720 results about "Electronic materials" patented technology

The invention discloses an electronic material life cycle quality tracing method based on digital twinning, and relates to the technical field of industrial Internet of Things, the digital twinning of an electronic material is constructed, a material constitutive equation, a process parameter threshold library and historical quality data are integrated, and a multi-dimensional virtual model is formed; a production line real-time data stream including an equipment state, environmental parameters and material attributes is collected. According to the method, the virtual model containing the material constitutive equation and the process parameter threshold library is constructed, the real-time data flow dynamic evolution is combined, and the graph calculation and the causal reasoning algorithm are applied, so that the interaction effect of the equipment state, the environmental parameters and the material attributes can be associated, the core influence factor chain of the quality abnormality can be positioned, the single-point alarm limitation is broken through, and the quality abnormality can be accurately detected. The quality problem is deeply analyzed from the angle of multi-factor coupling, a comprehensive and systematic analysis framework is provided for accurate attribution, the source of the quality problem can be quickly and accurately found, and the efficiency and accuracy of quality tracing are improved.

The invention belongs to the field of soft magnetic ferrite, and discloses a high-frequency low-loss manganese zinc ferrite material and a preparation method thereof, and the manganese zinc ferrite material comprises main components and auxiliary components. The main components comprise ferric oxide, zinc oxide, manganese oxide and cobaltosic oxide. The auxiliary components comprise calcium carbonate, silicon dioxide and tantalum pentoxide. The preparation method of the manganese zinc ferrite material comprises the following steps: proportioning, drying and ball-milling; pre-sintering is performed; performing secondary ball milling; performing granulation; forming is conducted; sintering is performed; and performing thermal aging. The manganese-zinc ferrite prepared by the invention has relatively low power loss under a high-frequency condition, and can be applied to the field of electronic materials related to power conversion, such as transformers and inductors.

The invention discloses composite conductive powder for preparing conductive silver paste and the conductive silver paste, and particularly relates to the technical field of electronic materials.The composite conductive powder is of a double-shell core-shell structure composed of a silver metal inner core, a silicon dioxide middle coating layer and a silver nanoparticle self-assembled outer layer and is subjected to ultraviolet irradiation treatment; the conductive silver paste is based on the composite conductive powder and is matched with cerium oxide modified glass powder, graphene nanosheets, thermoplastic polyurethane resin and a dibasic acid ester solvent to form a low-temperature environment-friendly formula. The volume resistivity of the conductive silver paste is as low as 1.2 * 10 <-6 > omega.cm, the curing temperature is reduced to 120 DEG C, the content of volatile organic compounds meets the environmental protection standard, meanwhile, the tensile strength is improved by 50%, the conductive silver paste can bear 500 times of bending circulation without breakage, the adhesive force reaches the level 0 of a cross-cut method, the strict requirement of a high-performance electronic device for the conductive silver paste is effectively met, and the conductive silver paste has wide application prospects.

The invention relates to the technical field of electronic materials, in particular to a preparation method of low-halogen alkali-soluble photosensitive resin and solder resist ink. Comprising the following steps: adding amino resin, alcohol olefin and a catalyst A into a solvent, mixing, and carrying out an ether exchange reaction to obtain an initial etherified product; adding peroxide into the initial etherification product, and carrying out epoxidation reaction to obtain an epoxy resin intermediate; adding an olefine acid compound, a catalyst B and a polymerization inhibitor into the epoxy resin intermediate, and carrying out ring-opening esterification reaction to obtain an epoxy acrylate intermediate; and adding acid anhydride into the epoxy acrylate intermediate, and carrying out carboxylation reaction to obtain the low-halogen alkali-soluble photosensitive resin. The problem of high halogen content of the existing alkali-soluble photosensitive resin is solved, and the solder resist ink prepared from the alkali-soluble photosensitive resin has high sensitivity, high resolution, high heat resistance, high acid and alkali resistance and high electrical insulation property.

The invention belongs to the technical field of electronic materials, and particularly relates to a broadband side wall graphical wave-absorbing honeycomb structure. Through the design mode that the strip-shaped resistive films are arranged at equal intervals according to the width and form the included angle with the honeycomb aperture Z direction to be fully distributed on the inner walls of the honeycomb units in parallel, the spiral-like structure design of resistive film stripes is finally formed on the inner walls of the honeycomb units, and the anisotropy of the effective dielectric constant of the wave-absorbing honeycomb structure is effectively improved; the polarization of the structure is insensitive; in addition, during processing of the structural design, the influence of pattern dislocation caused by process precision is extremely small. And the spiral-like structure design enables alternating impedance to be formed along the aperture direction, so that more times of reflection and absorption are formed on the inner walls of the honeycomb holes due to the arrangement angle of the strip-shaped resistive film after incident waves are incident, the impedance matching with air in a broadband range is effectively improved, and the 2-18GHz ultra-wideband wave-absorbing performance is realized.

The invention relates to the technical field of material detection, and discloses electronic product material detection equipment based on an intelligent sensor, which comprises a box body, the inner wall of the box body is fixedly connected with a bidirectional motor, the bottom of the box body is fixedly connected with supporting legs, the inner wall of the box body is provided with an optical sensor, and the inner wall of the box body is fixedly connected with an electric telescopic rod. According to the device, the detection precision of electronic materials can be improved, the detection sensitivity can be improved, the detection effect can be improved, the sensitivity of a sensor can be improved due to the fact that the materials are close to the sensor, a circuit board on the top of a placement plate can be fixedly clamped, and the detection precision of the device is improved; the situation that when the optical sensor detects the circuit board, the circuit board is affected by external adverse factors, then the position of the circuit board deviates, and consequently the precision of follow-up detection data is reduced is avoided.

The invention relates to the technical field of magnetron sputtering, and particularly discloses a magnetron sputtering silver-coated conductive material powder device based on an ultrasonic-electromagnetic suspension composite dispersion system and application of the magnetron sputtering silver-coated conductive material powder device. In order to solve the technical problems of powder agglomeration, low target material utilization rate and poor large-scale production uniformity, a porous ceramic tool plate is used as a core carrier, and a high-frequency ultrasonic vibrator array (adjustable in 20-100kHz), a planar rectangular cathode (with an inclination angle of 0-15 degrees) and a Helmholtz coil (0.1-0.5 T rotating magnetic field) are integrated; non-contact dispersion of powder and precise coating of a silver layer are achieved through the cavitation effect, electromagnetic suspension and multi-target cooperative sputtering. The tool disc adopts a gradient aperture design, and is combined with liquid nitrogen micro-channel cooling and a modular sub-cavity structure, so that the powder dispersion uniformity (CV value lt; 5%), the silver layer porosity (llt; 1%), the target material utilization rate (52%) and the single-furnace productivity (72 kg / 8 h) are obviously optimized, and an efficient and environment-friendly industrialization solution is provided for the field of electronic materials.

The invention belongs to the field of electronic materials, and particularly relates to a synthesis method of a high-purity metal complex precursor. Compared with a synthesis method in the prior art, the synthesis method provided by the invention changes a reaction route, substituted cyclopentadiene is prepared firstly, then the substituted cyclopentadiene reacts with butyl lithium and metal chloride in sequence to obtain a substituted cyclopentadienyl metal trichloride intermediate, and finally the substituted cyclopentadienyl metal trichloride intermediate reacts with lithium dialkylamino to obtain the substituted cyclopentadienyl metal trichloride. The target product substituted cyclopentadienyl tri (dialkylamino) metal complex is obtained, and the prepared product is high in yield and purity. The synthesis method provided by the invention is convenient for large-scale production in factories, improves the productivity, and meets the ever-increasing market demand.

A preparation method of a broadband low-loss high-Bs power manganese zinc ferrite material relates to an electronic material technology, and comprises the following steps: step 1, taking Fe2O3, ZnO and MnO as raw materials, and batching; step 2, performing primary ball milling on the ingredients obtained in the step 1, and then drying and sieving to obtain a primary ball-milled material; step 3, pre-sintering; step 4, by taking the mass of the pre-sintered material obtained in the step 3 as a standard, adding 0.02 to 0.04 weight percent of V2O5, 0.02 to 0.04 weight percent of Nb2O5, 0.02 to 0.04 weight percent of ZrO2, 0.04 to 0.07 weight percent of TiO2 and 0.01 to 0.03 weight percent of YIG, so as to obtain doped mixed powder; step 5, secondary ball milling; step 6, granulating; step 7, pressing the granulated material into a green body part; and step 8, sintering the green body by stages. According to the invention, the initial permeability is improved while the resistivity of the power manganese-zinc ferrite is improved.

The invention discloses a lignin-based epoxy resin derived porous carbon composite electrode material and a preparation method and application thereof, and belongs to the technical field of electronic materials. Sodium lignin sulfonate, hydroquinone and epichlorohydrin are used as main raw materials, m-phenylenediamine is added for polycondensation to prepare a lignin-based epoxy resin polymer, then lignin-based epoxy resin derived porous carbon is obtained through pre-carbonization and high-temperature pyrolysis, finally, the porous carbon adsorbs aniline and then is subjected to in-situ polymerization, and the lignin-based epoxy resin derivative porous carbon is obtained. The lignin-based epoxy resin derivative porous carbon composite electrode material is obtained. The lignin-based epoxy resin derived porous carbon has a hierarchical pore structure, the specific surface area reaches 2287.87 m / g, and the mass specific capacitance of the polyaniline-introduced composite electrode material reaches 497.7 F / g. The composite electrode material has excellent electrochemical performance, the preparation process is safe and easy to implement, the cost is low, and the application prospect is wide.

The invention discloses a classification code and description code combination-based electronic material coding method and system, and the method comprises the steps: formulating an 11-bit pure digital coding rule, taking the first three bits as classification codes, and distinguishing the paster / plug-in packaging, basic types and specific types of materials; the last eight bits are description codes and are divided into two types according to material characteristics: for materials with nominal values, such as resistors and capacitors, nominal value codes converted based on a scientific counting method are combined with conventional attribute codes of precision, packaging and the like; for materials without nominal values, such as chips, PCB finished products and the like, the combination of model codes and serial number codes is adopted; a classification code and a description code are automatically generated by analyzing the BOM and are compared with a database to process conflicts. According to the method, the coding rule has intuition and uniqueness, the problems that traditional serial number coding is poor in readability and prone to code repetition are effectively solved, and the efficiency and accuracy of electronic material management are remarkably improved.

The invention discloses a supply chain management system for research and development of electronic materials, and belongs to the technical field of supply chain management systems. Internet-of-things equipment data is acquired through sensors deployed in a raw material production link, a warehouse storage area and a transport vehicle, external interface data is from a supplier system, enterprise internal system data comprises PLM, ERP and MES system data, and the data processing layer performs real-time cleaning, conversion and stream batch fusion processing on the acquired data based on a stream calculation engine and performs data processing on the acquired data. The data storage layer adopts a hybrid storage architecture and comprises a Kafka cluster used for storing real-time data, an InfluxDB used for storing time sequence data, an HBase used for storing unstructured data and a MySQL cluster used for storing dimension data.

The application discloses a method for preparing a low-viscosity vinyl fluorine-containing hyperbranched silicone resin and belongs to the technical field of organic polymer materials. The low-viscosity vinyl fluorine-containing hyperbranched silicone resin is prepared from a vinyl-containing siloxane monomer, an alkyl-containing siloxane monomer and a fluorine-containing siloxane monomer as raw materials through hydrolysis nucleation, condensation growth, end capping and purification treatment, wherein the vinyl content is not less than 3 wt%, the fluorine content is not less than 15 wt% and the viscosity is not higher than 1000 mPa.s. The vinyl fluorine-containing hyperbranched silicone resin has excellent properties of both a vinyl silicone resin and a fluorine-containing polymer, the existence of the vinyl group can be suitable for various reaction conditions, the existence of the fluorine-containing group makes the hydrophobic and oleophobic properties excellent, and the friction coefficient of the fluorine-containing polymer material is small, so that the vinyl fluorine-containing hyperbranched silicone resin has great application potential in the fields of oil-resistant sealing, anticorrosion coating, electronic materials, medical devices and the like.

The invention relates to the technical field of electronic materials, in particular to conductive silver paste for a BC battery, and the conductive silver paste comprises the following components in percentage by weight: 88-93 wt% of silver powder, 3-5 wt% of glass powder, 1-3 wt% of organic resin, 6-10 wt% of solvent and 0-1 wt% of other auxiliaries, the sum of the components is 100 wt%, and the glass powder comprises gallium sesquioxide. The conductive silver paste can be used for a BC battery so as to completely or partially solve the problem of large contact resistance of a P region of the BC battery, and meanwhile, the reliability is guaranteed.

The invention discloses multi-station parallel automatic cutting integrated equipment, and relates to the technical field of electronic material processing. The conveying rollers are arranged in a groove in the workbench at equal intervals in a screwed mode through bearings, shaft rods of every two adjacent conveying rollers are connected through a synchronous wheel transmission assembly, and the shaft rod at one end of one conveying roller is connected with a driving motor; the cutting knives are arranged in the mounting frame at equal intervals, and fixing frames are arranged on the outer sides of the cutting knives in a sleeving manner; the lifting plate is embedded in the transverse plate of the mounting frame, the lifting plate is connected with the transverse plate of the mounting frame through a lifting mechanism, an adjusting mechanism is arranged in the lifting plate, and the adjusting mechanism is connected with the fixing frames; the rotating mechanism is arranged on the mounting frame and is connected with the plurality of cutting knives; the abutting mechanism is arranged on one side of the mounting frame and suspended on the upper side of the conveying roller. Multi-cutter-distance intelligent adjustment, synchronous precise cutting and stable conveying are achieved, the electronic material machining efficiency and cutting precision are greatly improved, and diversified production requirements are met.

The invention relates to the technical field of printed electronic materials, in particular to conductive copper ink for a printed circuit and a preparation method of the conductive copper ink. The conductive mica powder-graphene composite material comprises conductive mica powder, a nano-copper-graphene filler, flaky copper powder, spherical copper powder, an organic carrier, a dispersing agent, a coupling agent, an antioxidant and an auxiliary agent, a layer-point composite conductive structure is constructed through conductive mica powder and nano-copper-graphene filler, a close packing system is formed by combining particle size grading of copper powder with different morphologies, and the conductivity is guaranteed; by means of a chemical bonding interface formed by the coupling agent, the copper powder and the organic carrier, the integrity of the coating is enhanced, and stress cracking during welding is reduced; microencapsulated rosin in the auxiliary agent promotes wetting and spreading of the welding flux, titanate modified nano titanium dioxide constructs a three-dimensional cross-linked network to improve the bending resistance and thermal shock resistance of the coating, the falling phenomenon of components after welding is reduced, and the stability of the conductive copper ink in actual printed circuit production is improved.

The invention provides a silicon carbide fiber-copper composite bonding wire and a preparation method thereof, and relates to the technical field of electronic materials. The preparation method of the silicon carbide fiber-copper composite bonding wire comprises the following steps: pre-plating copper on the surface of silicon carbide fiber to obtain copper-coated silicon carbide fiber; laying copper-coated silicon carbide fibers to obtain a copper-coated silicon carbide fiber layer, then constructing a copper alloy layer on the copper-coated silicon carbide fiber layer by using composite copper powder, then arranging the copper-coated silicon carbide fiber layer on the surface of the copper alloy layer again, and repeating the operation to obtain a composite wire blank in which the copper-coated silicon carbide fiber layers and the copper alloy layers are alternately arranged; and sequentially carrying out hot isostatic pressing treatment, drawing and aging treatment on the composite wire blank to obtain the silicon carbide fiber-copper composite bonding wire. The copper powder further comprises Ag, Hf and Sc, the metal elements can form fine and dispersed second-phase particles in the preparation process, and the strength of the copper bonding wire is remarkably improved through a precipitation strengthening mechanism.

The invention relates to the field of electronic material technology and lightning protection, in particular to an all-metal progressive impedance edge scattering control material compatible with lightning protection. The passive protection method based on the Faraday cage concept is applied to lightning stroke protection of a typical edge scattering suppression structure, the surface of the edge scattering suppression structure is covered with the whole full-covering periodic hollow full-metal membrane, and the gradual hollow metal sheet is formed by carving a gradual change hole unit structure on the metal sheet. Therefore, the propagation characteristic of the electromagnetic wave on the metal surface is changed, and the electromagnetic wave adjusting effect is achieved. According to the invention, no negative influence is generated on the original electrical performance, strong lightning protection is compatible, and lightning current injected into a target body can be efficiently guided away, so that the lightning current smoothly flows into a conductor to well protect a wave-absorbing material below the conductor, and a good lightning protection effect is achieved. The method is simple in process, high in operability, easy to implement industrially and suitable for popularization.

The invention provides low-dielectric and high-heat-resistance adamantane type maleimide resin as well as a preparation method and application thereof, and belongs to the technical field of synthetic resin for electronic materials. The preparation method comprises the following steps: S1, dissolving an adamantane type amino compound to obtain a solution A; dissolving maleic anhydride to obtain a solution B; s2, dropwise adding the solution A into the solution B; s3, acetic anhydride and a catalyst are added into the solution obtained after the stirring reaction in the step S2, then the temperature is increased to 90-110 DEG C, and a heat preservation reaction is conducted for 4-6 h; and S4, cooling the solution subjected to the heat preservation reaction in the step S3, and then washing and removing the solvent to prepare the low-dielectric and high-heat-resistance adamantane type maleimide resin. The adamantane type maleimide resin provided by the invention can solve the problems of poor solubility and high brittleness of maleimide resin, and meanwhile, the resin is endowed with excellent heat resistance. In addition, the adamantane type maleimide resin can also be used for preparing copper-clad plates with low dielectric constant and low dielectric loss.

The present invention relates to the technical field of photocurable materials, and in particular to a cationic epoxy resin photocurable adhesive and a preparation method and application thereof. The cationic epoxy resin photocurable adhesive provided by the present invention comprises the following components by weight percentage: 25-55% alicyclic epoxy resin, 10-25% organosilicon-modified alicyclic epoxy resin, 10-25% oxetane, 5-20% rosin ester diol, 5-10% adhesion promoter, 0.3-3% sensitizer, and 0.1-2% photoacid generator. The cationic epoxy resin photocurable adhesive provided by the present invention is used in the bonding of electronic materials, and has the advantages of high adhesion and high elongation, especially the adhesion to copper materials is higher than that of conventional cationic epoxy adhesives, which solves the defects of conventional cationic photocurable adhesives, and the cured product has excellent performance, high aging reliability, and a wide range of applications.

The invention discloses a sample preparation method for observing the surface appearance of a medium-high voltage formed foil, which comprises the following steps: cutting the formed foil into a strip-shaped sample with a specific size, grinding and polishing, carrying out primary ultrasonic cleaning, putting into a special alkaline corrosive liquid for treatment, carrying out secondary ultrasonic cleaning, and finally observing by using a scanning electron microscope. The alkaline corrosive liquid comprises various components such as potassium hydroxide and sodium silicate, and the components have a synergistic effect and are prepared under the conditions of optimized temperature, stirring rotation speed and the like. The sample preparation method has remarkable advantages, and compared with a traditional method, the use of chemicals easy to explode is avoided, so that the safety is greatly improved; the operation process is standard, parameters are clear, simplicity and convenience are achieved, and repeatability is good; by accurately controlling the corrosion process, the sample preparation effect is good, and the surface appearance can be clearly presented; meanwhile, the components of the used corrosive liquid are environment-friendly, and environmental pollution is reduced. The method has a wide application prospect in the related scientific research and production fields of electronic materials.

The invention discloses a preparation method of low-temperature solderable conductive copper paste, and belongs to the technical field of electronic materials. The conductive copper paste is prepared from the following raw materials: silver-coated copper powder, an organic carrier, an antioxidant, a curing agent, an auxiliary agent, a thixotropic agent, a solvent and an adhesion enhancer. The design of the composite copper powder coated with the silver layer on the surface is matched with the graded particle size, and an organic carrier is combined, so that high conductivity and strong oxidation resistance under low-temperature curing are realized. The preparation method comprises the following steps: treating the copper powder by adopting a dipping-drying process, and coating the surface of the copper powder with the adhesion enhancer and the antioxidant by adopting a chemical method; uniformly mixing the organic carrier, the curing agent, the solvent and the auxiliary agent; and finally, copper powder and a thixotropic agent are added into the mixed organic carrier, and the low-temperature solderable conductive copper paste is prepared through high-speed dispersion and grinding of a three-roller machine. The product can be rapidly cured at 100-180 DEG C, the sheet resistance is smaller than or equal to 20 m omega / square, the welding strength reaches 15 MPa or above, cost is low, production is easy, and wide industrial application value is achieved.

The invention discloses a novel automobile back view mirror flexible printed circuit board prepared based on weldable silver paste, and belongs to the technical field of electronic materials and devices, conductor patterns in the flexible printed circuit board comprise a main circuit pattern and an auxiliary function structure formed by weldable low-temperature curing silver paste; the curing temperature of the weldable low-temperature silver paste is 125-135 DEG C, and the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, a high-boiling-point ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes, modified aluminum oxide powder, modified barium sulfate and a low-stress modifier. The polymer resin system comprises novolac epoxy resin, biphenyl epoxy resin and a polyacrylate-CTBN copolymer; through the synergistic effect of all the components and an innovative process, comprehensive improvement of mechanical reliability, environmental durability, conductive stability and power load capacity is achieved, and the strict requirement for high reliability of the automobile rearview mirror in an extreme environment is perfectly met.

The invention discloses a novel notebook flexible printed circuit board prepared based on weldable low-temperature silver paste and a backlight module, and belongs to the technical field of electronic materials and devices. Conductor patterns of the flexible printed circuit board comprise a main circuit pattern formed by rolled copper; the auxiliary function structure is formed in a local area of the main circuit pattern by weldable low-temperature silver paste; the curing temperature of the weldable low-temperature silver paste is 130-145 DEG C, the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, an ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes and modified antimony tin oxide powder, and the conductive filler comprises flaky silver powder, spherical silver powder and low-temperature alloy powder. The low-temperature alloy powder is Sn42Bi58 low-temperature alloy powder of which D50 is 12 [mu] m-15 [mu] m; according to the invention, low-temperature curing, high flexibility, excellent conductivity and direct weldability are integrated, and a solution suitable for local repair of a flexible printed circuit board and direct mounting of a jumper and a Mini LED chip is provided.

The invention relates to the technical field of electronic materials, and discloses a nano-structure-based flexible electronic material preparation method, which comprises: 1, dissolving 80-85% of a hydrogenated styrene-butadiene block copolymer (SEBS) in a tetrahydrofuran (THF) and N-methyl pyrrolidone (NMP) mixed solvent to form a matrix solution; 2, 12%-15% of functionalized graphene (EGO-PP) with the surface grafted with PEDOT: PSS is added into the matrix solution, and ultrasonic-shearing synergistic dispersion treatment is carried out; and step 3, performing programmed cooling control on the dispersion system, and cooling from 80 DEG C to 25 DEG C in stages to complete nano-network self-assembly. Matching ([delta] [delta] t; compared with the prior art that a blending method depends on high filler loading, the method provided by the invention has the advantages that a three-dimensional interpenetrating conductive network is formed by the functionalized graphene under the ultralow content of 1.8 vol% by using an ultra-low (0.5, 0.5) and Spinodal decomposition mechanism, and compared with a blending method which depends on high filler loading, the core contradiction of material embrittlement caused by high filler concentration is solved, and the flexibility is improved by 240% or above under the same conductivity.

The invention discloses a high CTI high thermal conductivity epoxy glass fiber cloth-based laminate and a preparation method thereof, belonging to the technical field of electronic materials. A resin system is formed by using a phenoxy resin with a molecular weight of 30,000 to 50,000, a fluorinated polyimide, a brominated epoxy resin and ethylene propylene diene rubber, and polydopamine-modified nanoparticles are added to the resin system as fillers. A cross-linking curing agent and an accelerator are then added to prepare glue. Then, the resin system is impregnated with glass fiber cloth to obtain a prepreg. The prepreg and copper foil are stacked, pressed and cut to obtain a high CTI high thermal conductivity epoxy glass fiber cloth-based laminate. By the above method, the epoxy glass fiber cloth-based laminate prepared by the invention meets the requirements of high CTI, excellent heat resistance, high thermal conductivity and low dielectric constant, and has high strength.

The invention belongs to the technical field of electronic materials, and particularly relates to a preparation method of a copper powder enhanced terahertz composite wave-absorbing film. The preparation method comprises the following steps: by taking polyurethane modified epoxy resin as a raw material, sequentially adding silane coupling agent modified aluminum oxide, chitin coated silicon dioxide and substituted thiophenol self-assembled nano-copper powder, stirring, then adding a curing agent and a dispersing agent to obtain a mixed solution, then pouring the mixed solution into a coating machine, and coating to obtain the coating. Preparing a copper powder enhanced terahertz composite wave-absorbing film; the minimum wave-absorbing efficiency of the thin film in the frequency band of 0.3-3.0 THz is-26.7 dB, and the effective bandwidth with the wave-absorbing efficiency smaller than-10 dB is the full frequency band; the composite wave-absorbing material can be used for wave-absorbing electromagnetic protection of 6G electronic devices.

The present technology relates generally to compositions comprising 3-amino-2- butanol. In particular, the present technology relates to compositions that comprise 3-amino- 2 -butanol for the manufacture of batteries, semiconductor devices, and other electronic materials and electrical devices.

The present invention relates to the field of magnetron sputtering technology, and specifically discloses a magnetron sputtering silver-coated conductive material powder device based on an ultrasonic-electromagnetic suspension composite dispersion system and its application. In response to the technical difficulties of powder agglomeration, low target utilization rate and poor uniformity in large-scale production, the present invention uses a porous ceramic tooling disk as the core carrier, integrates a high-frequency ultrasonic vibrator array (adjustable at 20-100kHz), a planar rectangular cathode (tilt angle 0-15°) and a Helmholtz coil (0.1-0.5T rotating magnetic field), and realizes non-contact dispersion of powder and precise coating of silver layer through cavitation effect, electromagnetic suspension and multi-target collaborative sputtering. The tooling disk adopts a gradient aperture design, combined with liquid nitrogen microchannel cooling and modular cavity structure, so that the powder dispersion uniformity (CV value <5%), silver layer porosity (<1%), target utilization rate (52%) and single furnace production capacity (72kg / 8h) are significantly optimized, providing an efficient and environmentally friendly industrial solution for the field of electronic materials.

The invention relates to the fields of information electronic material technology, information communication, wireless radio frequency communication and the like, in particular to a surface acoustic wave device and a preparation method thereof.The preparation method comprises the steps that after a metal film is deposited, patterned stripping is conducted on an interdigital electrode layer, and when patterned stripping is conducted on the interdigital electrode layer, a non-closed release window is formed; partially overlapping the thickened electrode layer from the direction of the non-closed release window to form a closed release window; etching the piezoelectric film exposed in the closed release window to form a release hole; and the sinking material is further released through the release holes so as to form a suspended piezoelectric film. According to the invention, by optimizing the patterning design and the processing flow of the resonator membrane structure, the release window in the bus bar region is efficiently stripped, the stripping processing difficulty of the bus bar electrode is reduced, and the stripping success rate of the bus bar electrode is improved.