227 results about "Solder alloy" patented technology

Provided are a solder alloy, a solder ball, a preformed solder, a solder joint, and a circuit, which are excellent in wettability and shear strength, suitable in failure mode, capable of suppressing the growth of an intermetallic compound at a bonding interface even after multiple reflow soldering, excellent in drop impact resistance, and suitable in the shape of a bump. The solder alloy has an alloy composition comprising, in mass%, 0.10 to 3.00% of Ag, 0.80 to 6.00% of Cu, 0.08 to 0.60% of Ni, 0.0010 to 0.0150% of Ge, and the balance of Sn. It is preferable that the alloy composition further contains 0.1% or less of at least one of Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and rare earths in total.

Some embodiments of the present disclosure relate to lead-free solder pastes with mixed solder powders, which are particularly suitable for high temperature soldering applications involving multi-board reflow operations. In one embodiment, the solder paste is composed of: 10 wt% to 90 wt% of a first solder alloy powder, the first solder alloy powder consisting of a SnSbCuAg solder alloy having a Sn:Sb wt% ratio of 0.75 to 1.1; 10 wt% to 90 wt% of a second solder alloy powder, the second solder alloy powder consisting of a Sn solder alloy including at least 80 wt% Sn; and a balance of flux.

Provided are a solder alloy and a solder joint formed from the soldier alloy. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.7%, Cu: 0.4 to 0.8%, Sb: 0.50 to 2.90%, In: 5.00 to 10.00%, and Ni: 0.01 to 0.06%, with the balance being Sn.

The invention relates to the technical field of PCB identification, in particular to an optical identification point manufacturing method of a PCB and an optical point structure, and the method comprises the following steps: S1, adding a process edge on a long edge of the PCB, and arranging the optical point structure on the process edge; s2, melting the tin bar in a tin cylinder through high temperature to form soldering tin alloy slurry of copper, tin and nickel in a proper proportion; and S3, the PCB is immersed in a tin furnace for a period of time, relevant parameters of a tin spraying machine and an air knife are adjusted to a proper range, and hot air leveling is conducted on the PCB. And S4, the PCB is taken out, whether the tin spraying thickness meets the requirement or not is checked, and if not, the air pressure of the tin spraying machine is adjusted. And S5, fixing the PCB which is processed and meets the requirement, and adjusting a lens to identify the PCB. Compared with the prior art, the copper optical points on the surface of the PCB are exposed through the solder resist windowing of the point A, the color of the base material below the point A is exposed, identification is convenient, the point B adopts the NPTH hole, the solder resist windowing is also used, and the point A and the point B control the tin thickness meeting the requirement through the tin spraying process.

A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.

The invention relates to a lead-free and halogen-free soldering paste and a preparation process thereof, and belongs to the technical field of soldering paste production, through the combination of nano-silver-loaded carbon nanotubes, organically coated solder alloy powder and soldering flux, the surface tension of the lead-free and halogen-free soldering paste can be reduced by carbon nanotube surface carboxyl in the nano-silver-loaded carbon nanotubes, so that the lead-free and halogen-free soldering paste is obtained. Nano-silver and tin form an Ag3Sn strengthening phase which synergistically promotes wetting and spreading of the solder on a substrate, meanwhile, the carbon nanotubes loaded with the nano-silver are uniformly dispersed in the soldering paste to play a dispersion strengthening role, and the brittleness caused by bismuth segregation is effectively inhibited in cooperation with the grain refinement effect of copper and indium in the solder alloy powder; and the organic coating layer hydrogenated rosin-terpene resin and the soldering flux alcohol ether solvent form a slight dissolution-fusion effect, so that the welding flux alloy powder is prevented from being oxidized, an organic acid active agent can be released to remove a substrate oxidation film, the metallurgical bonding quality of a welding interface is further guaranteed, and the defects of pseudo soldering, cavities and the like are reduced.

The utility model discloses a device for testing the surface oxidation state of a solder alloy melt. The device comprises a fixed plate (1), a heating container (2) of the solder alloy melt, a horizontal slag scraping mechanism (3), a vertical clamping mechanism (4), a power mechanism (5) fixed on the fixed plate, an image acquisition device (6) fixed on the fixed plate and arranged above the heating container, and a counter (7) and a controller which are respectively fixed on the fixed plate, the horizontal slag scraping mechanism (3) comprises a scraper (31) arranged in the heating container, a first connecting rod (32) with one end fixed to the scraper, a second connecting rod (33) hinged to the first connecting rod, and a first sliding guide rail (34) fixed to the fixing plate and allowing the first connecting rod to penetrate through. The device can effectively simulate the dip soldering process in production, can automatically and continuously record the surface states of solder alloy melts in different oxidation stages in real time, and guides the development and model selection of high-temperature lead-free tin-based solder products for dip soldering according to the pictures of the surface states of the solder alloy melts.

The invention relates to the technical field of lead-free solder alloy component design and preparation, in particular to a high-strength high-thermal-stability lead-free solder alloy and a preparation method and application thereof. The lead-free solder alloy is prepared from the following elements in percentage by weight: 2.0 to 5.0 percent of Ag, 0.01 to 0.7 percent of Cu, 1.0 to 4.0 percent of Sb, 1.0 to 5.0 percent of Bi, 0.01 to 0.5 percent of Ni, 0.01 to 1.0 percent of Ce, 0.005 to 0.5 percent of Ti and the balance of Sn. Wherein the number of Ce or Ti elements is one or more. The solder alloy belongs to lead-free soft solder with high strength and high thermal stability, is particularly suitable for connecting and packaging devices with high working temperature, high power and high reliability requirements in a high-power semiconductor application scene, and can be applied to the fields of automotive electronics, ships, energy, aerospace and the like.

The invention relates to the field of reliable interconnection between carbon nanotube fibers and metal, in particular to a method for achieving high-reliability interconnection between the carbon nanotube fibers and the metal through brazing. The method comprises the following steps: selecting a traditional tin-based brazing solder, heating a to-be-welded metal matrix to a preset temperature by using a planar heating stage in air, wetting and spreading a solder alloy on the surface of the matrix after the solder alloy is molten, putting a to-be-welded part of the pretreated carbon nanotube fiber on the surface of the molten liquid-state solder alloy, and welding the to-be-welded part of the pretreated carbon nanotube fiber; and when the solder alloy on the surface of the carbon nanotube fiber is melted, the solder alloy is quickly solidified, so that the brazed interconnection of the carbon nanotube fiber and the metal is realized. In the welding process, deionized water is sprayed to molten welding flux to achieve rapid cooling and solidification, the problem that welding cannot be achieved due to the large density difference between carbon nano tube fibers and metal is solved, and the problem that welding is not firm is solved by introducing a middle buffer layer with high bonding energy to the to-be-welded portion of the carbon nano tube fibers. And the prepared carbon nanotube fiber-metal interconnection piece has high service reliability.

The invention discloses a smokeless solder wire which comprises a hollow round-strip-shaped solder wire alloy and smokeless scaling powder filled in the solder wire alloy, the mass ratio of the solder wire alloy to the smokeless scaling powder is (97-98): (2-3), the solder wire alloy comprises, by mass, 93-95 parts of tin, 0.3-0.7 part of copper, 0.3-0.7 part of silver, 0.005-0.025 part of antimony and 0.01-0.05 part of bismuth, and the solder wire alloy comprises, by mass, 93-95 parts of tin, 0.3-0.7 part of copper, 0.3-0.7 part of silver, 0.005-0.025 part of antimony and 0.01-0.05 part of bismuth. The smokeless soldering flux comprises 2.1-2.5 parts of an alcohol solvent, 0.05-0.09 part of synthetic resin, 0.05-0.09 part of an organic delustering agent, 0.02-0.06 part of an active agent, 0.06-0.12 part of a cosolvent and 0.004-0.02 part of a corrosion inhibitor, antimony and bismuth are added into a tin solder alloy on the basis of original tin, silver and copper, the moisture capacity of a tin material can be improved, meanwhile, the tin blast problem is restrained, and therefore the tin solder alloy has the advantages of being good in corrosion resistance, good in corrosion resistance and the like. And moreover, the fatigue resistance of the tin solder alloy is improved, the bending resistance degree is high, the ductility is enhanced, the subsequent wire drawing process is facilitated, and the risk that the solder wire is broken is reduced.

Provided are a solder alloy, a solder paste, a solder ball, and a solder joint which have a low melting point, are excellent in ductility, shear strength, and heat cycle resistance, further suppress the occurrence of open defects, and in addition, have reduced residual voids even at the time of joining in a large area. A solder alloy has an alloy composition of, by mass %, Bi: 35.0 to 68.0%, Sb: 0.1 to 2.0%, Ni: 0.010 to 0.050%, Ge: 0.007 to 0.090%, with the balance being Sn. Preferably, the alloy composition further contains, by mass %, at least one of Co, Ti, Al, Mn, As, Fe, Pd, Zn, Zr, Pb, In, Ce, P, and Ga: 0.1% or less in total. Further, this solder alloy can be suitably used for solder pastes, solder balls, and solder joints.

This invention provides a highly conductive preformed solder sheet, comprising a core layer and a shell layer disposed around the core layer. By embedding the solid flux core layer within the solder alloy layer to form a sandwich-like shape, the flux can be effectively protected from oxidation. There is no need to apply flux before brazing or remove it after brazing, reducing manufacturing costs and the void rate on the welded surface, thus improving the reliability of the solder sheet. The solder alloy shell is composed of tin, silver, copper, indium, cerium, vanadium, lutetium, yttrium, and zinc. The addition of small amounts of rare earth elements lutetium, yttrium, and cerium improves the conductivity and heat transfer of the solder sheet. The addition of indium, vanadium, and zinc increases the melting point of the solder sheet and improves its solidification state. Since no magnetic materials such as lead, iron, cobalt, nickel, or niobium are added, signal interference caused by metals is avoided.

The application discloses a method and system for rapidly predicting a creep stress index of a tin-based solder alloy by integrating a model, collects element compositions, test temperatures and creep stress index values of the tin-based solder alloy from literature, and adds experimental data as dataset samples; the element compositions and test temperatures of the tin-based solder alloy are sorted out and used as features for modeling; the dataset is randomly divided into a training set and a test set in a 4:1 ratio; the collected creep stress index values of the tin-based solder alloy are used as target variables, and the features are used as independent variables; based on the divided training set, the independent variables are scaled by using RobustScaler, three learners are trained and integrated to obtain an R-X-L integrated model; and the R-X-L integrated model is used to rapidly predict the creep stress index of the test set samples and four independent experimental samples. The prediction model for the creep stress index of the tin-based solder alloy is simple, fast, low-cost, pollution-free and the like based on reliable literature data and a modeling method.

The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.

The invention discloses a high-reliability lead-free solder alloy for electronic applications in extreme environments. A lead-free solder alloy based on tin and comprising silver, copper, bismuth, cobalt and titanium is disclosed. The alloy may also include antimony, nickel, or both. The silver is present in an amount of 3.1% to 3.8% by weight of the solder. The copper is present in an amount of 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount of 0.0% (or 1.5%) to 3.2% by weight of the solder. The cobalt is present in an amount of 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium is present in an amount of 0.005% to 0.02% by weight of the solder. The antimony may be present in an amount of 1.0% to 3.0% by weight of the solder. And the balance of the solder is tin.

The invention relates to high-thermal-conductivity In-Pb-X alloy low-temperature soldering paste and a preparation method thereof, and belongs to the technical field of electronic packaging. The low-temperature soldering paste comprises the following components in percentage by weight: 80.0 to 90.0 percent of soldering flux alloy powder, 6.0 to 10.0 percent of high-activity soldering flux and 4.0 to 10.0 percent of coating agent, the solder alloy powder is composed of, by weight, 14.0%-41.0% of Pb, 0%-10% of X and the balance In, and the element X is one or more of Sn, Ag, Au, Bi, Sb and Cu. The preparation method comprises the steps of solder alloy smelting, solder alloy powder preparation, soldering flux preparation and soldering paste preparation. The soldering paste is low in melting point, low in brazing temperature, high in heat conductivity, high in welding rate, good in wettability to a gold-plated layer, good in brazing manufacturability and suitable for low-temperature packaging of electronic devices.

The present invention discloses titanium-based solder alloy particles, a preparation method thereof, and a titanium cup brazing process, comprising the following steps: preparing a metal alloy according to a mass fraction, preparing the metal alloy into a powder by argon atomization, and screening the powder with a particle size of less than 200 mesh; preparing an organic intermediate according to a mass fraction; mixing the powder with the organic intermediate according to a mass fraction, with the powder accounting for 89-94 and the organic intermediate accounting for 6-11, and extruding into a welding rod with a diameter of 2-3 mm after sufficient stirring; drying the welding rod at 80°C under vacuum for 12 hours; cutting the welding rod into 2-3 mm welding particles to obtain titanium-based solder alloy particles. Beneficial effects of the present invention: The present invention provides titanium-based solder alloy particles, a preparation method thereof, and a titanium cup brazing process, which increases the brazing temperature of traditional solder to 1050 degrees, and the brazing temperature matches the crystallization temperature of the titanium material, so that the crystallization of the titanium cup and vacuum brazing can be integrated, which can reduce processing time, improve product qualification rate, and reduce production cost.

To provide a method for supplying solder by which the content of Bi contained in a solder alloy in a solder bath is maintained at a prescribed amount even after many printed circuit boards are soldered with a Bi-containing solder alloy.SOLUTION: In the solder supply method, an additionally supplied solder, which is a low-Bi solder alloy having a Bi content lower than that of an Sn and / or Bi-containing solder alloy, is supplied to a solder bath into which the Bi-containing solder alloy has been introduced, and the Bi content in the solder bath is adjusted to the Bi content of the Bi-containing solder alloy at the beginning of being put into the solder bath.SELECTED DRAWING: None

The invention discloses a soldering flux, a low-void-rate high-lead soldering paste and a preparation method of the soldering paste, and belongs to the technical field of electronic circuit surface mounting. The soldering flux is composed of 40%-50% by weight of rosin, 0.5%-2% by weight of a defoaming agent, 6%-12% by weight of organic acid, 0.05%-0.2% by weight of haloid, 5%-8% by weight of a thixotropic agent, 1%-2% by weight of a corrosion inhibitor and the balance solvent. The soldering flux and the solder alloy powder are mixed according to the mass ratio of 1: 10 to prepare the high-lead soldering paste. The high-lead solder paste has extremely low voidage, shows good weldability in welding under the condition of meeting the halogen-free standard, is full and bright in welding spots after welding, and is particularly suitable for packaging and welding of electronic components with high voidage requirements.

The present invention provides solder alloys, solder pastes, solder balls, solder preforms, and solder joints that have excellent resistance to drop impact and heat cycling, suppress the occurrence of chipping, bridging, and icicle formation, and also suppress the occurrence of electromigration. [Solution] The solder alloy has an alloy composition consisting of, by mass%, Ag: 0.3~1.9%, Cu: 0.40~1.00%, Bi: 0.5~4.9%, P: 0.00100~0.02000%, and the remainder being Sn. The alloy composition may further contain Ge, Co, and Ga in amounts of 0.06% or less by mass, and at least one of each. The alloy composition may also further contain As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr, and Pt in amounts of 0.06% or less by mass, and at least one of each.

The present invention discloses a method for using a hollow mesh flexible carbon sponge transition layer to assist in the brazing of fiber-reinforced composite materials or ceramics with metals. The present invention utilizes vacuum rapid carbonization to treat melamine formaldehyde resin foam to obtain a carbon sponge material with a low thermal expansion coefficient, high mechanical flexibility, and a hollow network structure. During the brazing process using the carbon sponge material as a transition layer, the liquid solder will spontaneously perform capillary infiltration on the carbon sponge and completely fill it, forming an in-situ composite core-sheath structure in which a continuous network of carbon sponge (shell) wraps the solder alloy (core). This structure combines the advantages of the carbon sponge material's low thermal expansion coefficient, high elastic strain energy, and good plasticity of the metal material, giving the transition layer an overall excellent plastic toughness. This method can effectively improve the interface structure, increase the plastic toughness of the brazing seam, and reduce the thermal expansion coefficient of the brazing seam, significantly improving the mechanical properties of the fiber-reinforced composite material or ceramic and metal joints.

A high-strength thermal-fatigue-resistant lead-free solder alloy and a preparation method therefor. The high-strength thermal-fatigue-resistant lead-free solder alloy comprises the following components in percentage by mass: 2.5-4% of silver; 0.5-1% of copper; 3-3.5% of bismuth; and 2.5-4% of antimony; and further comprises 0.01-0.05% of nickel and 0.04-0.1% of neodymium, or / and 0.02-0.1% of manganese and 0.01-0.05% of cobalt, and the balance being tin and inevitable impurities. The preparation method for a lead-free solder alloy comprises: according to the proportions, blending raw materials, melting, carrying out heat preservation and stirring to obtain the lead-free solder alloy. Therefore, the high-strength thermal-fatigue-resistant lead-free solder alloy has excellent thermal fatigue resistance.

The application discloses a preparation method of a core-shell structure tin-based anti-oxidation solder alloy, and has the characteristics that an anti-oxidation intermediate alloy block is taken as a base body, a high-softening-point rosin is coated on the anti-oxidation intermediate alloy block, then tin foil is coated as a secondary outer layer, and boron nitride hollow mould is coated as an outermost layer, so that an anti-oxidation intermediate alloy-robin-tin foil-boron nitride coating hollow mould core-shell structure is formed; the anti-oxidation intermediate alloy block is a SnPGa anti-oxidation intermediate alloy block or a SnPGe anti-oxidation intermediate alloy block, the mass ratio of P to Ga in the SnPGa anti-oxidation intermediate alloy is 1:5, the mass ratio of P to Ge in the SnPGe anti-oxidation intermediate alloy is 1:2, the mass ratio of the high-softening-point rosin to the anti-oxidation intermediate alloy is 0.02:1, and the volume ratio of the anti-oxidation intermediate alloy block to the boron nitride coating hollow mould is 1:1.3. The core-shell structure tin-based anti-oxidation solder alloy prepared by the method can significantly improve the alloy element yield, improve the static melt surface anti-oxidation performance, and improve the dynamic melt surface mirror surface maintaining state.

A solder preform in the shape of a solder tube or washer includes: a cylindrically shaped solder alloy body including an inner surface, an outer surface, a first end, a second end, a first opening located at the first end, and a second opening located at the second end, the second end interlocking with the first end, and the first opening and the second opening cut along an entire height of the solder alloy body; and a flux core embedded in the solder alloy body between the inner surface and the outer surface, the flux core including a thermochromic indicator. During reflow soldering, the flux core including the thermochromic indicator flows out of the first opening of the first end and the second opening of the second end to coat the inner surface of the solder alloy body and the outer surface of the solder alloy body.

A solder alloy capable of forming a joint portion having heat cycle resistance and drop impact resistance, the solder alloy comprising: 45 mass% or more and 63 mass% or less of Bi; 0.1 mass% or more and less than 0.7 mass% of Sb; and 0.05 mass% or more and 1 mass% or less of In, with a balance being Sn and inevitable impurities, wherein a liquidus temperature of the solder alloy is 170°C or lower.

The present disclosure relates to a corrosion-resistant Sn—Ag—Cu series lead-free solder alloy, belonging to the technical field of soldering material. The present disclosure provides a Sn—Ag—Cu series lead-free solder alloy and a preparation method thereof, wherein the Sn—Ag—Cu series lead-free solder alloy includes, by mass percentage, 2.7-3.3% of Ag, 0.4-0.6% of Cu, 1.5-3.0% of Bi, 0.2-2.0% of Sb, 0.01-0.5% of Zr, and the balance of Sn. The Sn—Ag—Cu series lead-free solder alloy prepared by the preparation method of the present disclosure has properties such as low melting point, high tensile strength, and excellent corrosion resistance. It can be used under harsh conditions and has a wide range of applications.

The invention relates to an automatic transfer device for solder alloy melt. The device comprises a bracket, a crucible carrying mechanism, an electric control cabinet and an electronic circuit, the crucible carrying mechanism comprises a lifting mechanism, a clamp and a clamp moving mechanism; the lifting mechanism comprises a lifting plate, a lifting guide rod, a translation plate, a hydraulic rod and a top plate; the hydraulic rod is arranged between the translation plate and the top plate; the clamp movement mechanism comprises a transverse movement guide rod, a first screw rod, a second screw rod, a translation plate, a clamp guide rod and a first motor, one end of the first screw rod is connected with an output shaft of the first motor, the second screw rod is of a threaded rod structure with the two ends opposite in rotating direction, and one end of the second screw rod is connected to an output shaft of the second motor through a first worm gear reduction gearbox; the clamp comprises a first clamping arm, a second clamping arm, a first clamping plate and a second clamping plate, and a second rod at the tail of the second clamping plate is connected to an output shaft of a third motor through a second worm reduction gearbox. The automatic transfer device has the advantages of being safe and reliable to operate and high in working efficiency, and a worker can conduct automatic transfer operation on the crucible containing the high-temperature solder alloy melt remotely.

Disclosed is a solder alloy having a relatively low melting point and excellent impact resistance without containing Pb. The solder alloy may contain 14-22 mass% of Bi and 16-24 mass% of In, with the remainder comprising Sn and inevitable impurities.

A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W / m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

A paste-like solder for vacuum soldering without flux, characterized in that the paste-like solder for vacuum soldering without flux consists of 45%-60% solder alloy powder and 40%-55% binder by mass; wherein the paste-like solder contains no flux; and wherein the solder alloy powder is made from 6%-10% Mg, 15%-20% Cu and 70%-75% Al by mass; and wherein the binder consists of 75%-85% hexanediol, 8%-12% rosin resin, 2%-6% 1-decanol and 1.5%-4% glycerol by mass; and wherein the particle size of the solder alloy powder is less than 49 µm.