448 results about "Electronic materials" patented technology

The invention discloses an electronic material life cycle quality tracing method based on digital twinning, and relates to the technical field of industrial Internet of Things, the digital twinning of an electronic material is constructed, a material constitutive equation, a process parameter threshold library and historical quality data are integrated, and a multi-dimensional virtual model is formed; a production line real-time data stream including an equipment state, environmental parameters and material attributes is collected. According to the method, the virtual model containing the material constitutive equation and the process parameter threshold library is constructed, the real-time data flow dynamic evolution is combined, and the graph calculation and the causal reasoning algorithm are applied, so that the interaction effect of the equipment state, the environmental parameters and the material attributes can be associated, the core influence factor chain of the quality abnormality can be positioned, the single-point alarm limitation is broken through, and the quality abnormality can be accurately detected. The quality problem is deeply analyzed from the angle of multi-factor coupling, a comprehensive and systematic analysis framework is provided for accurate attribution, the source of the quality problem can be quickly and accurately found, and the efficiency and accuracy of quality tracing are improved.

The application discloses a method for preparing a low-viscosity vinyl fluorine-containing hyperbranched silicone resin and belongs to the technical field of organic polymer materials. The low-viscosity vinyl fluorine-containing hyperbranched silicone resin is prepared from a vinyl-containing siloxane monomer, an alkyl-containing siloxane monomer and a fluorine-containing siloxane monomer as raw materials through hydrolysis nucleation, condensation growth, end capping and purification treatment, wherein the vinyl content is not less than 3 wt%, the fluorine content is not less than 15 wt% and the viscosity is not higher than 1000 mPa.s. The vinyl fluorine-containing hyperbranched silicone resin has excellent properties of both a vinyl silicone resin and a fluorine-containing polymer, the existence of the vinyl group can be suitable for various reaction conditions, the existence of the fluorine-containing group makes the hydrophobic and oleophobic properties excellent, and the friction coefficient of the fluorine-containing polymer material is small, so that the vinyl fluorine-containing hyperbranched silicone resin has great application potential in the fields of oil-resistant sealing, anticorrosion coating, electronic materials, medical devices and the like.

The invention relates to the technical field of electronic materials, in particular to conductive silver paste for a BC battery, and the conductive silver paste comprises the following components in percentage by weight: 88-93 wt% of silver powder, 3-5 wt% of glass powder, 1-3 wt% of organic resin, 6-10 wt% of solvent and 0-1 wt% of other auxiliaries, the sum of the components is 100 wt%, and the glass powder comprises gallium sesquioxide. The conductive silver paste can be used for a BC battery so as to completely or partially solve the problem of large contact resistance of a P region of the BC battery, and meanwhile, the reliability is guaranteed.

The invention relates to the technical field of printed electronic materials, in particular to conductive copper ink for a printed circuit and a preparation method of the conductive copper ink. The conductive mica powder-graphene composite material comprises conductive mica powder, a nano-copper-graphene filler, flaky copper powder, spherical copper powder, an organic carrier, a dispersing agent, a coupling agent, an antioxidant and an auxiliary agent, a layer-point composite conductive structure is constructed through conductive mica powder and nano-copper-graphene filler, a close packing system is formed by combining particle size grading of copper powder with different morphologies, and the conductivity is guaranteed; by means of a chemical bonding interface formed by the coupling agent, the copper powder and the organic carrier, the integrity of the coating is enhanced, and stress cracking during welding is reduced; microencapsulated rosin in the auxiliary agent promotes wetting and spreading of the welding flux, titanate modified nano titanium dioxide constructs a three-dimensional cross-linked network to improve the bending resistance and thermal shock resistance of the coating, the falling phenomenon of components after welding is reduced, and the stability of the conductive copper ink in actual printed circuit production is improved.

The invention discloses a novel automobile back view mirror flexible printed circuit board prepared based on weldable silver paste, and belongs to the technical field of electronic materials and devices, conductor patterns in the flexible printed circuit board comprise a main circuit pattern and an auxiliary function structure formed by weldable low-temperature curing silver paste; the curing temperature of the weldable low-temperature silver paste is 125-135 DEG C, and the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, a high-boiling-point ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes, modified aluminum oxide powder, modified barium sulfate and a low-stress modifier. The polymer resin system comprises novolac epoxy resin, biphenyl epoxy resin and a polyacrylate-CTBN copolymer; through the synergistic effect of all the components and an innovative process, comprehensive improvement of mechanical reliability, environmental durability, conductive stability and power load capacity is achieved, and the strict requirement for high reliability of the automobile rearview mirror in an extreme environment is perfectly met.

The invention discloses a novel notebook flexible printed circuit board prepared based on weldable low-temperature silver paste and a backlight module, and belongs to the technical field of electronic materials and devices. Conductor patterns of the flexible printed circuit board comprise a main circuit pattern formed by rolled copper; the auxiliary function structure is formed in a local area of the main circuit pattern by weldable low-temperature silver paste; the curing temperature of the weldable low-temperature silver paste is 130-145 DEG C, the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, an ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes and modified antimony tin oxide powder, and the conductive filler comprises flaky silver powder, spherical silver powder and low-temperature alloy powder. The low-temperature alloy powder is Sn42Bi58 low-temperature alloy powder of which D50 is 12 [mu] m-15 [mu] m; according to the invention, low-temperature curing, high flexibility, excellent conductivity and direct weldability are integrated, and a solution suitable for local repair of a flexible printed circuit board and direct mounting of a jumper and a Mini LED chip is provided.

The invention belongs to the technical field of electronic materials, and particularly relates to a preparation method of a copper powder enhanced terahertz composite wave-absorbing film. The preparation method comprises the following steps: by taking polyurethane modified epoxy resin as a raw material, sequentially adding silane coupling agent modified aluminum oxide, chitin coated silicon dioxide and substituted thiophenol self-assembled nano-copper powder, stirring, then adding a curing agent and a dispersing agent to obtain a mixed solution, then pouring the mixed solution into a coating machine, and coating to obtain the coating. Preparing a copper powder enhanced terahertz composite wave-absorbing film; the minimum wave-absorbing efficiency of the thin film in the frequency band of 0.3-3.0 THz is-26.7 dB, and the effective bandwidth with the wave-absorbing efficiency smaller than-10 dB is the full frequency band; the composite wave-absorbing material can be used for wave-absorbing electromagnetic protection of 6G electronic devices.

The invention belongs to the technical field of electronic materials, and particularly relates to a FeSiAl soft magnetic composite material and a preparation method thereof.The preparation method comprises the steps that 1, FeSiAl powder, a silane coupling agent and organic silicon resin are mixed to obtain coated powder; (2) carrying out heat treatment on the coated powder to obtain FeSiAl-coated Al2SiO5 powder; and (3) mixing the FeSiAl-coated Al2SiO5 powder with a lubricant, and carrying out annealing heat treatment to obtain the FeSiAl soft magnetic composite material. The FeSiAl soft magnetic composite material prepared by the method has high magnetic conductivity and lower loss, the insulating layer is compact, the corrosion resistance is excellent, and the preparation method is simple in process, simple and convenient in equipment, short in coating treatment time, high in efficiency, low in cost and suitable for large-scale production.

The invention discloses a TPU film for robot electronic skin and a preparation method of the TPU film, and relates to the technical field of flexible electronic materials, the film takes TPU introduced with Diels-Alder dynamic reversible bonds as a matrix, a conductive filler is formed by dopamine-modified silver nanowires and MXene, the concentration of the conductive filler is in continuous or quasi-continuous gradient decrease, and the conductive filler is a conductive filler formed by silver nanowires and MXene. An integrated network with self-repairing and environmental stability is formed and is used as an electrode; phase change microcapsules and triboelectric nanofibers are compounded in a low-conductivity contact area to form an intelligent response layer which is self-adaptive in sensing threshold and capable of generating power by friction. Through one-step multi-nozzle electrostatic spinning forming, the problem that self-repairing, signal stability, environmental adaptability and energy independence in electronic skin are difficult to consider at the same time is solved.

The invention relates to the technical field of electronic materials, in particular to a copper-clad plate resin composition with an ultralow-loss medium and a preparation method of the copper-clad plate resin composition. The composition comprises the following components: modified polyphenyl ether, dicyclopentadiene epoxy resin, trifunctional epoxy resin, active ester, cyanate ester, DMAP, spherical silicon dioxide and a POSS-silicon dioxide compound, the preparation method comprises the following steps: carrying out surface norbornenylation modification on bimodal spherical silicon dioxide, and carrying out click reaction on the bimodal spherical silicon dioxide and octa-aminophenyl polysilsesquioxane with tetrazinyl at the tail end to prepare a POSS-silicon dioxide compound, so as to construct an interface transition layer with gradient modulus. According to the invention, collaborative optimization of dielectric loss, thermal mechanical properties and interface bonding strength is realized, and the material has excellent properties of low dielectric loss, high thermal stability, high peel strength and the like, and is suitable for the fields of 5G communication, high-frequency electronic equipment and the like.

The invention discloses a conjugated polymer film with electrical properties and tensile stability simultaneously improved, and a preparation method and application thereof, and belongs to the technical field of flexible electronic materials. The preparation method comprises the following steps: placing the conjugated polymer film in a solution formed by mixing an electrolyte and a dopant, and soaking for 30-60 seconds to complete ion exchange doping, thereby obtaining the conjugated polymer film with various carrier transport channels. The strategy of increasing the types of carrier transmission channels is adopted, and two main transmission channels of a crystal phase and an accumulation region are formed in the conjugated polymer film through an ion exchange doping method, so that the conjugated polymer film can maintain the electrical property at a high proportion under a stretching external field, and the electrical property of the conjugated polymer film is improved under the same stretching strain. And the tensile stability of the conductivity is far higher than that of a conjugated polymer film which only takes a crystal phase or an accumulation region as a carrier transmission channel.

The invention belongs to the technical field of electronic materials, and discloses a high-power and low-loss LiZn microwave ferrite material, the raw materials comprise main materials and a dopant, the main materials comprise Li2CO3, ZnO, MnCO3, CuO, NiO and Fe2O3; the doping agent is prepared from Bi2O3, CaCO3 and Co2O3. The preparation method comprises the following steps: carrying out primary ball milling and pre-sintering on the main material to obtain pre-sintered powder; adding a doping agent into the pre-sintered powder, and carrying out secondary ball milling; adding an organic adhesive into the secondary ball-milled material for granulation, and pressing into a blank; and sintering the blank to obtain the high-power and low-loss LiZn microwave ferrite material. Through a specific formula and a preparation process, uniform components and grain refinement can be ensured, and the microwave ferrite material with high Curie temperature, low ferromagnetic resonance line width, low dielectric loss and high spin wave line width is finally prepared.

The invention belongs to the technical field of electronic materials, and particularly relates to a high-performance sintered foil matched with multi-particle-size aluminum powder for industrial production and a preparation method of the high-performance sintered foil. In order to solve the problem that an existing sintered foil cannot obtain high bending performance and high specific capacitance performance at the same time, a multi-particle-size aluminum powder gradient matching strategy is adopted, the aluminum foil is prepared through slurry preparation, slurry stirring, double-face coating and drying integrated operation, sintering and formation treatment, the specific capacitance of the sintered foil after standardization is 0.8-1.2 mu F / cm, and the specific capacitance of the aluminum foil is 0.8-1.2 mu F / cm. The specific capacitance fluctuation range is smaller than or equal to 8%, the bending frequency is 40-100 times after a 90-degree bending test, the bent film layer is free of cracking and falling off, the leakage current is smaller than or equal to 3 [mu] A / cm < 2 > under the 25 DEG C and rated voltage test, and the film can be directly used for industrial production.

The invention discloses high-dispersion polyhedral nano silver powder as well as a preparation method and application thereof, and belongs to the technical field of preparation of electronic materials and nano powder. The problems that an existing polyhedral nano silver powder preparation method is difficult in morphology control and poor in dispersity, uses toxic reagents and the like are solved. According to the method, the growth process of the nano-silver crystal faces in a triethylene glycol system is regulated and controlled by means of high adsorption capacity and coordination of high-valence metal ions, the high-valence metal ions are selectively adsorbed on different crystal faces of silver, the surface energy and the growth rate of each crystal face are changed, and therefore control over the polyhedral morphology of the nano-silver powder is achieved. Besides, due to the fact that different high-valence metal ions are different in radius, charge number and adsorption capacity, the different high-valence metal ions have different regulation and control effects on the silver crystal face, and then controllable preparation of the polyhedral nano silver powder is achieved by selecting the different high-valence metal ions.

This invention discloses a cellulose-based ion-conductive gel membrane and its preparation method, belonging to the technical field of flexible wearable electronic materials and sensors. Addressing the technical pain points of existing ion gels, such as easy dehydration and failure, insufficient mechanical properties, difficulty in film formation, and inability to synergistically optimize multiple performance indicators, this invention constructs a composite gel matrix by crosslinking sodium alginate and sodium carboxymethyl cellulose with calcium ions. The crosslinking density of the system is controlled by sodium carboxymethyl cellulose, and glycerol is used as a plasticizer to construct ion transport channels. A solid gel membrane free of free water is obtained through coating, crosslinking, room temperature equilibration, and drying dehydration. The raw materials of this invention are environmentally friendly, the preparation process is simple and controllable, and the resulting gel membrane possesses high tensile strength, high transparency, excellent ion conductivity, and environmental stability. It exhibits sensitive strain response and good linearity, and can be widely used in the field of flexible strain sensing.

The application discloses a novel flexible printed circuit board and camera module prepared based on weldable low-temperature silver paste, and belongs to the technical field of electronic materials and devices. The conductor pattern in the flexible printed circuit board comprises a main circuit pattern and an auxiliary function structure formed by weldable low-temperature cured silver paste. The curing temperature of the weldable low-temperature silver paste is 87-103 DEG C. The silver paste comprises conductive fillers, a polymer resin system, ester solvents, a curing agent, a silane coupling agent, polyamide wax thixotropic agents, polysiloxane defoaming agents, modified carbon nanotubes, modified antimony tin oxide powder, modified ceramic fillers and low-stress modifiers. The polymer resin system comprises hydrogenated bisphenol A type epoxy resin, diphenyl type epoxy resin and polyacrylate-CTBN copolymer. The conductive fillers comprise silver-coated copper flaky powder, nano silver wire and low-temperature alloy powder. Through the synergistic effect of components and the innovative process, the comprehensive improvement of mechanical properties, conductive properties, high-frequency characteristics and welding reliability is realized under the premise of ultralow-temperature curing.

The invention belongs to the technical field of electronic materials, and provides a microwave dielectric material, a preparation method thereof and an electronic component. The microwave dielectric material is prepared from the following raw materials in percentage by weight: 5wt%-20wt% of calcium-aluminum-boron glass, 60wt%-85wt% of SiO2 and 2wt%-15wt% of an additive, wherein the total weight percentage of the calcium-aluminum-boron glass, the SiO2 and the additive is 100%; wherein the additive comprises at least one of B2O3, Li2O and Al2O3, and at least one of ZnO and TiO2. The microwave dielectric material provided by the invention has a relatively low dielectric constant, can meet the high-frequency application requirement of the microwave dielectric material, has relatively low dielectric loss, can effectively reduce the energy loss of a system, also has a near-zero frequency temperature coefficient, and can ensure the frequency temperature property of a product at different use temperatures.

The invention belongs to the field of bionic electronic materials and application, and discloses a dipeptide amino acid sequence with a piezoelectric effect, a dipeptide piezoelectric fiber film is prepared from the dipeptide amino acid sequence through a drop casting method, a meniscus driving method and an electric field induction meniscus driving method, and the obtained fiber film is assembled into an application example of a piezoelectric generator. The amino acid sequence of the dipeptide with the piezoelectric effect is Fc-L-Phe-L-Phe-OH, in the formula, Fc is a ferrocene benzoic acid group, Phe represents phenylalanine, and L represents the chirality of used amino acid. The dipeptide micron fiber thin film which is large in area and closely arranged is prepared by utilizing a drop casting method, a semilunar driving method and various methods of introducing a regulation and control electric field in a semilunar driving method membrane preparation process. The obtained fiber film is assembled into a piezoelectric generator of a sandwich structure, the piezoelectric output performance of the piezoelectric generator is closely related to the preparation method of the fiber film, and the piezoelectric performance of the dipeptide fiber film can be remarkably improved through an electric field induction meniscus driving method.

This invention belongs to the field of electronic materials technology, specifically relating to a sintering aid, a silicon nitride HTCC ceramic packaging electronic paste, its preparation method, and its application. The sintering aid comprises the following components by mass percentage: SiO2: 30%~60%, Al2O3: 10%~25%, Y2O3: 10%~40%, ZrO2: 0.2%~1.5%, MgO: 3%~15%, SiC: 0.3%~1.5%, and TiO2: 0.1%~1.5%. This sintering aid exhibits better corrosion resistance and mechanical properties, ensuring good bonding between the tungsten metallization layer and the silicon nitride ceramic substrate. It prevents blackening and blistering issues after nickel plating. When the electronic paste prepared using this sintering aid is applied to DIP leads, the pull-out strength reaches 55N~65N, with the fracture mode being lead breakage, meeting the requirements for package reliability and high-frequency transmission.

The invention discloses a power diode based on an MOF, a preparation method, a 3D chip packaging method and application, belongs to the technical field of electronic materials and power devices, and particularly relates to a composite structure based on an n-Si substrate / an (n-Si)-(ZIF-8) composite layer / an Ag layer, preparation, a 3D chip packaging method and application of the composite structure in the field of power devices. The reverse withstand voltage of the power diode based on the n-Si substrate / ''(n-Si)-(ZIF-8) composite layer'' / Ag layer composite structure exceeds 200V, the forward conduction voltage of the power diode is 0.25-1.5 V, the reverse bias voltage applied to the power diode is 0-200V, the reverse leakage current is basically not increased along with the increase of the reverse bias voltage, and the reverse leakage current is 0.2-2.1 mA (at the reverse voltage-100V). Compared with a conventional power diode based on an n-Si substrate / Ag layer Schottky structure, the performance of the power diode provided by the invention has the advantages that although the forward voltage is basically unchanged, the reverse voltage is increased by 80-400%, the reverse saturation current is reduced by 50-800%, and the highest yield reaches 95%.

A composition for an electronic material contains (A) a compound having one or more groups (X) selected from the group consisting of a hydroxy group, a carboxy group, a group that generates a hydroxy group, and a group that generates a carboxy group, and (B) a compound having one or two of one or more groups (Y) selected from the group consisting of an isocyanate group and a blocked isocyanate group. Further provided is a method for producing the composition for the electronic material.

The application discloses an electronic skin-oriented conductive silver paste and a preparation method and application thereof, and relates to the technical field of flexible printed electronic materials.The raw materials of the electronic skin-oriented conductive silver paste include flaky silver powder, silver nanoparticles, thermoplastic polyurethane elastomer, acrylic elastomer, PEDOT:PSS microgel dispersion, (3-glycidylpropoxy)trimethoxysilane, polydiallyldimethylammonium chloride, hexanedial modified dopamine copolymer, (3-aminopropyl)triethoxysilane, methacryloyloxypropyltrimethoxysilane, cellulose acetate, modified polyurea thixotropic agent, hydrogenated castor oil, ethylene glycol ether acetate, dibasic acid ester, leveling agent and water.The electronic skin-oriented conductive silver paste has the advantages of good electrical performance, good mechanical-electrical stability, good anti-electromigration and sweat corrosion resistance, and can still maintain dendrite-free and low drift under long-term coupling of sweat and bias, and is suitable for electronic skin.

The invention discloses a continuous synthesis method of a cobalt-based alkyne precursor based on micro-reaction reinforcement, which belongs to the technical field of advanced electronic material preparation, and comprises the following steps: pre-cooling an n-hexane solution of Co2 (CO) 8 to-30 DEG C; the method comprises the following steps: introducing an n-hexane solution of Co2 (CO) 8 and 3, 3-dimethyl-1-butyne into a stacked microreactor array under the protection of nitrogen to react, and collecting a product after the reaction is completed. According to the present invention, the micro-channel reaction system containing the passivation layer is constructed, the substitution reaction process is precisely regulated and controlled, and the in-situ detection technology is combined so as to achieve the directional synthesis and collection of the specific coordination structure; the obtained product has excellent thermal stability and vapor pressure characteristics, and can meet the requirements of advanced semiconductor device manufacturing on precursor materials.

To provide a method for producing a trimellitic anhydride ester satisfying high yield, high purity and low chlorine content required for an electronic material by a simple operation.SOLUTION: The method for producing a trimellitic anhydride ester includes a step A of reacting a trimellitic anhydride halide and a specific alkanediol to obtain a crude trimellitic ester, and a step B of purifying the crude trimellitic ester, wherein the step B includes a step B1 of mixing a poor solvent having an octanol / water partition coefficient of -2.0 or more and 0.0 or less and a boiling point of 40°C or more and 120°C or less with the crude trimellitic ester to reprecipitate the crude trimellitic ester, and a step B2 of heating the mixed liquid containing at least the crude trimellitic ester after the reprecipitation and acetic anhydride, and recrystallizing the trimellitic ester.SELECTED DRAWING: None

The invention relates to the technical field of electronic materials, in particular to thick film paste and a preparation method thereof, ZBS glass powder which is highly compatible with AIN ceramic and has specific components and particle sizes is adopted as a binding phase, an organic carrier formula is optimized, the thick film paste solves the problems of interface bubbles and layering caused by mismatching of traditional paste and an AIN substrate, and the thickness of the thick film paste is increased. The sufficient wetting of the glass relative to the substrate and the silver powder is realized, and a key foundation is laid for forming a compact and firmly combined metallized layer; according to the thick film paste, micron silver powder, nano silver powder and flake silver powder are compounded according to a specific proportion, the synergistic filling and overlapping effect of the silver powder with different morphologies is fully utilized, a more continuous and compact three-dimensional conductive network is constructed after sintering, and therefore the surface sheet resistance of a metallization layer is remarkably reduced, and the thickness of the metallization layer is improved. And excellent conductivity is obtained.

The invention discloses the field of organic electronic materials, and particularly discloses a chain terminating molecule for straight-chain polyphosphocarbazole and a polymerization terminating method. The chain termination molecule is a carbazole derivative containing boronic acid pinacol ester, the core structure is'carbazole matrix-linking group-diethyl phosphate group ', and the linking group can be a butyl chain or a benzene ring; after a chain termination molecule is synthesized through a three-step reaction, a Suzuki coupling reaction is utilized to completely replace a residual Br site of straight-chain polyphosphocarbazole, and polymerization termination is realized. The bromine residual quantity of the product is less than or equal to 0.01 wt%, the molecular weight is stabilized at 6-7 monomeric units, and the molecular weight change rate is less than or equal to 5% after the product is dried and stored at 25 DEG C for 6 months; when the material is used as a hole transport layer, the laboratory small-area film thickness deviation is less than or equal to 10%, the corresponding perovskite assembly efficiency is greater than or equal to 23%, the 1000-hour attenuation rate is less than or equal to 15%, the defects of self-agglutination, poor stability and device performance fluctuation of the existing material are solved, the process is simple, and industrialization is easy.

Provided is a resin material that exhibits high thermal conductivity while being low in dielectric constant and low in dielectric loss tangent, and that is also high in heat resistance. Provided is a multifunctional vinyl resin obtained by aromatic vinylization of the phenolic hydroxyl groups of a phenolic aralkyl resin having a biphenyl structure in the skeleton and having two or more phenolic hydroxyl groups, and a resin composition. The multifunctional vinyl resin has good dielectric properties and high thermal conductivity, and is suitable for use in electronic materials and composite materials.

The invention discloses a multilayer composite transparent conductive film and a preparation method thereof, and belongs to the technical field of flexible transparent electronic materials, the multilayer composite transparent conductive film comprises a flexible transparent substrate and functional composite layers sequentially constructed on the substrate, and each functional composite layer is composed of a conductive network layer, a modified SWCNTs layer and an AZO layer. According to the thin film, an AgNWs dispersion liquid is sprayed on the surface of a cleaned flexible transparent substrate to form a conductive network layer; a CA-SWCNTs aqueous dispersion is sprayed on the surface of the conductive network layer to construct an AgNWs / CA-SWCNTs composite conductive layer; and spin-coating an AZO solution on the surface of the composite conductive layer, forming an AZO layer through a low-temperature sol-gel process, and finally preparing the multi-layer composite transparent conductive film. According to the film, the unique multilayer structure effectively cooperates with the advantages of all the layers of materials, high light transmittance, high conductivity, high electromagnetic shielding effectiveness, rapid electrothermal response characteristics and excellent environmental stability and mechanical durability are achieved, the preparation process is simple and convenient, and the film is suitable for large-scale production.

The application relates to the technical field of electronic materials, and discloses a fluorinated iridium complex, a preparation method and application thereof, and an organic photoelectric device. The fluorinated iridium complex has a structure shown in formula (I): R 1 is a C1-C13 alkyl substituent, R 2 is a C1-C13 alkyl substituent, and the substitution sites are the meta and para positions of a carbon atom of an isoquinoline phenyl linkage, X is an independently existing hydrogen atom, a fluorine atom or an alkyl substituent, wherein the alkyl substituent is a deuterated, partially deuterated or aryl-substituted alkyl group; the fluorinated iridium complex realizes high-efficiency supersaturation deep red light as a red phosphor material in an organic light-emitting device.

This invention discloses a conductive paste for metallization of electronic ceramics, belonging to the field of electronic materials technology. The conductive paste for metallization of electronic ceramics of this invention includes copper alloy powder, glass powder, and an organic carrier. By controlling the ratio of copper, aluminum, and zinc in the copper alloy, the thermal expansion coefficient of the alloy is adjusted, making it compatible with electronic ceramic substrates such as alumina ceramics and zinc oxide varistors, achieving metallization through sintering under air conditions. The addition of tin improves the solderability of the metallized layer, meeting the process requirements of electronic components. The glass powder added in this invention has a low initial melting temperature, high bonding strength with the copper alloy, and strong adhesion to the ceramic substrate; combined with a specific ratio of organic carrier, it effectively improves the conductivity of the metallized layer after sintering.