The invention discloses a device and a method for measuring stress in a forming process of a large-size
aviation transparent part, and relates to the technical field of
polymer injection molding measurement. The device comprises a flexible substrate matched with the surface of a mold cavity, and an interdigital
electrode array, a
dielectric anisotropy measurement module and a
polymer stress calculation module which are arranged on the flexible substrate, the interdigital
electrode array is arranged in a non-uniform distribution mode, a high-density arrangement area is arranged in a stress sensitive area, and a
sparse array arrangement area is arranged in a non-sensitive area; the module is used for detecting
dielectric constants and calculating
principal stress differences of different positions. The flexible substrate is utilized to adapt to a complex curved surface, through the non-uniform array design, global coverage of a large-size workpiece is guaranteed, meanwhile, high-resolution capture of a key area is achieved,
signal crosstalk caused by global high-density arrangement is effectively avoided, and accurate, lossless and real-time measurement of the forming stress of the large-size
aviation transparent part is achieved.