The invention provides a through hole conductive film, a preparation method thereof and application. The preparation method of the through hole conductive film comprises the following steps: a, taking a single-layer or multi-layer film of which the thickness is between 3 and 1,000 microns to perform
plasma,
ion beam or
corona treatment so that the surface
dyne value is between 39 and 75; b, perforating the film after the treatment; c, performing
ion plating, magnetron
sputtering plating, vapor deposition and chemical
sensitization on the hole wall and at least one surface of the perforated film until a conductive layer of which the thickness is between 0.005 and 0.5 microns is generated; and d,
electroplating or chemically plating
metal outside the conductive layer until the thickness of the plating layer is between 0.01 and 5 microns, the resistance value is between 0.003 and 10
omega / sq, and the
pore diameter of a product is between 1 and 5,000 microns. The surface resistance and the
vertical resistance of the through hole conductive film are between 0.005 and 10 omegas, the
adhesive force is good, and the screening effectiveness is more than 70 dB; besides, the through hole conductive film is applied to the field of
software electromagnetic screen and omnibearing conductive adhesives, and can obtain various functional materials which are
heat resistant, inflaming retarding and the like.