827 results about "Reflow soldering" patented technology

The invention discloses an intelligent assembly method of a precise connector, which comprises the following steps of: adding phase change particles with different melting points into tin-silver-copper-based solder according to the difference of functional areas of welding spots in the connector, generating an area formula index, and obtaining composite solder with partition identification; according to the area formula index, the composite welding flux is deposited to preset welding spot positions according to the functional areas, and particle distribution information is recorded; performing reflow soldering on different functional areas by adopting corresponding temperature curves according to the melting point parameters of the phase change particles, and recording the temperature history of each area; applying pulse thermal excitation to the packaged connector, and collecting a surface temperature change curve of each welding spot to obtain thermal response data; and performing correlation comparison on the thermal response data and process historical data, identifying the welding spot defect type according to curve deviation characteristics, and generating process adjustment parameters. According to the scheme, after the connector is completely packaged, rapid nondestructive detection of internal tiny welding spots can be realized, hidden defects can be effectively identified, and intelligent optimization and adjustment of process parameters can be realized.

The invention relates to the technical field of semiconductor chip packaging, in particular to a photoelectric co-packaging optical coupling passive alignment packaging structure and method. According to the invention, high-precision automatic alignment of the grating coupler in the optical chip and the through hole of the adapter plate is realized by using the solder ball tension effect in the flip reflow soldering process of the optical chip, and a stable optical limiting structure is formed. The passive coupling of the optical elements (such as bare optical fibers, optical fiber arrays, reflectors and the like) and the grating coupler is realized by placing the optical elements with matched sizes in the via holes of the adapter plate and completing refractive index matching and structure fixing by using curing glue. The whole process does not need additional active alignment equipment, is the same as a traditional chip packaging process, has the advantages of being simple in process, low in cost and high in packaging efficiency, and is a key packaging technology of a photoelectric co-packaging system in the future.

An electronic package is mainly characterized in that a dam body is formed at the edge of the electronic package to prevent a packaging material from overflowing to the lower part, so that the packaging material does not contact a conductive element below the packaging material, and the problem that the conductive element is not wetted during subsequent reflow soldering of the conductive element can be avoided.

The application relates to the technical field of integrally-formed inductors, in particular to a moisture-resistant soft magnetic composite material and a preparation method thereof and an integrally-formed inductor. The moisture-resistant soft magnetic composite material comprises the following components by mass: 100 parts of soft magnetic powder, 2-5 parts of a resin bonding agent and silicon resin, wherein the mass ratio of the silicon resin to the resin bonding agent is (0.3-2.0):100. The moisture-resistant soft magnetic composite material can avoid the phenomenon of explosion of the integrally-formed inductor during a reflow soldering process after moisture absorption.

Provided are a solder alloy, a solder ball, a preformed solder, a solder joint, and a circuit, which are excellent in wettability and shear strength, suitable in failure mode, capable of suppressing the growth of an intermetallic compound at a bonding interface even after multiple reflow soldering, excellent in drop impact resistance, and suitable in the shape of a bump. The solder alloy has an alloy composition comprising, in mass%, 0.10 to 3.00% of Ag, 0.80 to 6.00% of Cu, 0.08 to 0.60% of Ni, 0.0010 to 0.0150% of Ge, and the balance of Sn. It is preferable that the alloy composition further contains 0.1% or less of at least one of Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and rare earths in total.

The invention relates to a method for predicting the thermal stress of a flip-chip bonding micro-welding spot interconnection structure, which comprises the following steps of: performing a flip-chip bonding test on an electronic device based on a reflow soldering process, establishing a three-dimensional geometric model, and calculating the thermal stress of the micro-welding spot interconnection structure based on the change of the interconnection structure between the micro-welding spot and a Ni-P / Cu bonding pad in the flip-chip bonding process of the electronic device. Coupling the material attributes of the chip, the substrate, the micro-solder joint and the Ni-P / Cu bonding pad in the flip-chip bonding test to obtain an equivalent finite element model, and simulating corresponding flip-chip bonding based on a birth-death element method in the equivalent finite element model; and finally, calculating and identifying the maximum equivalent thermal stress distribution rule at the interface of the micro welding spot layer, the intermetallic compound layer and the bonding pad by using the equivalent finite element model, namely predicting the thermal stress of the flip-chip micro welding spot interconnection structure. Theoretical support is provided for improving the reliability of the flip-chip bonding micro-welding spot interconnection structure, and a theoretical foundation is laid for thermal stress regulation and control.

The invention belongs to the technical field of electronic packaging and welding materials, and relates to lead-free solder powder for reflow soldering and a preparation method of the lead-free solder powder. The lead-free solder powder is based on a Sn-Ag-Cu alloy system, and melt purification, beta-Sn grain refinement and interface IMC stabilization are achieved by compositely adding trace Ce and Ni elements. The Sn-Cu-Ce alloy comprises the following components in percentage by mass: 2.9%-3.1% of Ag, 0.45%-0.55% of Cu, 0.01%-0.10% of Ce, 0.01%-0.05% of Ni and the balance of Sn and impurities. During preparation, a Ce-Ni intermediate alloy is adopted to introduce microalloy elements, and the spherical solder powder is obtained through vacuum melting, inert gas atomization and surface treatment. The obtained solder powder is low in oxygen content, good in wettability, slow in interface IMC growth after backflow, high in welding spot strength and excellent in thermal cycle reliability, and is suitable for the field of high-reliability electronic packaging.

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

The invention discloses a high-strength photovoltaic welding flux for a photovoltaic welding strip and a preparation method of the high-strength photovoltaic welding flux, and belongs to the technical field of energy conservation and environmental protection. According to the solder, the Sn-Zn-Bi alloy is used as a matrix, and the performance is comprehensively improved by introducing a dual nano reinforced phase of the multi-walled carbon nanotubes and the nano nickel particles. The preparation method comprises the steps of matrix alloy melting, a hydrothermal method, a liquid phase reduction method, ultrasonic dispersion, gas atomization powder preparation, silane coupling agent surface modification, scaling powder compounding, reflow soldering and the like. The obtained solder has excellent comprehensive performance, excellent thermal fatigue resistance and long-term reliability. The welding flux is suitable for interconnection welding of a main grid, a fine grid and a welding strip of a crystalline silicon photovoltaic cell, and provides technical guarantee for the service life of a photovoltaic module more than 25 years.

The invention provides an electronic component intelligent production control method and system, electronic equipment and a storage medium, and relates to the technical field of electronic component intelligent manufacturing, and the method comprises the steps: synchronously collecting second-level power consumption data, temperature field distribution information and environment temperature and humidity data of a chip mounter, reflow soldering equipment and optical detection equipment; and fusing to generate multi-source time sequence stream data. And generating thermal imaging data based on temperature field distribution, identifying an abnormal power consumption region, extracting cross-equipment cycle correlation characteristics through expansion convolution operation in combination with multi-source time sequence flow data, and predicting future energy efficiency state change points. And decomposing the global energy efficiency target into chip mounter start-stop time sequence constraint, reflow soldering power parameter constraint and optical detection sampling frequency constraint by using a time sequence target cascading algorithm to realize multi-device coordinated regulation and control. According to the invention, the energy efficiency management level and the product yield stability of the electronic component production line are improved.

The utility model provides a small-sized integrated diode device, which comprises a tube shell provided with a cavity and more than two groups of diode functional components arranged in the cavity of the tube shell, each group of diode function components comprises a diode bare chip, a packaging electrode and a metal wire; a plurality of welding islands are arranged on the wall of the cavity; the diode bare chips and the packaging electrodes are respectively arranged on the welding islands; the cathode of the diode bare chip is attached to the welding island so that the welding island where the diode bare chip is located forms a cathode welding island, and the anode of the diode bare chip is bonded with the packaging electrode through a metal wire so that the welding island where the packaging electrode is located forms an anode welding island; and an electric gap is formed between every two adjacent welding islands. According to the diode device, a plurality of diodes are integrated, and the space size occupied by the diodes in a circuit can be greatly optimized, so that the size and the weight of equipment are reduced, the time for reflow soldering is reduced, the efficiency is higher, and the requirements of miniaturization, light weight and high efficiency of the current market are met.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The utility model discloses a testing device for a damp-heat test of a plastic package device, which comprises a test board system and a high-acceleration test system, and the test board system is connected with the high-acceleration test system. The test board system comprises a PCB, a golden finger, a power supply jumper wire, a device welding area, a protective tube welding area and a support, the golden finger is connected with the PCB, and the golden finger, the power supply jumper wire, the protective tube welding area and the device welding area are electrically connected in sequence. According to the utility model, the test board is provided with the power supply jumper wire and the protective tube welding area, so that the electrical connection abnormity of a plug-in jumper wire structure and a plug-in protective tube caused by the oxidation of a connector lug in a humid and hot environment is avoided; the device welding area and the corresponding welding station are arranged, a to-be-tested device product is placed at the position of the welding pad during welding, welding is conducted through reflow soldering, and the situation that electric connection is abnormal due to the fact that a probe head is oxidized in a hot and humid environment in a testing seat connection mode is avoided.

The invention relates to the technical field of MEMS radiator processing, in particular to a processing method of an MEMS radiator, which comprises the following steps of: 1, manufacturing an air inlet grid opening, a gas advection bin body, a vibration upper opening binding ring, a piezoelectric vibrator, a flexible circuit board, a vibrator amplification layer, a gas beam dense hole layer and an impact platform according to the size; 2, the flexible circuit board and the piezoelectric vibrator form a circuit piezoelectric vibrator through reflow soldering; 3, the air inlet advection bin body, the vibration upper opening binding ring, the circuit piezoelectric vibrator, the vibrator amplification layer, the air beam dense hole layer and the impact platform are assembled from top to bottom. According to the machining method of the MEMS radiator, firstly, solder paste is printed on a flexible circuit board steel mesh to lead welding spots, the flexible circuit board steel mesh and the piezoelectric vibrator are placed into a clamp together to be fixed, and then the flexible circuit board steel mesh is welded to the piezoelectric vibrator; the circuit piezoelectric vibrator prepared by the method is reliable and durable, and welding spots are not easy to fall off, so that the piezoelectric vibrator can have better stability in high-frequency vibration.

The invention relates to the technical field of fluid machinery, in particular to a heater and a compressor assembly, a ceramic heating plate is arranged on a heat conducting plate through nickel plating, reflow soldering and the like, heat is transferred to a containing space of the heater through the heat conducting plate, and the situation that the ceramic heating plate directly makes contact with fluid, boiling is generated, and consequently the heat exchange efficiency is reduced is avoided. The combination mode of nickel plating bottom welding can enable the ceramic heating plate and the heat conduction plate to be combined more tightly, heat loss is small during heat conduction, and heat exchange efficiency is not affected.

The invention relates to the technical field of industrial control, in particular to an SMT production process quality control method and system. The SMT production process quality control system comprises a soldering paste distribution condition real-time acquisition module, an electromagnetic coil array parameter adjustment module and a reinforcement learning module. The electromagnetic coil array is arranged around the reflow soldering furnace, the infrared thermal imaging technology is combined, the thermal image of the PCB is obtained in real time and sent into the soldering paste segmentation model to be processed, the flowing state of the soldering paste is accurately represented, the system can dynamically adjust the control parameters of the electromagnetic coil array based on the soldering paste distribution thermodynamic diagram, and the stability of the reflow soldering system is improved. Comprise current intensity, current frequency, waveform and the like, so that the electromagnetic field is accurately adjusted, the flowability of the solder paste is optimized, excessive or too little solder paste accumulation is avoided, and the risks of solder bridge and insufficient solder are reduced.

The invention discloses reflow soldering equipment and process for SMT patch production. The reflow soldering equipment comprises a furnace body base, a conveying unit, a hearth and a sealing top cover. A conveying unit is horizontally laid on the furnace body base, the hearth is installed on the upper end face of the furnace body base in a sealed mode, and the interior of the hearth is evenly divided into three independent working areas which are the preheating area, the backflow area and the cooling area in sequence from left to right. A visual inspection chamber is installed at the position, located at the feeding end of the hearth, of the upper portion of the furnace body base. A heating device is arranged in each working area of the hearth; in the heating device of the backflow area, each microplate is slidably provided with a vertically arranged hot spray pipe, and the hot spray pipes can perform hot air pulse direct blowing on large-size surface-mounted elements on a PCB, directly heat pin welding spots, realize micro-swing attachment of the elements in cooperation with surface tension of solder paste, and eliminate mechanical stress when the chip mounter is placed.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.

The invention discloses a MicroLED chip packaging unit, a head-mounted display device and a preparation method of the MicroLED chip packaging unit. The MicroLED chip packaging unit comprises a substrate and a MicroLED chip, and the substrate is provided with a plurality of first bonding pads which are insulated from one another; the MicroLED chip is arranged on the first surface and is electrically connected with the first bonding pad. According to the packaging structure of the MicroLED chip, the packaging structure can be connected with an external circuit board through the first bonding pad on the substrate, so that control over the MicroLED chip is achieved, the size of the packaging unit of the MicroLED chip can be made to be smaller, universality is better, the defect that an existing packaging structure for packaging the MicroLED chip on the flexible circuit board is insufficient in application scene is overcome, and the inventory risk is reduced. Moreover, the MicroLED chip packaging unit can be welded and connected with an external circuit board through a reflow soldering mode, and the connection is very convenient.

The utility model provides a male pin structure and a floating terminal thereof, the floating terminal is connected with a first circuit board and a terminal, the first circuit board is provided with a through hole, the terminal is installed on a second circuit board, the terminal is provided with a port, the male pin structure comprises a base, the base comprises a main body and a first connecting body, the first connecting body is integrally formed on the lower side of the main body, and the first connecting body is connected with the first circuit board; the first connector penetrates through the through hole, and the outer surface of the base is welded to the first circuit board; and the second connecting body is mounted on the upper side of the base, and the second connecting body is inserted into the port. According to the technical scheme of the embodiment, the number of parts can be reduced through the integrally-formed base, assembly steps are reduced, and perforation reflow soldering is facilitated.

The invention discloses a semiconductor chip packaging method, and relates to the technical field of semiconductor packaging, and the method comprises the steps: carrying out the salient point preparation of a semiconductor chip, carrying out the data collection, obtaining a salient point shape data set, carrying out the cleaning after the preparation of a substrate, obtaining the surface data of the substrate, fusing the surface data of the substrate with the salient point shape data set, generating a shape quality data set, and carrying out the processing of the shape quality data set. The method comprises the following steps: establishing a chip prediction model, outputting a welding spot failure probability and optimized process parameters, overturning a chip, performing alignment operation to obtain a chip and a substrate assembly which are subjected to alignment, performing welding parameter optimization through a reflow soldering furnace, forming a uniform intermetallic compound, and obtaining a welded chip and substrate assembly. And according to the welded chip and substrate assembly, a dispensing machine and a molding press are used for processing, and a packaged chip assembly is obtained. According to the method, the chip prediction model is established, so that the failure rate of the welding spots is remarkably reduced, the adaptability of process parameters is improved, and missing detection of the failed welding spots is avoided.

The utility model discloses an auxiliary production jig based on a reflow soldering machine, which comprises a bottom plate jig and a pressing jig, the bottom plate jig is arranged on the lower side of the pressing jig, the bottom plate jig is provided with a base plate and a jig plate, the jig plate is arranged on the upper side of the end face of the base plate through a buckle, the end face of the jig plate is provided with a plurality of small PCB grooves, and the small PCB grooves are arranged on the base plate. Notches are formed in the four corners of the end face of the jig plate, and springs are arranged in the notches; the pressing jig comprises a pressing plate, a bracket and an adjusting column, an embedding groove is formed in the bottom face, facing the jig plate, of the pressing plate, and a balancing weight is embedded in the embedding groove; the pressing plate is provided with pressing grooves corresponding to the small PCB grooves, and the end face of the lower side of the pressing plate is provided with a notch corresponding to the notch of the jig plate. The auxiliary jig provided by the utility model adopts the combination of the bottom plate jig and the pressing jig, so that the situation that the small PCB is warped or deformed when being subjected to reflow soldering can be avoided.

The invention discloses a SnSb8 soldering lug welding process which is characterized in that a preformed hexagonal soldering lug is adopted as a soldering lug, the preformed soldering lug and a welded substrate are directly welded in a local vacuum reflow soldering mode, and the welding process mainly comprises the steps of vacuumizing, nitrogen filling, vacuumizing, formic acid filling, air blowing, first heating, second heating, cooling, vacuumizing and nitrogen filling. A multi-stage gas environment control process is innovatively introduced, a low-oxygen environment is constructed through a double-vacuumizing-double-inflating process (nitrogen and formic acid), and formic acid gas is decomposed at high temperature to generate reducing substances to replace traditional scaling powder; the composite process of gradient temperature control and gas purging is developed, formic acid purging is implemented in a specific temperature window, the oxide removal and solder wetting processes are synchronously completed, scaling powder does not need to be additionally added during welding, the technological process is simplified, and cavities are reduced.

The invention relates to the field of integrated circuit manufacturing, in particular to a high-precision positioning jig for an SMT (surface mount technology) mounting line, which comprises a tray for bearing a circuit board, the positioning mechanism is arranged on the tray and comprises a pressing assembly and a wedge-shaped assembly, and the wedge-shaped assembly is used for triggering the pressing assembly to press and position the circuit board before solder paste printing; according to the invention, the tray is used for bearing the circuit board, and the wedge-shaped assembly in the positioning mechanism is used for triggering the pressing assembly to carry out horizontal pressing positioning on the circuit board, so that the assembly is ensured to be flush with the upper surface of the tray in a non-working state, and the requirement of solder paste printing and component surface mounting for no projection interference is met; the steel mesh attaching gap or visual identification interference is avoided; and a limiting assembly is triggered by a shifting assembly in the reinforcing mechanism to tightly press the circuit board in the vertical direction, so that the fixed dimension is supplemented, and multidirectional stress generated by thermal expansion of the circuit board at high temperature in reflow soldering is effectively counteracted.

The invention relates to the technical field of reflow soldering, and discloses a jig and a reflow soldering method of a substrate chip, the jig comprises a base, a cover plate and a connecting device, the base comprises a base main body and a separation rib, the base main body is provided with a groove, the bottom wall of the groove is provided with a first heat conduction through hole, and the separation rib is arranged in the groove; the groove is divided into at least two accommodating grooves; the cover plate comprises a frame main body and a separation beam, a hollow part is arranged in the middle of the frame main body, the position of the hollow part corresponds to the position of the groove, and the separation beam is arranged on the frame main body and located in the hollow part so that the hollow part can be separated into at least two heat conduction channels; the frame body and the base body are detachably connected through a connecting device. In the structure, the groove is divided into at least two accommodating grooves for accommodating the substrate, and the area of the substrate is relatively small, so that when the jig is used for reflow soldering, the substrate does not warp and the like, and pseudo soldering and false soldering between the substrate and the chip are avoided.

The invention discloses a processing method capable of reducing tombstone standing of an electronic component, and the method comprises the steps: S1, solder paste printing: arranging a bonding pad of a 0402 component at the central position of a PCB, and coating the surface of a steel mesh with solder paste through a solder paste screen printing machine; s2, solder paste pre-detection: after the steel meshes are filled with the solder paste, a transparent sheet is arranged between the PCB and the first visual camera, a PCB outline identification frame and a bonding pad identification frame which are made of a light-proof material are arranged on the transparent sheet, and the first visual camera collects a pre-detection image of overlapping of the PCB and the transparent sheet; calculating whether the overflow area of the solder paste on the bonding pad in the pre-detection image exceeding the bonding pad identification frame exceeds a set threshold value or not, and if the overflow area does not exceed the set threshold value, judging that the solder paste coating is qualified; s3, element surface mounting is carried out; s4, reflow soldering; and S5, performing AOI optical detection. Compared with the prior art, the problem that electronic components stand up in the SMT process is solved.

The invention provides an SMT welding quality on-line detection method, and relates to the technical field of electronic quality detection.The method comprises the steps that after first reflow soldering is completed on a bottom surface component, three-dimensional contour parameters of a welding spot are extracted to serve as initial reference data; when the top surface component is subjected to second reflow soldering, temperature distribution data of a bottom surface welding spot is collected in real time, the thermal deformation quantity of the welding spot is calculated, when the deformation of the welding spot exceeds an independently set preset threshold value, the position coordinate and the deformation direction parameter of the welding spot are extracted, and the displacement compensation quantity is calculated; and temperature compensation is carried out through a temperature zone control system of the reflow furnace, so that secondary deformation of the bottom surface component is inhibited. According to the detection method provided by the invention, the technical problems that when the PCB is subjected to double-sided mounting, the bottom surface component is easy to deviate and insufficiently solder when being subjected to secondary reflow soldering, and the existing detection equipment is difficult to find the bottom surface welding defect in time are solved, and the stability and the reliability of the bottom surface welding quality in the double-sided mounting process are improved.

The invention discloses a method for improving backboard PTH macropore explosion, which comprises the following steps: a production board is provided, an inner circuit of the production board comprises at least one thick circuit layer with the thickness of 2oz, and the rest inner circuit layers are thin circuit layers with the thickness of 1oz; a drilling position with the outer diameter of 4.5 mm is arranged on the production plate; a copper disc with the outer diameter larger than 4.5 mm is arranged at the position, corresponding to the drilling position, in the thick circuit layer, and a circle of copper-free first isolating ring is formed between the periphery of the copper disc and the surrounding copper face. Large holes are drilled in the corresponding drilling positions, so that the holes are metalized; filling resin in the large holes, curing, and removing the resin protruding out of the plate surface through a grinding plate; an outer layer circuit is manufactured on the production board, a hole ring is manufactured around the large hole, a copper-free second isolating ring is formed between the periphery of the hole ring and the peripheral copper surface, and at least one connecting rib for connecting the hole ring and the peripheral copper surface is arranged between the hole ring and the peripheral copper surface. The method provided by the invention solves the problems that the substrate is leaked from the orifice after board grinding and the board is exploded after reflow soldering.

The invention relates to the technical field of semiconductor welding, and particularly discloses vacuum eutectic backflow equipment and a using method thereof.The vacuum eutectic backflow equipment comprises a glove box used for providing an inert gas environment and comprises a closed cavity, an observation window fixed to the closed cavity and operation gloves arranged on the observation window; a first material opening and a second material opening which can be opened and closed are formed in the closed cavity; the vacuum eutectic reflow furnace is arranged in the glove box, comprises a furnace body and a cover body which is arranged on the furnace body and can be opened and closed, and is used for vacuum eutectic reflow soldering of the soldering material; and the vacuum and atmosphere control module comprises a vacuum pump communicated with the furnace body and a plurality of gas circuit pipelines and is used for providing vacuum or different atmosphere environments for the furnace body of the vacuum eutectic reflow furnace. The invention can ensure that the semiconductor welding process meets the requirement of preventing small particle pollution.

The utility model provides 3D-AOI detection equipment which comprises a plate feeding assembly, a detection assembly is arranged on the top of the plate feeding assembly, and the detection assembly comprises a light shield, a controller, a servo motor, a support, a laser range finder, a supporting plate, a threaded rod, a lifting seat, a CCD camera and a light supplementing lamp. A controller is installed on the top of the light shield, servo motors are symmetrically installed on the top of the light shield, and a support is fixedly connected to the inner side wall of the light shield. The distance between the surface of the PCB and the laser range finder is detected through the laser range finder, the distance data is sent to the controller, and the controller performs height compensation on the CCD camera according to the distance change, so that the equipment detection precision is improved, the false alarm rate is reduced, and the yield and the detection rate are improved. According to the invention, through performing height compensation on the bending of the PCB, the problem that the detection precision is influenced by the bending of the PCB body after reflow soldering can be effectively solved, and the false alarm caused by the bending of the large-size PCB and the flexible circuit board can be reduced at the same time.