594 results about "Electronic materials" patented technology

The invention discloses an electronic material life cycle quality tracing method based on digital twinning, and relates to the technical field of industrial Internet of Things, the digital twinning of an electronic material is constructed, a material constitutive equation, a process parameter threshold library and historical quality data are integrated, and a multi-dimensional virtual model is formed; a production line real-time data stream including an equipment state, environmental parameters and material attributes is collected. According to the method, the virtual model containing the material constitutive equation and the process parameter threshold library is constructed, the real-time data flow dynamic evolution is combined, and the graph calculation and the causal reasoning algorithm are applied, so that the interaction effect of the equipment state, the environmental parameters and the material attributes can be associated, the core influence factor chain of the quality abnormality can be positioned, the single-point alarm limitation is broken through, and the quality abnormality can be accurately detected. The quality problem is deeply analyzed from the angle of multi-factor coupling, a comprehensive and systematic analysis framework is provided for accurate attribution, the source of the quality problem can be quickly and accurately found, and the efficiency and accuracy of quality tracing are improved.

The invention discloses composite conductive powder for preparing conductive silver paste and the conductive silver paste, and particularly relates to the technical field of electronic materials.The composite conductive powder is of a double-shell core-shell structure composed of a silver metal inner core, a silicon dioxide middle coating layer and a silver nanoparticle self-assembled outer layer and is subjected to ultraviolet irradiation treatment; the conductive silver paste is based on the composite conductive powder and is matched with cerium oxide modified glass powder, graphene nanosheets, thermoplastic polyurethane resin and a dibasic acid ester solvent to form a low-temperature environment-friendly formula. The volume resistivity of the conductive silver paste is as low as 1.2 * 10 <-6 > omega.cm, the curing temperature is reduced to 120 DEG C, the content of volatile organic compounds meets the environmental protection standard, meanwhile, the tensile strength is improved by 50%, the conductive silver paste can bear 500 times of bending circulation without breakage, the adhesive force reaches the level 0 of a cross-cut method, the strict requirement of a high-performance electronic device for the conductive silver paste is effectively met, and the conductive silver paste has wide application prospects.

The invention relates to the technical field of electronic materials, in particular to a preparation method of low-halogen alkali-soluble photosensitive resin and solder resist ink. Comprising the following steps: adding amino resin, alcohol olefin and a catalyst A into a solvent, mixing, and carrying out an ether exchange reaction to obtain an initial etherified product; adding peroxide into the initial etherification product, and carrying out epoxidation reaction to obtain an epoxy resin intermediate; adding an olefine acid compound, a catalyst B and a polymerization inhibitor into the epoxy resin intermediate, and carrying out ring-opening esterification reaction to obtain an epoxy acrylate intermediate; and adding acid anhydride into the epoxy acrylate intermediate, and carrying out carboxylation reaction to obtain the low-halogen alkali-soluble photosensitive resin. The problem of high halogen content of the existing alkali-soluble photosensitive resin is solved, and the solder resist ink prepared from the alkali-soluble photosensitive resin has high sensitivity, high resolution, high heat resistance, high acid and alkali resistance and high electrical insulation property.

A preparation method of a broadband low-loss high-Bs power manganese zinc ferrite material relates to an electronic material technology, and comprises the following steps: step 1, taking Fe2O3, ZnO and MnO as raw materials, and batching; step 2, performing primary ball milling on the ingredients obtained in the step 1, and then drying and sieving to obtain a primary ball-milled material; step 3, pre-sintering; step 4, by taking the mass of the pre-sintered material obtained in the step 3 as a standard, adding 0.02 to 0.04 weight percent of V2O5, 0.02 to 0.04 weight percent of Nb2O5, 0.02 to 0.04 weight percent of ZrO2, 0.04 to 0.07 weight percent of TiO2 and 0.01 to 0.03 weight percent of YIG, so as to obtain doped mixed powder; step 5, secondary ball milling; step 6, granulating; step 7, pressing the granulated material into a green body part; and step 8, sintering the green body by stages. According to the invention, the initial permeability is improved while the resistivity of the power manganese-zinc ferrite is improved.

The invention discloses a classification code and description code combination-based electronic material coding method and system, and the method comprises the steps: formulating an 11-bit pure digital coding rule, taking the first three bits as classification codes, and distinguishing the paster / plug-in packaging, basic types and specific types of materials; the last eight bits are description codes and are divided into two types according to material characteristics: for materials with nominal values, such as resistors and capacitors, nominal value codes converted based on a scientific counting method are combined with conventional attribute codes of precision, packaging and the like; for materials without nominal values, such as chips, PCB finished products and the like, the combination of model codes and serial number codes is adopted; a classification code and a description code are automatically generated by analyzing the BOM and are compared with a database to process conflicts. According to the method, the coding rule has intuition and uniqueness, the problems that traditional serial number coding is poor in readability and prone to code repetition are effectively solved, and the efficiency and accuracy of electronic material management are remarkably improved.

The invention discloses a supply chain management system for research and development of electronic materials, and belongs to the technical field of supply chain management systems. Internet-of-things equipment data is acquired through sensors deployed in a raw material production link, a warehouse storage area and a transport vehicle, external interface data is from a supplier system, enterprise internal system data comprises PLM, ERP and MES system data, and the data processing layer performs real-time cleaning, conversion and stream batch fusion processing on the acquired data based on a stream calculation engine and performs data processing on the acquired data. The data storage layer adopts a hybrid storage architecture and comprises a Kafka cluster used for storing real-time data, an InfluxDB used for storing time sequence data, an HBase used for storing unstructured data and a MySQL cluster used for storing dimension data.

The application discloses a method for preparing a low-viscosity vinyl fluorine-containing hyperbranched silicone resin and belongs to the technical field of organic polymer materials. The low-viscosity vinyl fluorine-containing hyperbranched silicone resin is prepared from a vinyl-containing siloxane monomer, an alkyl-containing siloxane monomer and a fluorine-containing siloxane monomer as raw materials through hydrolysis nucleation, condensation growth, end capping and purification treatment, wherein the vinyl content is not less than 3 wt%, the fluorine content is not less than 15 wt% and the viscosity is not higher than 1000 mPa.s. The vinyl fluorine-containing hyperbranched silicone resin has excellent properties of both a vinyl silicone resin and a fluorine-containing polymer, the existence of the vinyl group can be suitable for various reaction conditions, the existence of the fluorine-containing group makes the hydrophobic and oleophobic properties excellent, and the friction coefficient of the fluorine-containing polymer material is small, so that the vinyl fluorine-containing hyperbranched silicone resin has great application potential in the fields of oil-resistant sealing, anticorrosion coating, electronic materials, medical devices and the like.

The invention relates to the technical field of electronic materials, in particular to conductive silver paste for a BC battery, and the conductive silver paste comprises the following components in percentage by weight: 88-93 wt% of silver powder, 3-5 wt% of glass powder, 1-3 wt% of organic resin, 6-10 wt% of solvent and 0-1 wt% of other auxiliaries, the sum of the components is 100 wt%, and the glass powder comprises gallium sesquioxide. The conductive silver paste can be used for a BC battery so as to completely or partially solve the problem of large contact resistance of a P region of the BC battery, and meanwhile, the reliability is guaranteed.

The invention discloses multi-station parallel automatic cutting integrated equipment, and relates to the technical field of electronic material processing. The conveying rollers are arranged in a groove in the workbench at equal intervals in a screwed mode through bearings, shaft rods of every two adjacent conveying rollers are connected through a synchronous wheel transmission assembly, and the shaft rod at one end of one conveying roller is connected with a driving motor; the cutting knives are arranged in the mounting frame at equal intervals, and fixing frames are arranged on the outer sides of the cutting knives in a sleeving manner; the lifting plate is embedded in the transverse plate of the mounting frame, the lifting plate is connected with the transverse plate of the mounting frame through a lifting mechanism, an adjusting mechanism is arranged in the lifting plate, and the adjusting mechanism is connected with the fixing frames; the rotating mechanism is arranged on the mounting frame and is connected with the plurality of cutting knives; the abutting mechanism is arranged on one side of the mounting frame and suspended on the upper side of the conveying roller. Multi-cutter-distance intelligent adjustment, synchronous precise cutting and stable conveying are achieved, the electronic material machining efficiency and cutting precision are greatly improved, and diversified production requirements are met.

The invention relates to the technical field of printed electronic materials, in particular to conductive copper ink for a printed circuit and a preparation method of the conductive copper ink. The conductive mica powder-graphene composite material comprises conductive mica powder, a nano-copper-graphene filler, flaky copper powder, spherical copper powder, an organic carrier, a dispersing agent, a coupling agent, an antioxidant and an auxiliary agent, a layer-point composite conductive structure is constructed through conductive mica powder and nano-copper-graphene filler, a close packing system is formed by combining particle size grading of copper powder with different morphologies, and the conductivity is guaranteed; by means of a chemical bonding interface formed by the coupling agent, the copper powder and the organic carrier, the integrity of the coating is enhanced, and stress cracking during welding is reduced; microencapsulated rosin in the auxiliary agent promotes wetting and spreading of the welding flux, titanate modified nano titanium dioxide constructs a three-dimensional cross-linked network to improve the bending resistance and thermal shock resistance of the coating, the falling phenomenon of components after welding is reduced, and the stability of the conductive copper ink in actual printed circuit production is improved.

The invention provides a silicon carbide fiber-copper composite bonding wire and a preparation method thereof, and relates to the technical field of electronic materials. The preparation method of the silicon carbide fiber-copper composite bonding wire comprises the following steps: pre-plating copper on the surface of silicon carbide fiber to obtain copper-coated silicon carbide fiber; laying copper-coated silicon carbide fibers to obtain a copper-coated silicon carbide fiber layer, then constructing a copper alloy layer on the copper-coated silicon carbide fiber layer by using composite copper powder, then arranging the copper-coated silicon carbide fiber layer on the surface of the copper alloy layer again, and repeating the operation to obtain a composite wire blank in which the copper-coated silicon carbide fiber layers and the copper alloy layers are alternately arranged; and sequentially carrying out hot isostatic pressing treatment, drawing and aging treatment on the composite wire blank to obtain the silicon carbide fiber-copper composite bonding wire. The copper powder further comprises Ag, Hf and Sc, the metal elements can form fine and dispersed second-phase particles in the preparation process, and the strength of the copper bonding wire is remarkably improved through a precipitation strengthening mechanism.

The invention provides low-dielectric and high-heat-resistance adamantane type maleimide resin as well as a preparation method and application thereof, and belongs to the technical field of synthetic resin for electronic materials. The preparation method comprises the following steps: S1, dissolving an adamantane type amino compound to obtain a solution A; dissolving maleic anhydride to obtain a solution B; s2, dropwise adding the solution A into the solution B; s3, acetic anhydride and a catalyst are added into the solution obtained after the stirring reaction in the step S2, then the temperature is increased to 90-110 DEG C, and a heat preservation reaction is conducted for 4-6 h; and S4, cooling the solution subjected to the heat preservation reaction in the step S3, and then washing and removing the solvent to prepare the low-dielectric and high-heat-resistance adamantane type maleimide resin. The adamantane type maleimide resin provided by the invention can solve the problems of poor solubility and high brittleness of maleimide resin, and meanwhile, the resin is endowed with excellent heat resistance. In addition, the adamantane type maleimide resin can also be used for preparing copper-clad plates with low dielectric constant and low dielectric loss.

The invention discloses a preparation method of low-temperature solderable conductive copper paste, and belongs to the technical field of electronic materials. The conductive copper paste is prepared from the following raw materials: silver-coated copper powder, an organic carrier, an antioxidant, a curing agent, an auxiliary agent, a thixotropic agent, a solvent and an adhesion enhancer. The design of the composite copper powder coated with the silver layer on the surface is matched with the graded particle size, and an organic carrier is combined, so that high conductivity and strong oxidation resistance under low-temperature curing are realized. The preparation method comprises the following steps: treating the copper powder by adopting a dipping-drying process, and coating the surface of the copper powder with the adhesion enhancer and the antioxidant by adopting a chemical method; uniformly mixing the organic carrier, the curing agent, the solvent and the auxiliary agent; and finally, copper powder and a thixotropic agent are added into the mixed organic carrier, and the low-temperature solderable conductive copper paste is prepared through high-speed dispersion and grinding of a three-roller machine. The product can be rapidly cured at 100-180 DEG C, the sheet resistance is smaller than or equal to 20 m omega / square, the welding strength reaches 15 MPa or above, cost is low, production is easy, and wide industrial application value is achieved.

The invention discloses a novel automobile back view mirror flexible printed circuit board prepared based on weldable silver paste, and belongs to the technical field of electronic materials and devices, conductor patterns in the flexible printed circuit board comprise a main circuit pattern and an auxiliary function structure formed by weldable low-temperature curing silver paste; the curing temperature of the weldable low-temperature silver paste is 125-135 DEG C, and the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, a high-boiling-point ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes, modified aluminum oxide powder, modified barium sulfate and a low-stress modifier. The polymer resin system comprises novolac epoxy resin, biphenyl epoxy resin and a polyacrylate-CTBN copolymer; through the synergistic effect of all the components and an innovative process, comprehensive improvement of mechanical reliability, environmental durability, conductive stability and power load capacity is achieved, and the strict requirement for high reliability of the automobile rearview mirror in an extreme environment is perfectly met.

The invention discloses a novel notebook flexible printed circuit board prepared based on weldable low-temperature silver paste and a backlight module, and belongs to the technical field of electronic materials and devices. Conductor patterns of the flexible printed circuit board comprise a main circuit pattern formed by rolled copper; the auxiliary function structure is formed in a local area of the main circuit pattern by weldable low-temperature silver paste; the curing temperature of the weldable low-temperature silver paste is 130-145 DEG C, the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, an ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes and modified antimony tin oxide powder, and the conductive filler comprises flaky silver powder, spherical silver powder and low-temperature alloy powder. The low-temperature alloy powder is Sn42Bi58 low-temperature alloy powder of which D50 is 12 [mu] m-15 [mu] m; according to the invention, low-temperature curing, high flexibility, excellent conductivity and direct weldability are integrated, and a solution suitable for local repair of a flexible printed circuit board and direct mounting of a jumper and a Mini LED chip is provided.

The invention belongs to the technical field of electronic materials, and particularly relates to a preparation method of a copper powder enhanced terahertz composite wave-absorbing film. The preparation method comprises the following steps: by taking polyurethane modified epoxy resin as a raw material, sequentially adding silane coupling agent modified aluminum oxide, chitin coated silicon dioxide and substituted thiophenol self-assembled nano-copper powder, stirring, then adding a curing agent and a dispersing agent to obtain a mixed solution, then pouring the mixed solution into a coating machine, and coating to obtain the coating. Preparing a copper powder enhanced terahertz composite wave-absorbing film; the minimum wave-absorbing efficiency of the thin film in the frequency band of 0.3-3.0 THz is-26.7 dB, and the effective bandwidth with the wave-absorbing efficiency smaller than-10 dB is the full frequency band; the composite wave-absorbing material can be used for wave-absorbing electromagnetic protection of 6G electronic devices.

The present technology relates generally to compositions comprising 3-amino-2- butanol. In particular, the present technology relates to compositions that comprise 3-amino- 2 -butanol for the manufacture of batteries, semiconductor devices, and other electronic materials and electrical devices.

The present invention relates to the field of magnetron sputtering technology, and specifically discloses a magnetron sputtering silver-coated conductive material powder device based on an ultrasonic-electromagnetic suspension composite dispersion system and its application. In response to the technical difficulties of powder agglomeration, low target utilization rate and poor uniformity in large-scale production, the present invention uses a porous ceramic tooling disk as the core carrier, integrates a high-frequency ultrasonic vibrator array (adjustable at 20-100kHz), a planar rectangular cathode (tilt angle 0-15°) and a Helmholtz coil (0.1-0.5T rotating magnetic field), and realizes non-contact dispersion of powder and precise coating of silver layer through cavitation effect, electromagnetic suspension and multi-target collaborative sputtering. The tooling disk adopts a gradient aperture design, combined with liquid nitrogen microchannel cooling and modular cavity structure, so that the powder dispersion uniformity (CV value <5%), silver layer porosity (<1%), target utilization rate (52%) and single furnace production capacity (72kg / 8h) are significantly optimized, providing an efficient and environmentally friendly industrial solution for the field of electronic materials.

The invention relates to the fields of information electronic material technology, information communication, wireless radio frequency communication and the like, in particular to a surface acoustic wave device and a preparation method thereof.The preparation method comprises the steps that after a metal film is deposited, patterned stripping is conducted on an interdigital electrode layer, and when patterned stripping is conducted on the interdigital electrode layer, a non-closed release window is formed; partially overlapping the thickened electrode layer from the direction of the non-closed release window to form a closed release window; etching the piezoelectric film exposed in the closed release window to form a release hole; and the sinking material is further released through the release holes so as to form a suspended piezoelectric film. According to the invention, by optimizing the patterning design and the processing flow of the resonator membrane structure, the release window in the bus bar region is efficiently stripped, the stripping processing difficulty of the bus bar electrode is reduced, and the stripping success rate of the bus bar electrode is improved.

The invention belongs to the technical field of electronic materials, and particularly relates to a FeSiAl soft magnetic composite material and a preparation method thereof.The preparation method comprises the steps that 1, FeSiAl powder, a silane coupling agent and organic silicon resin are mixed to obtain coated powder; (2) carrying out heat treatment on the coated powder to obtain FeSiAl-coated Al2SiO5 powder; and (3) mixing the FeSiAl-coated Al2SiO5 powder with a lubricant, and carrying out annealing heat treatment to obtain the FeSiAl soft magnetic composite material. The FeSiAl soft magnetic composite material prepared by the method has high magnetic conductivity and lower loss, the insulating layer is compact, the corrosion resistance is excellent, and the preparation method is simple in process, simple and convenient in equipment, short in coating treatment time, high in efficiency, low in cost and suitable for large-scale production.

The invention discloses an electronic material automatic classification method and system based on multistage feature recognition, and relates to the field of material classification, and the method comprises the steps: firstly obtaining unstructured material information, and carrying out the regularization and preprocessing of the information; subsequently, through main category identification and feature lexical element marking, accurate positioning of material core attributes is realized, which exceeds shallow identification of traditional keyword matching, and the defect that complex semantics cannot be processed is effectively overcome. On the basis, structured extraction and analysis are further carried out on the marked features, and the marked features are converted into paradigm features which can be deeply understood by a machine. And finally, through code integration and verification, a standard and unique production code, such as an SPYY. XBBBVVVV structure, is automatically generated. In this way, low-efficiency and error-prone manual operation is replaced, and the fundamental problem that an existing automatic scheme is difficult to deal with description diversity is solved through the powerful analysis capacity and robustness of the manual operation.

The invention belongs to the technical field of electronic materials, and relates to a low-dielectric resin glue solution for a high-frequency high-speed copper-clad plate as well as a preparation method and application thereof, and the low-dielectric resin glue solution for the high-frequency high-speed copper-clad plate comprises the following components in parts by weight: 100 parts of a resin component, 2-4 parts of a compatibilizer, 2.5-4.5 parts of a curing system, 0.6-1.3 parts of an initiator, 55-80 parts of a filler and 1.1-2.3 parts of an auxiliary agent. By introducing a ternary interpenetrating network of the polybutylbenzene resin, the polyimide and the allyl-terminated modified polyphenyl ether, a resin compounding system is optimized; the copper-clad plate with the comprehensive performance of ultralow dielectric constant, ultralow dielectric loss, high peel strength and low Z-axis thermal expansion coefficient is realized by adopting double-initiator gradient curing, filler compounding dispersion and low-dielectric glass fabric-HVLP copper foil synergistic interface treatment; the method is suitable for high-frequency scenes such as 5G communication base stations and millimeter wave radars.

The invention discloses a TPU film for robot electronic skin and a preparation method of the TPU film, and relates to the technical field of flexible electronic materials, the film takes TPU introduced with Diels-Alder dynamic reversible bonds as a matrix, a conductive filler is formed by dopamine-modified silver nanowires and MXene, the concentration of the conductive filler is in continuous or quasi-continuous gradient decrease, and the conductive filler is a conductive filler formed by silver nanowires and MXene. An integrated network with self-repairing and environmental stability is formed and is used as an electrode; phase change microcapsules and triboelectric nanofibers are compounded in a low-conductivity contact area to form an intelligent response layer which is self-adaptive in sensing threshold and capable of generating power by friction. Through one-step multi-nozzle electrostatic spinning forming, the problem that self-repairing, signal stability, environmental adaptability and energy independence in electronic skin are difficult to consider at the same time is solved.

The invention relates to the technical field of electronic materials, in particular to a high-speed copper-clad plate resin mixture and a preparation method thereof. The high-speed copper-clad plate resin mixture is prepared from acetone, cyclohexanone, BNE type epoxy resin, DCPD type epoxy resin, an anhydride curing agent, fused silicon dioxide, toughened resin, modified nano silicon dioxide, phenolic resin, a phosphorus-containing flame retardant, phosphazene and an accelerant, and the modified nano silicon dioxide is subjected to amination treatment through a silane coupling agent KH-550; and then carrying out ring-opening grafting modification with polyethylene glycol diglycidyl ether and alicyclic epoxy resin. The high-speed copper-clad plate resin mixture disclosed by the invention has excellent thermal stability while ensuring good toughness, and solves the problem that the thermal stability of a traditional resin composition for a copper-clad plate is reduced due to the addition of toughening resin; the strict requirements of the high-frequency and high-speed copper-clad plate on the size stability, the signal integrity and the reliability are completely met.

The invention relates to the technical field of electronic materials, in particular to a copper-clad plate resin composition with an ultralow-loss medium and a preparation method of the copper-clad plate resin composition. The composition comprises the following components: modified polyphenyl ether, dicyclopentadiene epoxy resin, trifunctional epoxy resin, active ester, cyanate ester, DMAP, spherical silicon dioxide and a POSS-silicon dioxide compound, the preparation method comprises the following steps: carrying out surface norbornenylation modification on bimodal spherical silicon dioxide, and carrying out click reaction on the bimodal spherical silicon dioxide and octa-aminophenyl polysilsesquioxane with tetrazinyl at the tail end to prepare a POSS-silicon dioxide compound, so as to construct an interface transition layer with gradient modulus. According to the invention, collaborative optimization of dielectric loss, thermal mechanical properties and interface bonding strength is realized, and the material has excellent properties of low dielectric loss, high thermal stability, high peel strength and the like, and is suitable for the fields of 5G communication, high-frequency electronic equipment and the like.

The invention discloses a low-temperature sintered microwave dielectric ceramic material and a preparation method thereof, and belongs to the technical field of electronic materials. The composite material comprises the following raw materials: CaCO3, SrCO3, Bi2O3 and B2O3. The preparation method comprises the following steps: burdening and weighing according to a stoichiometric ratio CaxSr1-xBi2B2O7 (x is more than 0.1 and less than 0.9), then carrying out ball milling and mixing, pre-sintering to obtain pre-sintered ceramic powder, adding an organic material to prepare stable slurry, carrying out tape casting to obtain a green body, and sintering to obtain the low-temperature sintered microwave dielectric ceramic material. The sintering temperature of the ceramic material is 700-800 DEG C, the dielectric constant range is 4-8, the loss value is less than 0.00002, and the ceramic material has low dielectric constant and ultrahigh quality factor. The problems that an existing low-temperature sintering microwave dielectric ceramic material is high in water absorption and high in material cost are solved. The microwave ceramic dielectric is applied to the technical field of electronic components requiring low dielectric constant and low loss value microwave ceramic dielectric.

This invention relates to systems and methods for adaptive discovery and mixed-variable optimization of synthesizable microelectronic materials, and applications of the same. Specifically, an exemplary system includes a virtual screening (VS) module to extract information from literatures of a knowledge base by text mining, a ML-assisted conceptual exploration (CE) module to identify candidate material families for the specific class of compound materials based on the extracted information via a combination of ML models and to generate exogenous models of objective functions f(x, y) and constraint functions g(x, y), and an adaptive discovery (AD) engine to generate and optimize design of the newly discovered compound materials. The AD engine includes a mixed-variable ML module, a mixed-integer optimization (MIO) module, and a high-fidelity evaluation (HFE) module, which are iteratively and sequentially executed.

The invention discloses a conjugated polymer film with electrical properties and tensile stability simultaneously improved, and a preparation method and application thereof, and belongs to the technical field of flexible electronic materials. The preparation method comprises the following steps: placing the conjugated polymer film in a solution formed by mixing an electrolyte and a dopant, and soaking for 30-60 seconds to complete ion exchange doping, thereby obtaining the conjugated polymer film with various carrier transport channels. The strategy of increasing the types of carrier transmission channels is adopted, and two main transmission channels of a crystal phase and an accumulation region are formed in the conjugated polymer film through an ion exchange doping method, so that the conjugated polymer film can maintain the electrical property at a high proportion under a stretching external field, and the electrical property of the conjugated polymer film is improved under the same stretching strain. And the tensile stability of the conductivity is far higher than that of a conjugated polymer film which only takes a crystal phase or an accumulation region as a carrier transmission channel.

The invention discloses an electronic material intelligent management method and system, relates to the field of material management, and is based on a 12-bit production coding specification of an SPYY.XBBBVVVV format. The specification defines a device category (X), a capability value (BBB) and a main variable (VVVV) by means of a main code segment (XBBBVVVV); a device form (S), a specific package (P) and key characteristics (YY) such as precision and grade are defined through an auxiliary code segment (SPYY). And based on the rule, performing structured analysis on the target material code, and extracting candidate materials from the material library by taking the analyzed device type and packaging type as physical constraints. And then, parameterizing the candidate materials, and carrying out multi-dimensional compatibility scoring and weighted calculation on the candidate materials and the target materials to realize accurate quantitative evaluation. Finally, based on score sorting and recommendation of an optimal result, the problems of model selection and substitution caused by non-uniform coding are effectively solved, and the response efficiency and accuracy of the supply chain are remarkably improved.

The invention belongs to the technical field of electronic materials, and discloses a high-power and low-loss LiZn microwave ferrite material, the raw materials comprise main materials and a dopant, the main materials comprise Li2CO3, ZnO, MnCO3, CuO, NiO and Fe2O3; the doping agent is prepared from Bi2O3, CaCO3 and Co2O3. The preparation method comprises the following steps: carrying out primary ball milling and pre-sintering on the main material to obtain pre-sintered powder; adding a doping agent into the pre-sintered powder, and carrying out secondary ball milling; adding an organic adhesive into the secondary ball-milled material for granulation, and pressing into a blank; and sintering the blank to obtain the high-power and low-loss LiZn microwave ferrite material. Through a specific formula and a preparation process, uniform components and grain refinement can be ensured, and the microwave ferrite material with high Curie temperature, low ferromagnetic resonance line width, low dielectric loss and high spin wave line width is finally prepared.