The application discloses a method for improving the adhesion of an
integrated circuit and a glass substrate, comprising the following steps: S1,
surface cleaning, S2, surface treatment, S3, introducing an
adhesive layer, S4,
temperature control, S5, alignment and compression, and S6, solidification. The application improves the roughness and
chemical activity of the surface of the glass substrate through special treatment of the glass substrate, improves the adhesion of the surface of the glass substrate, controls the
compression pressure and compression rate of the
integrated circuit and the glass substrate, makes the contact surface between the two uniform and free of bubbles, and further improves the connection reliability between the
integrated circuit and the glass substrate. Excellent adhesion performance can realize better contact
thermal resistance, improve the heat conduction performance,
high adhesion can realize smaller gap and more compact packaging structure, make the overall size smaller, and can also increase the contact area and
bonding strength between the integrated circuit
chip and the glass substrate, and improve the anti-vibration and anti-
impact capability.