The invention relates to a cleaning
system (100, 200) for cleaning a
semiconductor substrate carrier (105, 205) or at least a surface of the carrier (105, 205), comprising: a first chamber (110, 210) and a second chamber (120, 220), where the first chamber (110, 210) and the second chamber (120, 220) are in fluid communication with each other, where the second chamber (120, 220) is configured to receive the carrier (105, 205); an input
fluid supply (130, 230) configured to provide an input fluid (135, 235) to the first chamber (110, 210); a
radiation source (140, 240) configured to provide
radiation of at least one predetermined
wavelength within the first chamber (110, 210) and configured to generate a cleaning fluid (145, 245) comprising
plasma and / or
ozone and / or
atomic oxygen by exposing an input fluid (135, 235) in the first chamber (110, 210) to the
radiation; a cleaning fluid delivery unit (150, 250) configured to deliver a cleaning fluid from the first chamber (110, 210) to the second chamber (120, 220) to clean the carrier (105, 205) or at least a surface of the carrier (105, 205) disposed in the second chamber (120, 220), and configured to subject the carrier (105, 205) or at least the surface of the carrier (105, 205) to the cleaning fluid in the second chamber (120, 220).