The invention belongs to the technical field of epoxy resin adhesives, and particularly discloses a single-component epoxy resin conductive silver adhesive composition and a preparation method thereof. The composition contains the following components in parts by weight: 10-25 parts of epoxy resin, 1-5 parts of diluter, 0.5-3 parts of toughening agent, 0.5-3 parts of enhancer, 0.5-3 parts of solvent, 0.5-3 parts of coupling agent, 0.5-3 parts of anti-aging agent, 1-5 parts of curing agent, 0.2-1 part of accelerator and 30-35 parts of silver powder. The preparation method of the composition comprises the following steps: thoroughly and uniformly mixing all the components except silver powder at 20-35 DEG C, adding the silver powder, thoroughly and uniformly mixing, and carrying out vacuum degassing under stirring conditions to obtain the finished epoxy resin conductive adhesive composition product. The composition has the advantages of low viscosity, favorable condensate strength, high adhesive force, low volume resistivity, high heat conductivity, long shelf life, favorable long-term weather resistance and stable electric properties, and can be widely used in electronic industry and other conductive adhesive industries.