2results about How to "Right melting point" patented technology

This invention discloses a highly efficient degassing refining agent for magnesium alloy ingots and its preparation method in the field of molten metal purification. The refining agent is composed of lanthanum fluoride-supported titanium carbide nanocomposite, calcium zirconate and graphene oxide nanohybrid, and various components such as anhydrous magnesium chloride, anhydrous sodium fluoride, anhydrous potassium chloride, metallic calcium powder, barium carbonate, and alumina micro powder in a specific ratio. Its preparation mainly includes: first, dispersing titanium carbide nanoparticles and reacting them with a lanthanum fluoride-containing solution, followed by hydrothermal treatment and calcination to obtain the lanthanum fluoride-supported titanium carbide nanocomposite; second, mixing a zirconium calcium salt solution with a graphene oxide dispersion, followed by urea co-precipitation, hydrothermal reaction, and calcination under a protective atmosphere to obtain the calcium zirconate and graphene oxide nanohybrid. This invention, through the synergistic effect of two inorganic modifying compounds, can deeply remove hydrogen and inclusions from magnesium melt, thereby significantly improving the metallurgical quality and overall performance of magnesium alloy ingots.

The present application relates to a kind of TR assembly package high thermal conductive eutectic medium temperature solder and foil strip preparation method, belong to microelectronic system packaging field.The solder composition: Sb 10.5~12.5wt%, Sn 0.5~2.0wt%, Ag 0.1~0.5wt%, Cu 0.1~0.5wt%, Pd 0.05~0.2wt%, Ni 0.05~0.2wt%, In 0.01~0.1wt%, P0.002~0.01wt%, the balance is Pb.Its foil strip preparation method includes raw material selection and intermediate alloy preparation, non-vacuum medium frequency induction melting, fast cooling horizontal casting and isothermal rolling step.The alloy melting point is moderate, has high strength, high thermal fatigue and high thermal conductivity etc.;Alloy foil composition is uniform, IMC is small, surface is clean, and the yield is high, satisfies the multistage packaging demand of TR assembly in microelectronic system.