of the bonding pad is detected to be unqualified, repeating the steps S2 to S4; s6, performing patch packaging on the maintained chip; and S7, carrying out quality detection on the maintained circuit board.

The invention discloses a high-density large-current LED (light-emitting diode) module based on an improved copper substrate circuit, which is characterized in that a traditional single'lane 'is widened into a plurality of'lanes' by additionally arranging a third bonding pad which is not electrically connected with an anode and a cathode at the bottom of a lamp bead and an auxiliary current path which is arranged on a copper substrate and corresponds to the third bonding pad; a low-resistance path is provided for current, and the current capacity, the packaging density, the heat dissipation performance and the welding yield are remarkably improved. Meanwhile, the adjacent welding bosses belonging to the same electrical network are connected through one or more solder paste flowing channels. The solder paste flowing channel is an exposed copper foil channel formed after etching. In the reflow soldering process, molten soldering tin can flow in the boss and the channel system which are communicated with each other to automatically compensate the tin quantity difference on each bonding pad, so that the uniformity of the welding height is realized, and the defects of tombstone standing, deviation, pseudo soldering and the like are effectively prevented.

The invention provides a chip packaging structure and a chip packaging method, and relates to the technical field of semiconductor packaging. The packaging structure comprises a substrate, a concave bonding pad and a convex bonding pad are formed on the surface of the substrate, the concave bonding pad is concave downwards relative to the surface of the substrate, and the convex bonding pad is convex upwards relative to the surface of the substrate; the first chip is electrically connected with the board through the convex bonding pad; and the second chip is electrically connected with the substrate through the concave bonding pad. Through the differential design of the concave and convex bonding pads and the double-layer peelable structure, the reflow soldering temperature of 200-220 DEG C is supported, compared with 180-200 DEG C of a traditional PS carrier tape, the reflow soldering temperature of 180-200 DEG C is remarkably improved, the connection stability and reliability in a high-temperature process are remarkably improved, a temporary carrier tape which needs to be independently used in the traditional process is omitted, the manufacturing cost is reduced, and the production efficiency is improved. And the method is suitable for complex packaging application requiring multiple welding.

This invention belongs to the field of electronic packaging and soldering materials technology, and relates to a lead-free solder powder for reflow soldering and its preparation method. This lead-free solder powder is based on a Sn-Ag-Cu alloy system, and achieves melt purification, β-Sn grain refinement, and interface IMC stabilization by adding trace amounts of Ce and Ni elements. Its composition, by mass percentage, is: Ag 2.9%–3.1%, Cu 0.45%–0.55%, Ce 0.01%–0.10%, Ni 0.01%–0.05%, with the balance being Sn and impurities. During preparation, a Ce-Ni master alloy is used to introduce microalloying elements, followed by vacuum melting, inert gas atomization, and surface treatment to obtain spherical solder powder. The resulting solder powder has low oxygen content, good wettability, slow interface IMC growth after reflow, high solder joint strength, and excellent thermal cycling reliability, making it suitable for high-reliability electronic packaging applications.

The utility model discloses a rapid cooling device of an SMT reflow soldering machine, and relates to the technical field of soldering machine cooling devices. The device comprises a base, a lower air outlet box and a lifting mechanism are fixedly installed on the top face of the base, and an electric conveying roller is fixedly installed on the top face of the lower air outlet box. According to the utility model, the lower air outlet box is matched with the air blowing mechanism, air cooling is carried out on the PCB after reflow soldering from the upper side and the lower side, and the liquid storage box is driven to ascend and descend in cooperation with the lifting mechanism, so that the flexible high-temperature-resistant film on the bottom surface of the liquid storage box is flexibly attached to the surface of the high-temperature PCB; the liquid storage tank and the flexible high-temperature-resistant film are arranged, so that cooling liquid contained in the liquid storage tank and the flexible high-temperature-resistant film in a sealed mode makes flexible contact with the surface of the PCB and is blocked by the flexible high-temperature-resistant film, the cooling liquid can rapidly absorb heat of the PCB, the liquid cooling function is achieved while the waterproof function is achieved, the air cooling function and the liquid cooling function are achieved at the same time, cooling of the PCB is more efficient, and the service life of the PCB is prolonged. The subsequent processing of the PCB can be carried out more quickly, and the production efficiency is improved.

The application relates to a reflow soldering part, which comprises a conductive bearing layer, a mask located on at least one side surface of the conductive bearing layer, the mask being provided with a first patterned groove and a second patterned groove, any one of the first patterned groove and the second patterned groove penetrating through the mask along the thickness direction of the mask, and a plating-resistant layer located on the surface of the conductive bearing layer facing the mask and located in the first patterned groove, the second patterned groove being used for gathering electroplating matters. The reflow soldering part can improve the reuse frequency and the service life, and is beneficial to controlling the cost of battery piece manufacturing.