The invention provides a deposition method and
system for
chemical vapor deposition of
silicon carbide, and the method comprises the following steps: S1, providing a
graphite base material, putting the base material into a reaction module, starting a rotating device, introducing
silane gas, controlling the
reaction temperature to be 1100-1200 DEG C, and continuously reacting for 5-10 minutes to form
silicon carbide grains on the surface of the base material; s2, the temperature of the reaction module is lowered to 400-500 DEG C, annealing treatment is conducted on the base material with the
silicon carbide crystal grains formed on the surface, the reaction time is not shorter than 5 min, and the flatness of the
silicon carbide crystal grains is improved; and S3, the
gas supply module introduces at least three kinds of process gas into the reaction module, the temperature of the reaction module is adjusted to rise to 1300-1500 DEG C, and the
silicon carbide film is deposited on the surface of the base material. Through annealing treatment, the flatness of
silicon carbide grains is remarkably improved, the deposition efficiency of the silicon carbide thin film is optimized,
internal stress generated in the
deposition process is effectively reduced, the uniformity and consistency of a deposition layer are ensured through application of the rotating device, and the overall quality of the silicon carbide thin film is further improved.