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Preparation method for coiled omnibearing electroconductive sponge

A conductive sponge, all-round technology, applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problems of high resistance, inability to achieve high conductivity requirements, etc., to achieve the effect of high conductivity

Inactive Publication Date: 2011-10-19
HUAIAN FUYANG ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The demand for electronic products is diverse. The conductive sponge is an elastic conductor material. The preparation method of the conductive sponge is: one is to cover the sponge with a flexible conductive film, and the other is to add conductive powder when preparing the sponge and wrap it with a flexible conductive film. The middle part of the conductive sponge prepared by covering the sponge is non-conductive, and the conductive sponge with conductive powder added during the preparation of the sponge cannot achieve high conductivity requirements due to its large resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1: Prepare conductive sponge according to the following steps

[0015] (1) Select sponge: select flame-retardant or non-flame-retardant sponge prepared by traditional polyether ester and polyurethane, and the sponge density is 10kg / m 3 , PPI 30, thickness 1.00mm;

[0016] (2) Baking and dehumidification: The selected sponges are baked in a vertical oven or a tunnel drying line. The temperature of the vertical oven is 90°C, and the temperature of the tunnel drying line is 110°C. Type drying line 100m / h;

[0017] (3) Vacuum coating: Use a winding magnetron sputtering coating machine to vacuum-plate conductive nickel on the dehumidified sponge. Vacuum coating parameters: pre-pumping background pressure: 1.0×10 -2 pa, working pressure: 1.2×10 -1 pa, argon gas flow rate: 120SCCM, argon gas pressure: 0.1Mpa, flat rectangular single target sputtering power: 5Kw, running line speed: 1.0m / min, flat rectangular nickel target purity: ≥99.95%, vacuum nickel Layer sur...

Embodiment 2

[0019] Embodiment 2: Prepare conductive sponge according to the following steps

[0020] (1) Select sponge: select flame-retardant or non-flame-retardant sponge prepared from traditional polyether ester and polyurethane, with a sponge density of 80kg / m 3 , PPI 90, thickness 4.5mm;

[0021] (2) Baking and dehumidification: The selected sponges are baked in a vertical oven or a tunnel drying line. The temperature of the vertical oven is 100°C, and the temperature of the tunnel drying line is 120°C. Type drying line 75m / h;

[0022] (3) Vacuum coating: Use a winding magnetron sputtering coating machine to vacuum-plate conductive nickel on the dehumidified sponge, vacuum coating parameters: pre-pumping background pressure: 1.25×10 -2 pa, working pressure: 1.8×10 -1 pa, argon gas flow rate: 240SCCM, argon gas pressure: 0.2Mpa, planar rectangular single target sputtering power: 7.5Kw, operating line speed: 2.25m / min, planar rectangular nickel target purity: ≥99.95%, vacuum Surfac...

Embodiment 3

[0024] Embodiment 3: Prepare conductive sponge according to the following steps

[0025] (1) Select sponge: select flame-retardant or non-flame-retardant sponge prepared from traditional polyether ester and polyurethane, and the sponge density is 150kg / m 3 , PPI 150, thickness 8.00mm;

[0026] (2) Baking and dehumidification: The sponge prepared in step 1 is baked in a vertical oven or tunnel drying line, the temperature of the vertical oven is 110°C, the temperature of the tunnel drying line is 130°C, and the vertical oven is ≥ 24 hours , tunnel drying line 50m / h;

[0027] (3) Vacuum coating: Use a winding magnetron sputtering coating machine to vacuum-plate conductive nickel on the dehumidified sponge. Vacuum coating parameters: pre-pumping background pressure: 1.5×10 -2 pa, working pressure: 2.5×10 -1 pa, argon gas flow rate: 360SCCM, argon gas pressure: 0.3Mpa, flat rectangular single target sputtering power: 10Kw, running line speed: 3.5m / min, flat rectangular nickel t...

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Abstract

The present invention discloses a preparation method for coiled omnibearing electroconductive sponge. The method is characterized by comprising the following specific steps of: (1) sponge selection: selecting flame-retardant or non-flame-retardant sponge prepared from traditional polyether esters and polyurethane; (2) baking dehumidification: baking the selected with a vertical oven or a tunnel baking line; (3) vacuum coating: vacuum-coating electroconductive nickel on the dehumidified sponge with a winding magnetron sputtering coating machine; and (4) hydroelectric nickel plating: carrying out hydroelectric nickel plating on the vacuum-coated sponge, then carrying out three-stage counter-flow rinsing and drying at the temperature of 110-160 DEG C. The sponge prepared by utilizing a vacuum coating technology and a hydroelectric plating technology provided by the invention has a compression ratio of not less than 70%, high electrical conductivity, surface resistance of not more than 1 Omega and vertical resistance of not more than 0.1 Omega, meets environmental protection requirement and belongs to clean production.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a roll-shaped sponge, in particular to a preparation method of a roll-shaped omni-directional conductive sponge. Background technique [0002] The demand for electronic products is diverse. The conductive sponge is an elastic conductor material. The preparation method of the conductive sponge is: one is to cover the sponge with a flexible conductive film, and the other is to add conductive powder when preparing the sponge and wrap it with a flexible conductive film. The middle part of the conductive sponge prepared by covering the sponge is non-conductive, and the conductive sponge with conductive powder added during the preparation of the sponge cannot achieve high conductivity requirements due to its large resistance. Contents of the invention [0003] The purpose of the present invention is to provide a method for preparing a roll-shaped omnidirectional conductive...

Claims

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Application Information

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IPC IPC(8): C25D5/56C25D3/12C23C14/20C23C14/35
Inventor 陈先锋傅青炫马尔松夏慎领
Owner HUAIAN FUYANG ELECTRONICS MATERIALS
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