The invention discloses a preparation method of a fine-grain high-
hardness high-flatness
copper plate, which comprises the following steps: (1) sequentially cleaning and
polishing a high-purity
oxygen-free
copper plate to obtain a pre-rolled plate; (2) stacking a plurality of pre-rolled plates, fixing the edges of the pre-rolled plates, and performing multi-pass rolling at
room temperature to realize accumulative ply rolling, so as to obtain rolled plates; (3) carrying out annealing treatment on the rolled plate in an
inert atmosphere, and then straightening; (4) the annealed plate is subjected to
laser surface melting treatment; and (5)
surface chemical mechanical
polishing and cleaning are carried out, and the fine-grain high-
hardness high-flatness
copper plate is obtained. According to the method, the copper plate is subjected to
severe plastic deformation through the
accumulative roll bonding technology, the refining limit of a traditional
machining mode on the grain size is broken through through the large dependent variable, then through
laser surface melting, the grain size of the surface of the copper plate is further reduced, meanwhile, the surface
hardness is increased to 120-190 HV from 50-60 HV, the
polishing efficiency is remarkably improved, and the polishing quality is improved. And finally, the high-flatness copper plate is obtained.