Method for preparing epoxy resin adhesive

An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of decreased bending strength, poor electrical properties, poor compatibility, etc., to improve impact toughness and bending Effects of strength, improved compatibility, excellent heat resistance and electrical insulation properties

Inactive Publication Date: 2008-05-28
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to improve the shortcomings of poor compatibility, decreased flexural strength and poor electrical properties during toughening of epoxy-based silicone oil modified epoxy resin adhesives, to achieve good compatibility, and to achieve good compatibility while toughening. Reduced flexural strength, heat resistance and insulation properties

Method used

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  • Method for preparing epoxy resin adhesive
  • Method for preparing epoxy resin adhesive

Examples

Experimental program
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Embodiment 1

[0019] 25g bisphenol A epoxy resin (brand DER331, DOW Chemicals, epoxy equivalent is 182-192g / mol), 25g bisphenol A epoxy resin (brand 1050, Wuxi Diaisheng, epoxy equivalent 450-500 is g Melt with 50g of linear phenol-formaldehyde epoxy resin (grade F-44, Shanghai Zhengrui, epoxy equivalent is 205-213g / mol) at 80-100°C, stir well and vacuum debubble for 0.5-1.0 hours , heat up to 140°C and add 0.3g aluminum acetylacetonate, stir until the aluminum acetylacetonate is evenly melted, then cool down to 100°C and add 30g methylhexahydrophthalic anhydride and 10g epoxy phenyl silicone oil (structural formula is a, m =20-25, n=23-26), stirred evenly to obtain 140g epoxy resin adhesive. The mixture was transparent before and after mixing and curing, and no phase separation occurred. Impact strength 15KJ / m 2 , 40% higher than pure epoxy system; bending strength 107MPa, 7% higher than pure epoxy system; volume resistivity at room temperature 4×10 17 Ω.cm, dielectric loss 0.3%; dielec...

Embodiment 2

[0021] 50g bisphenol A epoxy resin (brand name DER331, DOW Chemicals, epoxy equivalent 182-192 is g / mol), 25g alicyclic epoxy resin (brand name ERL4221, Union Carbide, epoxy equivalent is 131-143g / mol) mol); and 25g of linear phenol-formaldehyde epoxy resin (brand F-44, Shanghai Zhengrui, epoxy equivalent is 205-213g / mol) melted at 80-100°C, stirred evenly and vacuum degassed for 0.5-1.0 hours, Raise the temperature to about 140°C and add 0.25g of aluminum acetylacetonate, stir until the aluminum acetylacetonate is evenly melted, then cool down to 100°C and add 35g of methylhexahydrophthalic anhydride and 10g of epoxy phenyl silicone oil (structural formula such as b, m =21-25, n=24-28), to obtain 145g of epoxy resin adhesive. The mixture was transparent before and after mixing and curing, and no phase separation occurred. Impact strength 13KJ / m 2 , 34% higher than pure epoxy system; bending strength 114MPa, 10% higher than pure epoxy system; volume resistivity at room tempe...

Embodiment 3

[0023] With 25g bisphenol A epoxy resin (brand DER331, DOW Chemicals, epoxy equivalent is 182-192g / mol), 25g bisphenol A epoxy resin (brand 1050, Wuxi Di Aisheng, epoxy equivalent is 450- 500g / mol); and 50g of linear phenol-formaldehyde epoxy resin (grade F-44, Shanghai Zhengrui, epoxy equivalent of 205-213g / mol) melted at 80-100°C, stirred evenly and vacuum degassed 0.5-1.0 After hours, heat up to about 140°C and add 0.3g of aluminum acetylacetonate, stir until the aluminum acetylacetonate is evenly melted, then cool down to about 100°C and add 5g of SiO with a particle size of about 15nm 2 After uniform dispersion, 32g of methylhexahydrophthalic anhydride and 10g of epoxy phenyl silicone oil (structural formula such as a, m=30-33, n=35-37) were added to obtain 147g of epoxy resin adhesive. The mixture was transparent before and after mixing and curing, and no phase separation occurred. Impact strength 18KJ / m 2 , 46% higher than pure epoxy system; bending strength 126MPa, 1...

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Abstract

The invention discloses a process for preparing epoxy resin adhesive. epoxy phenyl silicone oil(PEPDMS) is employed as a toughening modifier of the epoxy-resin binder, the mixing compatibility of organosilicon resin and epoxide resin are improved by introducing phenyl group to the molecular structure of the naphthene-base silicone oil, simultaneously, the impact ductility and bending intensity of solidifying matters can be increased owing to the mutual function of the soft Si-O-Si chain and the rigid phenyl group, thereby the invention has the function of toughening and strengthening, and the invention has the advantages of sound fire-resisting property and electricity-air insulating property. The beginning heat decomposition temperature is more than 400 DEG C, volume resistivity is more than 10 17 omega, cm under indoor temperature, the consumption of medium is less than 2% under indoor temperature and in 155 DEG C, and the invention is in particular adaptable for casting and packaging of electronic materials and the manufacture of electrical resistant materials.

Description

technical field [0001] The invention relates to a preparation method of an adhesive, in particular to a preparation method of an epoxy resin adhesive. Background technique [0002] Epoxy resin has the advantages of excellent mechanical properties, electrical properties, chemical resistance, bonding properties, etc., and is widely used in coatings, adhesives, electrical and electronic material insulation, and the matrix of advanced composite materials. Insulation materials are developing towards high performance, which requires materials to have higher performance, such as high toughness, low internal stress, heat resistance, moisture resistance, etc., while epoxy resin cured products are mostly brittle and have low heat resistance. Easy to absorb moisture and so on. [0003] At present, the methods of epoxy resin toughening mainly include: rubber elastomer toughening, thermoplastic resin toughening, thermotropic liquid crystal toughening, interpenetrating network toughening...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06
Inventor 金小林江平开韦平郑芸
Owner SHANGHAI JIAO TONG UNIV
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