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Leadless welding alloy for welding electronic elements

A technology of lead-free solder alloys and electronic components, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as electric corrosion, excessive welding slag, poor corrosion resistance, etc., and achieve a dense alloy structure , Improve the mechanical properties and refine the alloy structure

Inactive Publication Date: 2009-04-29
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, Sn-Zn series products still have disadvantages such as poor oxidation resistance: due to the high activity of Zn, it is easy to be oxidized to form an oxide film, which leads to poor wettability and more welding slag during the welding process of Sn-Zn solder, and is prone to electrical corrosion. , so the preparation process often needs to be carried out under a protective atmosphere, and a more active flux must be used
The anti-oxidation lead-free solder disclosed in the Chinese patent application number 03129619.X improves the oxidation resistance of the solder by adding alloy elements such as Cu, Ag, Ga, etc., but the disadvantage is that the melting point is too high
Researchers in the United States and Japan believe that the addition of Al is beneficial to improve wettability, but the content of Al in the solder used is very low, because the added Al content is too high, which will make the oxide film too thick and seriously affect the brazing material. Solderability, but the control of trace Al content is difficult
In addition, rare earth-containing tin-based lead-free solder can refine the structure and increase solderability by adding rare earth elements, but the corrosion resistance is not good

Method used

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Examples

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Effect test

Embodiment 1

[0023] Example 1: 100g of rare earth-containing tin-zinc-gallium lead-free solder, its composition and weight percentage are: 5% Zn, 0.1% Ga, 0.1% Ce, and the balance is Sn. Weigh 230g of LiCl and KCl with a mass percentage of 1.3:1, mix them evenly, put them in an alumina crucible, heat to 500°C, put Sn into the crucible after melting, put it back into the furnace to melt Sn completely, and then add Ga. Zn, and Ce, keep stirring, heat preservation for 2h, and pre-cool it out of the furnace. After the covering agent starts to crystallize and salt grains appear, the slag is quickly removed, and then cast.

Embodiment 2

[0024] Example 2: 100g of rare earth-containing tin-zinc-gallium lead-free solder, its composition and weight percentage are: 8% Zn, 3% Ga, 0.8% La, 0.2 Ni, and the balance is Sn. Weigh 230g of LiCl and KCl with a mass percentage of 1.3:1, mix them evenly, put them in an alumina crucible, heat to 500°C, put Sn into the crucible after melting, put it back into the furnace to melt Sn completely, and then add Ga. Zn, and La, keep stirring, heat preservation for 2h, pre-cooling out of the furnace, after the covering agent begins to crystallize and salt grains appear, quickly slag off, and then cast.

Embodiment 3

[0025] Embodiment 3: 100g of rare earth-containing tin-zinc-gallium lead-free solder, its composition and weight percentage are: 10% Zn, 5% Ga, 1% Ce, 2% Ni, and the balance is Sn. Weigh 230g of LiCl and KCl with a mass percentage of 1.3:1, mix them evenly, put them in an alumina crucible, heat to 500°C, put Sn into the crucible after melting, put it back into the furnace to melt Sn completely, and then add Ga. Zn, and Ce, keep stirring, heat preservation for 2h, and pre-cool it out of the furnace. After the covering agent starts to crystallize and salt grains appear, the slag is quickly removed, and then cast.

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Abstract

The invention relates to a leadless soldering alloy used for welding of electronic elements and is characterized in that the weight percentage of all the alloying elements is as follows: 5 to 10 percent of zinc, 0.1 to 5 percent of gallium, 0.1 to 1 percent of rare earth elements and tin as the rest. The leadless soldering alloy has the advantages of low alloy cost, proximity of melting point to the traditional solder, better wettability, excellent mechanical performance, no toxicity, no pollution, excellent comprehensive performance and leading the oxidation resistance to be improved greatly, and can meet the requirements of the application fields of leadless solder of the electronic industry, in particular to household appliances and the like.

Description

Technical field [0001] The invention belongs to the technical field of metal materials, relates to electronic packaging soldering material technology, and particularly relates to a low-cost lead-free solder alloy suitable for soldering electronic components without causing thermal damage. Background technique [0002] Lead-free has become a trend, and the direction of lead-free and non-toxic soldering materials has been determined. my country is also a major electronic assembly country. It is carrying out research on advanced electronic lead-free connecting materials and processes to realize the development and application of lead-free products and promote information The technological advancement of the industry and the electronics industry has improved the competitiveness of my country's electronic products in the international market, and its economic and social benefits are self-evident. In addition, the European Union has banned the use of harmful elements such as lead and c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 郭宏张品杨福宝徐骏石力开
Owner BEIJING COMPO ADVANCED TECH
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