127 results about "Solder alloy" patented technology

Provided are a solder alloy, a solder ball, a preformed solder, a solder joint, and a circuit, which are excellent in wettability and shear strength, suitable in failure mode, capable of suppressing the growth of an intermetallic compound at a bonding interface even after multiple reflow soldering, excellent in drop impact resistance, and suitable in the shape of a bump. The solder alloy has an alloy composition comprising, in mass%, 0.10 to 3.00% of Ag, 0.80 to 6.00% of Cu, 0.08 to 0.60% of Ni, 0.0010 to 0.0150% of Ge, and the balance of Sn. It is preferable that the alloy composition further contains 0.1% or less of at least one of Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and rare earths in total.

A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.

The invention relates to a lead-free and halogen-free soldering paste and a preparation process thereof, and belongs to the technical field of soldering paste production, through the combination of nano-silver-loaded carbon nanotubes, organically coated solder alloy powder and soldering flux, the surface tension of the lead-free and halogen-free soldering paste can be reduced by carbon nanotube surface carboxyl in the nano-silver-loaded carbon nanotubes, so that the lead-free and halogen-free soldering paste is obtained. Nano-silver and tin form an Ag3Sn strengthening phase which synergistically promotes wetting and spreading of the solder on a substrate, meanwhile, the carbon nanotubes loaded with the nano-silver are uniformly dispersed in the soldering paste to play a dispersion strengthening role, and the brittleness caused by bismuth segregation is effectively inhibited in cooperation with the grain refinement effect of copper and indium in the solder alloy powder; and the organic coating layer hydrogenated rosin-terpene resin and the soldering flux alcohol ether solvent form a slight dissolution-fusion effect, so that the welding flux alloy powder is prevented from being oxidized, an organic acid active agent can be released to remove a substrate oxidation film, the metallurgical bonding quality of a welding interface is further guaranteed, and the defects of pseudo soldering, cavities and the like are reduced.

Provided are a solder alloy, a solder paste, a solder ball, and a solder joint which have a low melting point, are excellent in ductility, shear strength, and heat cycle resistance, further suppress the occurrence of open defects, and in addition, have reduced residual voids even at the time of joining in a large area. A solder alloy has an alloy composition of, by mass %, Bi: 35.0 to 68.0%, Sb: 0.1 to 2.0%, Ni: 0.010 to 0.050%, Ge: 0.007 to 0.090%, with the balance being Sn. Preferably, the alloy composition further contains, by mass %, at least one of Co, Ti, Al, Mn, As, Fe, Pd, Zn, Zr, Pb, In, Ce, P, and Ga: 0.1% or less in total. Further, this solder alloy can be suitably used for solder pastes, solder balls, and solder joints.

This invention provides a highly conductive preformed solder sheet, comprising a core layer and a shell layer disposed around the core layer. By embedding the solid flux core layer within the solder alloy layer to form a sandwich-like shape, the flux can be effectively protected from oxidation. There is no need to apply flux before brazing or remove it after brazing, reducing manufacturing costs and the void rate on the welded surface, thus improving the reliability of the solder sheet. The solder alloy shell is composed of tin, silver, copper, indium, cerium, vanadium, lutetium, yttrium, and zinc. The addition of small amounts of rare earth elements lutetium, yttrium, and cerium improves the conductivity and heat transfer of the solder sheet. The addition of indium, vanadium, and zinc increases the melting point of the solder sheet and improves its solidification state. Since no magnetic materials such as lead, iron, cobalt, nickel, or niobium are added, signal interference caused by metals is avoided.

The application discloses a method and system for rapidly predicting a creep stress index of a tin-based solder alloy by integrating a model, collects element compositions, test temperatures and creep stress index values of the tin-based solder alloy from literature, and adds experimental data as dataset samples; the element compositions and test temperatures of the tin-based solder alloy are sorted out and used as features for modeling; the dataset is randomly divided into a training set and a test set in a 4:1 ratio; the collected creep stress index values of the tin-based solder alloy are used as target variables, and the features are used as independent variables; based on the divided training set, the independent variables are scaled by using RobustScaler, three learners are trained and integrated to obtain an R-X-L integrated model; and the R-X-L integrated model is used to rapidly predict the creep stress index of the test set samples and four independent experimental samples. The prediction model for the creep stress index of the tin-based solder alloy is simple, fast, low-cost, pollution-free and the like based on reliable literature data and a modeling method.

The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.

The invention relates to high-thermal-conductivity In-Pb-X alloy low-temperature soldering paste and a preparation method thereof, and belongs to the technical field of electronic packaging. The low-temperature soldering paste comprises the following components in percentage by weight: 80.0 to 90.0 percent of soldering flux alloy powder, 6.0 to 10.0 percent of high-activity soldering flux and 4.0 to 10.0 percent of coating agent, the solder alloy powder is composed of, by weight, 14.0%-41.0% of Pb, 0%-10% of X and the balance In, and the element X is one or more of Sn, Ag, Au, Bi, Sb and Cu. The preparation method comprises the steps of solder alloy smelting, solder alloy powder preparation, soldering flux preparation and soldering paste preparation. The soldering paste is low in melting point, low in brazing temperature, high in heat conductivity, high in welding rate, good in wettability to a gold-plated layer, good in brazing manufacturability and suitable for low-temperature packaging of electronic devices.

The present invention discloses titanium-based solder alloy particles, a preparation method thereof, and a titanium cup brazing process, comprising the following steps: preparing a metal alloy according to a mass fraction, preparing the metal alloy into a powder by argon atomization, and screening the powder with a particle size of less than 200 mesh; preparing an organic intermediate according to a mass fraction; mixing the powder with the organic intermediate according to a mass fraction, with the powder accounting for 89-94 and the organic intermediate accounting for 6-11, and extruding into a welding rod with a diameter of 2-3 mm after sufficient stirring; drying the welding rod at 80°C under vacuum for 12 hours; cutting the welding rod into 2-3 mm welding particles to obtain titanium-based solder alloy particles. Beneficial effects of the present invention: The present invention provides titanium-based solder alloy particles, a preparation method thereof, and a titanium cup brazing process, which increases the brazing temperature of traditional solder to 1050 degrees, and the brazing temperature matches the crystallization temperature of the titanium material, so that the crystallization of the titanium cup and vacuum brazing can be integrated, which can reduce processing time, improve product qualification rate, and reduce production cost.

To provide a method for supplying solder by which the content of Bi contained in a solder alloy in a solder bath is maintained at a prescribed amount even after many printed circuit boards are soldered with a Bi-containing solder alloy.SOLUTION: In the solder supply method, an additionally supplied solder, which is a low-Bi solder alloy having a Bi content lower than that of an Sn and / or Bi-containing solder alloy, is supplied to a solder bath into which the Bi-containing solder alloy has been introduced, and the Bi content in the solder bath is adjusted to the Bi content of the Bi-containing solder alloy at the beginning of being put into the solder bath.SELECTED DRAWING: None

The invention discloses a soldering flux, a low-void-rate high-lead soldering paste and a preparation method of the soldering paste, and belongs to the technical field of electronic circuit surface mounting. The soldering flux is composed of 40%-50% by weight of rosin, 0.5%-2% by weight of a defoaming agent, 6%-12% by weight of organic acid, 0.05%-0.2% by weight of haloid, 5%-8% by weight of a thixotropic agent, 1%-2% by weight of a corrosion inhibitor and the balance solvent. The soldering flux and the solder alloy powder are mixed according to the mass ratio of 1: 10 to prepare the high-lead soldering paste. The high-lead solder paste has extremely low voidage, shows good weldability in welding under the condition of meeting the halogen-free standard, is full and bright in welding spots after welding, and is particularly suitable for packaging and welding of electronic components with high voidage requirements.

The present invention provides solder alloys, solder pastes, solder balls, solder preforms, and solder joints that have excellent resistance to drop impact and heat cycling, suppress the occurrence of chipping, bridging, and icicle formation, and also suppress the occurrence of electromigration. [Solution] The solder alloy has an alloy composition consisting of, by mass%, Ag: 0.3~1.9%, Cu: 0.40~1.00%, Bi: 0.5~4.9%, P: 0.00100~0.02000%, and the remainder being Sn. The alloy composition may further contain Ge, Co, and Ga in amounts of 0.06% or less by mass, and at least one of each. The alloy composition may also further contain As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr, and Pt in amounts of 0.06% or less by mass, and at least one of each.

The present invention discloses a method for using a hollow mesh flexible carbon sponge transition layer to assist in the brazing of fiber-reinforced composite materials or ceramics with metals. The present invention utilizes vacuum rapid carbonization to treat melamine formaldehyde resin foam to obtain a carbon sponge material with a low thermal expansion coefficient, high mechanical flexibility, and a hollow network structure. During the brazing process using the carbon sponge material as a transition layer, the liquid solder will spontaneously perform capillary infiltration on the carbon sponge and completely fill it, forming an in-situ composite core-sheath structure in which a continuous network of carbon sponge (shell) wraps the solder alloy (core). This structure combines the advantages of the carbon sponge material's low thermal expansion coefficient, high elastic strain energy, and good plasticity of the metal material, giving the transition layer an overall excellent plastic toughness. This method can effectively improve the interface structure, increase the plastic toughness of the brazing seam, and reduce the thermal expansion coefficient of the brazing seam, significantly improving the mechanical properties of the fiber-reinforced composite material or ceramic and metal joints.

The application discloses a preparation method of a core-shell structure tin-based anti-oxidation solder alloy, and has the characteristics that an anti-oxidation intermediate alloy block is taken as a base body, a high-softening-point rosin is coated on the anti-oxidation intermediate alloy block, then tin foil is coated as a secondary outer layer, and boron nitride hollow mould is coated as an outermost layer, so that an anti-oxidation intermediate alloy-robin-tin foil-boron nitride coating hollow mould core-shell structure is formed; the anti-oxidation intermediate alloy block is a SnPGa anti-oxidation intermediate alloy block or a SnPGe anti-oxidation intermediate alloy block, the mass ratio of P to Ga in the SnPGa anti-oxidation intermediate alloy is 1:5, the mass ratio of P to Ge in the SnPGe anti-oxidation intermediate alloy is 1:2, the mass ratio of the high-softening-point rosin to the anti-oxidation intermediate alloy is 0.02:1, and the volume ratio of the anti-oxidation intermediate alloy block to the boron nitride coating hollow mould is 1:1.3. The core-shell structure tin-based anti-oxidation solder alloy prepared by the method can significantly improve the alloy element yield, improve the static melt surface anti-oxidation performance, and improve the dynamic melt surface mirror surface maintaining state.

A solder preform in the shape of a solder tube or washer includes: a cylindrically shaped solder alloy body including an inner surface, an outer surface, a first end, a second end, a first opening located at the first end, and a second opening located at the second end, the second end interlocking with the first end, and the first opening and the second opening cut along an entire height of the solder alloy body; and a flux core embedded in the solder alloy body between the inner surface and the outer surface, the flux core including a thermochromic indicator. During reflow soldering, the flux core including the thermochromic indicator flows out of the first opening of the first end and the second opening of the second end to coat the inner surface of the solder alloy body and the outer surface of the solder alloy body.

A solder alloy capable of forming a joint portion having heat cycle resistance and drop impact resistance, the solder alloy comprising: 45 mass% or more and 63 mass% or less of Bi; 0.1 mass% or more and less than 0.7 mass% of Sb; and 0.05 mass% or more and 1 mass% or less of In, with a balance being Sn and inevitable impurities, wherein a liquidus temperature of the solder alloy is 170°C or lower.

The present disclosure relates to a corrosion-resistant Sn—Ag—Cu series lead-free solder alloy, belonging to the technical field of soldering material. The present disclosure provides a Sn—Ag—Cu series lead-free solder alloy and a preparation method thereof, wherein the Sn—Ag—Cu series lead-free solder alloy includes, by mass percentage, 2.7-3.3% of Ag, 0.4-0.6% of Cu, 1.5-3.0% of Bi, 0.2-2.0% of Sb, 0.01-0.5% of Zr, and the balance of Sn. The Sn—Ag—Cu series lead-free solder alloy prepared by the preparation method of the present disclosure has properties such as low melting point, high tensile strength, and excellent corrosion resistance. It can be used under harsh conditions and has a wide range of applications.

Disclosed is a solder alloy having a relatively low melting point and excellent impact resistance without containing Pb. The solder alloy may contain 14-22 mass% of Bi and 16-24 mass% of In, with the remainder comprising Sn and inevitable impurities.

A paste-like solder for vacuum soldering without flux, characterized in that the paste-like solder for vacuum soldering without flux consists of 45%-60% solder alloy powder and 40%-55% binder by mass; wherein the paste-like solder contains no flux; and wherein the solder alloy powder is made from 6%-10% Mg, 15%-20% Cu and 70%-75% Al by mass; and wherein the binder consists of 75%-85% hexanediol, 8%-12% rosin resin, 2%-6% 1-decanol and 1.5%-4% glycerol by mass; and wherein the particle size of the solder alloy powder is less than 49 µm.

The application discloses a preparation method of an antioxidant lead-free tin-based solder alloy for high temperature, and belongs to the technical field of solder alloy production processes. When the solder alloy is prepared by the method, elements in raw materials include the following in percentage by mass: 88-95% of Sn, 1-4% of Ag, 0.5-3% of Bi, 0.1-1% of Y, 0.05-0.2% of Hf, and the balance is inevitable impurities. The preparation method of the solder alloy is as follows: after metal raw materials are pickled and dried, Sn is first smelted and kept warm under inert gas protection, then Ag and Bi are added, stirring and heating, Y and Hf are further added and ultrasonic smelting is conducted; after a deoxidizing agent is added and reacts, the solder alloy is placed and slag is removed; three-stage refining is conducted through plasma atomization, high-low frequency ultrasonic treatment and a pulse ultrasonic conversion system; finally, the solder alloy is cooled, sieved and annealed to obtain the solder alloy. The application combines plasma technology, gas atomization and ultrasonic technology, realizes preparation of a tin-based solder alloy with uniform composition, high oxidation resistance and excellent mechanical properties, and meets the needs of the electronic welding field under high temperature environment.

The invention relates to the technical field of tin alloy solder, and discloses a preformed soldering lug with high welding strength, which comprises a soldering flux layer and a soldering lug main body, the soldering flux layer comprises esterified rosin, methyl ester, succinic acid, glutaric acid, cyclohexylamine hydrochloride and isopropanol; the soldering lug main body comprises tin, antimony, silver, bismuth, copper and nickel; by adding silver, bismuth, copper, nickel and metal elements in the alloy into the soldering lug, the mechanical strength of the solder alloy can be improved, compared with common tin-copper alloy, the mechanical strength of the soldering lug is greatly improved, the soldering flux is high in activity but low in corrosivity, stable high-mechanical-strength intermediate layer alloy is formed, and the soldering flux can be applied to the field of soldering. The welding strength and the tensile strength are more excellent, the soldering flux layer and the soldering lug main body have the synergistic effect, so that a welded part has high tensile property after being welded, and the mechanical strength of the solder alloy can be improved by adding silver, bismuth, copper and nickel in the alloy into the soldering lug and metal elements.

A solder preform in the shape of a solder tube or washer includes: a cylindrically shaped solder alloy body including an inner surface, an outer surface, a first end, and a second end, the second end interlocking with the first end, and the first end and the second end cut along an entire height of the cylindrically shaped solder alloy body; and a flux core embedded in the cylindrically shaped solder alloy body between the inner surface and the outer surface, the flux core including a thermochromic indicator. During reflow soldering, the flux core including the thermochromic indicator is configured to flow out of the first end and the second end to coat a substrate that is soldered.

The invention relates to the technical field of soldering tin materials, in particular to soldering tin alloy, soldering paste, a preparation method of the soldering paste, soldering flux and a soldering structural part, and aims to solve the problems that low-temperature soldering materials are poor in soldering firmness, fragile in soldering spots, poor in soldering performance compared with high-temperature soldering materials, poor in reliability and the like in the prior art. The soldering tin alloy is a ternary alloy material of In, Sn and Bi, and in the ternary alloy material, the mass ratio of In is 40%-60%, the mass ratio of Sn is 20%-40%, and the balance is Bi.

Provided are a solder alloy, a solder paste, and a solder joint that exhibit a suitable melting temperature, are excellent in wettability, are high in tensile strength and shear strength, and are further excellent in drop impact resistance. The solder alloy has the following alloy composition. The alloy composition has an alloy composition consisting of, by mass %, Ag: 0.1 to 3.9%, Cu: 0.1 to 1.0%, Bi: 0.6 to 1.4%, Sb: 5.1 to 7.9%, Ni: 0.01 to 0.30%, Co: 0.001 to 0.100% or less, with the balance being Sn.

A composite material and method for producing said composite material are disclosed, with a support layer composed of a wrought aluminum alloy and with an external solder layer composed of an aluminum solder alloy provided on one or both flat sides of the support layer, wherein the solder layer has partially exposed silicon particles on its surface, which constitute a first area fraction of the total area of the surface of the solder layer. In order to reliably ensure flux-free solderability, it is proposed for the solder layer to have a rolled surface and for its aluminum solder alloy to contain at least 0.1 wt % bismuth (Bi), wherein the first area fraction is greater than 2.5%.

The application discloses a preparation method of a high-reliability core-shell composite solder capable of low-temperature welding, and belongs to the technical field of welding materials of electronic components. The core-shell composite solder is made of Sn-based solder powder by means of rolling plating, and a series of Sn-Bi low-temperature alloy plating layers are plated on the surface of the solder powder. The core-shell composite solder powder is produced in batches by changing the type and size of the commonly used Sn-based solder in the core to plate a series of Sn-x Bi low-temperature solder alloy plating layers on the shell, so as to produce core-shell composite solder powders of different sizes and types and composite BGA solder balls. The composite solder powder is suitable for the preparation of solder paste capable of low-temperature reflow and high-temperature service, and the composite BGA solder ball can be directly used for solder balls capable of low-temperature reflow and high-temperature service, so that the types and usability of the composite solder at the present stage are greatly improved, and the welding reliability is improved. Compared with the alloy solder prepared by the traditional melting and casting method, the method has the advantages of simple process, low cost and easy operation.

The present invention provides a semiconductor device in which the front and back surfaces of a semiconductor element are connected to a rigid body via a solder alloy, the influence of thermal stress generated on the front and back surfaces of the semiconductor element during use of the semiconductor device is mitigated. A semiconductor device includes: a semiconductor element; a lead frame; an insulating substrate; a first bonding material that bonds the semiconductor element and the lead frame; a second bonding material that bonds the semiconductor element and the insulating substrate; and a third bonding material that bonds the insulating substrate and the lead frame, the semiconductor device being characterized in that the solidus temperature of the first bonding material is lower than the solidus temperature of the second bonding material, and the solidus temperature of the third bonding material is equal to or higher than the solidus temperature of the second bonding material.

The invention discloses a high-temperature oxidation resistant solder paste and a preparation method thereof, relates to the technical field of solder paste production and processing, and solves the technical problem of insufficient high-temperature oxidation resistance of the existing solder paste. The solder paste comprises the following components in percentage by mass: 88.0%-92.0% of solder alloy powder and 8.0%-12.0% of soldering flux, the soldering flux comprises a thermal collapse regulating agent, a high-temperature polymerization shielding agent and an antioxidant; the antioxidant comprises a high-temperature antioxidant, a metal chelating antioxidant and a corrosion inhibition antioxidant. According to the invention, the oxidation resistance in a high-temperature environment can be obviously improved, so that the lasting and stable welding activity is ensured, and the generation of welding defects such as grape balls is effectively inhibited.

The present invention provides a solder structure of low-temperature soldering, which comprises, in sequence from bottom to top, a circuit layer of a printed circuit board, an intermetallic compound layer, a first solder diffusion layer, a solder metal layer, a second solder diffusion layer, and an electrode layer of an electronic component. The surface treatment of the circuit layer of the printed circuit board is performed by using a lead-free solder alloy pad, so that the solder structure after soldering has good cold and hot cycle reliability. The present invention also provides a manufacturing method of a solder structure for manufacturing the aforementioned solder structure of low-temperature soldering.