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Enhanced surfaces, coatings, and related methods

A surfactant, average cross-section technology, applied in the field of molded articles, to solve problems such as efficacy limitations

Active Publication Date: 2011-09-14
TPK HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Third, the thickness of the coating layer is generally much larger than the size of the particles or additives, causing these additives to become embedded in the coating, limiting their effectiveness

Method used

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  • Enhanced surfaces, coatings, and related methods
  • Enhanced surfaces, coatings, and related methods
  • Enhanced surfaces, coatings, and related methods

Examples

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example 1

[0220] Non-limiting example 1 : Surface plasmons are the excitation of free electrons on metal surfaces under photoexcitation conditions; many semiconductor and organic semiconductor systems now employ plasmonic passive and active materials. Using the embedding methods described herein (or the polymer softening methods described in the related patent applications incorporated herein by reference in their entirety), embedding particles, molecules, etc., such as nanowires and nanocones, to form passive optical nanoantennas , the nanoantenna can alter or improve the absorption of radiation, photons and / or light incident into the OPV.

example 2

[0221] Non-limiting example 2 : the method disclosed in the present invention can make TiO 2 The interlayer of particles is embedded in and / or on top of the OPV. Such particles and layers reduce recombination losses and dramatically increase device efficiency (up to 160%). TiO 2 Light blocking layers are beneficial, for example, in organic dye-sensitized solar cells.

example 3

[0222] Non-limiting example 3 : The method disclosed in the present invention can be applied to luminescent solar concentrators (LSC). In some embodiments, a polymer softening solution (described in a related patent application incorporated herein by reference) is capable of temporarily altering the polymer substrate surface so that particles can be embedded into the polymer surface in the LSC. These particles can be, but are not limited to, scatterers, concentrators, nanoantennas, nanotubes, butt couplers, mirrors, focusing elements, refractive elements, mirrors, or waveguides that facilitate the absorption of incident solar radiation and its coupling into the interior of the LSC Other structures in the mold. This solution-based treatment of polymers by embedding particle inclusions into the polymer surface can alter the material's surface impedance, surface conductivity, refractive index, extinction, and / or optical transparency, resulting in improved device performance.

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Abstract

Disclosed are methods for incorporating additives, such as chemically active particles, into the surfaces of articles or into coatings disposed atop articles. The disclosed methods are also applicable to conventional molding techniques, and can be performed in batch or continuous fashion.

Description

[0001] related application [0002] This invention claims U.S. Patent Application No. 61 / 189,540 (filed August 21, 2008) and U.S. Patent Application No. 61 / 203,661 (filed December 26, 2008) and PCT Patent Application PCT / US2008 / 065083 (filed 2008 filed May 29), which are incorporated herein by reference in their entirety. technical field [0003] The present application relates to the field of moldings and the application of coating materials. Background technique [0004] Direct or bulk blending and compounding methods are widely used in industry to treat polymer bodies with performance enhancing additives, resulting in dispersion of the additives throughout the bulk of the material. Conventionally, the term "additive" refers to chemicals and materials (plastic additives) that are incorporated into masterbatches for bulk blending or directly into resin mixtures by direct compounding, or in coatings. Chemicals and materials (paint additives) into solution. [0005] Howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B23/00B28B19/00B05D5/00
CPCB29C2071/0018B29C37/0032B29C71/0009B29C70/64B29C2071/0054B29K2995/0005B29K2105/0023B29C59/022B29C2059/028Y10T428/25Y10T428/254H01L31/055B28B1/00B28B5/00B28B19/00B28B23/00
Inventor 迈克尔·E·扬亚历山大·C·米塔尔阿琼·D·斯里尼瓦斯卡尔文·彭
Owner TPK HLDG
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