44results about How to "Reduce aspect ratio" patented technology

The invention discloses a passive feed-forward noise shaping SAR ADC structure and a quantification method thereof. The structure comprises a second-order noise shaping circuit based on a charge pump, a sampling switch circuit, a DAC capacitor array, a six-input comparator and a logic control circuit. The method comprises the following steps: sampling an input analog signal to an upper pole plate of a DAC capacitor array; carrying out inter-board capacitor voltage switching processing according to the control signal, and outputting a successive approximation voltage signal; obtaining quantization residual voltage in inter-board capacitor voltage switching processing, performing second-order noise shaping filtering processing, and outputting a first-order integral voltage signal and a second-order integral voltage signal; comparing the successive approximation voltage signal, the first-order integral voltage signal and the second-order integral voltage signal to obtain a digital code; and carrying out inter-board capacitor voltage switching according to the digital code to obtain a quantization result. According to the embodiment of the invention, the power consumption of the SAR ADC structure can be reduced, and the quantization precision of the SAR ADC structure can be improved. The circuit can be widely applied to the technical field of integrated circuits.

The invention relates to a transmission grating and a preparation method thereof, and the transmission grating comprises a substrate which is provided with a first surface; the grating layer comprises trapezoidal grating teeth arranged on the first surface in an array mode, the grating teeth extend in the thickness direction of the substrate, and a gap is formed between every two adjacent grating teeth; the dielectric layer is arranged on the surface of the grating layer and fills the gap, one side, far away from the substrate, of the dielectric layer is provided with a second surface, a difference value exists between the distance between the second surface and the first surface and the height of the grating teeth, and the difference value is m; incident light enters the second surface through the inside of the grating layer. By designing the film layer structure and the film layer size of the transmission grating, the transmission grating with different diffraction efficiencies and polarization degrees can be obtained, the size of the film layer structure of the transmission grating can be accurately controlled during processing, and processing is easy.

The invention discloses a distributed power fixed-point take-off and landing portable solar unmanned aerial vehicle, and belongs to the technical field of overall comprehensive design of unmanned aerial vehicles. Comprising a front wing, a rear wing and a folding assembly, the front wing and the rear wing are arranged in a tandem wing mode, the folding assembly is connected between the front wing and the rear wing, the front edge of the front wing and the front edge of the rear wing are each provided with a plurality of rotors in the spanwise direction, and the four rotors located in the spanwise middle of the front wing and the spanwise middle of the rear wing are located at the four vertexes of a quadrangle respectively to form the four-rotor power system of the unmanned aerial vehicle. The other rotor wings form a fixed wing power system of the unmanned aerial vehicle; the front wing and the rear wing are connected into a tandem wing with a space height difference through the folding assembly, and the front wing and the rear wing can be in a stacked state through deformation. The problems that a single-type propeller of a tailstock type configuration machine consumes much energy, the efficiency of the cruising stage is low, and the endurance is short are solved.

The invention discloses a method for forming a contact hole of a semiconductor device and a semiconductor device structure. The method comprises the following steps: providing a substrate on which a first contact hole etching stop layer is formed, and forming a plurality of gate structures on the substrate; an original sacrificial layer is formed on the first contact hole etching stop layer, and partial modification processing is performed on the original sacrificial layer, so that the original sacrificial layer above the top of each gate structure is modified into a modified sacrificial layer; the modified sacrificial layer and the first contact hole etching stop layer are etched, so that the first contact hole etching stop layer located between the modified sacrificial layer and the top of each gate structure is reserved, and a compensation etching stop layer is formed; forming a target structure comprising a second contact hole etching stop layer and an interlayer dielectric layer on the substrate; and forming a contact hole in the target structure. According to the scheme of the invention, the problems of grid damage, gaps and holes of the interlayer dielectric layer and the like in the manufacturing process of the contact hole are solved.

The invention discloses a stacked and integrated micro-display device and a preparation method thereof, and relates to the technical field of semiconductors. The micro display device comprises a driving wafer and a plurality of display device layers arranged on the driving wafer, any display device layer comprises a sub-pixel, and the sub-pixel is electrically connected with a first type of electrode contact in the driving wafer through a transparent conductive layer at the top of the display device layer; at least one display device layer further comprises an electrode conduction structure, the electrode conduction structure is conducted with electrode contacts including the first type of electrode contacts in the driving wafer, and the electrode conduction structure comprises a first electrode conduction structure and a second electrode conduction structure which are stacked in the direction away from the driving wafer; the top height of the first electrode conduction structure is not higher than the top height of the sub-pixel in the current display device layer, and the top height of the second electrode conduction structure is not lower than the top height of the sub-pixel in the current display device layer.

The invention provides a circulating biological filter based on packaged nitrifying bacteria and an operation method thereof.The circulating biological filter comprises a conical bottom area V1, a cylindrical reaction area V2 and a three-phase separation area V3, the bottom of the three-phase separation area V3 is communicated with the cylindrical reaction area V2, the bottom of the cylindrical reaction area V2 is communicated with the conical bottom area V1, and the conical bottom area V1 is communicated with the cylindrical reaction area V2. The three-phase separation area V3 is formed by a conical bottom inner cavity, the cylindrical reaction area V2 is formed by a reaction area inner cavity, and the conical bottom area V1 is formed by an overflow weir inner cavity. By optimizing the proportion of each part of the biological filter of the three-phase biological fluidized bed, the height-diameter ratio is reduced; and the flow guide cylinder and the flow guide cover are arranged, and air is utilized for pushing, so that an aerobic environment required by nitrifying bacteria can be ensured, the filler can be fully fluidized, the mass transfer effect is enhanced, and a good treatment effect on ammonia nitrogen pollutants in aquaculture tail water is achieved.

The invention discloses a lossless reinforcing device and reinforcing method applied to a single-angle steel structure of a power transmission tower, the lossless reinforcing device is connected to the single-angle steel structure of the power transmission tower, and the lossless reinforcing device comprises a buckle, reinforcing angle steel and at least two limiting plates; the limiting plates are fixedly connected to the reinforcing angle steel at intervals, clamping grooves matched with the back of the single-angle steel structure are formed in the limiting plates, the reinforcing angle steel is connected with the back of the single-angle steel structure in a clamped mode through the clamping grooves of the limiting plates to form symmetrical attaching pieces with cross-shaped cross sections, and rapid limiting of the reinforcing angle steel relative to the single-angle steel structure is achieved. The buckles are connected with the limb tips, on the same side relative to the symmetry axis, of the attaching pieces in a clamped mode to achieve fixation between the reinforcing angle steel and the single-angle steel structure. The lossless reinforcing device has the beneficial effects that the purpose of improving the compression and bending stable bearing capacity of the single angle steel of the power transmission tower is achieved, drilling and welding on the original angle steel are avoided, and in-situ lossless reinforcing can be achieved.

The utility model provides an upper nozzle cutting line for blow molding processing, and belongs to the technical field of blow molding processing. Comprising a primary cutting station and a secondary cutting station, the secondary cutting station comprises a mounting frame, a rotating roller located below an outlet of a conveying belt, two clamping pieces located on the two sides of the rotating roller correspondingly, a front push plate, a rear push plate and a secondary cutting knife, and the front push plate and the rear push plate are both controlled through an air cylinder; the clamping piece comprises main rollers rotationally connected to the mounting frame and secondary rollers located on one side of the main rollers, the two main rollers, the two secondary rollers and the rotating roller form a positioning structure capable of clamping a bottle body, the main rollers and the rotating roller are hollow rollers, two insertion rods inserted into the two main rollers respectively are fixedly arranged on the front push plate, and the two insertion rods are fixedly connected to the front push plate. The rear push plate is rotationally connected with a driving rod in spline connection with the rotating roller, the rear push plate is further provided with a positioning rod capable of being inserted into a bottle opening, and the front push plate is provided with a positioning block corresponding to the bottom of a bottle body; and the secondary cutting knife is controlled by a lifting device. The device has the advantages of high precision and the like.

The present application relates to the technical field of net rack structure reinforcement, and particularly relates to a welding-free full-assembled net rack rod piece reinforcement device and method. The device comprises: a fixed center bearing frame for reinforcing a circular tube component; a telescopic vertical sliding inclined strut assembly arranged between two adjacent vertical fixed vertical rods; an assembled sectional sleeve assembly for fixing the fixed center bearing frame outside the circular tube component; a cable body for connecting two connecting bases on the fixed center bearing frame; and a tensioning adjusting mechanism for adjusting the tension of the cable body. The welding-free full-assembled net rack rod piece reinforcement device and method provided by the present application adopts a welding-free full-assembled construction process, and the components are standardized prefabricated in a factory. The components are only assembled by bolts and pins at the site, so that the construction is safe and efficient, welding damage is avoided, and the original structure performance is not affected. The components are connected by bolts, so that the components are convenient to disassemble and assemble, the components can be recycled and reused, and the engineering cost is reduced.

This invention provides a semiconductor structure and a method for fabricating the semiconductor structure. The semiconductor structure includes an array region and a logic region located adjacent to each other on one side of a substrate. The array region includes a first array connection portion and a semiconductor device sequentially connected along a first direction. The semiconductor device has a first surface in contact with the first array connection portion. The logic region has a first logic connection portion and a second logic connection portion sequentially connected along the first direction. The second logic connection portion has a second surface in contact with the first logic connection portion. The cross-sectional dimension of the first logic connection portion in the second direction is smaller than the cross-sectional dimension of the second logic connection portion in the second direction, and the second direction is perpendicular to the first direction. In the first direction, the first surface has a first perpendicular distance from the substrate, and the second surface has a second perpendicular distance from the substrate. The first perpendicular distance is greater than or equal to the second perpendicular distance.

The invention discloses an air oxygen enrichment process for full-temperature simulated rotating moving bed pressure swing adsorption, belongs to the technical field of pressure swing adsorption, and solves the technical problem that both the purity and yield of O2 products cannot be achieved. The process places a plurality of axial flow fixed bed adsorption towers on a circular rotating tray and is placed in the center of a multi-channel rotary valve and around the valve, and is connected through pipelines and the rotation direction and speed of the rotary valve, the rotation direction and speed of the circular rotating tray are regulated, so that the gas flowing through the multi-channel rotary valve channel and the pipeline connected to the inlet and outlet ends of the channel and the inlet and outlet ends of the adsorption tower on the circular rotating tray and the rotating and moving adsorption bed in the adsorption tower continuously passes through the position of the inlet and outlet of each adsorption tower and each adsorption bed completes the mass transfer of the respective adsorption and desorption steps while rotating, thereby forming a "simulated rotating moving bed" pressure swing adsorption process, improving the mass transfer efficiency and production scale, and obtaining high-purity and high-yield O2 products.

The utility model discloses a kind of reinforcing structures between steel structure factory building beam column steel frame, including the inclined brace component being arranged between existing steel column and existing steel frame beam, inclined brace component includes inclined brace rod, and column connecting plate and beam connecting plate being arranged at both ends, column connecting plate connects the existing steel column, and beam connecting plate connects the existing steel frame beam;Existing steel column is provided with column reinforcing plate in the region of connecting the column connecting plate, and existing steel frame beam is provided with beam reinforcing plate in the region of connecting the beam connecting plate;Adjacent the existing steel column between being arranged at factory building side wall is further provided with detachable intercolumnar rigid tie rod, and the setting height of the intercolumnar rigid tie rod is not lower than the height of column connecting plate at the position. Through the above setting, the safety and stability of the roof truss beam can be better ensured, the roof permanent load can be increased, the overall structure is simple, and the original structure does not need to be disassembled or adjusted, so the installation and construction are easy.

The invention provides a semiconductor device, a manufacturing method thereof and electronic equipment. The semiconductor device comprises a fin structure, an isolation dielectric layer, a source electrode, a drain electrode and a power supply through hole. The fin structure penetrates through the isolation dielectric layer in the thickness direction, the surface of one side of the fin structure is flush with the second surface of the isolation dielectric layer, and the other side of the fin structure protrudes out of the first surface of the isolation dielectric layer. The source and drain electrodes are electrically connected with the channel region of the fin structure, the power supply through hole penetrates through the isolation dielectric layer in the thickness direction, the first end of the power supply through hole is electrically connected with the source and drain electrodes, the second end of the power supply through hole is flush with the second surface of the isolation dielectric layer, and the second end of the power supply through hole is used for being electrically connected with a back side power distribution network. By removing the substrate on the back surface, the end surface of the power supply through hole is flush with the second surface of the isolation dielectric layer, and the depth-to-width ratio of the power supply through hole can be reduced, so that the manufacturing process of the power supply through hole is simplified, and the complexity of the manufacturing process of the back surface of the semiconductor device is reduced.

The invention belongs to the field of optical devices, and particularly relates to a large-view-field super-structure lens based on a multilayer structure, which is characterized in that Ge with high refractive index and ZnSe with low refractive index are alternately stacked to form a super-structure unit with an eight-layer structure, so that excitation of a high-order mode is destroyed, and the super-structure lens only supports a single electric dipole mode; the resonant frequency is broadened by controlling the coupling effect between layers, so that more consistent phase response can be generated under different incident angles; the total height of the superstructure unit of the eight-layer structure is 7 microns, the angle insensitive characteristic of the superstructure unit can be improved, meanwhile, the aspect ratio of the superstructure unit can be reduced, and the superstructure unit evenly and reasonably corresponds to the 2pi phase range within the simulation radius; compared with a super-structure lens composed of a super-structure unit of a single-layer structure, the focusing efficiency of the super-structure lens composed of the super-structure units of an eight-layer structure is improved by about 30% during 50-degree incidence, and the super-structure lens has important significance in optimizing the optical performance of the large-view-field super-structure lens.

The present disclosure provides a semiconductor structure and a method for manufacturing the same. The method includes: providing a silicon substrate having a gate structure disposed thereon and including source / drain doped regions; forming a dielectric stack covering the source / drain doped regions on the silicon substrate, the dielectric stack including a first nitride layer, an oxide layer and a second nitride layer stacked in sequence; etching the dielectric stack to form an initial contact hole exposing the source / drain doped regions, the initial contact hole having a lateral dimension in the first nitride layer and the oxide layer smaller than a lateral dimension in the second nitride layer; etching the oxide layer and the first nitride layer to form a contact hole having a lateral dimension in the first nitride layer and the oxide layer larger than a lateral dimension in the second nitride layer; forming a metal silicide layer at a bottom of the contact hole; forming a nitride liner layer at sidewalls of the contact hole; and forming a contact plug in the contact hole and connected to the metal silicide layer. The present disclosure is easy to form the metal silicide layer and prevents metal diffusion of the contact plug.

The invention discloses an air separation nitrogen production process of full-temperature simulated rotating moving bed pressure swing adsorption (FTrSRMPSA), in which a plurality of axial flow fixed bed adsorption towers are placed in the center of a multi-channel rotary valve and arranged on a circular rotating tray around the valve, and are connected through pipelines and the rotating direction and speed (ω1) of the rotary valve and the rotating direction and speed (ω2) of the circular rotating tray are regulated, so that the gas flowing through the rotating adsorption bed layer in the adsorption tower continuously passes through the positions of the inlet and outlet of each adsorption tower and each adsorption bed layer completes the mass transfer of its own adsorption and desorption steps while rotating, thereby realizing the simulated rotating moving bed pressure swing adsorption process based on the axial flow fixed bed pressure swing adsorption, so that the adsorption and desorption multi-step cyclic operation is performed, and the nitrogen product gas with a purity of 96-99.9% and a yield of 50-70% is obtained from the air.

The invention discloses a lossless reinforcing device for an angle steel structure of a power transmission tower, which is connected to a single angle steel structure of the power transmission tower and comprises a buckle and reinforcing angle steel, the reinforcing angle steel and the single angle steel structure are attached to each other in a limb back mode to form symmetrical attaching pieces with T-shaped sections. The buckles are connected with the two limb tips on one side of the symmetry axis of the attaching piece and the two limb tips on the two sides of the symmetry axis of the attaching piece in a clamped mode respectively, and fixing between the reinforcing angle steel and the single-angle steel structure is achieved. The method has the beneficial effects that the fixing design that the fitting pieces with symmetrical T-shaped sections are formed by the reinforcing angle steel and the single angle steel in a limb back attaching mode and the buckles is adopted; when the single angle steel is pressed or bent, the buckles ensure that the reinforcing angle steel and the original single angle steel are firmly attached and cooperatively work, the inertia moment of the T-shaped section is increased, the bearing capacity of the T-shaped section is enhanced, and the original angle steel is prevented from being untimely unstable and damaged; the reinforcing method adopting the lossless reinforcing device is suitable for reinforcing single angle steel of structures such as a power transmission tower, drilling and welding on original angle steel are not needed, in-situ lossless reinforcing is achieved, and field installation is convenient.

The invention discloses a silicon optical device structure and a manufacturing method thereof. The silicon optical device structure comprises a dielectric layer arranged on a substrate; the waveguide structure is arranged in the dielectric layer; the waveguide structure comprises a first waveguide, an electro-optical material pattern and a second waveguide which are sequentially stacked away from the substrate; the electro-optical material pattern and the second waveguide are sequentially formed on the first waveguide in a self-alignment mode. The groove-shaped waveguide structure capable of being subjected to photoelectric modulation can be formed by utilizing the characteristics of the electro-optical material, the groove width of the groove-shaped waveguide can be adjusted through the filling thickness of the electro-optical material, the groove-shaped waveguide structure with different intervals can be achieved, automatic alignment of the two layers of waveguides in the width direction can be achieved, and the photoelectric modulation efficiency is improved. And the dual advantages of low loss and photoelectric modulation can be realized.

The invention belongs to the field of material cooling, and particularly relates to a gravity flow type indirect cooler and a cooling method.The dry gas is introduced into a recooler body through a fluidization air gas distribution assembly, so that materials in a material fluidization section are in a fluidized state, it is guaranteed that the gas evenly penetrates through the materials upwards, and the materials are cooled; therefore, materials fed from the feeding port are quickly spread in the horizontal direction, and after uniform particle distribution is formed on the cross section of the cooler, the materials integrally and uniformly move downwards to pass through the gravity cooling section, so that material segregation and non-uniform cooling caused by different cooling speeds of the materials at all positions are eliminated; and the materials are fluidized by using dry gas, so that wet and hot gas brought along with the materials and moisture in pores or air holes on the surfaces of material particles can be more effectively removed, and the materials are prevented from scabbing on the surface of the heat exchanger assembly. According to the invention, materials can be cooled more uniformly, the moisture of the materials is more uniform, and the problems of hardening and caking in the storage and transportation process of products can be improved.

The invention discloses a reinforcing device and reinforcing method applied to a single-angle steel structure of a power transmission tower, and the reinforcing device is connected to the single-angle steel structure of the power transmission tower and comprises a buckle and at least one reinforcing angle steel; the reinforcing angle steel is externally wrapped or internally attached to the single angle steel structure to form an angle steel attaching piece of a multi-layer structure, and the buckles are connected with the two limb tips of the angle steel attaching piece in a clamped mode to achieve detachable connection with the attaching piece. The reinforcing device has the beneficial effects that the reinforcing angle steel is locally or wholly attached to or externally wrapped on the original single angle steel or can be simultaneously attached to or externally wrapped on the original single angle steel, so that an L-shaped overlapped section is formed; the buckles can ensure that the outer wrapping angle steel and the inner attaching angle steel are firmly attached to the original angle steel and work cooperatively, and the compression bearing capacity and the bending bearing capacity of the original single angle steel are improved; according to the reinforcement method, in-situ lossless reinforcement can be realized without welding and drilling on the original angle steel.

The invention discloses a packaging structure and a packaging device. The packaging structure comprises a metal substrate, a ceramic wall body structure and a lead, the ceramic wall body structure and the lead are located on one side of the metal substrate, the ceramic wall body structure comprises at least two cavities, the cavities are communicated with the surface, close to one side of the ceramic wall body structure, of the metal substrate, the lead is connected with the ceramic wall body structure, and the at least two cavities comprise the first cavity and the second cavity. The first cavity and the second cavity are arranged in the first direction, and the first direction is parallel to the surface of the side, close to the ceramic wall structure, of the metal substrate. According to the packaging structure and the packaging device provided by the embodiment of the invention, at least two independent cavities are arranged on the same metal substrate, so that the combined packaging of high-power multi-electronic elements is met, the length-width ratio of a single cavity can be reduced, the problem of cracking caused by mismatching of thermal expansion coefficients of a ceramic wall body structure and the metal substrate is solved, and the service life of the ceramic wall body structure and the metal substrate is prolonged. And the integration level is higher, the cost is lower, and the assembly consistency is better.

The utility model provides a structure for improving the section grade of a composite beam. The structure comprises a steel beam, reinforcing angle steel and a concrete floor. The concrete floor slab and the steel beam are connected through a connecting piece; the steel beam is provided with a neutralizing shaft, the part above the neutralizing shaft forms a compression area, the compression area comprises a T-shaped compression area of the steel beam and a concrete floor, reinforcing angle steel is installed on the outer side of the steel beam and located in the T-shaped compression area of the steel beam, and two limb plates of the reinforcing angle steel are tightly attached to a web and an upper flange of the steel beam respectively. The reinforcing angle steel is symmetrically arranged on two sides of a web of the steel beam. The reinforcing angle steel is arranged in the compression area of the web of the steel beam, so that the width-to-thickness ratio of the web in the compression area is reduced, the web of the composite beam meets the S1 section grade, and meanwhile, the bending resistance and the shearing resistance of the composite beam are improved. The combined beam is simple in structure and beneficial to popularization of the combined beam in a steel structure reinforcing project.

The utility model provides a horizontal cutting device for an upper nozzle of a plastic bottle, and belongs to the technical field of blow molding processing. Comprising a rack and a conveying belt rotationally connected to the rack, a limiting baffle and a first transmission belt are arranged on one side of the conveying belt, a second transmission belt is arranged on the other side of the conveying belt, an air storage box fixed to the rack is arranged between two straight sections of the first transmission belt, and a side face opening, parallel to the straight sections on the inner side of the first transmission belt, of the air storage box is formed; a plurality of air nozzles are alternately arranged on the first transmission belt, the air inlet ends of the air nozzles located on the inner side of the first transmission belt are communicated with an air storage box, the air storage box is communicated with a positive pressure air source, a plurality of partition plates are arranged on the conveying belt, and the distance between every two adjacent partition plates is equal to that between every two adjacent air nozzles. The linear speed of the conveying belt, the linear speed of the first transmission belt and the linear speed of the second transmission belt are equal; a secondary cutting knife is arranged at the top of the gas storage tank; a pressing belt located above the conveying belt is arranged on the machine frame. The device has the advantages of high precision and the like.

The present application discloses a method for forming a contact hole of a semiconductor device and a semiconductor device structure. The method includes: providing a substrate formed with a first contact hole etch stop layer, and a plurality of gate structures are also formed on the substrate; forming an original sacrificial layer on the first contact hole etch stop layer, and partially modifying the original sacrificial layer so that the original sacrificial layer located above the top of each gate structure is modified into a modified sacrificial layer; etching the modified sacrificial layer and the first contact hole etch stop layer so that the first contact hole etch stop layer located between the modified sacrificial layer and the top of each gate structure is retained and a compensation etch stop layer is formed; forming a target structure including a second contact hole etch stop layer and an interlayer dielectric layer on the substrate; and forming a contact hole on the target structure. Through the scheme of the present application, problems such as gate damage and interlayer dielectric layer gaps and holes that are prone to occur during the contact hole manufacturing process are improved.

The invention discloses a multilayer RDL interconnection structure and a manufacturing method thereof, and belongs to the technical field of printed circuits. The multi-layer RDL interconnection structure comprises at least one layer of RDL, a plurality of micropores used for connecting the RDL are prepared in a photosensitive dielectric material layer attached to the surface of each layer of RDL, and all the layers of RDL are interconnected through the metalized micropores. According to the structure, a copper pad structure in a conventional multilayer RDL interconnection structure is abandoned, the micropores used for interconnection are directly manufactured on the metal wires, the size of the interconnection structure is reduced, and the structure has practical value.

The application provides an etching method, and provides an etching structure, which comprises an insulating layer, a metal layer and a patterned photoresist layer arranged on the insulating layer in sequence; the photoresist layer is used as a mask, and the metal layer is etched by using an inert gas ion beam at a first etching angle to obtain an etching groove; a metal deposition layer is formed on the sidewall surface of the photoresist layer during the etching process; the photoresist layer and the metal deposition layer are etched by using a mixed gas ion beam at a second etching angle to remove the metal deposition layer; the mixed gas comprises inert gas and reactive gas, the reactive gas can react with the photoresist layer and can consume the photoresist layer, so that the aspect ratio of the etching groove is reduced, the etching of the metal deposition layer by the mixed gas ion beam is facilitated, the mixed gas is incident into the etching groove at the second etching angle, the second etching angle is greater than the first etching angle, the metal deposition layer can be completely removed, the damage to the insulating layer is reduced, and the yield of the metal electrode is improved.

The invention relates to the field of ceramic materials, in particular to an aluminum oxide-based ceramic material and a preparation method thereof.The preparation method comprises the steps that sulfonic polyferrocene modified carbon nanotubes, magnesium oxide and aluminum oxide are mixed and subjected to ball milling to obtain slurry, the slurry is dried, and then the slurry is subjected to granulation, blank pressing and sintering to obtain the aluminum oxide-based ceramic material. The method has wide application prospects in the fields of machinery, electronics, chemical engineering, biomedicine and the like.

The utility model discloses a large-scale steel structural member hoisting frame suitable for indoor use, which comprises two groups of steel supporting pipe frame bodies, a plurality of steel supporting pipe frame bodies and a plurality of steel supporting pipe frame bodies, the steel supporting pipe frame bodies comprise a plurality of longitudinal steel pipes and a plurality of transverse steel pipes, the longitudinal steel pipes and the transverse steel pipes are arranged in a # shape, and the lower ends of the longitudinal steel pipes abut against the ground; the hoisting beam is arranged above the two sets of steel supporting pipe frame bodies, the two ends of the hoisting beam are fixedly connected with the two sets of steel supporting pipe frame bodies correspondingly, the hoisting beam comprises three first steel pipes, and the three first steel pipes of the hoisting beam are perpendicularly and fixedly connected with the top transverse steel pipes of the two sets of steel supporting pipe frame bodies correspondingly; the two first steel pipes are arranged above the top transverse steel pipes of the two sets of steel supporting pipe frames, and the other first steel pipe is arranged below the top transverse steel pipes on the two sides. By means of conventional measures and materials in constructional engineering and by matching with a conventional erecting and combining method, the problem of hoisting construction points under the condition that operation conditions are limited in a narrow indoor space is solved, and application and popularization value is achieved.

This utility model patent belongs to the field of equipment technology in the steel industry, and is an inlet guide device for a steel straightening machine invented to achieve stable entry of steel sections into the straightening machine. The main components include a base, a screw jack, a fixed seat, a vertical roller assembly, side guide plates, and a guide plate. The screw jack is mounted on the base via the fixed seat and connected to the vertical roller assembly. The side guide plate adopts a thickened stepped recessed design and is fixed to the roller base via positioning pins and sleeve seats. The vertical roller assembly is fixed to the base via the guide plate. This reduces the installation height of the load-bearing components, the vertical roller assembly and the side guide plate, down to the base, thus reducing the height-to-width ratio of the entire guide device and decreasing the overturning moment when the steel section impacts the guide device, thereby preventing impact damage. The vertical roller assembly can be adjusted in position under the action of the screw jack, making it suitable for straightening and introducing steel sections of different specifications. Under the locking of the screw jack, a stable structure is formed, enabling the initial straightening of bent steel sections.

This invention discloses a design method for an ultra-thin 3D inductor passive device, comprising the following steps: S1, selecting a suitable substrate; S2, setting a bottom metal on the bottom of the substrate, metallizing a hole on the bottom metal, and extending the metallized hole through the substrate and above the upper surface of the substrate; S3, setting a trace metal on the metallized hole, and fixing the trace metal to the upper surface of the substrate; S4, setting bumps on the trace metal, and setting a top metal on the top of the bumps, forming a passive device with 3D inductance. This invention reduces the aspect ratio of the 3D inductor while ensuring inductance performance, lowers the processing difficulty, and reduces the thickness of the manufactured product and the overall thickness of the packaging module.